CN106811741A - Novel metal depositing process - Google Patents

Novel metal depositing process Download PDF

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Publication number
CN106811741A
CN106811741A CN201510848492.4A CN201510848492A CN106811741A CN 106811741 A CN106811741 A CN 106811741A CN 201510848492 A CN201510848492 A CN 201510848492A CN 106811741 A CN106811741 A CN 106811741A
Authority
CN
China
Prior art keywords
alloy layers
novel metal
depositing process
metal depositing
sodium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510848492.4A
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Chinese (zh)
Inventor
赵敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201510848492.4A priority Critical patent/CN106811741A/en
Publication of CN106811741A publication Critical patent/CN106811741A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Abstract

The present invention relates to novel metal depositing process, using reducing agent, self catalyzed reduction deposition obtains ni-p alloy layers on another part surface is activated, acquisition is up to 27: 25% amorphous ni-w-p alloy layers containing w, and to show and its special tissue shape and its feature is texturized in refinement procedure under perspective Electronic Speculum.A certain amount of raw material is prepared in the following proportions:Nickel sulfate:20-35g/l sodium hypophosphites:15-30. sodium acetates:5-25. lactic acid:2-30. saccharin:3: 8. NaOH:40-80.

Description

Novel metal depositing process
Technical field
The invention belongs to chemical plating field, more particularly to a kind of new chemical coating technology.
Background technology
The plating piece commonly used in people's daily life seldom considers the height of cost, it is easy to cause the shortcomings of energy waste, environmental pollution.
The content of the invention
The present invention is in order to overcome the technical deficiency of the above, there is provided a kind of new chemical coating technology, this chemical plating revolutionizes the shortcoming that original energy waste brings, energy-conserving and environment-protective.
What the present invention was achieved through the following technical solutions:
Using reducing agent, self catalyzed reduction deposition obtains ni-p alloy layers on another part surface is activated, and acquisition is up to 27: 25% amorphous ni-w-p alloy layers containing w, and shows under perspective Electronic Speculum its special tissue shape and its feature is texturized in refinement procedure.A certain amount of raw material is prepared in the following proportions:
Nickel sulfate:20-35g/l
Sodium hypophosphite:15-30.
Sodium acetate:5-25.
Lactic acid:2-30.
Saccharin:3∶8.
NaOH:40-80.
All the components are entered in reactor, under 35-45 Celsius temperatures react 5-6 hour, be subsequently adding ammoniacal liquor adjust ph values to 3: 3 be well mixed form.
Specific embodiment
The present invention is elaborated with reference to embodiment:
The present invention is in order to overcome the technical deficiency of the above, there is provided a kind of new chemical coating technology, this chemical plating revolutionizes the shortcoming that original energy waste brings, energy-conserving and environment-protective.
What the present invention was achieved through the following technical solutions:
Using reducing agent, self catalyzed reduction deposition obtains ni-p alloy layers on another part surface is activated, and acquisition is up to 27: 25% amorphous ni-w-p alloy layers containing w, and shows under perspective Electronic Speculum its special tissue shape and its feature is texturized in refinement procedure.A certain amount of raw material is prepared in the following proportions:
Nickel sulfate:20-35g/l
Sodium hypophosphite:15-30.
Sodium acetate:5-25.
Lactic acid:2-30.
Saccharin:3∶8.
NaOH:40-80.
All the components are entered in reactor, under 35-45 Celsius temperatures react 5-6 hour, be subsequently adding ammoniacal liquor adjust ph values to 3: 3 be well mixed form.
General principle of the invention and principal character and advantages of the present invention has been shown and described above.It should be understood by those skilled in the art that; the present invention is not limited to the above embodiments; merely illustrating the principles of the invention described in above-described embodiment and specification; without departing from the spirit and scope of the present invention; various changes and modifications of the present invention are possible, and these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appending claims and its equivalent thereof.

Claims (2)

1. novel metal depositing process is it is characterized in that self catalyzed reduction deposition obtains ni-p alloy layers on another part surface is activated using reducing agent, acquisition is up to 27: 25% amorphous ni-w-p alloy layers containing w, and to show and its special tissue shape and its feature is texturized in refinement procedure under perspective Electronic Speculum.
2. this novel metal depositing process is further characterized in that and prepares a certain amount of raw material in the following proportions,
Nickel sulfate:20-35g/l sodium hypophosphites:15-30. sodium acetates:5-25. lactic acid:2-30. saccharin:3: 8. NaOH:40-80.
CN201510848492.4A 2015-11-30 2015-11-30 Novel metal depositing process Pending CN106811741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510848492.4A CN106811741A (en) 2015-11-30 2015-11-30 Novel metal depositing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510848492.4A CN106811741A (en) 2015-11-30 2015-11-30 Novel metal depositing process

Publications (1)

Publication Number Publication Date
CN106811741A true CN106811741A (en) 2017-06-09

Family

ID=59102208

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510848492.4A Pending CN106811741A (en) 2015-11-30 2015-11-30 Novel metal depositing process

Country Status (1)

Country Link
CN (1) CN106811741A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110157363A (en) * 2019-06-11 2019-08-23 莱芜职业技术学院 A kind of preparation method of electromagnetic shielding conductive glue conductive powder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110157363A (en) * 2019-06-11 2019-08-23 莱芜职业技术学院 A kind of preparation method of electromagnetic shielding conductive glue conductive powder

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Legal Events

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PB01 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170609

WD01 Invention patent application deemed withdrawn after publication