CN106852005A - A kind of method that application calixarenes makes printed circuit board - Google Patents
A kind of method that application calixarenes makes printed circuit board Download PDFInfo
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- CN106852005A CN106852005A CN201710103611.2A CN201710103611A CN106852005A CN 106852005 A CN106852005 A CN 106852005A CN 201710103611 A CN201710103611 A CN 201710103611A CN 106852005 A CN106852005 A CN 106852005A
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- Prior art keywords
- calixarenes
- circuit board
- printed circuit
- liquid
- substrate
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of method that application calixarenes makes printed circuit board, it comprises the following steps：A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and continue stirring can obtain calixarenes solution；B) under normal temperature and pressure, liquid copper slurry and calixarenes solution are separately added into the container with dispersal device, and continue dispersion, then discharge to obtain one-step print liquid；C) treatment such as drilled to substrate, cleaned, and substrate is placed on screen printer；D) in the screen printer that gained printed liquid is added, and one-step print liquid is embrocated to substrate formation printing liquid layer；E) gained substrate is placed in baking box and is toasted, then printed circuit board can be obtained after natural cooling.The method feature of environmental protection that application calixarenes of the invention makes printed circuit board is strong, the adhesive force on substrate that can improve copper particle and reduce conducting wire impedance.
Description
Technical field
The present invention relates to a kind of manufacture field of printed circuit board, it is specifically a kind of not only there is good environmental-protecting performance but also
Possesses the method that the application calixarenes of excellent quality stability makes printed circuit board.
Background technology
As economic continues to develop, printed circuit board is also increasingly wide in the application of the industries such as household electrical appliance, industrial electronic
It is general.Because printed circuit board has processing cost, extremely strong industrial repeatability, automaticity and life that electronic product can be greatly reduced
Efficiency advantage higher is produced, so it is favored by vast electrical equipment, electron trade producer deeply.However, existing printed circuit board
There are two great technological deficiencies in production process.First, traditional printed circuit board is generally processed using Subtraction method, its
Mainly it is made up of operations such as cleaning, press mold, development, etching and stripings.Due to the Reusability industrial chemicals on base material plate body, because
And the environmental contaminants of substantial amounts of heavy metal, high concentrated acid, alkali etc. can be produced in the process of printed circuit board.When above-mentioned
When pollutant is directly discharged toward the external world, the ecological environment around its meeting heavy damage, so traditional printed circuit board production category
Heavily contaminated processing industry.Second, the technique of traditional Subtraction method production printed circuit board (PCB) can not only consume substantial amounts of metal money
Source, can also consume the substantial amounts of energy, and need to carry out environmental protection treatment to waste material in following process.So, Subtraction method adds
Work printed circuit board is a kind of industry of labour's highly dense, in addition to it is more the step of there is whole processing,
Also need to carry out a certain degree of staff operation in processing, cause the production cost of printed circuit board (PCB) all the time can not significantly under
Drop, and its processing efficiency is relatively low.
In order to solve the problems, such as that pollutant discharge amount is larger, the silk-screen printing technique of circuit board is occurred in that in the market.
It utilizes printing plate that the line map of electrically conductive ink is printed to substrate, and small copper particle is solidificated in electrically conductive ink by plating
On, so as to form the conducting wire on substrate.As Chinese patent literature CN102612269A discloses a kind of all print printing electricity
The preparation method of road plate, it utilizes the principle of silk-screen printing that the line map that electrically conductive ink is constituted is printed to substrate, and passes through
Electroplating line figure makes copper particle adhere on line map, to form conductive circuit diagram on substrate.Although the method can be from one
Determine to solve the problems, such as that pollutant is largely discharged in degree, but, although although plating belongs to electrochemical process, copper particle is still
It is to realize that it is fixed on substrate by the way of physical adherence, thus adhesive force of the copper particle on substrate is relatively low.Meanwhile, copper
Simple substance can be directly exposed in the external world when sticking to substrate, cause the circuit of circuit board to be easy to occur aoxidizing come off with copper particle
Situation, so as to considerably increase the impedance of circuit.Therefore, the adhesive force of copper particle and substrate how had both been improved, can have been reduced again
The impedance of circuit, is always the significant technology issues of printed circuit board (PCB) manufacture field.
In fact, when in the manufacturing process of printed circuit board, occurring the feelings of conducting wire broken string due to manufacturing deficiency
Condition often occurs.Traditional solution is that printed circuit board is placed on independent benefit line machine, first removes the protection on circuit
Oil, then strikes off the copper particle around at broken string, then carries out mending line operation.But, traditional benefit line method equally occurs benefit
The copper particle relatively low problem of adhesive force on substrate again at line, and mend the operation of line and need individually to carry out, so as to cause printed circuit
The processing efficiency of plate declines to a great extent.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided a kind of feature of environmental protection is strong and can improve copper particle and exists
The method that the application calixarenes of the adhesive force on substrate makes printed circuit board.
Another object of the present invention is to overcome the deficiencies in the prior art, there is provided a kind of conduction that can effectively prevent on substrate
There is the method that the application calixarenes of oxidation makes printed circuit board in circuit.
What goal of the invention of the invention was realized in：A kind of method that application calixarenes makes printed circuit board, it is special
Levy and be：The method for making printed circuit board comprises the following steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and are persistently stirred
Calixarenes solution is obtained by mixing 5-30 minutes, calixarenes mass percent in the solution is 1-20%；
B) under normal temperature and pressure, liquid copper slurry and a steps gained calixarenes solution are separately added into the appearance with dispersal device
In device, and persistently disperse under 400-900 revs/min of speed 10-40 minutes, then discharge to obtain one-step print liquid, one-step print
Copper particle and the mass ratio of calixarenes are (2-8) in liquid:1；
(2) substrate pre-treatment
C) treatment such as drilled to substrate according to line requirements, cleaned, and substrate is placed on the screen printing table of screen printer；
(3) the circuit printing of substrate
D) in b step gained printed liquid being added the screen printer of step c, and one-step print liquid is embrocated according to line requirements
Printing liquid layer is formed on to substrate；
E) Step d gained substrate is placed in baking box, is toasted 30-240 minutes at 100-200 DEG C, then natural cooling
The printed circuit board that calixarenes can be utilized to make after to room temperature.
Furtherly, the calixarenes in step a be cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons in one kind or with
Arbitrary proportion mixes.
Furtherly, cup [4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；
Cup [8] aromatic hydrocarbons is to tert-butyl-calix [8] aromatic hydrocarbons.
Furtherly, the organic solvent in step a is the one kind or mixed with arbitrary proportion in toluene, dimethylbenzene or styrene
Close.
Furtherly, after the completion of step e, at normal temperatures and pressures, liquid copper slurry and a steps gained calixarenes solution point
In not adding the container with dispersal device, and persistently disperse under 600-1200 revs/min of speed 20-60 minutes, then discharge
Secondary printing liquid is obtained, copper particle and the mass ratio of calixarenes are (9-15) in secondary printing liquid:1；Printed circuit board is placed in again
On the screen printing table of screen printer, and toward addition secondary printing liquid in screen printer, two are carried out to printed circuit board according still further to line requirements
Secondary printing.
Furtherly, after the completion of secondary printing, gained substrate is placed in baking box, is toasted at 120-200 DEG C
100-300 minutes, then by naturally cooling to after room temperature printed circuit board.
Furtherly, copper slurry is nanosized copper slurry in step b, and the particle diameter of copper particle is 50-90 nanometers.
The present invention is improved to the production technology of the printed circuit board of prior art, and its advantage is as follows：
1st, during application calixarenes of the invention makes the method for printed circuit board, calixarenes is employed as copper particle in base
Carrier on plate.First, calixarenes have multidimensional can complexed active key, its except can with baseplate material occur complex reaction
Outward, moreover it is possible to be complexed the copper particle in copper slurry, the attachment structure of two-way complexing is formed.The two-way chelation structure can make copper particle exist
Complexing power on substrate persistently by chemical bond rank is acted on, and is truly realized copper particle being connected chemically on non-metal base plate,
So as to greatly improving adhesive force of the copper particle on substrate, it is to avoid the feelings for coming off occurs on the circuit for printing in copper particle
Condition.Secondly, calixarenes itself has the adjustable molecule cavity of size, can be according to copper particle when complex reaction is produced with copper particle
Particle size adjust the receiving space of molecule cavity, to eliminate the space steric effect between copper particle in complexing so that
Close-packed arrays of the copper particle on printing liquid layer are realized, uniform complex copper continuous phase is formed, substrate is greatly improved and is reached the standard grade
The electric conductivity on road.
2nd, during application calixarenes of the invention makes the method for printed circuit board, copper particle is on substrate in the way of being complexed
Formed with printing liquid layer and be connected chemically structure.First, this is connected chemically structure and can greatly improve copper particle in whole circuit board print
Utilization rate during system, effectively reduces the waste of copper particle, so as to reduce processing cost when circuit board prints.Secondly,
After being complexed with calixarenes, its chemical reactivity declines to a great extent copper particle, so as to effectively reduce copper particle exposed to air
The oxidation reaction of middle generation, it is to avoid conducting wire makes circuit produce the phenomenon of impedance increase because of oxidation, to ensure conducting wire
The stability and reliability of work.
3rd, during application calixarenes of the invention makes the method for printed circuit board, printed liquid employs calixarenes solution and liquid
The dispersion mixing of state copper slurry, makes printed liquid form the suspension system of copper particle.The system can lift copper particle in calixarenes
The uniformity of distribution, and the multidimensional that printed liquid is constituted between copper particle and calixarenes on substrate is complexed environment, it is effectively improved
Arranging density of the copper particle in unit area, so as to lift the electric conductivity of circuit.In addition, calixarenes solution can be to copper particle
Produce package action, it is to avoid copper particle is directly exposed to the external world, to reduce the oxidation activity of copper particle, so as to reduce line
The generation of the phenomenons such as road oxidation is dimmed, nigrescence.
4th, during application calixarenes of the invention makes the method for printed circuit board, after copper slurry is completed for printing, can be with
Secondary printing is carried out to substrate using copper particle content secondary printing liquid higher.Secondary printing can ensure copper particle and printed liquid
The completeness of complexing, and copper particle cavity, missing point of generation etc. in one-step print are repaired, so as to improve copper particle exist
Uniformity and compactness on substrate, improve the electric conductivity of circuit.
5th, during utilization calixarenes of the invention makes the method for printed circuit board, starched to printed circuit board using high concentration copper
Carry out secondary printing.First, the excessive copper particle starched by copper produces highdensity complex reaction with printed liquid, to repair in print
The defects such as open circuit, the circuit defect that circuit board processed is produced when processing, ensure that the complete of conducting wire on printed circuit board
Property and electric conductivity.Secondly, secondary printing can be carried out on the screen printer of initial production, so in printing without to printing
Circuit board carries out the operation such as extra positioning, calibration, significantly reduces the difficulty of circuit mending, so that effectively lifting printing electricity
The processing efficiency of road plate.
Specific embodiment
The method that application calixarenes of the invention makes printed circuit board, it is characterised in that：The making printed circuit board
Method comprise the following steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and are persistently stirred
Calixarenes solution is obtained by mixing 5-30 minutes, calixarenes mass percent in the solution is 1-20%；
B) under normal temperature and pressure, liquid copper slurry and a steps gained calixarenes solution are separately added into the appearance with dispersal device
In device, and persistently disperse under 400-900 revs/min of speed 10-40 minutes, then discharge to obtain one-step print liquid, one-step print
Copper particle and the mass ratio of calixarenes are (2-8) in liquid:1；
(2) substrate pre-treatment
C) treatment such as drilled to substrate according to line requirements, cleaned, and substrate is placed on the screen printing table of screen printer；
(3) the circuit printing of substrate
D) in b step gained printed liquid being added the screen printer of step c, and one-step print liquid is embrocated according to line requirements
Printing liquid layer is formed on to substrate；
E) Step d gained substrate is placed in baking box, is toasted 30-240 minutes at 100-200 DEG C, then natural cooling
The printed circuit board that calixarenes can be utilized to make after to room temperature.
Wherein, the calixarenes in step a is for the one kind in cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons or with any
Ratio mixes.The multidimensional having using calixarenes can complexed active structure, make its can respectively with baseplate material and copper slurry in
There is complex reaction in copper particle, form the two-way complexing attachment structure with calixarenes as basic point.The two-way chelation structure makes copper particle
Complexing power of the son persistently by chemical bond rank on substrate is acted on, and realizes copper particle being connected chemically on non-metal base plate,
So as to lifting adhesive force of the copper particle on substrate, it is to avoid situation about coming off occurs on the circuit for printing in copper particle.This
Outward, because cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons itself have the adjustable molecule cavity of size, produced with copper particle
The receiving space of molecule cavity can be adjusted during raw complex reaction according to the particle size of copper particle, it is achieved thereby that copper particle is in print
Close-packed arrays on brush liquid layer, form uniform complex copper continuous phase, improve the electric conductivity of circuit on substrate.In the present invention
In, cup [4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons is to uncle
Butyl cup [8] aromatic hydrocarbons.Said components have symmetrical chelation structure with phenyl ring as basic point, be effectively improved its respectively with baseplate material
The stability being complexed with copper particle.
In addition, the organic solvent in step a mixes for the one kind in toluene, dimethylbenzene or styrene or with arbitrary proportion.
Above-mentioned solvent has approximate benzene ring structure with calixarenes, and it can produce outstanding dissolving according to similar compatibility principle to calixarenes
Effect, so as to improve uniformity of the calixarenes in printed liquid.
Liquid copper slurry and calixarenes solution have been carried out dispersion mixing by step b of the invention, printed liquid is formed copper particle
The suspension system of son.The system can lift the uniformity that copper particle is distributed in calixarenes, and printed liquid is constituted on substrate
Multidimensional complexing environment between copper particle and calixarenes, is effectively improved arranging density of the copper particle in unit area, so as to carry
Rise the electric conductivity of circuit.In addition, calixarenes solution can produce package action to copper particle, it is to avoid copper particle is directly exposed to outer
Boundary, to reduce the oxidation activity of copper particle, so as to reduce the generation of the phenomenons such as circuit oxidation is dimmed, black.
After the completion of step e of the invention, under normal temperature and pressure environment, liquid copper slurry and a steps gained calixarenes
Solution is separately added into the container with dispersal device, and persistently disperses 20-60 minutes under 600-1200 revs/min of speed, so
After discharge to obtain secondary printing liquid, copper particle and the mass ratio of calixarenes are (9-15) in secondary printing liquid:1；Again printed circuit
Plate is placed on the screen printing table of screen printer, and toward addition secondary printing liquid in screen printer, according still further to line requirements to printed circuit board
Carry out secondary printing.By the ratio of copper particle and calixarenes using excessive complexing mode, enable copper particle as far as possible with cup
Aromatic hydrocarbons produces complex reaction, thus lifted copper particle after the completion of complexing than table density, with to the copper particle produced in one-step print
Sub- cavity, missing point etc. are repaired, and improve uniformity and compactness of the copper particle on substrate.
After the completion of secondary printing, gained substrate can be placed in baking box, and 100-300 is toasted at 120-200 DEG C
Minute, then naturally cool to printed circuit board can be obtained after room temperature.By lifting the basal temperature and baking time of baking, can carry
The complex reaction activity of copper particle and calixarenes in copper slurry is risen, makes to occur in whole complex system that density is high, fireballing network
Reaction is closed, and the space steric effect between copper particle in complexing can be eliminated, further lifting copper particle is on printing liquid layer
The compactness of arrangement.
Additionally, carrying out secondary printing to printed circuit board present invention utilizes high concentration copper slurry.The excess copper starched by copper
Particle produces highdensity complex reaction with printed liquid, to repair the open circuit produced when printed circuit board is processed, circuit defect
Etc. defect, the integrality and electric conductivity of conducting wire on printed circuit board are ensured that.Meanwhile, secondary printing can be first
Carried out on the screen printer of beginning production, so in printing without carry out the operation such as extra positioning, calibration to printed circuit board plate,
The difficulty of circuit mending is significantly reduced, so as to effectively lift the processing efficiency of printed circuit board.
In step e of the invention, copper slurry can use nanosized copper slurry, and the particle diameter of copper particle is 50-90 nanometers.Upper
State under particle size range, copper particle has extremely outstanding ductility, and with excellent mechanical performance.Additionally, the particle size range
Under copper particle be also equipped with the advantages of deformation is uniform, bonding strength is high, so as to assign circuit good inclusion characteristic, can improve logical
Bonding strength of the electric line on substrate.
Resistivity, adhesive force are carried out according to IPC-TM-650 standards respectively to the printed circuit board made by the use present invention
With welding performance test, printed circuit board (PCB) obtained in the method for this utilization invention in the conductive under of same units length, its
Resistivity is 1.5-12 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And in immersed solder experiment
Its wetting state is good and the phenomenon such as is bubbled, is layered, burns and changes colour without appearance after being heated at 250-280 DEG C.
Each embodiment for the method for making printed circuit board to present invention application calixarenes below is described in detail, but
Therefore do not limit the invention in the scope of embodiments：
Embodiment 1
The method for making printed circuit board of the invention comprises the following steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and are persistently stirred
Calixarenes solution is obtained by mixing 5 minutes, calixarenes mass percent in the solution is 1%；
B) under normal temperature and pressure, liquid copper slurry and a steps gained calixarenes solution are separately added into the appearance with dispersal device
In device, and persistently disperse under 400 revs/min of speed 10 minutes, then discharge to obtain one-step print liquid, copper particle in one-step print liquid
Son is 2 with the mass ratio of calixarenes:1；
(2) substrate pre-treatment
C) treatment such as drilled to substrate according to line requirements, cleaned, and substrate is placed on the screen printing table of screen printer；
(3) the circuit printing of substrate
D) in b step gained printed liquid being added the screen printer of step c, and one-step print liquid is embrocated according to line requirements
Printing liquid layer is formed on to substrate；
E) Step d gained substrate is placed in baking box, is toasted 30 minutes at 100 DEG C, then after naturally cooling to room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes in wherein step a is cup [4] aromatic hydrocarbons, and cup [4] aromatic hydrocarbons can use 4- tert-butyl group p tertButylcalixarenes；And
Organic solvent in step a can use toluene.
Additionally, after the completion of step e, under normal temperature and pressure environment, liquid copper slurry and a steps gained calixarenes solution point
In not adding the container with dispersal device, and persistently disperse under 600 revs/min of speed 20 minutes, then discharge to obtain secondary print
Brush liquid, copper particle and the mass ratio of calixarenes are 9 in secondary printing liquid:1；Printed circuit board is placed in again the screen printing table of screen printer
On, and toward addition secondary printing liquid in screen printer, secondary printing is carried out to printed circuit board according still further to line requirements.And work as secondary
After being completed for printing, gained substrate is placed in baking box, is toasted 100 minutes at 120 DEG C, then after naturally cooling to room temperature
Obtain printed circuit board.
In addition, copper slurry is nanosized copper slurry in step e, the particle diameter of copper particle is 90 nanometers.
Resistivity, adhesive force are carried out according to IPC-TM-650 standards respectively to the printed circuit board made by the use present invention
With welding performance test, printed circuit board (PCB) obtained in the method for this utilization invention in the conductive under of same units length, its
Resistivity is 12 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And it moistens in immersed solder experiment
Wet condition is good and the phenomenon such as is bubbled, is layered, burns and changes colour without appearance after being heated at 250 DEG C.
Embodiment 2
The method for making printed circuit board of the invention comprises the following steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and are persistently stirred
Calixarenes solution is obtained by mixing 30 minutes, calixarenes mass percent in the solution is 20%；
B) under normal temperature and pressure, liquid copper slurry and a steps gained calixarenes solution are separately added into the appearance with dispersal device
In device, and persistently disperse under 900 revs/min of speed 40 minutes, then discharge to obtain one-step print liquid, copper particle in one-step print liquid
Son is 8 with the mass ratio of calixarenes:1；
(2) substrate pre-treatment
C) treatment such as drilled to substrate according to line requirements, cleaned, and substrate is placed on the screen printing table of screen printer；
(3) the circuit printing of substrate
D) in b step gained printed liquid being added the screen printer of step c, and one-step print liquid is embrocated according to line requirements
Printing liquid layer is formed on to substrate；
E) Step d gained substrate is placed in baking box, is toasted 240 minutes at 200 DEG C, then after naturally cooling to room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes in wherein step a is the arbitrary proportion mixture of cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons.
Specifically, cup [4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons be
To tert-butyl-calix [8] aromatic hydrocarbons.And the organic solvent in step a is the arbitrary proportion mixture of toluene, dimethylbenzene or styrene.
Additionally, after the completion of step e, under normal temperature and pressure environment, liquid copper slurry and a steps gained calixarenes solution point
In not adding the container with dispersal device, and persistently disperse under 1200 revs/min of speed 60 minutes, then discharge to obtain secondary print
Brush liquid, copper particle and the mass ratio of calixarenes are 15 in secondary printing liquid:1；Printed circuit board is placed in again the silk-screen of screen printer
On platform, and toward addition secondary printing liquid in screen printer, secondary printing is carried out to printed circuit board according still further to line requirements.And when two
It is secondary be completed for printing after, gained substrate is placed in baking box, toasted 300 minutes at 200 DEG C, then naturally cool to after room temperature i.e.
Printed circuit board can be obtained.
In addition, copper slurry is nanosized copper slurry in step e, the particle diameter of copper particle is 50 nanometers.
Resistivity, adhesive force are carried out according to IPC-TM-650 standards respectively to the printed circuit board made by the use present invention
With welding performance test, printed circuit board (PCB) obtained in the method for this utilization invention in the conductive under of same units length, its
Resistivity is 1.5 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And it moistens in immersed solder experiment
Wet condition is good and the phenomenon such as is bubbled, is layered, burns and changes colour without appearance after being heated at 280 DEG C.
Embodiment 3
The method for making printed circuit board of the invention comprises the following steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and are persistently stirred
Calixarenes solution is obtained by mixing 15 minutes, calixarenes mass percent in the solution is 6%；
B) under normal temperature and pressure, liquid copper slurry and a steps gained calixarenes solution are separately added into the appearance with dispersal device
In device, and persistently disperse under 500 revs/min of speed 15 minutes, then discharge to obtain one-step print liquid, copper particle in one-step print liquid
Son is 3 with the mass ratio of calixarenes:1；
(2) substrate pre-treatment
C) treatment such as drilled to substrate according to line requirements, cleaned, and substrate is placed on the screen printing table of screen printer；
(3) the circuit printing of substrate
D) in b step gained printed liquid being added the screen printer of step c, and one-step print liquid is embrocated according to line requirements
Printing liquid layer is formed on to substrate；
E) Step d gained substrate is placed in baking box, is toasted 80 minutes at 140 DEG C, then after naturally cooling to room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes in wherein step a is cup [6] aromatic hydrocarbons and the arbitrary proportion mixture of cup [8] aromatic hydrocarbons.Specifically, cup
[6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons is to tert-butyl-calix [8] aromatic hydrocarbons.And the organic solvent in step a
It is toluene, the arbitrary proportion mixture of dimethylbenzene.
Additionally, after the completion of step e, under normal temperature and pressure environment, liquid copper slurry and a steps gained calixarenes solution point
In not adding the container with dispersal device, and persistently disperse under 700 revs/min of speed 30 minutes, then discharge to obtain secondary print
Brush liquid, copper particle and the mass ratio of calixarenes are 11 in secondary printing liquid:1；Printed circuit board is placed in again the silk-screen of screen printer
On platform, and toward addition secondary printing liquid in screen printer, secondary printing is carried out to printed circuit board according still further to line requirements.And when two
It is secondary be completed for printing after, gained substrate is placed in baking box, toasted 150 minutes at 140 DEG C, then naturally cool to after room temperature i.e.
Printed circuit board can be obtained.
In addition, copper slurry is nanosized copper slurry in step e, the particle diameter of copper particle is 80 nanometers.
Resistivity, adhesive force are carried out according to IPC-TM-650 standards respectively to the printed circuit board made by the use present invention
With welding performance test, printed circuit board (PCB) obtained in the method for this utilization invention in the conductive under of same units length, its
Resistivity is 10 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And it moistens in immersed solder experiment
Wet condition is good and the phenomenon such as is bubbled, is layered, burns and changes colour without appearance after being heated at 260 DEG C.
Embodiment 4
The method for making printed circuit board of the invention comprises the following steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and are persistently stirred
Calixarenes solution is obtained by mixing 20 minutes, calixarenes mass percent in the solution is 12%；
B) under normal temperature and pressure, liquid copper slurry and a steps gained calixarenes solution are separately added into the appearance with dispersal device
In device, and persistently disperse under 700 revs/min of speed 25 minutes, then discharge to obtain one-step print liquid, copper particle in one-step print liquid
Son is 5 with the mass ratio of calixarenes:1；
(2) substrate pre-treatment
C) treatment such as drilled to substrate according to line requirements, cleaned, and substrate is placed on the screen printing table of screen printer；
(3) the circuit printing of substrate
D) in b step gained printed liquid being added the screen printer of step c, and one-step print liquid is embrocated according to line requirements
Printing liquid layer is formed on to substrate；
E) Step d gained substrate is placed in baking box, is toasted 160 minutes at 150 DEG C, then after naturally cooling to room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes in wherein step a is cup [4] aromatic hydrocarbons and the arbitrary proportion mixture of cup [8] aromatic hydrocarbons.Specifically, cup
[4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [8] aromatic hydrocarbons is to tert-butyl-calix [8] aromatic hydrocarbons.And the organic solvent in step a
It is toluene and the arbitrary proportion mixture of styrene.
Additionally, after the completion of step e, under normal temperature and pressure environment, liquid copper slurry and a steps gained calixarenes solution point
In not adding the container with dispersal device, and persistently disperse under 900 revs/min of speed 40 minutes, then discharge to obtain secondary print
Brush liquid, copper particle and the mass ratio of calixarenes are 12 in secondary printing liquid:1；Printed circuit board is placed in again the silk-screen of screen printer
On platform, and toward addition secondary printing liquid in screen printer, secondary printing is carried out to printed circuit board according still further to line requirements.And when two
It is secondary be completed for printing after, gained substrate is placed in baking box, toasted 200 minutes at 180 DEG C, then naturally cool to after room temperature i.e.
Printed circuit board can be obtained.
In addition, copper slurry is nanosized copper slurry in step e, the particle diameter of copper particle is 70 nanometers.
Resistivity, adhesive force are carried out according to IPC-TM-650 standards respectively to the printed circuit board made by the use present invention
With welding performance test, printed circuit board (PCB) obtained in the method for this utilization invention in the conductive under of same units length, its
Resistivity is 8 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And its wetting in immersed solder experiment
State is good and the phenomenon such as is bubbled, is layered, burns and changes colour without appearance after being heated at 270 DEG C.
Embodiment 5
The method for making printed circuit board of the invention comprises the following steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and are persistently stirred
Calixarenes solution is obtained by mixing 25 minutes, calixarenes mass percent in the solution is 16%；
B) under normal temperature and pressure, liquid copper slurry and a steps gained calixarenes solution are separately added into the appearance with dispersal device
In device, and persistently disperse under 800 revs/min of speed 35 minutes, then discharge to obtain one-step print liquid, copper particle in one-step print liquid
Son is 7 with the mass ratio of calixarenes:1；
(2) substrate pre-treatment
C) treatment such as drilled to substrate according to line requirements, cleaned, and substrate is placed on the screen printing table of screen printer；
(3) the circuit printing of substrate
D) in b step gained printed liquid being added the screen printer of step c, and one-step print liquid is embrocated according to line requirements
Printing liquid layer is formed on to substrate；
E) Step d gained substrate is placed in baking box, is toasted 220 minutes at 180 DEG C, then after naturally cooling to room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes in wherein step a is the arbitrary proportion mixture of cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons.
Specifically, cup [4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons be
To tert-butyl-calix [8] aromatic hydrocarbons.And the organic solvent in step a is the arbitrary proportion mixture of toluene, dimethylbenzene or styrene.
Additionally, after the completion of step e, under normal temperature and pressure environment, liquid copper slurry and a steps gained calixarenes solution point
In not adding the container with dispersal device, and persistently disperse under 1000 revs/min of speed 50 minutes, then discharge to obtain secondary print
Brush liquid, copper particle and the mass ratio of calixarenes are 14 in secondary printing liquid:1；Printed circuit board is placed in again the silk-screen of screen printer
On platform, and toward addition secondary printing liquid in screen printer, secondary printing is carried out to printed circuit board according still further to line requirements.And when two
It is secondary be completed for printing after, gained substrate is placed in baking box, toasted 260 minutes at 190 DEG C, then naturally cool to after room temperature i.e.
Printed circuit board can be obtained.
In addition, copper slurry is nanosized copper slurry in step e, the particle diameter of copper particle is 60 nanometers.
Resistivity, adhesive force are carried out according to IPC-TM-650 standards respectively to the printed circuit board made by the use present invention
With welding performance test, printed circuit board (PCB) obtained in the method for this utilization invention in the conductive under of same units length, its
Resistivity is 6 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And its wetting in immersed solder experiment
State is good and the phenomenon such as is bubbled, is layered, burns and changes colour without appearance after being heated at 280 DEG C.
Claims (7)
1. a kind of method that application calixarenes makes printed circuit board, it is characterised in that：The method for making printed circuit board
Comprise the following steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added into the container with agitating device, and continue to stir 5-
Calixarenes solution can be obtained within 30 minutes, calixarenes mass percent in the solution is 1-20%；
B) under normal temperature and pressure, liquid copper slurry and a steps gained calixarenes solution are separately added into the container with dispersal device,
And persistently disperse under 400-900 revs/min of speed 10-40 minutes, then discharge to obtain one-step print liquid, copper in one-step print liquid
Particle is (2-8) with the mass ratio of calixarenes:1；
(2) substrate pre-treatment
C) treatment such as drilled to substrate according to line requirements, cleaned, and substrate is placed on the screen printing table of screen printer；
(3) the circuit printing of substrate
D) in b step gained printed liquid being added the screen printer of step c, and one-step print liquid is embrocated to base according to line requirements
Printing liquid layer is formed on plate；
E) Step d gained substrate is placed in baking box, is toasted 30-240 minutes at 100-200 DEG C, then naturally cool to room
The printed circuit board that calixarenes can be utilized to make after temperature.
2. the method that application calixarenes makes printed circuit board according to claim 1, it is characterised in that：In the step a
Calixarenes mix for the one kind in cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons or with arbitrary proportion.
3. the method that application calixarenes makes printed circuit board according to claim 2, it is characterised in that：Cup [4] virtue
Hydrocarbon is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons is to tert-butyl-calix [8] virtue
Hydrocarbon.
4. the method that application calixarenes makes printed circuit board according to claim 1, it is characterised in that：In the step a
Organic solvent mix for the one kind in toluene, dimethylbenzene or styrene or with arbitrary proportion.
5. the method that application calixarenes makes printed circuit board according to claim 1, it is characterised in that：The step e is complete
Liquid copper slurry and a steps gained calixarenes solution, at normal temperatures and pressures, are separately added into the container with dispersal device by Cheng Hou
In, and persistently disperse under 600-1200 revs/min of speed 20-60 minutes, then discharge to obtain secondary printing liquid, secondary printing liquid
Middle copper particle is (9-15) with the mass ratio of calixarenes:1；Printed circuit board is placed on the screen printing table of screen printer again, and past silk
Secondary printing liquid is added in print machine, secondary printing is carried out to printed circuit board according still further to line requirements.
6. the method that application calixarenes makes printed circuit board according to claim 5, it is characterised in that：The secondary printing
After the completion of, gained substrate is placed in baking box, toasted 100-300 minutes at 120-200 DEG C, then after naturally cooling to room temperature
Printed circuit board can be obtained.
7. the method that application calixarenes makes printed circuit board according to claim 1, it is characterised in that：In the step e
Copper slurry is nanosized copper slurry, and the particle diameter of copper particle is 50-90 nanometers.
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| CN201710103611.2A CN106852005B (en) | 2017-02-24 | 2017-02-24 | A method of printed circuit board is made using calixarenes |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642362A (en) * | 1984-01-30 | 1987-02-10 | Loctite (Ireland) Limited | Polymer bound calixarenes |
| CN101525745A (en) * | 2009-04-03 | 2009-09-09 | 四川大学 | Metal surface treatment agent and printed wiring board with protecting film formed thereby |
| CN102414343A (en) * | 2009-04-30 | 2012-04-11 | 法国原子能及替代能源委员会 | Method for preparing a metallised substrate, the resulting substrate and the uses thereof |
| JP2012230896A (en) * | 2011-04-13 | 2012-11-22 | Sekisui Chem Co Ltd | Anisotropic conductive material and connection structure |
| JP2013067097A (en) * | 2011-09-22 | 2013-04-18 | Dainippon Printing Co Ltd | Water transfer printing film, and method of manufacturing decorative molding using the same |
| US20130098870A1 (en) * | 2011-09-29 | 2013-04-25 | Jsr Corporation | Method for forming pattern |
| JP2014024977A (en) * | 2012-07-27 | 2014-02-06 | Dic Corp | Curable resin composition, cured product and printed wiring board |
-
2017
- 2017-02-24 CN CN201710103611.2A patent/CN106852005B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642362A (en) * | 1984-01-30 | 1987-02-10 | Loctite (Ireland) Limited | Polymer bound calixarenes |
| CN101525745A (en) * | 2009-04-03 | 2009-09-09 | 四川大学 | Metal surface treatment agent and printed wiring board with protecting film formed thereby |
| CN102414343A (en) * | 2009-04-30 | 2012-04-11 | 法国原子能及替代能源委员会 | Method for preparing a metallised substrate, the resulting substrate and the uses thereof |
| JP2012230896A (en) * | 2011-04-13 | 2012-11-22 | Sekisui Chem Co Ltd | Anisotropic conductive material and connection structure |
| JP2013067097A (en) * | 2011-09-22 | 2013-04-18 | Dainippon Printing Co Ltd | Water transfer printing film, and method of manufacturing decorative molding using the same |
| US20130098870A1 (en) * | 2011-09-29 | 2013-04-25 | Jsr Corporation | Method for forming pattern |
| JP2014024977A (en) * | 2012-07-27 | 2014-02-06 | Dic Corp | Curable resin composition, cured product and printed wiring board |
Non-Patent Citations (1)
| Title |
|---|
| 张卫等: "杯芳烃--一种打印线路的粘固剂", 《印制电路信息》 * |
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