CN106825549A - A kind of copper particle with high surface area structure - Google Patents
A kind of copper particle with high surface area structure Download PDFInfo
- Publication number
- CN106825549A CN106825549A CN201710239196.3A CN201710239196A CN106825549A CN 106825549 A CN106825549 A CN 106825549A CN 201710239196 A CN201710239196 A CN 201710239196A CN 106825549 A CN106825549 A CN 106825549A
- Authority
- CN
- China
- Prior art keywords
- copper
- copper particle
- surface area
- longitudinal
- transversal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 82
- 239000010949 copper Substances 0.000 title claims abstract description 82
- 239000002245 particle Substances 0.000 title claims abstract description 52
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001431 copper ion Inorganic materials 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
Classifications
-
- B22F1/0007—
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The invention discloses a kind of copper particle with high surface area structure, including copper particle body, copper particle body is the shape of cylinder, include longitudinal hollow channel and transversal hollow passage on copper ball body, longitudinal hollow channel includes several, transversal hollow passage includes several, longitudinal hollow channel is arranged at the inside of copper ball body and through the longitudinal direction of copper ball body, transversal hollow passage is arranged at the inside of copper ball body and through the transverse direction of copper ball body, and the section of longitudinal hollow channel and transversal hollow passage is polygonized structure.Through the above way, the present invention uses the hollow surface area for being designed to greatly increase copper particle, the utilization rate of copper particle can be increased when in use, the big copper particle of surface area can increase the copper ion released under identical conditions, the time of plating can be shortened, the copper particle of hollow structure can reduce gross weight, reduces cost, using light.
Description
Technical field
The present invention relates to Copper fabrication field, more particularly to a kind of copper particle with high surface area structure.
Background technology
In non-ferrous metal, copper is the one kind being most widely used, and is ranked first place.The volume of production and marketing of copper is only second to aluminium, is located at
Second.Copper has the advantages that good electric conductivity, thermal conductivity, ductility.The mankind before more than 7000 years early in beginning to use copper, copper
Can apply in electrical equipment, ship, vehicle, machine-building, for distribution and everyday home apparatus the aspect such as decorate, with very wide
General application.Copper can have more different good characteristics, make copper with other many metal component alloys, these alloys
Purposes is more extensive.When using copper and copper alloy, it will be processed into variform material, wherein copper to people by the overwhelming majority
Grain is conventional one kind.Existing copper particle is all single surface, and utilization rate is not high when using.
The content of the invention
The present invention solves the technical problem of a kind of copper particle with high surface area structure of offer, it is possible to increase copper particle
Utilization rate.
In order to solve the above technical problems, one aspect of the present invention is：There is provided a kind of with high surface area knot
The copper particle of structure, including copper particle body, the copper particle body are the shape of cylinder, include that longitudinal direction is hollow logical on the copper ball body
Road and transversal hollow passage, longitudinal hollow channel include several, and the transversal hollow passage includes several, described vertical
The inside of the copper ball body is arranged to hollow channel and through the longitudinal direction of the copper ball body, the transversal hollow passage
It is arranged at the inside of the copper ball body and through the transverse direction of the copper ball body, longitudinal hollow channel and the transverse direction
The section of hollow channel is polygonized structure.
In a preferred embodiment of the present invention, longitudinal hollow channel is 2-4, and the transversal hollow passage is 2-
4.
In a preferred embodiment of the present invention, several described longitudinal hollow channels are with the longitudinal direction of the copper particle body
It is symmetrically arranged centered on central shaft.
In a preferred embodiment of the present invention, several described transversal hollow passages are with the transverse direction of the copper particle body
It is symmetrically arranged centered on central shaft.
In a preferred embodiment of the present invention, the section radius of the copper particle body are 2-4mm, the copper particle body
Highly it is 20-22mm.
In a preferred embodiment of the present invention, the section of longitudinal hollow channel is triangle, quadrangle, pentagon
Or hexagon.
In a preferred embodiment of the present invention, the section of the transversal hollow passage is triangle, quadrangle, pentagon
Or hexagon.
The beneficial effects of the invention are as follows：Copper particle with high surface area structure of the invention, is designed to using hollow
Greatly increase the surface area of copper particle, the utilization rate of copper particle can be increased when in use, the big copper particle of surface area can make same
Under the conditions of the copper ion released increase, can shorten the time electroplated, the copper particle of hollow structure can reduce gross weight, reduces cost,
Using light.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to that will make needed for embodiment description
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing, wherein：
Fig. 1 is the structural representation of the preferred embodiment of copper particle one with high surface area structure of the invention；
The mark of each part is as follows in accompanying drawing：1st, copper particle body, 2, longitudinal hollow channel, 3, transversal hollow passage.
Specific embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
Fig. 1 is referred to, the embodiment of the present invention includes：
A kind of copper particle with high surface area structure, including copper particle body 1, the copper particle body 1 are the shape of cylinder.It is described
The section radius of copper particle body are 2-4mm, and the height of the copper particle body is 20-22mm.
Include longitudinal hollow channel 2 and transversal hollow passage 3 on the copper ball body 1, longitudinal hollow channel 2 includes
Several, longitudinal hollow channel 2 described in the present embodiment is 3.The transversal hollow passage 3 includes several, in this reality
It is 2 to apply longitudinal hollow channel 2 described in example.
Longitudinal hollow channel 2 is arranged at the inside of the copper ball body 1 and indulging through the copper ball body 1
To.3 longitudinal hollow channels 2 are symmetrically arranged centered on the vertical central axis of the copper particle body 1.
The transversal hollow passage 3 is arranged at the inside of the copper ball body 1 and through the horizontal stroke of the copper ball body 1
To.2 transversal hollow passages 3 are symmetrically arranged centered on the transverse central axis of the copper particle body 1.
The section of longitudinal hollow channel 2 and the transversal hollow passage 3 is polygonized structure.The longitudinal direction is hollow logical
The section in road 2 can be triangle, quadrangle, pentagon or hexagon, be quadrangle in the present embodiment.The transversal hollow is led to
The section in road 3 is triangle, quadrangle, pentagon or hexagon, is triangle in the present embodiment.
The beneficial effects of the invention are as follows：
First, the copper particle with high surface area structure is using the hollow surface area for being designed to greatly increase copper particle,
The utilization rate of copper particle can be increased when use；
2nd, the copper particle with high surface area structure can increase the copper ion released under identical conditions, can shorten plating
Time；
3rd, the copper particle of the hollow structure can reduce gross weight, reduces cost, using light.
Embodiments of the invention are the foregoing is only, the scope of the claims of the invention is not thereby limited, it is every to utilize this hair
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (7)
1. a kind of copper particle with high surface area structure, it is characterised in that including copper particle body, the copper particle body is cylinder
Shape, longitudinal hollow channel and transversal hollow passage are included on the copper ball body, longitudinal hollow channel includes some
Individual, the transversal hollow passage includes several, and longitudinal hollow channel is arranged at the inside of the copper ball body and runs through
In the longitudinal direction of the copper ball body, the transversal hollow passage is arranged at the inside of the copper ball body and through the copper ball
The section of the transverse direction of body, longitudinal hollow channel and the transversal hollow passage is polygonized structure.
2. the copper particle with high surface area structure according to claim 1, it is characterised in that longitudinal hollow channel is
2-4, the transversal hollow passage is 2-4.
3. the copper particle with high surface area structure according to claim 1, it is characterised in that several described longitudinal directions are hollow
Passage is symmetrically arranged centered on the vertical central axis of the copper particle body.
4. the copper particle with high surface area structure according to claim 1, it is characterised in that several described transversal hollows
Passage is symmetrically arranged centered on the transverse central axis of the copper particle body.
5. the copper particle with high surface area structure according to claim 1, it is characterised in that the section of the copper particle body
Radius is 2-4mm, and the height of the copper particle body is 20-22mm.
6. the copper particle with high surface area structure according to claim 1, it is characterised in that longitudinal hollow channel
Section is triangle, quadrangle, pentagon or hexagon.
7. the copper particle with high surface area structure according to claim 1, it is characterised in that the transversal hollow passage
Section is triangle, quadrangle, pentagon or hexagon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710239196.3A CN106825549A (en) | 2017-04-13 | 2017-04-13 | A kind of copper particle with high surface area structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710239196.3A CN106825549A (en) | 2017-04-13 | 2017-04-13 | A kind of copper particle with high surface area structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106825549A true CN106825549A (en) | 2017-06-13 |
Family
ID=59148246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710239196.3A Pending CN106825549A (en) | 2017-04-13 | 2017-04-13 | A kind of copper particle with high surface area structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106825549A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112585303A (en) * | 2018-08-22 | 2021-03-30 | 株式会社荏原制作所 | Solid copper oxide material for use in plating of substrates, method for producing the same, and apparatus for supplying plating solution to plating tank |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8527663D0 (en) * | 1985-11-08 | 1985-12-11 | Ici Plc | Catalyst precursors |
| FR2912400A1 (en) * | 2007-02-14 | 2008-08-15 | Univ Paris Curie | Material in the form of a honeycomb monolith, useful as an adsorbent or catalyst support, comprises an inorganic oxide polymer with organic substituents |
| CN201171991Y (en) * | 2008-03-28 | 2008-12-31 | 荆州市金威石化配件有限公司 | Improved ripple structured packing |
| JP2010189695A (en) * | 2009-02-17 | 2010-09-02 | Fujifilm Corp | Metallic member |
| CN102453918A (en) * | 2010-10-29 | 2012-05-16 | 中国海洋石油总公司 | Sacrificial anode with high superficial area |
| CN103722350A (en) * | 2014-01-14 | 2014-04-16 | 东又悦（苏州）电子科技新材料有限公司 | Electroplating hollow phosphor copper ball and preparation method thereof |
| CN104790020A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper particle and processing method thereof |
| CN104790019A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper ball for PCB and processing method |
| CN205413044U (en) * | 2016-03-25 | 2016-08-03 | 江西省萍乡市方上化工填料有限责任公司 | Netted slot porcelain ball |
| CN206046046U (en) * | 2016-09-21 | 2017-03-29 | 江西安发环保新材料有限公司 | Ceramic honey comb protective agent |
-
2017
- 2017-04-13 CN CN201710239196.3A patent/CN106825549A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8527663D0 (en) * | 1985-11-08 | 1985-12-11 | Ici Plc | Catalyst precursors |
| FR2912400A1 (en) * | 2007-02-14 | 2008-08-15 | Univ Paris Curie | Material in the form of a honeycomb monolith, useful as an adsorbent or catalyst support, comprises an inorganic oxide polymer with organic substituents |
| CN201171991Y (en) * | 2008-03-28 | 2008-12-31 | 荆州市金威石化配件有限公司 | Improved ripple structured packing |
| JP2010189695A (en) * | 2009-02-17 | 2010-09-02 | Fujifilm Corp | Metallic member |
| CN102453918A (en) * | 2010-10-29 | 2012-05-16 | 中国海洋石油总公司 | Sacrificial anode with high superficial area |
| CN103722350A (en) * | 2014-01-14 | 2014-04-16 | 东又悦（苏州）电子科技新材料有限公司 | Electroplating hollow phosphor copper ball and preparation method thereof |
| CN104790020A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper particle and processing method thereof |
| CN104790019A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper ball for PCB and processing method |
| CN205413044U (en) * | 2016-03-25 | 2016-08-03 | 江西省萍乡市方上化工填料有限责任公司 | Netted slot porcelain ball |
| CN206046046U (en) * | 2016-09-21 | 2017-03-29 | 江西安发环保新材料有限公司 | Ceramic honey comb protective agent |
Non-Patent Citations (1)
| Title |
|---|
| "《催化剂载体制备及应用技术》" * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112585303A (en) * | 2018-08-22 | 2021-03-30 | 株式会社荏原制作所 | Solid copper oxide material for use in plating of substrates, method for producing the same, and apparatus for supplying plating solution to plating tank |
| CN112585303B (en) * | 2018-08-22 | 2021-09-17 | 株式会社荏原制作所 | Solid copper oxide, method for producing solid copper oxide, and plating solution supply device |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |
|
| RJ01 | Rejection of invention patent application after publication |