CN106825938A - For being gone to lose the method and system of crisp and hard material by means of cold shock light radiation and heat shock light radiation - Google Patents
For being gone to lose the method and system of crisp and hard material by means of cold shock light radiation and heat shock light radiation Download PDFInfo
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- CN106825938A CN106825938A CN201510880905.7A CN201510880905A CN106825938A CN 106825938 A CN106825938 A CN 106825938A CN 201510880905 A CN201510880905 A CN 201510880905A CN 106825938 A CN106825938 A CN 106825938A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention relates to a kind of method for going to lose crisp and hard material by means of cold shock light radiation and heat shock light radiation, comprise the following steps：There is provided first laser radiation and by means of first laser radiation along go lose crisp and hard material go erosion path irradiation crisp and hard material；And second laser radiation is provided and erosion path irradiation crisp and hard material is removed along described by means of second laser radiation, wherein first laser radiation is one of cold shock light radiation and heat shock light radiation and second laser radiation is another in cold shock light radiation and heat shock light radiation.The invention further relates to a kind of corresponding system.Using methods described or system, machining accuracy high can be at lower cost realized and while realize processing efficiency high, these above-mentioned advantages especially can be also realized in Processing Curve and curved surface path.
Description
Technical field
Present invention relates in general to field of laser processing, in particular to for by means of cold shock
Light radiation and heat shock light radiation go to lose the method and system of crisp and hard material.
Background technology
Laser machine because its accuracy and minimum processing apparatus wear and tear by more and more universal
Use.In recent years, with the rise of the giant-screen equipment such as mobile phone, tablet PC, laser
The crisp and hard material of such as thin glass etc is processed in processing more and more.
Laser processing technology can be divided into cold laser process technology and thermal laser process technology.
Cold laser refers to laser pulse width in the 10 other laser spokes of psec or even below femtosecond
Penetrate, wherein cold laser process technology the principle on which is, by means of cold laser radiation ablation target
Material to produce HTHP plasma, but the irradiation time for forming plasma be less than in order to
By irradiation time of the incident pulse energy transmission to needed for periphery material so that thermal expansion will not be caused
Dissipate effect.The Chinese patent application of such as entitled " method of cutting glass by laser "
CN103964682A discloses a kind of such cold laser process technology, and wherein pulsewidth is in psec
Glass to be cut is incident to after the laser beam line focus treatment produced to the laser of femtosecond scope
In workpiece, laser beam is relatively moved with glass pieces by path set in advance, focus is existed
Glass pieces are internally formed the cutting being made up of along the path that laser beam is strafed multiple fine fisssure points
Layer, finally applies external force in glass pieces so that glass pieces are torn along path.
And thermal laser refers to the laser emission of continuous wave laser or pulse width higher than 10 psecs,
Wherein thermal laser process technology the principle on which is that heat shock light radiation is focused onto what is processed
On material so that otherwise the material directly absorbs the energy of heat shock light radiation, otherwise thermal laser spoke
Ablation target is penetrated to produce HTHP plasma, and due in the case of thermal laser,
The irradiation time for forming plasma is more than in order to by incident pulse energy transmission to periphery material institute
The irradiation time for needing, therefore can in the material cause thermal diffusion effect and produce heat, wherein being produced
Raw heat is used for fusing material or produces thermal stress in the material.For example entitled " laser adds
The Chinese patent application CN102814591A of work method and laser process equipment " disclose it is a kind of this
The thermal laser process technology of sample, wherein will gather on the surface of laser light incident to machining object and nearby
Light causes that the machining object near focal point gasifies or melts, so as to be formed on cutting initial surface
Beginning heat abstraction area, then continues to irradiate laser and optically focused so that poly- in heat abstraction area before
The machining object gasification of local optical is melted, so as to form follow-up heat abstraction area, and makes subsequent thermal
Removal area is continuously distributed so as to form follow-up heat abstraction line along predefined paths.
In view of thermal laser process technology can in process produce substantial amounts of heat or thermal stress, from
And be easy to produce ablation that is excessive or deviateing or undesirable thermal stress occur, therefore thermal laser
The process of process technology is difficult to control and machining accuracy is not high, thus more universal does at present
Method is to be combined thermal laser process technology with mechanical separation technology to reduce the use of thermal laser
Amount, or use liquid fast cooling technology produced to resist in thermal laser process
Heat or thermal stress, but this dramatically increases process complexity and process costs.Additionally, thermal laser
Process technology is difficult to high accuracy processing crisp and hard material due to produced substantial amounts of thermal stress,
Because these thermal stress are easy to cause undesirable microcrack in crisp and hard material, so as to directly lead
Crisp and hard material is in use easily after causing the rupture or processing of crisp and hard material in process
Rupture.
Cold laser process technology due to not producing or producing few heat or thermal stress in process
And be more suitable for processing crisp and hard material.But all it is pulse laser due to cold laser, if cold laser
Pulse stays in the overlong time near certain ad-hoc location of workpiece, then cold laser processing skill
Art produced in workpiece accumulation heat equally can also produce very important thermal stress.Therefore it is
The Thermal incubation effect in cold laser processing is reduced, is generally reduced in time-domain and/or spatial domain cold
The interval of laser pulse, and/or directly reduce the pulse energy of cold laser.But use the method
The Thermal incubation effect reduced in cold laser processing can reduce processing efficiency and crudy, especially
Crisp and hard material edge is difficult to control to during cutting curve path (such as radius of curvature is less than 10 millimeters) to cut
Cut curved path and separate/division.At cutting curve path, cutting speed must substantially reduce with
Control crisp and hard material separates/division along cutting curve path.But the cutting speed for substantially reducing is same
When will increase heat history and the thermal stress that therefore produces, it is difficult to ensure the quality of cut surface.
The content of the invention
Task of the invention is to provide a kind of being used for by means of cold shock light radiation and heat shock light radiation
The method and system of erosion (for example cut, scraping or drilling) crisp and hard material is removed, using the side
Method or system, can at lower cost realize machining accuracy high and while realize processing effect high
Rate and crudy, especially can also realize that these are above-mentioned in Processing Curve and curved surface path
Advantage.
In the first aspect of the present invention, the task be used for by means of cold shock light radiation by a kind of and
Heat shock light radiation goes the method for losing crisp and hard material to solve, and the method comprises the following steps：
There is provided first laser radiation and by means of first laser radiation along going to lose crisp and hard material
Remove erosion path irradiation crisp and hard material；And
Second laser radiation is provided and goes to erosion path to shine along described by means of second laser radiation
Penetrate crisp and hard material,
Wherein first laser radiation is one of cold shock light radiation and heat shock light radiation and second laser
Radiation is another in cold shock light radiation and heat shock light radiation.
The method according to this invention the principle on which is, by with cold laser along Qu Shi roads
Crisp and hard material is irradiated in footpath so that intensity of the crisp and hard material in the part for going to lose path physics is weakened,
On the other hand, by with thermal laser along go erosion path irradiate crisp and hard material so that in fragility material
Thermal stress is produced in material, when the thermal stress reaches certain threshold value, fragile material will be in thermal stress
In the presence of occur division/separate.It should be noted here that applying the time of cold laser and thermal laser
Order can be selectable, i.e., both can first apply cold laser, apply thermal laser again, also may be used
First to apply thermal laser, apply cold laser, can also simultaneously apply cold laser and thermal laser,
Because by cold laser to the reduction of material and by thermal laser produce thermal stress according to material
The difference of material is possible to change over time, therefore the applying order of cold laser and thermal laser can be with root
Selection is needed to determine according to technique.In addition, the spatial order for applying cold laser and thermal laser can also
It is selectable, i.e., cold laser can be both placed in after thermal laser, it is also possible to put thermal laser
After cold laser, the two at least part of coincidence can also be made.
Made a return journey erosion crisp and hard material using both cold laser and thermal laser by the present invention, at least can
Realize advantages below：(1) improve and machining accuracy and reduce material damage because with pure heat
Laser processing is compared and produces less heat and thermal stress in the method for the invention, so as to keep away
Exempt from unnecessary and undesirable ablation and the generation of undesirable microcrack, and due to using heat
The thermal stress that laser is produced separates crisp and hard material without any mechanically decoupled step, can be with
Avoid the material damage that mechanically decoupled step is brought；(2) improve processing efficiency because with it is pure
Cold laser processing method compare, in the method for the invention by using thermal laser produce heat
Stress separates crisp and hard material, can be compared with the cold laser separation material extremely short by pulsewidth more
Plus quickly and effectively remove corrosion material；(3) processing cost is reduced, because the method according to the invention
Eliminate mechanically decoupled step, it is not required that additional cooling device, and control flow is relative
It is simple and quick with it is efficient.
Specify in an expansion scheme of the invention, cold shock light radiation is pulse width in 10 skins
Laser emission below second, and heat shock light radiation is that continuous laser radiation or pulse width are high
In the laser emission of 10 psecs.Additionally, by femtosecond laser as cold laser be also it is contemplated that.
Specify in another expansion scheme of the invention, first laser radiation and second laser are radiated
There is provided by same laser or various lasers.First laser is radiated and second laser radiation can
With with different wave length.Carried by same laser in first laser radiation and second laser radiation
For in the case of, the laser by changing the pulse duration of laser come in cold shock light radiation and
Switch between heat shock light radiation.By using single laser, can be with reduces cost.But make
It is also what is be contemplated that to provide cold shock light radiation and heat shock light radiation respectively with various lasers.
Specify in a preferred scheme of the invention, first laser radiation is cold shock light radiation,
And second laser radiation is heat shock light radiation, and wherein the method also includes：
By first laser radiation and/or second laser incident on the acting surface of crisp and hard material
To form non-round spot, wherein coming from the surface normal of laser and the acting surface of crisp and hard material
See, the length direction of non-round spot goes to erosion path to overlap with described.
By the preferred scheme, (surface and inside) maximization can be produced on crisp and hard material
Can promote crisp and hard material along go lose path cracking thermal stress and micro-crack, while avoiding or showing
The generation of the thermal stress and micro-crack that reduce influence product quality is write, it is processed so as to significantly improve
Crisp and hard material quality and improve processing efficiency and machining accuracy.Because, by basis
The present invention cuts crisp and hard material and makes non-round spot using cold or heat shock light beam non-round spot
Length direction with go to lose in view of surface normal of the path from laser with the acting surface of crisp and hard material
Overlap, can make non-round spot that direction is substantially acted in crisp and hard material and erosion is gone
The thermal stress of path orthogonal and along go lose path extend micro-crack (not shown) so that
Being conducive on crisp and hard material (surface and inside) to produce maximized can promote crisp and hard material edge
Go lose path cracking thermal stress and micro-crack and reduce to greatest extent other directions heat should
The generation and propagation of power and micro-crack, so as to significantly improve processed crisp and hard material quality simultaneously
Improve processing efficiency and machining accuracy.If it should be noted here that cold laser is in the material to be processed
The material upper residence time is short, then do not generate heat or produce thermal stress, but if during the effect of cold laser
Between it is more long, can equally produce heat and thermal stress, therefore this preferred scheme be applied to cold shock light and heat
Both laser, you can so that the hot spot of thermal laser and/or thermal laser is non-circular and make spot length
Direction overlaps to improve processing efficiency and machining accuracy with erosion direction is gone to.
Specify in another preferred scheme of the invention, first laser radiation is cold shock light radiation,
And second laser radiation be heat shock light radiation, wherein by means of first laser radiation along go erosion
The erosion path irradiation crisp and hard material that goes of crisp and hard material includes：Erosion is gone by means of first laser radiation edge
Path produces multiple defects discontinuous on the thickness direction of crisp and hard material in crisp and hard material,
Wherein described defect defines line of cut or cut surface.
By the preferred scheme, can be with degree of precision and low cost processing workpiece, especially three
Dimension curve surface work pieces because by produce in crisp and hard material it is multiple in the thickness direction thereof not
Continuous defect can avoid the cutting accuracy of pure laser cutting method low to separate crisp and hard material
Shortcoming, because by suitably defect described in spatial distribution, can not only reduce ablation amount and keep away
Exempt from unnecessary ablation, and can accurately define variously-shaped, such as curve or curved surface goes
Erosion path, in addition in the case of the defect of spatial distribution, the separation process of material is more uniform
And rule, and it is not susceptible to undesirable fracture, damage and loss.
Specify in an expansion scheme of the invention, the crisp and hard material is one of the following：
Glass and sapphire.
Specify in another expansion scheme of the invention, first laser radiation is in time and/or empty
Between it is upper radiate in second laser before or after, or with second laser radiation at least in part
Overlap.As it was previously stated, the time and/or spatial order of cold laser and thermal laser can be according to techniques
Need to select.
In the second aspect of the present invention, the task be used for by means of cold shock light radiation by a kind of and
Heat shock light radiation goes the system for losing crisp and hard material to solve, and the system includes：
One or more lasers, it is configured to supply first laser radiation and second laser spoke
Penetrate；And
Mobile device, it is configured as making one or more of lasers and crisp and hard material relative
It is mobile so as to go the irradiation of erosion path crisp along remove to lose crisp and hard material by means of first laser radiation
Hard material and by means of second laser radiation along it is described go erosion path irradiation crisp and hard material；
Wherein first laser radiation is one of cold shock light radiation and heat shock light radiation and second laser
Radiation is another in cold shock light radiation and heat shock light radiation.
By means of the system according to the present invention, can equally realize combining the method according to the invention
Described advantage, i.e., can at lower cost realize machining accuracy high and while realize high
Processing efficiency.
Specify in an expansion scheme of the invention, cold shock light radiation is pulse width in 10 skins
Laser emission below second, and heat shock light radiation is that continuous laser radiation or pulse width are high
In the laser emission of 10 psecs.
Specify in a preferred scheme of the invention, first laser radiation is cold shock light radiation,
And second laser radiation is heat shock light radiation, and the wherein system also includes：
Optics, it is configured as carrying out light to first laser radiation and/or second laser radiation
Beam shaping so that first laser is radiated and/or second laser incident is to institute's shape on crisp and hard material
Into hot spot for non-circular；
Wherein described mobile device is additionally configured to move one or more of lasers, optics
Device and/or crisp and hard material so that come from the surface normal of laser and the acting surface of crisp and hard material
See, the length direction of non-round spot goes to erosion path to overlap with described.
Can significantly improve the quality of processed crisp and hard material and improve by the preferred scheme and add
Work efficiency rate and machining accuracy.
Specify in an expansion scheme of the invention, first laser radiation is in time and/or empty
Between it is upper radiate in second laser before or after, or with second laser radiation at least in part
Overlap.
Specify in a preferred scheme of the invention, mobile device is additionally configured to described one
Individual or multiple lasers and crisp and hard material are relatively moved on the thickness direction of crisp and hard material so that
One or more of lasers are multiple in crisp and hard material along going to erosion path to be produced in crisp and hard material
Thickness direction on discontinuous defect, wherein the defect define line of cut or cut surface.
By the preferred scheme, can be with degree of precision and low cost processing workpiece, especially three
Dimension curve surface work pieces.
Brief description of the drawings
Fig. 1 is shown of the invention for by means of cold shock light radiation and heat shock light radiation
The space of the cold shock light radiation and heat shock light radiation gone to lose used in the method for crisp and hard material
Position；
Fig. 2 shows of the invention for being gone by means of cold shock light radiation and heat shock light radiation
Lose a preferred embodiment of the method for crisp and hard material；And
Fig. 3 is shown of the invention for by means of cold shock light radiation and heat shock light radiation
The cold shock light radiation gone to lose used in the method for crisp and hard material and the time of heat shock light radiation are suitable
Sequence.
Specific embodiment
Fig. 1 is shown of the invention for by means of cold shock light radiation and heat shock light radiation
Go to lose cold shock light radiation 102 and the heat shock light radiation 101 used in the method for crisp and hard material
Relative tertiary location.
In Fig. 1, acting surface of the heat shock light radiation 101 in crisp and hard material is represented with solid line circle
The hot spot of upper formation, and represent work of the cold shock light radiation 102 in crisp and hard material with dashed circle
With the hot spot formed on face.Herein, it is noted that although heat shock light radiation 101 and cold laser
The hot spot of radiation 102 is illustrated as circle herein, but other non-round spots also can be to set
Think, such as oval hot spot (referring to Fig. 2), rectangular light spots and combination hot spot etc..
Shown in the part A of Fig. 1 cold shock light radiation 102 be located at heat shock light radiation 101 it
Preceding situation, shows cold shock light radiation 102 and heat shock light radiation 101 in the part B of Fig. 1
The situation for partially overlapping, and cold shock light radiation 102 is shown in the C portion of Fig. 1 and is located at heat
Situation after laser emission 101, wherein it refers to by means of heat shock light radiation 101 to go to erosion path
Go to lose path, the i.e. cold shock light radiation 101 of (irradiation) crisp and hard material with cold shock light radiation 102
With moving direction of the heat shock light radiation 102 on crisp and hard material.
For the situation in the part A for realizing Fig. 1, for example, can make by first laser device (not
Show) transmitting cold shock light radiation 102 first along go erosion path irradiation crisp and hard material (not shown),
Then moved a certain distance in cold shock light radiation 102 and (go erosion more than or equal to first laser device edge
The length of the hot spot of path direction) after, then make what is launched by second laser (not shown)
Heat shock light radiation 101 removes erosion path irradiation crisp and hard material along this.
For the situation in the part B for realizing Fig. 1, for example, can make to be launched by second laser
Cold shock light radiation 102 along go erosion path irradiation crisp and hard material, then almost synchronously or cold
The movement a small distance of laser emission 102 is (less than second laser along the light for removing erosion path direction
The length of spot) make the heat shock light radiation 101 launched by first laser device go to lose path along this later
Irradiation crisp and hard material.Or (not shown) can make the thermal laser spoke launched by first laser device
101 are penetrated along erosion path irradiation crisp and hard material is removed, then almost synchronously or in heat shock light radiation 101
Mobile a small distance (less than first laser device along the hot spot for going to lose path direction length) with
Afterwards, the cold shock light radiation 102 launched by second laser is made to go to erosion path to irradiate brittle material along this
Material.
For the situation in the C portion for realizing Fig. 1, for example, can make to be launched by second laser
Heat shock light radiation 101 first along go erosion path irradiation crisp and hard material, then in heat shock light radiation
102 move a certain distance after (more than or equal to second laser along go lose path direction light
The length of spot), then make the cold shock light radiation 102 launched by first laser device go to lose path along this
Irradiation crisp and hard material.
Although it should be noted here that in Fig. 1, cold shock light radiation 102 and heat shock light radiation 101
It is illustrated as what is launched simultaneously by various lasers, but in other embodiments, cold shock light radiation
102 and heat shock light radiation 101 can also be by changing laser pulse width by same laser
In different time transmitting.
Made a return journey erosion crisp and hard material using both cold laser and thermal laser by the present invention, at least can
Realize advantages below：(1) improve and machining accuracy and reduce material damage because with pure heat
Laser processing is compared and produces less heat and thermal stress in the method for the invention, so as to keep away
Exempt from unnecessary and undesirable ablation and the generation of undesirable microcrack, and due to using heat
The thermal stress that laser is produced separates crisp and hard material without any mechanically decoupled step, can be with
Avoid the material damage that mechanically decoupled step is brought；(2) improve processing efficiency because with it is pure
Cold laser processing method compare, in the method for the invention by using thermal laser produce heat
Stress separates crisp and hard material, can be compared with the cold laser separation material extremely short by pulsewidth more
Plus quickly and effectively remove corrosion material；(3) processing cost is reduced, because the method according to the invention
Eliminate mechanically decoupled step, it is not required that additional cooling device, and control flow is relative
It is simple and quick with it is efficient.
Fig. 2 shows of the invention for being gone by means of cold shock light radiation and heat shock light radiation
Lose a preferred embodiment of the method for crisp and hard material.
In fig. 2, the hot spot 203 of heat shock light radiation is illustrated as ellipse, wherein oval
The length direction 204 of hot spot 203 comes from the surface normal of laser and the acting surface of crisp and hard material
See and overlapped with erosion path 201 is gone to.Where length direction 204 refers to the length of non-round spot
Direction, such as oval long axis direction, length direction of rectangle etc..The length of non-round spot
The ratio between degree and width, i.e. length-width ratio (also known as draw ratio or aspect ratio) are preferably greater than 1.5.
This, it is noted that is although the hot spot 203 of heat shock light radiation is configured in the present embodiment non-
Circular, i.e. oval, but in other embodiments, it is also possible to by the hot spot structure of cold laser
Make as non-circular, to realize similar effect.
The coincidence can be realized by multi-axis linkages.For example, by laser and brittle
Material is arranged on the different rotary axle of multi-axis linkages so that they can be relatively moved
And rotation, so as to keep foregoing coincidence come the moment by the movement and rotation.Additionally, adopting
With beam forming device to form non-round spot in the case of, beam forming device can pass through
Such as synchronous rotary is so that the length direction of non-round spot keeps weight in real time with erosion path is gone to
Close.
By the preferred scheme of Fig. 2, (surface and inside) can be produced most on crisp and hard material
The crisp and hard material edge that can promote of bigization is gone to lose the thermal stress and micro-crack of the cracking of path 201, while
The generation of the thermal stress and micro-crack of influence product quality is avoided or is substantially reduced, so as to significantly carry
The quality of processed crisp and hard material high simultaneously improves processing efficiency and machining accuracy.Because,
By according to the present invention is using cold or heat shock light beam non-round spot cutting crisp and hard material and makes non-
The length direction of circular light spot with go to lose surface method of the path from laser and the acting surface of crisp and hard material
Conjunction is valued on, non-round spot substantially side of acting in crisp and hard material can be made
To with the thermal stress 202 for removing erosion path orthogonal and along the micro-crack for going to erosion path 201 to extend
(not shown), so as to be conducive on crisp and hard material (surface and inside) to produce maximized energy
Promote crisp and hard material along the thermal stress and micro-crack and to greatest extent for removing to lose the cracking of path 201
The generation and propagation of the thermal stress and micro-crack in other directions are reduced, it is processed so as to significantly improve
Crisp and hard material quality and improve processing efficiency and machining accuracy.In short, by means of Fig. 2
Preferred scheme, can greatly improve processing efficiency, i.e. go lose crisp and hard material speed, and
Improve machining accuracy.
Fig. 3 is shown of the invention for by means of cold shock light radiation and heat shock light radiation
Go to lose cold shock light radiation 302 and the heat shock light radiation 301 used in the method for crisp and hard material
Time sequencing.
Show that cold laser spoke is launched in first heat of emission laser emission 301 again in the part A of Fig. 3
302 situation is penetrated, almost heat of emission laser emission 301 simultaneously is shown in the part B of Fig. 3
With the situation of cold shock light radiation 302, and shown in the C portion of Fig. 3 and first launch cold laser
The situation of the heat of emission laser emission 301 again of radiation 302.
From figure 3, it can be seen that heat of emission laser emission 301 and cold shock light radiation 302 when
Between order can be selected according to technique needs because by cold shock light radiation 302 to material
The reduction of material and by heat shock light radiation 302 produce thermal stress be possible to according to the difference of material
Change over time, therefore the applying order of cold shock light radiation and heat shock light radiation can be according to technique
Selection is needed to determine.
Although some embodiments of the present invention are described in present specification,
It is it will be apparent for a person skilled in the art that these implementation methods are merely possible to example shows
Go out.It may occur to persons skilled in the art that numerous flexible programs, alternative solution and improvement side
Case is without beyond the scope of this invention.Appended claims are intended to limit the scope of the present invention,
And thereby cover method and structure of these claims and its in the range of equivalents in itself.
Claims (12)
1. a kind of for being gone to lose the side of crisp and hard material by means of cold shock light radiation and heat shock light radiation
Method, comprises the following steps：
There is provided first laser radiation and by means of first laser radiation along going to lose crisp and hard material
Remove erosion path irradiation crisp and hard material；And
Second laser radiation is provided and goes to erosion path to shine along described by means of second laser radiation
Penetrate crisp and hard material,
Wherein first laser radiation is one of cold shock light radiation and heat shock light radiation and second laser
Radiation is another in cold shock light radiation and heat shock light radiation.
2. method according to claim 1, wherein cold shock light radiation is pulse width 10
Laser emission below psec, and heat shock light radiation is continuous laser radiation or pulse width
Higher than the laser emission of 10 psecs.
3. the radiation of method according to claim 1, wherein first laser and second laser radiation
There is provided by same laser or various lasers.
4. the radiation of method according to claim 1, wherein first laser is cold shock light radiation,
And second laser radiation is heat shock light radiation, and wherein the method also includes：
By first laser radiation and/or second laser incident on the acting surface of crisp and hard material
To form non-round spot, wherein coming from the surface normal of laser and the acting surface of crisp and hard material
See, the length direction of non-round spot goes to erosion path to overlap with described.
5. the radiation of method according to claim 1, wherein first laser is cold shock light radiation,
And second laser radiation be heat shock light radiation, wherein by means of first laser radiation along go erosion
The erosion path irradiation crisp and hard material that goes of crisp and hard material includes：Erosion is gone by means of first laser radiation edge
Path produces multiple defects discontinuous on the thickness direction of crisp and hard material in crisp and hard material,
Wherein described defect defines line of cut or cut surface.
6. method according to claim 1, wherein the crisp and hard material is the following
One：Glass and sapphire.
7. the radiation of method according to claim 1, wherein first laser in time and/or
It is before or after being spatially in second laser radiation or at least part of with second laser radiation
Ground overlaps.
8. it is a kind of to be for remove erosion crisp and hard material by means of cold shock light radiation and heat shock light radiation
System, including：
One or more lasers, it is configured to supply first laser radiation and second laser spoke
Penetrate；And
Mobile device, it is configured as making one or more of lasers and crisp and hard material relative
It is mobile so as to go the irradiation of erosion path crisp along remove to lose crisp and hard material by means of first laser radiation
Hard material and by means of second laser radiation along it is described go erosion path irradiation crisp and hard material；
Wherein first laser radiation is one of cold shock light radiation and heat shock light radiation and second laser
Radiation is another in cold shock light radiation and heat shock light radiation.
9. system according to claim 8, wherein cold shock light radiation is pulse width 10
Laser emission below psec, and heat shock light radiation is continuous laser radiation or pulse width
Higher than the laser emission of 10 psecs.
10. the radiation of system according to claim 8, wherein first laser is cold shock light radiation,
And second laser radiation is heat shock light radiation, and the wherein system also includes：
Optics, it is configured as carrying out light to first laser radiation and/or second laser radiation
Beam shaping so that first laser is radiated and/or second laser incident is to institute's shape on crisp and hard material
Into hot spot for non-circular；
Wherein described mobile device is additionally configured to move one or more of lasers, optics
Device and/or crisp and hard material so that come from the surface normal of laser and the acting surface of crisp and hard material
See, the length direction of non-round spot goes to erosion path to overlap with described.
11. systems according to claim 8, wherein first laser radiation in time and/
Or before or after being spatially in second laser radiation, or radiate at least portion with second laser
Ground is divided to overlap.
12. systems according to claim 8, wherein mobile device are additionally configured to will be described
One or more lasers and crisp and hard material are relatively moved on the thickness direction of crisp and hard material, are made
Obtain one or more of lasers multiple in brittle material along going to erosion path to be produced in crisp and hard material
Discontinuous defect on the thickness direction of material, wherein the defect defines line of cut or cut surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510880905.7A CN106825938A (en) | 2015-12-04 | 2015-12-04 | For being gone to lose the method and system of crisp and hard material by means of cold shock light radiation and heat shock light radiation |
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| CN201510880905.7A CN106825938A (en) | 2015-12-04 | 2015-12-04 | For being gone to lose the method and system of crisp and hard material by means of cold shock light radiation and heat shock light radiation |
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Citations (5)
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|---|---|---|---|---|
| US20050006361A1 (en) * | 2003-07-11 | 2005-01-13 | Satoshi Kobayashi | Machining apparatus utilizing laser beam |
| JP2006035710A (en) * | 2004-07-28 | 2006-02-09 | Cyber Laser Kk | Glass processing method using laser and device |
| JP2007229758A (en) * | 2006-02-28 | 2007-09-13 | Fukami Seisakusho:Kk | Laser beam machining system |
| CN101516566A (en) * | 2006-09-19 | 2009-08-26 | 浜松光子学株式会社 | Laser processing method and laser processing apparatus |
| CN102152003A (en) * | 2011-02-24 | 2011-08-17 | 华中科技大学 | Method and device for separating optical crystal by using two laser beams |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050006361A1 (en) * | 2003-07-11 | 2005-01-13 | Satoshi Kobayashi | Machining apparatus utilizing laser beam |
| JP2006035710A (en) * | 2004-07-28 | 2006-02-09 | Cyber Laser Kk | Glass processing method using laser and device |
| JP2007229758A (en) * | 2006-02-28 | 2007-09-13 | Fukami Seisakusho:Kk | Laser beam machining system |
| CN101516566A (en) * | 2006-09-19 | 2009-08-26 | 浜松光子学株式会社 | Laser processing method and laser processing apparatus |
| CN102152003A (en) * | 2011-02-24 | 2011-08-17 | 华中科技大学 | Method and device for separating optical crystal by using two laser beams |
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Application publication date: 20170613 |