CN106853521A - Electronic device metallic composite and preparation method thereof - Google Patents
Electronic device metallic composite and preparation method thereof Download PDFInfo
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- CN106853521A CN106853521A CN201510907920.6A CN201510907920A CN106853521A CN 106853521 A CN106853521 A CN 106853521A CN 201510907920 A CN201510907920 A CN 201510907920A CN 106853521 A CN106853521 A CN 106853521A
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- parts
- electronic device
- metallic composite
- powder
- device metallic
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/16—Both compacting and sintering in successive or repeated steps
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C33/00—Making ferrous alloys
- C22C33/02—Making ferrous alloys by powder metallurgy
- C22C33/0257—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements
- C22C33/0278—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5%
- C22C33/0285—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5% with Cr, Co, or Ni having a minimum content higher than 5%
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/002—Ferrous alloys, e.g. steel alloys containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
Abstract
The present invention relates to electronic device metallic composite and preparation method thereof, belong to electronic device material field.The electronic device metallic composite, including according to the following raw material of mass fraction meter：Iron powder 48-65 parts, carborundum 15-20 parts, aluminum oxide 3-8 parts, polytetrafluorethylepowder powder 3-5 parts, magnesium powder 5-10 parts, nickel powder 8-18 parts, manganese 0.5-1 parts, calcirm-fluoride 1-2 parts, lubricant 0.1-0.8 parts, graphite 3-8 parts.During preparation, according to quality proportioning, each component is well mixed, in being suppressed under 400-450MPa, after sintering 1-2h at 1140-1180 DEG C, after be cooled to 860-900 DEG C of holding 30min, continue to be cooled to 450-460 DEG C, 30min is kept, natural cooling is treated, the electronic device metallic composite is obtained final product.It is the metallic composite impact resistance, corrosion-resistant, can be widely applied to field of electronic devices.
Description
Technical field
The invention belongs to electronic device material field, and in particular to electronic device metallic composite and preparation method thereof.
Background technology
An electronic device part indispensable in being lived into us, and many parts of electronic device are required for using metal, must tool
There is the function such as big hardness, impact resistance, corrosion-resistant.And single metal is typically difficult to meet and is required, therefore to use metallic composite.
Metallic composite refers to using complex technique or the different metal of various, chemical, mechanical property metallurgical binding to be realized on interface and
The composite of formation, it is thermal expansivity that it significantly improves single metal material, intensity, fracture toughness, impact flexibility, wear-resistant
Many performances such as property, electrical property, magnetic property, so that composite has excellent mechanical property, thus it is wide to be widely applied to product
It is general to be applied to oil, chemical industry, ship, metallurgy, mine, machine-building, electric power, water conservancy, traffic, environmental protection, pressure vessel system
Make, food, brewage, the industrial circle such as pharmacy.Composite mainly includes three big fields：Metal-base composites, ceramic base are combined
Material and polymer composite etc..
The content of the invention
The invention aims to provide a kind of electronic device metallic composite and preparation method thereof, it is prepared into by method simple and easy to apply
To impact resistance, corrosion resistant metallic composite.
The technical solution adopted by the present invention is as follows：
Electronic device metallic composite, including according to the following raw material of mass fraction meter：Iron powder 48-65 parts, carborundum 15-20 parts,
Aluminum oxide 3-8 parts, polytetrafluorethylepowder powder 3-5 parts, magnesium powder 5-10 parts, nickel powder 8-18 parts, manganese 0.5-1 parts, calcirm-fluoride 1-2
Part, lubricant 0.1-0.8 parts, graphite 3-8 parts.
Above-described electronic device metallic composite, including according to the following raw material of mass fraction meter：56 parts of iron powder, carborundum 17
Part, 5 parts of aluminum oxide, 4 parts of polytetrafluorethylepowder powder, 7 parts of magnesium powder, 13 parts of nickel powder, 0.8 part of manganese, 1.5 parts of calcirm-fluoride,
0.4 part of lubricant, 6 parts of graphite.
Further, the lubricant is NaF or CuCl.
Further, the polytetrafluorethylepowder powder particle size is less than 100nm.
The preparation method of above-described electronic device metallic composite, comprises the following steps：According to quality proportioning, each component is mixed
Uniformly, in being suppressed under 400-450MPa, after sintering 1-2h at 1140-1180 DEG C, after be cooled to 860-900 DEG C of holding 30min, after
It is continuous to be cooled to 450-460 DEG C, 30min is kept, natural cooling is treated, obtain final product the electronic device metallic composite.
Beneficial effects of the present invention are：Gained metallic composite of the invention has excellent impact resistance, and its compression strength may be up to
5240MPa；Gained metallic composite of the invention has good corrosion resistance；Preparation method of the present invention is simple and easy to apply, is adapted to industrial production.
Specific embodiment
With reference to embodiment, the present invention is described in further detail, and the reagent used in the present invention can be obtained by purchased in market unless otherwise instructed
.
Embodiment 1
Electronic device metallic composite, including according to the following raw material of mass fraction meter：48 parts of iron powder, 15 parts of carborundum, oxidation
3 parts of aluminium, 3 parts of polytetrafluorethylepowder powder, 5 parts of magnesium powder, 8 parts of nickel powder, 0.5 part of manganese, 1 part of calcirm-fluoride, lubricant NaF0.1
Part, 3 parts of graphite.Wherein, the polytetrafluorethylepowder powder particle size is less than 100nm.
The preparation method of the electronic device metallic composite of the present embodiment, comprises the following steps：According to quality proportioning, each component is mixed
Uniformly, in being suppressed under 400-450MPa, after sintering 1-2h at 1140-1180 DEG C, after be cooled to 860-900 DEG C of holding 30min, after
It is continuous to be cooled to 450-460 DEG C, 30min is kept, natural cooling is treated, obtain final product the electronic device metallic composite.
Embodiment 2
The present embodiment electronic device metallic composite, including according to the following raw material of mass fraction meter：52 parts of iron powder, 16 parts of carborundum,
4 parts of aluminum oxide, 3.5 parts of polytetrafluorethylepowder powder, 6 parts of magnesium powder, 10 parts of nickel powder, 0.6 part of manganese, 1.2 parts of calcirm-fluoride, profit
Lubrication prescription CuCl0.3 parts, 5 parts of graphite.Wherein, the polytetrafluorethylepowder powder particle size is less than 100nm.
The preparation method of the electronic device metallic composite of the present embodiment, comprises the following steps：According to quality proportioning, each component is mixed
Uniformly, in being suppressed under 400-450MPa, after sintering 1-2h at 1140-1180 DEG C, after be cooled to 860-900 DEG C of holding 30min, after
It is continuous to be cooled to 450-460 DEG C, 30min is kept, natural cooling is treated, obtain final product the electronic device metallic composite.
Embodiment 3
Electronic device metallic composite, including according to the following raw material of mass fraction meter：56 parts of iron powder, 17 parts of carborundum, oxidation
5 parts of aluminium, 4 parts of polytetrafluorethylepowder powder, 7 parts of magnesium powder, 13 parts of nickel powder, 0.8 part of manganese, 1.5 parts of calcirm-fluoride, lubricant NaF0.4
Part, 6 parts of graphite.Wherein, the polytetrafluorethylepowder powder particle size is less than 100nm.
The preparation method of the electronic device metallic composite of the present embodiment, comprises the following steps：According to quality proportioning, each component is mixed
Uniformly, in being suppressed under 400-450MPa, after sintering 1-2h at 1140-1180 DEG C, after be cooled to 860-900 DEG C of holding 30min, after
It is continuous to be cooled to 450-460 DEG C, 30min is kept, natural cooling is treated, obtain final product the electronic device metallic composite.
Claims (5)
1. electronic device metallic composite, it is characterised in that including the following raw material according to mass fraction meter：Iron powder 48-65 parts, carborundum
15-20 parts, aluminum oxide 3-8 parts, polytetrafluorethylepowder powder 3-5 parts, magnesium powder 5-10 parts, nickel powder 8-18 parts, manganese 0.5-1 parts, fluorine
Change 1-2 parts, lubricant 0.1-0.8 parts, graphite 3-8 parts of calcium.
2. electronic device metallic composite according to claim 1, it is characterised in that including the following raw material according to mass fraction meter：Iron
56 parts of powder, 17 parts of carborundum, 5 parts of aluminum oxide, 4 parts of polytetrafluorethylepowder powder, 7 parts of magnesium powder, 13 parts of nickel powder, manganese 0.8
Part, 1.5 parts of calcirm-fluoride, 0.4 part of lubricant, 6 parts of graphite.
3. electronic device metallic composite according to claim 1 and 2, it is characterised in that the lubricant is NaF or CuCl.
4. electronic device metallic composite according to claim 1 and 2, it is characterised in that the polytetrafluorethylepowder powder particle size is small
In 100nm.
5. the preparation method of the electronic device metallic composite described in claim 1, it is characterised in that comprise the following steps：Match somebody with somebody according to quality
Than, each component is well mixed, in being suppressed under 400-450MPa, after sintering 1-2h at 1140-1180 DEG C, after be cooled to 860-900 DEG C
30min is kept, continues to be cooled to 450-460 DEG C, keep 30min, treat natural cooling, obtain final product the electronic device metallic composite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510907920.6A CN106853521A (en) | 2015-12-09 | 2015-12-09 | Electronic device metallic composite and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510907920.6A CN106853521A (en) | 2015-12-09 | 2015-12-09 | Electronic device metallic composite and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106853521A true CN106853521A (en) | 2017-06-16 |
Family
ID=59132136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510907920.6A Pending CN106853521A (en) | 2015-12-09 | 2015-12-09 | Electronic device metallic composite and preparation method thereof |
Country Status (1)
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| CN (1) | CN106853521A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107698972A (en) * | 2017-10-18 | 2018-02-16 | 徐宏伟 | A kind of joint of robot self-lubricating material and its preparation technology |
| CN109295394A (en) * | 2018-09-18 | 2019-02-01 | 安徽省众文重科新材料有限公司 | A kind of Ceramo-steel and its manufacturing method |
-
2015
- 2015-12-09 CN CN201510907920.6A patent/CN106853521A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107698972A (en) * | 2017-10-18 | 2018-02-16 | 徐宏伟 | A kind of joint of robot self-lubricating material and its preparation technology |
| CN109295394A (en) * | 2018-09-18 | 2019-02-01 | 安徽省众文重科新材料有限公司 | A kind of Ceramo-steel and its manufacturing method |
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| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170616 |