CN106848551A - Antenna pattern frame and the manufacture method for possessing this casting of electronic device - Google Patents
Antenna pattern frame and the manufacture method for possessing this casting of electronic device Download PDFInfo
- Publication number
- CN106848551A CN106848551A CN201610245203.6A CN201610245203A CN106848551A CN 106848551 A CN106848551 A CN 106848551A CN 201610245203 A CN201610245203 A CN 201610245203A CN 106848551 A CN106848551 A CN 106848551A
- Authority
- CN
- China
- Prior art keywords
- antenna pattern
- pattern part
- casting
- electronic device
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
Abstract
The present invention discloses a kind of antenna pattern frame and possesses the manufacture method of this casting of electronic device, including：Radiator frame manufactured, is sent and reception signal with connecting end sub-portion with the circuit substrate with electronic equipment；And antenna pattern part, the connecting end sub-portion is connected to, it is laminated on the radiator frame manufactured by means of thermal transfer ink layer.
Description
Technical field
The present invention relates to a kind of antenna pattern frame and the manufacture method of the casting of electronic device for possessing this.
Background technology
Support mobile phone, PDA (Personal Digital Assistant), navigator, the notes of wireless telecommunications
The mobile communication terminals such as this computer are devices indispensable in modern society.The hair of the mobile communication terminal
Exhibition trend is additional CDMA (Code Division Multiple Access), WLAN, GSM
(Global System for Mobile Communications)、DMB(Digital Multimedia
The function such as Broadcasting), and realize that one of most important part of these functions is exactly antenna.
In addition, being built-in with the casting of electronic device of integral antenna recently in the mill.
But, in order to by above-mentioned built-in antenna in casting of electronic device, and the method for using insert injection moulding,
But this mode has manufacture yield reduction, the problem that manufacturing cost rises.
The content of the invention
The present invention provides a kind of antenna pattern frame and tool that can be improved and manufacture yield and reduce manufacturing cost
Standby this casting of electronic device.
The antenna pattern frame of an embodiment of the invention includes：Radiator frame manufactured, with connection end
Sub-portion, sends and receives signal with the circuit substrate with electronic equipment；Antenna pattern part, is connected to institute
Connecting end sub-portion is stated, the radiator frame manufactured is laminated on by means of thermal transfer ink layer.
According to the present invention, with can improve manufacture yield and reduce the effect of manufacturing cost.
Brief description of the drawings
Fig. 1 is the approximate three-dimensional map of the antenna pattern frame for showing an embodiment of the invention.
Fig. 2 is cuing open for the antenna pattern part of the antenna pattern frame for showing an embodiment of the invention
View.
Fig. 3 is the electronic equipment shell of the antenna pattern frame for showing to be embedded with an embodiment of the invention
The approximate three-dimensional map of body.
Fig. 4 to Fig. 7 is the manufacturer for illustrating the casting of electronic device of an embodiment of the invention
The process chart of method.
Reference numeral
100：Antenna pattern frame 120：Radiator frame manufactured
122：Connecting end sub-portion 140：Antenna pattern part
200：Casting of electronic device
Specific embodiment
Hereinafter, the form that is preferable to carry out of the invention is illustrated referring to the drawings.But, reality of the invention
Applying form can be changed into various different shapes, and the scope of the present invention is not limited to the embodiment of following explanation.
Also, embodiment of the invention is carried out to give the personnel for having prevailing foundation knowledge in the art
More complete explanation and provide.In order to more clearly illustrate, the shape of the inscape in accompanying drawing and big
It is small etc. to be shown by exaggeration.
Fig. 1 is the approximate three-dimensional map of the antenna pattern frame for showing an embodiment of the invention.
Reference picture 1, the antenna pattern frame 100 of an embodiment of the invention is configured to may include：
Radiator frame manufactured 120 and antenna pattern frame 140.
Radiator frame manufactured 120 has connecting end sub-portion 122, so as to the circuit substrate with electronic equipment (not
Diagram) send or receive signal.Connecting end sub-portion 122 plays a part of terminal, by what is received
External signal is sent to electronic equipment, and is contacted with antenna pattern part 140.
That is, connecting end sub-portion 122 is connected to antenna pattern part 140 and plays by antenna pattern part
140 external signals for being received are sent to the effect of electronic equipment.
As an example of connecting end sub-portion 122, can be in radiator frame manufactured 120 by means of inserts
Injection is formed.That is, a part for connecting end sub-portion 122 is buried to radiator frame manufactured 120, its remaining part
Divide to be protruded from radiator frame manufactured 120 and formed.
Antenna pattern part 140 is connected to connecting end sub-portion 122 and radiation is laminated in by means of thermal transfer
Body framework 120.Antenna frame part 140 plays the signal for receiving external signal and being transferred to electronic equipment
The effect of processing unit (not shown), can have the antenna diagram for forming folding line (Meander line)
Case portion, to receive the signal of various wave bands.
Also, antenna pattern part 140 can be formed as with by its embedded casting of electronic device 200
The corresponding three-dimensional structure of regional area shape.So as to the shape of antenna pattern part 140 is not limited to Fig. 1
In the shape that shows, various deformation can be carried out.
And then, antenna pattern part 140 is embedded in electronics and sets when casting of electronic device 200 is shaped to
Standby housing 200 is without being externally exposed, but connecting end sub-portion 122 can be from casting of electronic device 200
It is externally exposed, the circuit substrate (not shown) of electronic equipment is connected in shaping.
In addition, an example as shown in Figure 2, antenna pattern part 140 is configured to include：Adhesive phase
142nd, metal level 144, coating layer 146, heterosphere 148, film layer 150.
Adhesive phase 142 is played makes the fixed engagement of antenna pattern part 140 in the work of radiator frame manufactured 120
With.Adhesive phase 142 can be formed by the material that can be solidified by means of thermal transfer.That is, adhesive
Layer 142 can be formed by following material, be glued by means of the heat transmitted from thermoelectron fixture 10 described later
Together in the thermosets being cured after radiator frame manufactured 120.
Metal level 144 is laminated on adhesive phase 142.Metal level 144 is by the conductive material shape such as aluminium or copper
Into and play receive external signal and be transferred to mobile communication terminal etc electronic equipment signal processing device
The effect put.Therefore, metal level 144 is connected to the connecting end sub-portion 122 for being formed at radiator frame manufactured 120.
Coating layer 146 is layered on metal level 144, while the damage of metal level 144 is prevented, can
With the color identical color with radiator frame manufactured 120, or can have be clearly distinguishable from radiant body frame
The color of frame 120.
Heterosphere 148 is laminated on coating layer 146 and plays and separate coating layer 146 and film layer 150
Effect.Heterosphere 148 can be by easily engageable to film while coating layer 146 are easily laminated in
The material of layer 150 is formed.
Make the upper surface of antenna pattern part 140 that there is the work of smooth-shaped in addition, film layer 150 is played
With as an example, being formed by synthetic resin material (PET etc.).
As described above, antenna pattern part 140 is laminated in by means of thermal transfer is integrally formed with connection
The radiator frame manufactured 120 of portion of terminal 122, it is possible to while manufacturing cost is reduced, can improve
Manufacture yield.
Fig. 3 is the electronic equipment shell for showing the antenna pattern frame that an embodiment of the invention is embedded with
The approximate three-dimensional map of body.
Reference picture 3, antenna pattern frame 100 is embedded in the inside of casting of electronic device 200 and sets.That is,
After casting of electronic device 200 can set antenna pattern frame 100 on injection mould for insert, by embedding
Part injection moulding.
Also, the antenna pattern part 140 of antenna pattern frame 100 is arranged in radiator frame manufactured and electronics
Without being externally exposed between apparatus casing 200.
But, the external terminal portions 122 being integrally formed with radiator frame manufactured 120 are exposed to electronic equipment
The outside of housing 200 and be connected to the circuit substrate of electronic equipment.
Hereinafter, the manufacture method referring to the drawings to the casting of electronic device of an embodiment of the invention is entered
Row explanation.
Fig. 4 to Fig. 7 is the manufacturer for illustrating the casting of electronic device of an embodiment of the invention
The process chart of method.
First, as shown in figure 4, making spoke by injection moulding in the way of embedded connecting end sub-portion 122
Beam framework 120 is molded.Used as an example, the bottom of connecting end sub-portion 122 can protrude from spoke
The bottom surface of beam framework 120, and upper surface is exposed to the upper surface of radiator frame manufactured 120.
Connecting end sub-portion 122 can be formed by conductive materials such as aluminium or copper, and radiator frame manufactured 120 can be by
Synthetic resin material is formed.
Then, as shown in figure 5, preparing to be arranged it for forming the pad S of antenna pattern part
Between thermal transfer fixture 10 and radiator frame manufactured 120.
In addition, being formed with shape corresponding with the shape of antenna pattern part in thermal transfer fixture 10
Protuberance 12.In addition, as shown in figure 5, the marginal position of protuberance 12 tartly can form to cut
Open the pad S for forming antenna pattern part.That is, in order to be based on for forming antenna pattern part
Pad S forms antenna pattern part 140, and the marginal position of protuberance 12 can be formed as the cutting edge of a knife or a sword such as the knife edge
Profit.
Also, for the part that the marginal position for being inserted in protuberance 12 is tartly formed, radiator frame manufactured
Groove 124 is could be formed with 120.
And then, thermal transfer fixture 10 is being connected to thermal source (not shown), is forming antenna pattern part afterwards
When 140, play a part of to transfer heat to the pad S for forming antenna pattern part.
Though also, it is not shown in figures, could be arranged to：In the shape of fixed thermal transfer fixture 10
Under state, pad S and radiator frame manufactured 120 for forming antenna pattern part are liftably arranged at system
Make apparatus main body (not shown)；Or for forming the pad S and thermal transfer fixture of antenna pattern part
10 can be lifted with being fixed on the state of radiator frame manufactured 120.
As described above, by thermal transfer fixture 10, using thermal transfer, from for forming antenna pattern part
Pad S antenna pattern part 140 is formed in radiator frame manufactured 120.
That is, as shown in fig. 6, so that antenna pattern part 140 is connected to the connection of radiator frame manufactured 120
The mode of portion of terminal 122, antenna pattern part 140 is laminated in radiator frame manufactured 120.
Hereafter, as shown in fig. 7, in order that being laminated with the radiator frame manufactured 120 of antenna pattern part 140
Inside is embedded in, casting of electronic device 200 passes through insert injection molding.
As described above, being made antenna pattern part 140 be laminated in the company of being integrally formed with by means of thermal transfer
The radiator frame manufactured 120 in connecting terminal portion 122, it is possible to can also be carried while manufacturing cost is reduced
Height manufacture yield.
That is, antenna pattern part 140 is not formed at radiator frame manufactured 120 by insert injection moulding,
But be laminated in radiator frame manufactured 120 by simple thermal transfer operation, therefore can be manufactured reducing
Manufacture yield can also be improved while cost.
More than, one embodiment of the invention has been described in detail, but interest field of the invention is not
It is limited to this, in the personnel that correlative technology field has general knowledge, this hair can be not being departed from
Various modifications and deformation are carried out in the range of bright technological thought, this is self-evident.
Claims (16)
1. a kind of antenna pattern frame, it is characterised in that including：
Radiator frame manufactured, with connecting end sub-portion, sends and receives letter with the circuit substrate with electronic equipment
Number；And
Antenna pattern part, is connected to the connecting end sub-portion, and the radiation is laminated on by means of thermal transfer ink layer
Body framework.
2. antenna pattern frame as claimed in claim 1, it is characterised in that
The antenna pattern part includes：
Metal level, is formed by conductive materials；
Adhesive phase, is laminated in the metal level.
3. antenna pattern frame as claimed in claim 2, it is characterised in that
The antenna pattern part also includes：
Coating layer, is laminated on the metal level.
4. antenna pattern frame as claimed in claim 2, it is characterised in that
The antenna pattern part also includes：
Film layer, is arranged in the coating layer top.
5. antenna pattern frame as claimed in claim 2, it is characterised in that
The antenna pattern part also includes：
Heterosphere, is arranged between the film layer and the coating layer.
6. antenna pattern frame as claimed in claim 1, it is characterised in that
The connecting end sub-portion is embedded in by the radiator frame manufactured of insert injection molding.
7. the manufacture method of a kind of electronic equipment housing, it is characterised in that comprise the following steps：
To make connecting end sub-portion by embedded mode, by insert injection molding radiator frame manufactured；
In the way of to be connected to the connecting end sub-portion, antenna pattern part is laminated on institute by thermal transfer ink layer
State in radiator frame manufactured；And
Make the radiator frame manufactured by embedded mode to cover a face of the radiator frame manufactured, make
Case frame is molded.
8. the manufacture method of casting of electronic device as claimed in claim 7, it is characterised in that
In the step of being laminated the stacking antenna pattern part, will using the heat transmitted from thermal transfer fixture
The thermal transfer film is laminated in the radiator frame manufactured.
9. the manufacture method of casting of electronic device as claimed in claim 8, it is characterised in that
Protuberance corresponding with the shape of the antenna pattern part is formed with the thermal transfer fixture.
10. the manufacture method of casting of electronic device as claimed in claim 9, it is characterised in that
The marginal portion of the protuberance is tartly formed, to form antenna pattern part；
Groove is formed with the radiator frame manufactured, to insert the marginal portion of the protuberance.
The manufacture method of 11. casting of electronic device as claimed in claim 7, it is characterised in that
The antenna pattern part includes：
Metal level, is formed by conductive materials；
Adhesive phase, is laminated in the metal level.
The manufacture method of 12. casting of electronic device as claimed in claim 11, it is characterised in that
The antenna pattern part also includes：
Coating layer, is laminated on the metal level.
The manufacture method of 13. casting of electronic device as claimed in claim 11, it is characterised in that
The antenna pattern part also includes：
Film layer, is arranged in the coating layer top.
The manufacture method of 14. casting of electronic device as claimed in claim 11, it is characterised in that
The antenna pattern part also includes：
Heterosphere, is arranged between the film layer and the coating layer.
The manufacture method of 15. casting of electronic device as claimed in claim 11, it is characterised in that
The metal level includes at least one material in aluminium, copper and constitutes.
The manufacture method of 16. casting of electronic device as claimed in claim 11, it is characterised in that
Described adhesive layer is formed by thermosets.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0172375 | 2015-12-04 | ||
| KR1020150172375A KR20170065953A (en) | 2015-12-04 | 2015-12-04 | Antenna pattern frame and method for manufacturing case of electronic device having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106848551A true CN106848551A (en) | 2017-06-13 |
Family
ID=59145225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610245203.6A Pending CN106848551A (en) | 2015-12-04 | 2016-04-19 | Antenna pattern frame and the manufacture method for possessing this casting of electronic device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20170065953A (en) |
| CN (1) | CN106848551A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102642862B1 (en) * | 2022-06-07 | 2024-03-04 | (주)케스피온 | An antenna module and wireless communication device having the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988257A (en) * | 2005-12-21 | 2007-06-27 | 北京金辰西科尼安全印务有限公司 | Process for producing radio-frequency antenna by thermoprinting-mould cutting |
| CN101373854A (en) * | 2007-08-22 | 2009-02-25 | 三星电机株式会社 | Film type antenna, case structure, and method of manufacturing the same |
| CN101796687A (en) * | 2007-06-13 | 2010-08-04 | 世界产权公司 | Antenna with thermally transferred element |
| CN102290631A (en) * | 2010-06-15 | 2011-12-21 | 深圳富泰宏精密工业有限公司 | Electronic device shell and production method thereof |
| CN103871909A (en) * | 2012-12-18 | 2014-06-18 | Imec公司 | A method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package |
-
2015
- 2015-12-04 KR KR1020150172375A patent/KR20170065953A/en not_active Application Discontinuation
-
2016
- 2016-04-19 CN CN201610245203.6A patent/CN106848551A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988257A (en) * | 2005-12-21 | 2007-06-27 | 北京金辰西科尼安全印务有限公司 | Process for producing radio-frequency antenna by thermoprinting-mould cutting |
| CN101796687A (en) * | 2007-06-13 | 2010-08-04 | 世界产权公司 | Antenna with thermally transferred element |
| CN101373854A (en) * | 2007-08-22 | 2009-02-25 | 三星电机株式会社 | Film type antenna, case structure, and method of manufacturing the same |
| CN102290631A (en) * | 2010-06-15 | 2011-12-21 | 深圳富泰宏精密工业有限公司 | Electronic device shell and production method thereof |
| CN103871909A (en) * | 2012-12-18 | 2014-06-18 | Imec公司 | A method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170065953A (en) | 2017-06-14 |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170613 |
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| WD01 | Invention patent application deemed withdrawn after publication |