CN106832852A - A kind of middle board mount and preparation method and mobile device for being applied to mobile device - Google Patents
A kind of middle board mount and preparation method and mobile device for being applied to mobile device Download PDFInfo
- Publication number
- CN106832852A CN106832852A CN201611233101.9A CN201611233101A CN106832852A CN 106832852 A CN106832852 A CN 106832852A CN 201611233101 A CN201611233101 A CN 201611233101A CN 106832852 A CN106832852 A CN 106832852A
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- China
- Prior art keywords
- board mount
- middle board
- mobile device
- mixture
- graphite powder
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of middle board mount and preparation method and mobile device for being applied to mobile device, belong to field of mobile equipment.Wherein, middle board mount includes graphite powder and plastic cement, and the mass ratio between graphite powder and plastic cement is 1:10 to 1:Between 1.Because the addition of graphite powder makes plastic material have preferable thermal diffusivity, board mount ensure that the power consumption heat of mobile device is conducted in time in gained；Plastic material has intensity higher in itself, and board mount ensure that the strength support of machine product in gained；The density of plastic material is smaller, the lighter in weight of board mount in gained, further such that the weight saving of mobile device；Other board mount middle as obtained in plastic material will not produce interference and influence on aerial signal.The invention also discloses the preparation method of board mount in this, the method process is simple, using injection moulding by mould, processing and forming is convenient and the product design free degree is high, it is easy to produce in batches.
Description
Technical field
The present invention relates to field of mobile equipment, more particularly to a kind of middle board mount for being applied to mobile device and preparation side
Method and mobile device.
Background technology
The middle plate inner support of mobile phone or flat-type product is mostly using stainless steel stamped bracket, aluminium alloy punching in existing industry
The metallic supports such as support, magnesium alloy pressure-casting support and aluminium alloy compression casting support are pressed to complete.Metallic support has relatively good intensity
And heat dispersion, good intensity is used to ensure the strength support of machine product, and good thermal diffusivity can ensure the power consumption of machine
Heat can be conducted in time.But board mount is metal because in, density is big so weight weight, material unit price is expensive, and opponent
Machine class product antenna transmission has interference and influences.
The content of the invention
The present invention solves the technical problem of a kind of middle board mount and preparation method for being applied to mobile device of offer
And mobile device, can make middle board mount that also there is preferable thermal diffusivity and light weight while with preferable intensity.
In order to solve the above technical problems, one aspect of the present invention is：One kind is provided and is applied to mobile device
Middle board mount, in this board mount include graphite powder and plastic cement, the mass ratio between graphite powder and plastic cement is 1:10 to 1:1 it
Between.
Wherein, plastic cement is makrolon or acrylonitrile-butadiene-styrene copolymer.
In order to solve the above technical problems, another technical solution used in the present invention is：One kind is provided and is applied to mobile setting
The preparation method of standby middle board mount, the method includes：By graphite powder and plastic grains according to 1:10 to 1:1 ratio mixes, system
Obtain the first mixture；First mixture is toasted into the scheduled time at a predetermined temperature, the second mixture is obtained；By the second mixture
Mold middle board mount.
Wherein, the second mixture is molded into middle board mount includes：Middle board mount is gone out by the first injection molded.
Wherein, predetermined temperature is 90~110 DEG C, and the scheduled time is 2~4h.
Wherein, after the second mixture being molded into middle board mount, also include：Middle board mount is entered into cast gate removal.
Wherein, entering middle board mount after cast gate removal, also including middle board mount is carried out by the second injection mold
In-mould injection, molds completion part.
Wherein, mold completion part after, also including by complete part appearance carry out spraying coating process.
Wherein, after the appearance for completing part being carried out into spraying coating process, also include：Completion part is checked and measured.
In order to solve the above technical problems, another technical scheme that the present invention is used is：A kind of mobile device is provided, the shifting
Dynamic equipment includes above-mentioned middle board mount.
The beneficial effects of the invention are as follows：The situation of prior art is different from, the present invention provides one kind and is applied to mobile device
Middle board mount, board mount is made up of the plastic material for being added with graphite powder in this.Because the addition of graphite powder makes plastic material
With preferable thermal diffusivity, board mount high heat conduction and radiating is uniform in gained ensure that the power consumption heat of mobile device is passed in time
Derivation is gone, it is to avoid scorching hot point, reduces local deformation of the part caused by high temperature；Plastic material has intensity higher, institute in itself
Board mount ensure that the strength support of machine product in obtaining；The density of plastic material is smaller, in gained the weight of board mount compared with
Gently, can 40-50% lighter than aluminium, further such that the weight saving of mobile device；The middle board mount as obtained in plastic material
Interference will not be produced on aerial signal and is influenceed.In addition, the price of plastic material is low, board mount is produced into can reducing
This, further such that mobile device is univalent low so that consumer groups more gladly buy.The invention also discloses board mount in this
Preparation method, the method process is simple, using mould can injection moulding, processing and forming is convenient, without secondary operation, and produces
Product design freedom is high, it is easy to produce in batches.
Brief description of the drawings
Fig. 1 is the structural representation of the implementation method of board mount one in the present invention.
Fig. 2 is the flow chart of the implementation method of board mount preparation method one in the present invention.
Fig. 3 is the sectional view of the implementation method of mobile device of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
Fig. 1 is referred to, Fig. 1 is the structural representation of the implementation method of board mount one in the present invention.The present invention provides a kind of answering
For the middle board mount 10 of mobile device, board mount 10 is applied in the mobile devices such as mobile phone, panel computer in this, plate branch in this
The shape and structure of frame is specifically set according to the model of mobile device.
Board mount 10 includes graphite powder and plastic cement in this, and the mass ratio between graphite powder and plastic cement is 1:10 to 1:Between 1,
Such as 1:10、2:8、3:7、4:6、5:5 etc..
Wherein, graphite powder is high purity graphite micropowders or the graphite powder of other particle diameters.
Plastic cement is conventional thermoplastic plastic's material, for example：Makrolon (Polycarbonate, PC), acrylic nitrile-butadiene
Diene-styrene copolymer (Acrylonitrile butadiene Styrene copolymers, ABS), polypropylene
(Polypropylene, PP), polystyrene (Polystyrene, PS), polyethylene (polyethylene, PE), polyphenylene sulfide
(Polyphenylene sulfide, PPS), polybutylene terephthalate (PBT) (polybutylene terephthalate,
PBT) etc..
Fig. 2 is referred to, Fig. 2 is the flow chart of the implementation method of board mount preparation method one in the present invention.The present invention is also provided
A kind of preparation method of above-mentioned middle board mount, including：
S101：By graphite powder and plastic grains according to 1:10 to 1:1 ratio mixes, and the first mixture is obtained.
Above-mentioned graphite powder can be matched with the mixed proportion of plastic grains according to cooling requirements.
S102：First mixture is toasted into the scheduled time at a predetermined temperature, the second mixture is obtained.
Specifically, baking material time and the baking material temperature of materal drier are set, and putting the first mixture into materal drier carries out baking material.
The baking material time and baking material temperature herein can be configured according to the requirement of the baking material of selected plastic material.It is optional
Ground, the baking material time is 2~4h, for example：2h, 3h, 4h etc.；Baking material temperature is 90~110 DEG C, for example：90℃、100℃、110℃
Deng.
S103：Second mixture is molded into middle board mount.
Specifically, required middle board mount product can be gone out by the first injection mold injection moulding.Required modeling during injection
Change temperature plastic material according to selected by set, alternatively, plasticization temperature is 230~280 DEG C, for example：230℃、245℃、270
DEG C, 280 DEG C etc..
Now, middle board mount product is molded, and subsequently will process preparation by conventional post-processing approach draws final product
Product.
S104：The cast gate that enters of the middle board mount after by shaping is removed.
S105：The middle board mount that will have been removed into cast gate carries out in-mould injection by the second injection mold, molds completion
Part.
Because can't temporarily do appearance with the middle board mount product that the method is worked it out, support class is only used for non-outer
See on the product of class, so need centering board mount product to carry out in-mould injection being sprayed to its outward appearance with facilitating.
S106：Appearance to completing part carries out spraying coating process, obtains final products.
S107：Gained final products are checked and measured, it is ensured that product is qualified.
In an application scenarios, we prepare above-mentioned middle board mount as plastic material from PC and ABS.
Each graphite powder for mixing 55-60%, each by above two mixture under the conditions of 100 DEG C first in PC and ABS
Baking 3 hours, then goes out required middle board mount product by mixture by injection mold injection moulding.Wherein, it is with PC
The plasticization temperature of plastic material is 270 DEG C, and the plasticization temperature with ABS as plastic material is 245 DEG C.By products obtained therefrom by follow-up
Treatment obtains final products, and performance parameter to final products is determined, and specifically refers to table 1.
Table 1：The performance parameter table of middle board mount product
Can be drawn by upper table, the middle board mount worked it out using the plastic material mixed with graphite powder, density is smaller, heat becomes
Shape temperature is higher, and need not add fire retardant, also with preferable heat conductivility, to sum up in this board mount it is functional.
Simultaneously in this board mount preparation process is simple, homogeneity of product is high, being capable of expanding production.
Fig. 3 is referred to, Fig. 3 is the structural representation of the implementation method of mobile device of the present invention.Present invention also offers one
Mobile device 30 is planted, the middle board mount 31 of the mobile device 30 is to use above-mentioned material as obtained by prepared by the above method.The shifting
Dynamic equipment is mobile phone, panel computer etc., and the shape and structure of the mobile device is specifically set according to the model of mobile device.
Embodiments of the present invention are the foregoing is only, the scope of the claims of the invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, is included within the scope of the present invention.
Claims (10)
1. a kind of middle board mount for being applied to mobile device, it is characterised in that including graphite powder and plastic cement, the graphite powder and institute
The mass ratio between plastic cement is stated 1:10 to 1:Between 1.
2. middle board mount according to claim 1, it is characterised in that the plastic cement is makrolon or acrylic nitrile-butadiene two
Alkene-styrol copolymer.
3. a kind of method of the middle board mount prepared described in claim 1 or 2, it is characterised in that
By the graphite powder and the plastic grains according to 1:10 to 1:1 ratio mixes, and the first mixture is obtained；
First mixture is toasted into the scheduled time at a predetermined temperature, the second mixture is obtained；
Second mixture is molded into the middle board mount.
4. method according to claim 3, it is characterised in that described that second mixture is molded into the middle plate branch
Frame includes：The middle board mount is gone out by the first injection molded.
5. method according to claim 3, it is characterised in that the predetermined temperature is 90~110 DEG C, the scheduled time
It is 2~4h.
6. method according to claim 3, it is characterised in that by second mixture mold the middle board mount it
Afterwards, also include：The middle board mount is entered into cast gate removal.
7. method according to claim 6, it is characterised in that by entering after cast gate removal for the middle board mount, also wrap
Include：The middle board mount is carried out into in-mould injection by the second injection mold, completion part is molded.
8. method according to claim 7, it is characterised in that mold after completion part, also include：By the completion part
Appearance carry out spraying coating process.
9. method according to claim 8, it is characterised in that by the appearance of the completion part carry out spraying coating process it
Afterwards, also include：The completion part is checked and measured.
10. a kind of mobile device, it is characterised in that including the middle board mount described in claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611233101.9A CN106832852A (en) | 2016-12-28 | 2016-12-28 | A kind of middle board mount and preparation method and mobile device for being applied to mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611233101.9A CN106832852A (en) | 2016-12-28 | 2016-12-28 | A kind of middle board mount and preparation method and mobile device for being applied to mobile device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106832852A true CN106832852A (en) | 2017-06-13 |
Family
ID=59113961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611233101.9A Pending CN106832852A (en) | 2016-12-28 | 2016-12-28 | A kind of middle board mount and preparation method and mobile device for being applied to mobile device |
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|---|---|
| CN (1) | CN106832852A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108724587A (en) * | 2018-05-16 | 2018-11-02 | 苏州万融塑胶有限公司 | In-mould injection technique |
| US10601116B2 (en) | 2013-07-30 | 2020-03-24 | Huawei Technologies Co., Ltd. | Wireless terminal |
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|---|---|---|---|---|
| JPH08277342A (en) * | 1995-04-05 | 1996-10-22 | Mitsubishi Rayon Co Ltd | Vibration damping thermoplastic resin composition and molding obtained from the same |
| KR20090118344A (en) * | 2008-05-13 | 2009-11-18 | 케이. 에이. 이 (주) | Slide module for mobile phone |
| CN103122092A (en) * | 2013-02-27 | 2013-05-29 | 深圳市飞荣达科技股份有限公司 | Thermal conductive plastic and method for manufacturing mobile telephone shell by utilizing thermal conductive plastic |
| CN103781855A (en) * | 2011-06-15 | 2014-05-07 | 拜尔材料科学有限公司 | Thermally conductive thermoplastic compositions |
| CN104327288A (en) * | 2007-10-01 | 2015-02-04 | 帝斯曼知识产权资产管理有限公司 | Heat-processable thermally conductive polymer composition |
| CN204810332U (en) * | 2015-07-02 | 2015-11-25 | 张志才 | Cell -phone center support |
| CN205545436U (en) * | 2016-03-14 | 2016-08-31 | 东莞市鑫濠信精密工业有限公司 | Ultra -thin type combination formula cell -phone medium plate |
| CN205545434U (en) * | 2016-03-14 | 2016-08-31 | 东莞市鑫濠信精密工业有限公司 | Quick heat dissipation type cell -phone medium plate |
-
2016
- 2016-12-28 CN CN201611233101.9A patent/CN106832852A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08277342A (en) * | 1995-04-05 | 1996-10-22 | Mitsubishi Rayon Co Ltd | Vibration damping thermoplastic resin composition and molding obtained from the same |
| CN104327288A (en) * | 2007-10-01 | 2015-02-04 | 帝斯曼知识产权资产管理有限公司 | Heat-processable thermally conductive polymer composition |
| KR20090118344A (en) * | 2008-05-13 | 2009-11-18 | 케이. 에이. 이 (주) | Slide module for mobile phone |
| CN103781855A (en) * | 2011-06-15 | 2014-05-07 | 拜尔材料科学有限公司 | Thermally conductive thermoplastic compositions |
| CN103122092A (en) * | 2013-02-27 | 2013-05-29 | 深圳市飞荣达科技股份有限公司 | Thermal conductive plastic and method for manufacturing mobile telephone shell by utilizing thermal conductive plastic |
| CN204810332U (en) * | 2015-07-02 | 2015-11-25 | 张志才 | Cell -phone center support |
| CN205545436U (en) * | 2016-03-14 | 2016-08-31 | 东莞市鑫濠信精密工业有限公司 | Ultra -thin type combination formula cell -phone medium plate |
| CN205545434U (en) * | 2016-03-14 | 2016-08-31 | 东莞市鑫濠信精密工业有限公司 | Quick heat dissipation type cell -phone medium plate |
Non-Patent Citations (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10601116B2 (en) | 2013-07-30 | 2020-03-24 | Huawei Technologies Co., Ltd. | Wireless terminal |
| CN108724587A (en) * | 2018-05-16 | 2018-11-02 | 苏州万融塑胶有限公司 | In-mould injection technique |
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Application publication date: 20170613 |