CN106842432B - A kind of novel optical fiber array and preparation method thereof - Google Patents
A kind of novel optical fiber array and preparation method thereof Download PDFInfo
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- CN106842432B CN106842432B CN201710092343.9A CN201710092343A CN106842432B CN 106842432 B CN106842432 B CN 106842432B CN 201710092343 A CN201710092343 A CN 201710092343A CN 106842432 B CN106842432 B CN 106842432B
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- optical fiber
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- shaped groove
- cover board
- shape slot
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000000835 fiber Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000011521 glass Substances 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 7
- 229920013657 polymer matrix composite Polymers 0.000 claims abstract description 5
- 239000011160 polymer matrix composite Substances 0.000 claims abstract description 5
- 238000005253 cladding Methods 0.000 claims abstract description 4
- 238000000520 microinjection Methods 0.000 claims description 10
- 238000003754 machining Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000005300 metallic glass Substances 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 5
- 239000007791 liquid phase Substances 0.000 claims description 5
- 208000030208 low-grade fever Diseases 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 238000004781 supercooling Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 2
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- 238000004891 communication Methods 0.000 abstract description 3
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- 238000010586 diagram Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 3
- -1 borosilicate Chemical compound 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 229920006324 polyoxymethylene Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229920000491 Polyphenylsulfone Polymers 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- OANVFVBYPNXRLD-UHFFFAOYSA-M propyromazine bromide Chemical compound [Br-].C12=CC=CC=C2SC2=CC=CC=C2N1C(=O)C(C)[N+]1(C)CCCC1 OANVFVBYPNXRLD-UHFFFAOYSA-M 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000000347 anisotropic wet etching Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000013308 plastic optical fiber Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920012287 polyphenylene sulfone Polymers 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
- G02B6/364—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves inverted grooves, e.g. dovetails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
Abstract
The present invention proposes a kind of novel optical fiber array and preparation method thereof, including V-shaped groove substrate, cover board and optical fiber, V-shaped groove substrate and fiber fixed seat are integrally formed, the upper surface of V-shaped groove substrate is provided with an evenly distributed column V-shaped groove, it arranges and is configured in V-groove after the cladding of optical fiber removal end, cover board is covered in above V-shaped groove substrate, and V-shaped groove substrate, optical fiber and cover board are adhered to one, the thickness of V-shaped groove substrate is greater than the thickness of fiber fixed seat, and V-shaped groove substrate is equipped with the inclined-plane that an angle is the angle α close to the side of fiber fixed seat and fiber fixed seat upper surface.Simple production process of the invention reduces the difficulty of processing of fiber array；Encapsulation uses ultrasonic precision welding technique；Existing silicon substrate and glass material are replaced using low-shrinkage high-weatherability polymer matrix composite, makes that the process-cycle of fiber array is short, manufacturing cost is low, product qualification rate is high, is suitble to promote and apply in fiber optic communication field.
Description
Technical field
The present invention relates to a kind of novel optical fiber array substrates, are mainly used in the planar optical waveguide device of optical-fibre communications field
Part.
Background technique
Fiber array has very extensive application in integrated optical device, optical imagery and detection system, for light
Device is learned, the coupling between optical fiber and chip is all a great problem, this is because the alignment precision requirement of coupling is very stringent.V
Type groove is also known as fiber array substrate, is the basis of the optical passive components such as fiber array, collimator, PLC splitter, wavelength division multiplexer
Component.
Currently, producing fiber array V-shaped type groove both at home and abroad there are two main classes technique:
The silicon wafer of the first kind, use processes V-groove as the method for substrate wet etching, and the method uses the skill of photoetching
Art, anisotropic wet etching silicon wafer are not machined caused accumulated error, therefore precision is not limited by V slot number, benefit
The characteristics of with the anisotropy of silicon wafer, the V groove shape corroded out is consistent；But the V rooved face wetability after corroding is poor, if in group
Without surface treatment before dress fiber array, glue and the poor contact of V slot can be made, cause bubble and optical fiber and V slot caking property
It can be poor.
Second class, using the method for machining, needed for the method is cut on the glass sheet using diamond dust cutter
V slot, glass is at low cost, but diamant is worn in cutting process, needs continuous reconditioning, and the diamant of abrasion also leads to V flute profile
Shape changes, and is not able to satisfy required precision；When making the V-groove of multichannel, when such as larger than 32 slot, due to constantly accumulating for equipment
Error is greater than the cost of the V-groove in 32 channels very using mechanical means processing so as to cause precision reduction, yield decline
It is high.China has grasped a whole set of processing technology of fiber array machining, but groove cutting equipment and ultraviolet glue domesticize not yet,
Cause processing cost higher.
Summary of the invention
The purpose of the present invention is in view of the above shortcomings of the prior art, propose a kind of novel optical fiber array and its preparation side
Method.
The technical scheme of the present invention is realized as follows: a kind of novel optical fiber array, including V-shaped groove substrate, cover board and light
Fibre, V-shaped groove substrate and fiber fixed seat are integrally formed, and the upper surface of V-shaped groove substrate is provided with an evenly distributed column V-shaped groove,
It arranging and is configured in V-groove after the cladding of optical fiber removal end, cover board is covered in above V-shaped groove substrate, and V-shaped groove substrate,
Optical fiber and cover board are adhered to one, and the thickness of V-shaped groove substrate is greater than the thickness of fiber fixed seat, and V-shaped groove substrate leans on dipped beam
The angle α that the side and fiber fixed seat upper surface of fine fixing seat are formed is obtuse angle, and the cover board lower edge is close to V-shaped groove substrate
Place is equipped with chamfering.
The V-shaped groove substrate and fiber fixed seat are that polymer matrix composite is integrally formed.
The angle α is 135 °.
The chamfering of the cover board lower edge is 30 °.
A kind of novel optical fiber array preparation method, it is characterised in that include the following steps:
A. fiber array V-shaped type groove is obtained using machining or silicon etching method；
B. hot-forming, duplication V-groove is carried out in the low feature of supercooling liquid phase region viscosity using glassy metal；
C. design, processing and the assembly of microinjection molding are carried out；
D. the block metal glass insert embedded template that V-groove array structure will be had, constitutes micro-mould type chamber；
E. fiber array is injection moulded using low-grade fever press or microinjection machine.
The application prepares V-groove in supercooling liquid phase region using the superplastic forming technology of Pd base or Zr bast block metal glass
Mold abaculus, or nickel and nickel alloy die insert are obtained using galvanoplastics, V-groove mold abaculus is packed into template, mould
Plate can arrange a multi-cavity mold, be injected into using microinjection machine and micro injection molding technique using thermoplastic as injected plastics material
Plastic fiber array.Simple production process of the invention reduces the difficulty of processing of fiber array；Encapsulation is using ultrasonic wave essence
Close welding technique, high-cost glue package before substitution；It is replaced using low-shrinkage high-weatherability polymer matrix composite
Existing silicon substrate and glass material, make that the process-cycle of fiber array is short, manufacturing cost is low, product qualification rate is high, are suitble in light
Fiber communication promotes and applies in field.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is stereoscopic schematic diagram of the invention.
Fig. 2 is main view of the invention.
Fig. 3 is the left view of Fig. 2.
Fig. 4 is the structural schematic diagram of V-groove glass mold.
Fig. 5 is light array V-groove schematic illustration.
Fig. 6 is thermoplastic molding's glassy metal mold insert and polymer V-groove schematic illustration.
The molded plastic optical fiber array of Fig. 7 low-grade fever.
Fig. 8 is the fiber array V-shaped type groove structure figure in a variety of channels.
Fig. 9 is fiber array V-shaped type groove scale diagrams.
Figure 10 is fiber array packaging fixture schematic diagram.
Figure 11 is that fiber array encapsulates front-end geometry variation schematic diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under that premise of not paying creative labor
Embodiment shall fall within the protection scope of the present invention.
As shown in Figures 1 to 3, a kind of novel optical fiber array, including V-shaped groove substrate 1, cover board 2 and optical fiber 3, V-shaped groove substrate 1
It is integrally formed with fiber fixed seat 4, the upper surface of V-shaped groove substrate 1 is provided with an evenly distributed column V-shaped groove 5, and optical fiber 3 removes
It arranges and is configured in V-groove 5 after the cladding of end, cover board 2 is covered in 1 top of V-shaped groove substrate, and V-shaped groove substrate 1, optical fiber 3
It is adhered to one with cover board 2, the thickness of V-shaped groove substrate 1 is greater than the thickness of fiber fixed seat 4, and V-shaped groove substrate 1 leans on dipped beam
The angle α that the side and 4 upper surface of fiber fixed seat of fine fixing seat are formed is obtuse angle, and 2 lower edge of cover board is close to V-shaped groove base
Chamfering is equipped at plate.
α is that obtuse angle is mainly when be packaged fiber, optical fiber with from V slot come out to fiber fixed seat 4 have one it is gentle
Transition.
The V-shaped groove substrate 1 is that polymer matrix composite is integrally formed with fiber fixed seat 4.
The angle α is 135 °.
The chamfering of 2 lower edge of cover board is 30 °.Chamfering as obtuse angle alpha use, optical fiber with from V slot come out to light
Fine fixing seat 4 has a gentle transition.Dispensing can also be given, and there are certain spaces.
In the application, the production method of plastic optical fiber array V-groove includes the following steps:
A. fiber array V-shaped type groove is obtained using machining or silicon etching method, principle is as illustrated in Figures 5 and 6；Such as Fig. 8
It is shown, the V-groove in different channels, such as 32 channels, 16 channels can be prepared；Fiber array V-shaped type groove specific size such as Fig. 9 and
Shown in table 1；
The various port number fiber array reference dimensions of table 1
B. hot-forming, duplication V-groove, obtained V are carried out in the low feature of supercooling liquid phase region viscosity using glassy metal
Type groove glass mold is as shown in Figure 4；
C. design, processing and the assembly of microinjection molding are carried out；
D. the block metal glass insert embedded template that V-groove array structure will be had, constitutes micro-mould type chamber；
E. it is injection moulded fiber array using low-grade fever press or microinjection machine, as shown in Figure 7.
In the application, using glassy metal superplastic forming processing or use electroforming process that mold, ruler is prepared
Very little error is in 2 μm.Cover board is identical as the basic size of V-groove and matches.
The storage temperature and operating temperature of fiber array are -40 DEG C~+85 DEG C, in order to ensure polymer light fibre array has
Enough strength and stiffness, it is necessary to use the higher polymer of glass transition temperature, prevent polymer in operating temperature range
It is interior to enter elastomeric state.In addition, the linear expansion coefficient of usually polymer is higher than the materials such as quartz glass, borosilicate, silicon, therefore in order to
Guarantee dimensional accuracy, it is necessary to use the lower polymer of linear expansion coefficient, make polymer light fibre array due to variation of ambient temperature
The scale error of generation controls within the scope of required precision.Amid all these factors, it can be used for preparing the polymer of fiber array
Material has: polymethyl methacrylate (PMMA), polycarbonate (PC), polyformaldehyde (Polyoxymethylene, POM), polyphenyl
Thioether (Polyphenylene sulfide, PPS), polyphenylsulfone (Polyphenylene sulfone, PPSU), polyetherimide
(Polyetherimide, PEI), polyether-ether-ketone (Polyetheretherketone, PEEK), polybutylene terephthalate (PBT)
(Polybutyleneterephthalate, PBT), polyphenylene oxide (Polyphenylether, PPE), polyamidoimide
(Polyamide-imide, PAI) etc..
In order to reduce the thermal expansion coefficient of resin, product size stability is provided, needs to fill out by filling inorganic or metal
Expect thermal expansion system during (filling quality ratio is generally 40% or more) reduces shrinking percentage and military service in forming process
Number.
Usual situation lower cover plate and V slot are packaged by dedicated ultraviolet glue, and the present invention also proposes a kind of using super
Sonic soldering connects the structure design being packaged, and as shown in Figure 10, cover board 2, which is equipped with, leads energy band 11, and it is recessed that V-shaped groove substrate 1 is equipped with welding
Slot 12 can use high-frequency low-power ultrasonic vibration and realize fast packing.
Soldering tip 7 can transmit ultrasonic wave while play the role of constraining cover board 6；8 be V slot array, and lower mold 9 is for fixing V
Slot array, optical fiber 3 are fixed on the optical fiber in V slot.Structure before (a) is welding in Figure 11,11 is lead energy band, are (b) welding
Structure later.The welding groove frictional fusion leading energy band 11 and surpassing under high-frequency ultrasonic effect with V on cover board, makes to contact
The fusion of interfacial polymerization object, links together after cooling, realizes the encapsulation of cover board and V slot array.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of novel optical fiber array, including V shape slot substrate (1), cover board (2) and optical fiber (3), it is characterised in that: V shape slot
Substrate (1) and fiber fixed seat (4) are integrally formed, and the upper surface of V shape slot substrate (1) is provided with an evenly distributed column V shape
Slot (5) is arranged and is configured in the V type groove (5) after the cladding of optical fiber (3) removal end, and cover board (2) is covered in V shape slot substrate
(1) top, and V shape slot substrate (1), optical fiber (3) and cover board (2) are adhered to one, the thickness of V shape slot substrate (1) is greater than light
The thickness of fine fixing seat (4), and V shape slot substrate (1) is close to the side and fiber fixed seat (4) upper surface of fiber fixed seat
The angle α of formation is obtuse angle, and cover board (2) lower edge is equipped with chamfering at V shape slot substrate；Novel optical fiber array be by
According to following step preparation:
A. fiber array V-shaped type groove is obtained using machining or silicon etching method；
B. hot-forming, duplication V-groove is carried out in the low feature of supercooling liquid phase region viscosity using glassy metal；
C. design, processing and the assembly of microinjection molding are carried out；
D. the block metal glass insert embedded template that V-groove array structure will be had, constitutes micro-mould type chamber；
E. fiber array is injection moulded using low-grade fever press or microinjection machine.
2. the novel optical fiber array according to claim 1, it is characterised in that: the V shape slot substrate (1) and optical fiber are solid
Reservation (4) is that polymer matrix composite is integrally formed.
3. the novel optical fiber array according to claim 1, it is characterised in that: the angleαIt is 135 °.
4. the novel optical fiber array according to claim 1, it is characterised in that: the chamfering of cover board (2) lower edge is
30 °。
5. novel optical fiber array according to claim 1, it is characterised in that there is one 8 ° of oblique angle in V slot end face.
6. novel optical fiber array according to claim 1, it is characterised in that cover board (2) is equipped with and leads energy band (11), V shape slot
Substrate (1) is equipped with welding groove (12), can use high-frequency low-power ultrasonic vibration and realizes fast packing.
7. a kind of novel optical fiber array preparation method, it is characterised in that include the following steps:
A. fiber array V-shaped type groove is obtained using machining or silicon etching method；
B. hot-forming, duplication V-groove is carried out in the low feature of supercooling liquid phase region viscosity using glassy metal；
C. design, processing and the assembly of microinjection molding are carried out；
D. the block metal glass insert embedded template that V-groove array structure will be had, constitutes micro-mould type chamber；
E. fiber array is injection moulded using low-grade fever press or microinjection machine.
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| CN112171384B (en) * | 2020-09-07 | 2022-08-09 | 中国科学院上海硅酸盐研究所 | Polishing method of hundred-micron-diameter single crystal optical fiber |
| CN113650175A (en) * | 2021-08-26 | 2021-11-16 | 深圳鑫振华光电科技有限公司 | Cutting method for upper and lower cutting grooves of 2DV groove cover plate |
| CN116360032B (en) * | 2023-05-30 | 2023-09-08 | 武汉驿路通科技股份有限公司 | Optical fiber array without cover plate and preparation method thereof |
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| KR100476317B1 (en) * | 2002-10-24 | 2005-03-16 | 한국전자통신연구원 | Optical coupling device and method for fabricating the same, master for fabricating the optical coupling device and method for fabricating the same |
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| CN103278894A (en) * | 2013-06-14 | 2013-09-04 | 洛合镭信光电科技（上海）有限公司 | Coupling assembly, optical fiber array module using coupling assembly and optical transceiver engine module using coupling assembly |
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| CN1932569A (en) * | 2002-03-15 | 2007-03-21 | 日本电气硝子株式会社 | Optical fiber array substrate and method for producing the same |
| CN103207423A (en) * | 2012-01-13 | 2013-07-17 | 中国科学院物理研究所 | Metal glass optical grating and method and device for manufacturing same |
| CN102615820A (en) * | 2012-04-12 | 2012-08-01 | 中国科学院物理研究所 | Plastic hot stamping micro-molding mold taking metal glass as base body and preparation method |
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