CN106833403B - High-adhesion polymer film and application thereof - Google Patents

High-adhesion polymer film and application thereof Download PDF

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CN106833403B
CN106833403B CN201710138454.9A CN201710138454A CN106833403B CN 106833403 B CN106833403 B CN 106833403B CN 201710138454 A CN201710138454 A CN 201710138454A CN 106833403 B CN106833403 B CN 106833403B
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film material
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CN106833403A (en
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郑炯洲
林维红
梅云宵
曹明杰
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Hangzhou First Applied Material Co Ltd
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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Abstract

The invention discloses a high-adhesion polymer film and application, wherein the high-adhesion polymer film consists of an adhesive layer and a base layer, wherein the adhesive layer consists of 100 parts by weight of first main body resin, 0-10 parts by weight of cross-linking agent, 0-10 parts by weight of auxiliary cross-linking agent, 0.001-0.1 part by weight of anti-heat-oxygen aging agent, 0.001-0.1 part by weight of light stabilizer and 0.1-2 parts by weight of first modification auxiliary agent; the base layer consists of 100 parts by weight of second main body resin, 0.1-10 parts by weight of hydrolysis stabilizer, 0.001-0.1 part by weight of anti-heat-oxygen aging agent, 0.01-0.1 part by weight of light stabilizer and a second modification auxiliary agent; the film disclosed by the invention has good cohesiveness to tin wires, copper wires and battery pieces, and also has high light transmittance, excellent dimensional stability, mechanical property and aging resistance, so that the reliability of the photovoltaic module in outdoor long-term application is guaranteed.

Description

High-adhesion polymer film and application thereof
Technical Field
The invention belongs to the field of photovoltaic materials, and particularly relates to a polymer film for fixing a crystalline silicon multi-fine grid cell and application thereof.
Background
With the increasing deterioration of global air quality, renewable energy sources are receiving more and more attention. Renewable energy power generation is power generation using a variety of inexhaustible and renewable energy sources that are not exhausted during the history of human life. Generally refers to hydroelectric power generation, wind power generation, biomass power generation, solar power generation, ocean power generation, geothermal power generation and the like. Among them, solar power generation is a technology of directly converting light energy into electric energy by using a photovoltaic effect of a semiconductor interface.
At present, solar power generation has the advantages that hydroelectric power generation, thermal power generation and nuclear power generation do not have, such as wide resource distribution, no noise, good stability, low maintenance cost, no pollution due to quick installation in any place, complete cleanness and the like. In addition, the solar power generation is absolutely clean and does not produce public nuisance, so the solar power generation is praised as an ideal energy source. However, solar power generation has disadvantages that the energy distribution density of solar irradiation is small, the annual power generation time is low and is only 1300 hours on average, the influence of weather conditions such as seasons, day and night, cloudy and sunny conditions is large, and the manufacturing cost is 40000-60000 yuan/kW higher than the system cost. In order to enable the solar power generation to really reach the national use level, not only a government is required to assist in issuing a preferential incentive policy in the aspect of power grid networking, but also innovative development is required to be carried out on the aspect of improving the solar photoelectric conversion efficiency and reducing the cost by improving the supply side end.
The solar cell mainly comprises a crystalline silicon cell and a polycrystalline silicon cell, and the solar cell mainly comprises an amorphous silicon solar cell, a copper indium gallium selenide solar cell and a cadmium telluride solar cell. The monocrystalline silicon and polycrystalline silicon solar cells have the characteristics of mature manufacturing technology, stable product performance, long service life and relatively high photoelectric conversion efficiency, and are still the mainstream of the solar cells. Among them, the photoelectric conversion efficiency of the single crystal silicon solar cell is the highest in the solar cell, and can be up to 15% or more, and up to 25%, but the manufacturing cost is high. The photoelectric conversion efficiency of the polycrystalline silicon solar cell is more than 13%, and the manufacturing cost is lower than that of the monocrystalline silicon solar cell, so that the polycrystalline silicon solar cell is greatly developed.
The main structure of the crystalline silicon battery can be divided into a back electrode, a silicon wafer base region, an emitter, a passivation antireflection layer and a positive electrode grid line. The traditional positive electrode grid line comprises thin grid lines which are uniformly and densely distributed and three to five main grid lines which are perpendicular to the thin grid lines, and is generally prepared by silver paste screen printing. The positive grid line of the structure has larger diameter, so that the light receiving area is reduced, and the efficiency of the battery is greatly improved; and the silver paste is large in dosage and high in cost, so that the manufacturing cost of the photovoltaic module is not further reduced.
Therefore, on the basis of not influencing the current collection efficiency, the improvement of the positive electrode grid line is carried out to further reduce the light shielding area of the cell and reduce the consumption of silver paste, and the improvement is an important development direction of the cell interconnection technology. If the silver main grid of the battery is replaced by a plurality of fine copper wires plated with special plating layers and the interconnection of the battery pieces is realized through the copper wires, the light receiving area of the battery can be greatly increased, and the consumption of silver paste is reduced. The technology is applied to an N-type PERT double-sided battery and a heterojunction HIT battery, the power can be improved to 6-8W, the material cost is reduced, the manufacturing cost can be further reduced, the product competitiveness is improved, and therefore the technology can gradually replace a conventional crystalline silicon battery. However, the technical difficulty lies in that dozens of fine copper wires are laid on the battery piece and welded with the fine grid wires, and a layer of base material is required for pre-arranging and fixing the copper wires and supporting and positioning the copper wires in the welding process. In addition to grid line technology, the choice of the base material used to secure the grid lines plays a very critical role. Therefore, a material with excellent light transmission performance needs to be developed, and the material has excellent bonding performance with tin wires, copper wires and battery pieces, has good heat-resistant dimensional stability, and simultaneously meets the requirements of moisture and heat resistance and ultraviolet aging resistance of a photovoltaic material in long-term outdoor use.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the high-adhesion polymer film, the adhesive layer has good adhesion to tin, copper wires and battery pieces through the optimized design of a composite structure, and the substrate layer has excellent dimensional stability, mechanical property and aging resistance. Can be used for fixing the multi-fine grid cell.
The purpose of the invention is realized by the following technical scheme: a high-adhesion polymer film material comprises an adhesive layer and a substrate layer; the thickness of the polymer bonding layer is 5-100 microns, and the polymer bonding layer is composed of 100 parts by weight of first main body resin, 0-10 parts by weight of cross-linking agent, 0-10 parts by weight of auxiliary cross-linking agent, 0.001-0.1 part by weight of anti-thermal-oxidative aging agent, 0.001-0.1 part by weight of light stabilizer and 0.1-2 parts by weight of first modification auxiliary agent; the first main body resin is copolymerized by a mixture of ethylene and one or more of propylene, butylene, pentene, octene, vinyl acetate, butadiene, styrene and maleic anhydride according to any proportion;
the thickness of the base layer is 5-100 microns, and the base layer is composed of 100 parts by weight of second main body resin, 0.1-10 parts by weight of hydrolysis stabilizer, 0.001-0.1 part by weight of anti-thermal-oxidative aging agent, 0.01-0.1 part by weight of light stabilizer and 2-5 parts by weight of second modification auxiliary agent; the second main body resin is formed by mixing one or more of polyamide, polyethylene terephthalate, polytrimethylene terephthalate, polybutylene naphthalate, polymethyl methacrylate, polycyclohexylenedimethylene terephthalate, polystyrene and polytrimethylene terephthalate according to any proportion.
Further, the cross-linking agent is formed by mixing one or more of benzoyl peroxide, butylcumyl peroxide, 2, 5-dimethyl-2, 5-bis (benzoylperoxy) -hexane, ethyl 3, 3-bis (t-butylperoxy) butyrate, o-t-butyl-o-isopropyl-mono-peroxycarbonate, N-butyl 4, 4-di (t-butylperoxy) valerate, ethylene glycol dimethacrylate, divinylbenzene, trimethylpropane trimethacrylate, pentaerythritol triacrylate, tetraethylsilane, N-methylenebisacrylamide in any ratio.
Further, the auxiliary crosslinking agent is formed by mixing one or more of 1,3, 5-triallyl-s-triazine-2, 4, 6-trione, N' -m-phenyl bismaleimide, trimethylolpropane triacrylate, 1, 2-polybutadiene, triallyl isocyanate, diallyl phthalate, triallyl cyanurate and triallyl isocyanurate according to any proportion.
Further, the thermal-oxidative aging resistant agent is prepared by mixing one or more of 2, 2-methylene-bis- (4-methyl-6-tert-butyl) phenol, 1,3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl), 3, 5-di-tert-butyl-4-hydroxy-benzoic acid hexadecyl ester, distearyl pentaerythritol diphosphite and bisphenol A bis (diphenyl phosphate) according to any proportion.
Further, the light stabilizer is prepared by mixing one or more of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, bis-1-decyloxy-2, 2,6, 6-tetramethylpiperidin-4-ol sebacate, a compound of N, N' -bis (2,2,6, 6-tetramethyl-4-piperidyl) -1, 6-hexanediamine and 2, 4-dichloro-6-6 (4-morpholinyl) -1,3, 5-triazine and methyl-1, 2,2,6, 6-pentamethyl-4-piperidyl sebacic acid according to any proportion.
Furthermore, the first modification auxiliary agent is composed of one or more of vinyltrimethoxysilane, vinyltri (beta-methoxyethoxy) silane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltriisopropenoxysilane and methyl vinyldiethoxysilane according to any proportion.
Further, the hydrolysis stabilizer is formed by mixing one or more of a monomer carbodiimide hydrolysis stabilizer, poly [ nitrilomethane tetraazanyl [2,4, 6-tri (1-methylethyl) -1, 3-phenylene ], oxazoline compound hydrolysis stabilizer and epoxy compound hydrolysis stabilizer according to any ratio.
Further, the second modification auxiliary agent is formed by mixing one or more of isopropyl tri (isostearoyl) titanate, isopropyl tri (dioctyl pyrophosphate) titanate, di (dioctyl pyrophosphate) oxoacetate titanium, tetraisopropyl di (dilauryl phosphite) titanate, di (dioctyl pyrophosphate) ethylene titanate, isopropyl tri (dodecylbenzenesulfonyl) titanate and isopropyl tri (n-ethylamino) titanate according to any proportion.
Further, the tie layer and the substrate layer may both be made by melt coating, cast film or bi-layer coextrusion.
Further, the high-adhesion polymer film is used as a polycrystalline silicon cell photovoltaic module, particularly a photovoltaic module without a main grid cell, and the grid line is adhered and fixed on the cell sheet.
The invention has the beneficial effects that: according to the invention, by designing the formula system and the composite structure of the bonding layer and the substrate layer, the tin wire, the copper wire and the battery piece are well bonded, the visible light-near infrared region has high light transmittance of more than 90%, and the mechanical property, the heat-resistant dimensional stability, the long-term aging resistance and the like are excellent, so that the tin wire, the copper wire and the battery piece are suitable for industrial popularization.
Detailed Description
The present invention is further specifically described below with reference to examples, but is not limited thereto.
Example 1:
the thickness of the polymer bonding layer is 30 micrometers, and the polymer bonding layer comprises the following components in parts by weight:
100 parts of ethylene vinyl acetate copolymer (DuPont, USA) with a VA content of 30% by mass are added with 0.1 part of vinyltrimethoxysilane (Bailingwei technology Co., Ltd.), 0.01 part of butylcumyl peroxide (Bailingwei technology Co., Ltd.), 0.1 part of trimethylolpropane triacrylate (Bailingwei technology Co., Ltd.), 0.01 part of 2, 2-methylene-bis- (4-methyl-6-tert-butyl) phenol (Tianda Tianhai technology development Co., Ltd.), 0.01 part of bis-2, 2,6, 6-tetramethylpiperidinol sebacate (Shanghai Jia plasting Co., Ltd.), and mixed uniformly by a high-speed mixer at a stirring speed of 10000 r/min.
The thickness of the polymer matrix layer is 30 micrometers, and the polymer matrix layer comprises the following components in parts by weight:
to 100 parts of PET (Sichuan Dong material) were added 0.1 part of poly [ nitrilomethane tetraazanyl [2,4, 6-tris (1-methylethyl) -1, 3-phenylene ], 0.01 part of 2, 2-methylene-bis- (4-methyl-6-t-butyl) phenol (Tianda Tianhai science and technology development Co., Ltd.), 0.02 part of bis-2, 2,6, 6-tetramethylpiperidinol sebacate (German BASF), 2 parts of isopropyl tris (n-ethylamino) titanate (Bailingwei science and technology Co., Ltd.), and the mixture was mixed uniformly at a stirring speed of 10000r/min by means of a high-speed mixer.
The polymeric tie layer and polymeric base film layer of the present invention may be made by melt coating.
Example 2:
the thickness of the polymer bonding layer is 30 micrometers, and the polymer bonding layer comprises the following components in parts by weight:
to 100 parts of an ethylene-propylene copolymer (DuPont, USA) were added 3 parts of vinyltriisopropenoxysilane, (Bailingwei science Co., Ltd.), 1 part of o-tert-butyl-o-isopropyl-mono-peroxycarbonate (Bailingwei science Co., Ltd.), 5 parts of 1, 2-polybutadiene (avastin reagent), 0.05 part of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate (avastin reagent), 0.05 part of a complex of N, N' -bis (2,2,6, 6-tetramethyl-4-piperidyl) -1, 6-hexanediamine and 2, 4-dichloro-6-6 (4-morpholinyl) -1,3, 5-triazine (avastin reagent), the mixture was uniformly mixed by a high speed mixer at a mixing speed of 10000 r/min.
The thickness of the polymer matrix layer is 30 micrometers, and the polymer matrix layer comprises the following components in parts by weight:
100 parts of PET (Sichuan dong material), 5 parts of oxazoline compound hydrolysis stabilizer (an alatin reagent), 0.05 part of 3, 5-di-tert-butyl-4-hydroxy-benzoic acid hexadecyl ester (an alatin reagent), 0.05 part of a compound of N, N' -bis (2,2,6, 6-tetramethyl-4-piperidyl) -1, 6-hexanediamine and 2, 4-dichloro-6-6 (4-morpholinyl) -1,3, 5-triazine (Bailingwei science and technology Co., Ltd.), and 3 parts of isopropyl tris (dodecylbenzenesulfonyl) titanate (Bailingwei science and technology Co., Ltd.) are added and mixed uniformly by a high-speed mixer at a stirring speed of 10000 r/min.
The polymeric tie layer and the polymeric base film layer of the present invention may be prepared by double layer coextrusion.
Example 3:
the thickness of the polymer bonding layer is 30 micrometers, and the polymer bonding layer comprises the following components in parts by weight:
to an ethylene vinyl acetate copolymer (DuPont, USA) having a VA content of 30%, 4 parts of vinyltris (. beta. -methoxyethoxy) silane (Bailingwei science Co., Ltd.), 3 parts of 2, 5-dimethyl-2, 5-bis (benzoylperoxy) -hexane (Aladdin reagent), 4 parts of triallyl isocyanate (Aladdin reagent), 0.08 part of bisphenol A bis (diphenyl phosphate) (Bailingwei science Co., Ltd.), 0.08 part of methyl-1, 2,2,6, 6-pentamethyl-4-piperidyl sebacic acid (Aladdin reagent) were added, and they were mixed uniformly by a high-speed mixer at a stirring speed of 10000 r/min.
The thickness of the polymer matrix layer is 30 micrometers, and the polymer matrix layer comprises the following components in parts by weight:
to 100 parts of a copolymer of propylene and methyl methacrylate, 2 parts of poly [ nitrilomethane tetraazao [2,4, 6-tris (1-methylethyl) -1, 3-phenylene ], 0.05 part of 2, 2-methylene-bis- (4-methyl-6-tert-butyl) phenol, 0.06 part of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, and 3 parts of isopropyl tris (n-ethylamino) titanate (welength scientific co., ltd.) were added, and the mixture was uniformly mixed by a high-speed mixer at a stirring speed of 10000 r/min.
The polymeric tie layer and polymeric base film layer of the present invention may be made by melt coating.
Example 4:
the thickness of the polymer bonding layer is 30 micrometers, and the polymer bonding layer comprises the following components in parts by weight:
to 100 parts of an ethylene-butadiene copolymer (DuPont, USA), 3 parts of vinyltrimethoxysilane (Bailingwei science and technology Co., Ltd.), 0.05 part of butylcumyl peroxide, 2 parts of trimethylolpropane triacrylate, 0.05 part of 2, 2-methylene-bis- (4-methyl-6-t-butyl) phenol, and 0.05 part of bis-2, 2,6, 6-tetramethylpiperidinol sebacate were added and mixed uniformly by a high-speed mixer at a stirring speed of 10000 r/min.
The thickness of the polymer matrix layer is 30 micrometers, and the polymer matrix layer comprises the following components in parts by weight:
to 100 parts of a copolymer of propylene and styrene were added 3 parts of poly [ nitrilomethane tetraazayl [2,4, 6-tris (1-methylethyl) -1, 3-phenylene ] (avastin reagent), 0.06 part of 2, 2-methylene-bis- (4-methyl-6-tert-butyl) phenol (carbofuran technologies, Ltd.), 0.05 part of bis-2, 2,6, 6-tetramethylpiperidinol sebacate (carbofuran technologies, Ltd.), 4 parts of isopropyl tris (n-ethylamino) titanate (carbofuran technologies, Ltd.), and the mixture was mixed uniformly at a stirring rate of 10000r/min by means of a high-speed mixer.
The tie layer and polymer base film layer of the present invention may be prepared by double layer coextrusion.
Comparative example 1:
the thickness of the polymer bonding layer is 30 micrometers, and the polymer bonding layer comprises the following components in parts by weight:
100 parts of ethylene vinyl acetate copolymer (DuPont, USA) with the VA content of 30% by mass are added with 0.1 part of vinyl trimethoxy silane (Bailingwei science and technology Co., Ltd.), 0.01 part of butyl cumyl peroxide (Bailingwei science and technology Co., Ltd.), 0.1 part of trimethylolpropane triacrylate (Bailingwei science and technology Co., Ltd.), 0.01 part of 2, 2-methylene-bis- (4-methyl-6-tert-butyl) phenol (Tianda Tianhai science and technology development Co., Ltd.), 0.01 part of bis-2, 2,6, 6-tetramethyl piperidinol sebacate (Shanghai Yan Jia plasting Co., Ltd.), 0.1 part of ultraviolet absorbent 2-hydroxy-4-n-octyloxy benzophenone (Nanjing Zhongzhi science and technology Co., Ltd.), the mixture was uniformly mixed by a high speed mixer at a mixing speed of 10000 r/min.
The thickness of the polymer matrix layer is 30 micrometers, and the polymer matrix layer comprises the following components in parts by weight:
100 parts of PET (Sichuan Dong material) was added with 0.1 part of poly [ nitrilomethane tetraazayl [2,4, 6-tris (1-methylethyl) -1, 3-phenylene ], 0.01 part of 2, 2-methylene-bis- (4-methyl-6-tert-butyl) phenol (Tianda Tianhai science and technology development Co., Ltd.), 0.02 part of bis-2, 2,6, 6-tetramethylpiperidinol sebacate (German BASF), 2 parts of isopropyl tris (n-ethylamino) titanate (Bailingwei science and technology Co., Ltd.), and 0.1 part of a salicylic ester phenyl ester as an ultraviolet absorber (Nanjing Zhongzhi science and technology Co., Ltd.) and mixed uniformly at a stirring speed of 10000r/min by a high-speed mixer.
The polymeric tie layer and polymeric base film layer of the present invention may be made by melt coating.
Comparative example 2:
the thickness of the polymer bonding layer is 30 micrometers, and the polymer bonding layer comprises the following components in parts by weight:
to 100 parts of an ethylene-butadiene copolymer (DuPont, USA), 3 parts of vinyltrimethoxysilane (Bailingwei science and technology Co., Ltd.), 0.05 part of butylcumyl peroxide, 2 parts of trimethylolpropane triacrylate, 0.05 part of 2, 2-methylene-bis- (4-methyl-6-tert-butyl) phenol, 0.05 part of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, and 0.1 part of 2-hydroxy-4-n-octyloxybenzophenone as an ultraviolet absorber were added and mixed uniformly by a high-speed mixer at a stirring speed of 10000 r/min.
The thickness of the polymer matrix layer is 30 micrometers, and the polymer matrix layer comprises the following components in parts by weight:
to 100 parts of a copolymer of propylene and styrene, 3 parts of poly [ nitrilomethane tetraazayl [2,4, 6-tris (1-methylethyl) -1, 3-phenylene ] (avastin reagent), 0.06 part of 2, 2-methylene-bis- (4-methyl-6-tert-butyl) phenol (chlorothalocarb technologies co., ltd.), 0.05 part of bis-2, 2,6, 6-tetramethylpiperidinol sebacate (chlorothalocarb technologies co., ltd.), 4 parts of isopropyl tris (n-ethylamino) titanate (chlorothalocarb technologies co., ltd.) and 0.2 part of a uv absorber (2-hydroxy-4-methylphenyl) phenylketone were added and mixed uniformly by a high-speed mixer at a stirring speed of 10000 r/min.
The tie layer and polymer base film layer of the present invention may be prepared by double layer coextrusion.
The test evaluation method comprises the following steps:
1. light transmittance:
light transmittance and haze: the light transmittance and the haze of the transparent plastic are measured according to the specification of GB/T2410-2008 (measurement of the light transmittance and the haze of the transparent plastic), and the light transmittance is 300nm-1100 nm.
2. Yellowing index:
detection was carried out as specified in GB 2409-80.
3. Ultraviolet aging:
according to the specification of GBT-19394 and 2003. The transmittance, yellowness index (. DELTA.YI) of the samples after UV & DH aging for 120kwh was recorded.
4. Peel strength:
the test method refers to the national standard GB/T2790 adhesive 180 DEG peel strength test method flexible material to rigid material.
TABLE 1
Figure BDA0001242114570000071
The data in the table show that the film for the non-main gate battery has high light transmittance, good dimensional stability and small yellowing index after aging, achieves the purpose of the invention and can well meet the long-term application of the film in the crystalline silicon gate battery.

Claims (8)

1. The application of the high-adhesion polymer thin film material is characterized in that the high-adhesion polymer thin film material is used as a polycrystalline silicon cell photovoltaic module, and grid lines are adhered and fixed on a cell slice;
the high-adhesion polymer film material consists of an adhesive layer and a substrate layer; the thickness of the polymer bonding layer is 5-100 microns, and the polymer bonding layer is composed of 100 parts by weight of first main body resin, 0-10 parts by weight of cross-linking agent, 0-10 parts by weight of auxiliary cross-linking agent, 0.001-0.1 part by weight of anti-thermal-oxidative aging agent, 0.001-0.1 part by weight of light stabilizer and 0.1-2 parts by weight of first modification auxiliary agent; the first main body resin is copolymerized by a mixture of ethylene and one or more of propylene, butylene, pentene, octene, vinyl acetate, butadiene, styrene and maleic anhydride according to any proportion;
the thickness of the base layer is 5-100 microns, and the base layer is composed of 100 parts by weight of second main body resin, 0.1-10 parts by weight of hydrolysis stabilizer, 0.001-0.1 part by weight of anti-thermal-oxidative aging agent, 0.01-0.1 part by weight of light stabilizer and 2-5 parts by weight of second modification auxiliary agent; the second main body resin is formed by mixing one or more of polyamide, polyethylene terephthalate, polytrimethylene terephthalate, polybutylene naphthalate, polymethyl methacrylate, polycyclohexylenedimethylene terephthalate and polystyrene according to any proportion;
the first modification auxiliary agent is composed of one or more of vinyltrimethoxysilane, vinyltris (beta-methoxyethoxy) silane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltriisopropenoxysilane and methyl vinyldiethoxysilane according to any proportion;
the second modification auxiliary agent is formed by mixing one or more of isopropyl tri (isostearoyl) titanate, isopropyl tri (dioctyl pyrophosphate) titanate, di (dioctyl pyrophosphate) oxyacetate titanium, tetraisopropyl di (dilauryl phosphite) titanate, di (dioctyl pyrophosphate) ethylene titanate, isopropyl tri (dodecyl benzenesulfonyl) titanate and isopropyl tri (n-ethylamino) titanate according to any proportion.
2. The use of a highly coherent polymer film material in accordance with claim 1, wherein said crosslinking agent is composed of one or more selected from the group consisting of benzoyl peroxide, butylcumyl peroxide, 2, 5-dimethyl-2, 5-bis (benzoylperoxy) -hexane, ethyl 3, 3-bis (t-butylperoxy) butyrate, o-t-butyl-o-isopropyl-mono-peroxycarbonate, N-butyl-4, 4-bis (t-butylperoxy) valerate, ethyleneglycol dimethacrylate, divinylbenzene, trimethylpropane trimethacrylate, pentaerythritol triacrylate, N-methylenebisacrylamide, mixed in any desired ratio.
3. The use of a highly adhesive polymer film material according to claim 1, wherein said co-crosslinking agent is one or more selected from 1,3, 5-triallyl-s-triazine-2, 4, 6-trione, N' -m-phenyl bismaleimide, trimethylolpropane triacrylate, 1, 2-polybutadiene, triallyl isocyanate, diallyl phthalate, and triallyl isocyanurate, which are mixed in any ratio.
4. The use of a highly coherent polymer film material in accordance with claim 1, wherein said thermal oxidation aging inhibitor is composed of one or more selected from the group consisting of 2, 2-methylene-bis- (4-methyl-6-t-butyl) phenol, 1,3, 5-tris (4-t-butyl-3-hydroxy-2, 6-dimethylbenzyl), 3, 5-di-t-butyl-4-hydroxy-benzoic acid hexadecyl ester, distearyl pentaerythritol diphosphite, bisphenol A bis (diphenyl phosphate) in any mixing ratio.
5. The use of a highly adhesive polymer film material as claimed in claim 1, wherein said light stabilizer is one or more selected from bis-2, 2,6, 6-tetramethylpiperidinol sebacate, bis-1-decyloxy-2, 2,6, 6-tetramethylpiperidin-4-ol sebacate, N' -bis (2,2,6, 6-tetramethyl-4-piperidinyl) -1, 6-hexanediamine and 2, 4-dichloro-6- (4-morpholinyl) -1,3, 5-triazine, and methyl-1, 2,2,6, 6-pentamethyl-4-piperidinyl sebacate.
6. The use of a highly adhesive polymer film material according to claim 1, wherein said hydrolysis stabilizer is composed of one or more of monomeric carbodiimide hydrolysis stabilizer, poly [ nitrilomethane tetrazo [2,4, 6-tris (1-methylethyl) -1, 3-phenylene ], oxazoline compound hydrolysis stabilizer, and epoxy compound hydrolysis stabilizer mixed in any ratio.
7. Use of a high adhesion polymeric film material as claimed in claim 1, wherein the adhesive and substrate layers are made by melt coating, cast film or double layer coextrusion.
8. The use of a high adhesion polymer thin film material as claimed in claim 1, wherein the multiple fine grid crystalline silicon cell photovoltaic module is a main grid cell free photovoltaic module.
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