CN106802387B - Low-sensitivity test equipment - Google Patents
Low-sensitivity test equipment Download PDFInfo
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- CN106802387B CN106802387B CN201710107263.6A CN201710107263A CN106802387B CN 106802387 B CN106802387 B CN 106802387B CN 201710107263 A CN201710107263 A CN 201710107263A CN 106802387 B CN106802387 B CN 106802387B
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- current sensor
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- absorption capacitor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- General Physics & Mathematics (AREA)
- Testing Relating To Insulation (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The invention discloses low-sensing test equipment, which comprises a current sensor, a passing electrode, a shell electrode, an absorption capacitor, an upper connecting plate and a lower connecting plate, wherein the current sensor is arranged on the upper connecting plate; the electrode penetrates through a hole in the middle of the current sensor, the shell electrode, the penetrating electrode and the current sensor are not contacted, the shell electrode extends to two sides to form end parts, one end of the penetrating electrode serves as one port of the test equipment, the other end of the penetrating electrode is connected with one electrode of the absorption capacitor through the lower connecting plate, the other electrode of the absorption capacitor is connected with one end of the shell electrode through the upper connecting plate, and the other end of the shell electrode serves as the other port of the test equipment. The invention can effectively reduce parasitic inductance and improve the accuracy of test.
Description
Technical Field
The invention relates to the field of power electronics, in particular to low-sensitivity test equipment.
Background
The power electronic technology plays a very important role in the current rapidly-developed industrial field, and a power semiconductor device is used as a representative of the power electronic technology and is widely applied to industries such as electric automobiles, photovoltaic power generation, wind power generation, industrial frequency conversion and the like. With the rise of industries in China, the power semiconductor device has wider market prospect.
The electrical performance parameters of the power semiconductor device are very focused indicators of application engineers, and the indicators can be used as the basis of the electrical design of the system, and often play a critical role in the quality of the designed product. The electrical performance parameters of the power semiconductor device need to be evaluated by means of professional dynamic and static test mechanisms, but the parasitic inductance of the current mature dynamic test mechanism is larger, usually about 70nH, which directly causes larger deviation of dynamic parameters and even limits the test of high-speed switch devices, such as SiC devices.
Disclosure of Invention
The invention aims to: the invention provides low-inductance test equipment capable of effectively reducing parasitic inductance.
The technical scheme is as follows: the low-sensing test equipment comprises a current sensor, a passing electrode, a shell electrode, an absorption capacitor, an upper connecting plate and a lower connecting plate; the electrode penetrates through a hole in the middle of the current sensor, the shell electrode, the penetrating electrode and the current sensor are not contacted, the shell electrode extends to two sides to form end parts, one end of the penetrating electrode serves as one port of the test equipment, the other end of the penetrating electrode is connected with one electrode of the absorption capacitor through the lower connecting plate, the other electrode of the absorption capacitor is connected with one end of the shell electrode through the upper connecting plate, and the other end of the shell electrode serves as the other port of the test equipment.
Further, the device also comprises an upper insulation pressing column arranged above the upper connecting plate and a lower insulation pressing column arranged below the lower connecting plate; the upper insulation pressing column presses the upper connecting plate downwards, and the lower insulation pressing column upwards props against the lower connecting plate. Therefore, the upper connecting plate is fully contacted with one end of the shell electrode and the other electrode of the absorption capacitor, the lower connecting plate is fully contacted with one electrode penetrating through the other end of the electrode and the absorption capacitor, parasitic inductance is further reduced, and testing accuracy is improved.
Further, the upper insulation pressing column and the lower insulation pressing column are connected through bolts, the bolts penetrate through the upper connecting plate and the lower connecting plate, and the bolts are not contacted with the upper connecting plate and the lower connecting plate. Therefore, the upper connecting plate can be fully contacted with one end of the shell electrode and the other electrode of the absorption capacitor through the bolts, the lower connecting plate is fully contacted with one electrode penetrating through the other end of the electrode and the absorption capacitor, parasitic inductance is further reduced, and testing accuracy is improved. Moreover, the bolts are not contacted with the upper connecting plate and the lower connecting plate, so that the upper connecting plate and the lower connecting plate are not conducted.
Furthermore, the electrode end part of the shell is parallel to the electrode end part of the penetrating electrode, so that parasitic inductance can be further reduced, and the accuracy of testing is improved.
Furthermore, the shell electrode cover is arranged on the part of the current sensor, so that parasitic inductance can be further reduced, and the accuracy of the test is improved.
Further, only the lead end of the current sensor is exposed outside, and other parts of the current sensor are covered by the shell electrode. Therefore, parasitic inductance can be further reduced, and the accuracy of the test is improved.
Furthermore, the two electrodes of the absorption capacitor are parallel, so that parasitic inductance can be further reduced, and the accuracy of the test is improved.
Further, the two electrodes of the absorption capacitor are arranged in the middle of one side of the absorption capacitor, so that parasitic inductance can be further reduced, testing accuracy is improved, testing can be facilitated, and the absorption capacitor does not need to be turned over when the upper half bridge and the lower half bridge are tested respectively.
Further, the portion of the penetrating electrode, which is positioned in the middle of the current sensor, is cylindrical, so that the distance between the penetrating electrode and the electrode of the shell can be reduced, parasitic inductance can be effectively reduced, and the accuracy of the test is improved.
The beneficial effects are that: the invention discloses low-sensitivity test equipment, wherein the other end of a penetrating electrode is connected with one electrode of an absorption capacitor through a lower connecting plate, the other electrode of the absorption capacitor is connected with one end of a shell electrode through an upper connecting plate, so that the other end of the penetrating electrode is better connected with one electrode of the absorption capacitor, the other electrode of the absorption capacitor is better connected with one end of the shell electrode, parasitic inductance can be effectively reduced, and test accuracy is improved.
Drawings
FIG. 1 is a schematic diagram of a test apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an up-down split structure of a test apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a left-right split structure of a test apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic view of the structure of a housing electrode of a test device according to an embodiment of the present invention;
FIG. 5 is a schematic view of the structure of a pass-through electrode of a test apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of the structure of the absorption capacity of the test device according to the embodiment of the present invention;
FIG. 7 is an enlarged view at A in FIG. 6;
fig. 8 is a schematic diagram showing an internal structure of an absorption capacitor of a test apparatus according to an embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further described below with reference to the accompanying drawings and the specific embodiments.
The present embodiment discloses a low-inductance test device, as shown in fig. 1 and 2, comprising a current sensor 1, an absorption capacitor 2, a housing electrode 3, a passing electrode 4, an upper connection plate 51, a lower connection plate 52, a first upper insulation column 61, a second upper insulation column 62, a first lower insulation column 63 and a second lower insulation column 64.
The housing electrode 3 includes a left electrode portion 31 and a right electrode portion 32, the left electrode portion 31 and the right electrode portion 32 are fixed by screws, as shown in fig. 3 and 4, the housing electrode 3 is covered outside the current sensor 1, and the housing electrode 3 has only one opening 33, the lead terminal 11 of the current sensor is exposed outside, as shown in fig. 4, and other portions of the housing electrode 3 are closed. As shown in fig. 4, the left electrode portion 31 extends leftward beyond the housing electrode left end portion 311, a housing electrode through hole 3111 is provided in the housing electrode left end portion 311, and the right electrode portion 32 extends rightward beyond the housing electrode right end portion 321.
The through electrode 4 passes through the hole in the middle of the current sensor 1, and the through electrode 4 includes a cylindrical through electrode middle portion 43 in the middle of the current sensor 1, and as shown in fig. 5, the through electrode 4 further includes a through electrode left end portion 41 in the left side of the current sensor 1 and a through electrode right end portion 42 in the right side of the current sensor 1. The through electrode left end 41 is provided with a through electrode through hole 411.
The absorption capacitor 2 comprises an upper polar plate 23, a lower polar plate 24 and a capacitor core group 25, wherein the capacitor core group 25 is positioned between the upper polar plate 23 and the lower polar plate 24, as shown in fig. 8, the lower polar plate 24 extends to one side to form a first electrode 21, the upper polar plate 23 is firstly bent vertically to the direction of the lower polar plate 24, and then extends to form a second electrode 22 vertically to the bending surface, as shown in fig. 6, 7 and 8, the first electrode 21 is parallel to the second electrode 22. The first electrode 21 is further provided with a first electrode through hole 211 penetrating therethrough, and the second electrode 22 is also provided with a second electrode through hole penetrating therethrough (not shown), as shown in fig. 6.
The housing electrode 3, the passing electrode 4 and the current sensor 1 are not in contact. The right end portion 42 of the passing electrode serves as one port of the testing device for connecting the power module 8 to be tested, the left end portion 41 of the passing electrode serves as the other port of the testing device for connecting the power module 8 to be tested, the second electrode 22 is connected through the lower connecting plate 52, the first electrode 21 is connected through the upper connecting plate 51 to the left end portion 311 of the housing electrode, and the right end portion 321 of the housing electrode serves as the other port of the testing device for connecting the power module 8 to be tested. The upper connection plate 51 is provided with an upper connection hole 511 therethrough as shown in fig. 2. Similarly, the lower connecting plate 52 is also provided with a lower connecting hole (not shown). In addition, a first upper insulation pressing column 61 and a second upper insulation pressing column 62 are further arranged above the upper connecting plate 51, and a first lower insulation pressing column 63 and a second lower insulation pressing column 64 are further arranged below the lower connecting plate 52, wherein the first upper insulation pressing column 61 is parallel to and opposite to the first lower insulation pressing column 63 to form a first group of insulation pressing columns; the second upper insulation studs 62 are also parallel and opposite to the second lower insulation studs 64, forming a second set of insulation studs. The two groups of insulating press columns are respectively fixed from bottom to top through the two groups of bolts, so that the lower connecting plate 52 is fully contacted with the electrode left end 41 and the second electrode 22, and the upper connecting plate 51 is fully contacted with the shell electrode left end 311 and the first electrode 21. The first set of bolts 71 is used to fix the first upper insulation stud 61 and the first lower insulation stud 63, and the second set of bolts 72 is used to fix the second upper insulation stud 62 and the second lower insulation stud 64, as shown in fig. 2. The first set of bolts 71 pass through the first lower insulating pressing post 63, the lower connection hole (not shown), the second electrode through hole (not shown), the first electrode through hole 211, the upper connection hole 511, and the first upper insulating pressing post 61 in this order, and the first set of bolts 71 are not in contact with the lower connection hole (not shown), the second electrode through hole (not shown), the first electrode through hole 211, and the upper connection hole 511. The second set of bolts 72 pass through the second lower insulating pressing post 64, the lower connecting hole (not shown), the through-electrode through-hole 411, the case electrode through-hole 3111, the upper connecting hole 511, and the second upper insulating pressing post 62 in this order, and the second set of bolts 72 are not in contact with the lower connecting hole (not shown), the through-electrode through-hole 411, the case electrode through-hole 3111, and the upper connecting hole 511.
In consideration of the electrical safety problems such as creepage distance and electrical clearance, insulating mediums are arranged between different electrodes of the low-sensitivity test equipment and between the electrodes and the current sensor, and the size of the insulating mediums is larger than that of the electrodes, so that the creepage distance is increased.
Claims (5)
1. A low-sensitivity test apparatus, characterized in that: the device comprises a current sensor, a penetrating electrode, a shell electrode, an absorption capacitor, an upper connecting plate and a lower connecting plate; the electrode penetrates through a hole in the middle of the current sensor, the shell electrode, the penetrating electrode and the current sensor are not contacted, the shell electrode extends to two sides to form end parts, one end of the penetrating electrode serves as one port of the test equipment, the other end of the penetrating electrode is connected with one electrode of the absorption capacitor through the lower connecting plate, the other electrode of the absorption capacitor is connected with one end of the shell electrode through the upper connecting plate, and the other end of the shell electrode serves as the other port of the test equipment; the shell electrode cover is arranged on part of the current sensor; only the lead end of the current sensor is exposed outside, and other parts of the current sensor are covered by the shell electrode; the two ends of the passing electrode are provided with electrode terminals; the absorption capacitor is provided with two electrode terminals; the shell electrode end is parallel to the penetrating electrode end; the two electrodes of the absorption capacitor are parallel.
2. The low-sensitivity test apparatus according to claim 1, wherein: the device also comprises an upper insulation pressing column arranged above the upper connecting plate and a lower insulation pressing column arranged below the lower connecting plate; the upper insulation pressing column presses the upper connecting plate downwards, and the lower insulation pressing column upwards props against the lower connecting plate.
3. The low-sensitivity test apparatus according to claim 2, wherein: the upper insulation pressing column and the lower insulation pressing column are connected through bolts, the bolts penetrate through the upper connecting plate and the lower connecting plate, and the bolts are not contacted with the upper connecting plate and the lower connecting plate.
4. The low-sensitivity test apparatus according to claim 1, wherein: the two electrodes of the absorption capacitor are arranged in the middle of one side of the absorption capacitor.
5. The low-sensitivity test apparatus according to claim 1, wherein: the part of the penetrating electrode positioned in the middle of the current sensor is cylindrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710107263.6A CN106802387B (en) | 2017-02-27 | 2017-02-27 | Low-sensitivity test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710107263.6A CN106802387B (en) | 2017-02-27 | 2017-02-27 | Low-sensitivity test equipment |
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| Publication Number | Publication Date |
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| CN106802387A CN106802387A (en) | 2017-06-06 |
| CN106802387B true CN106802387B (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710107263.6A Active CN106802387B (en) | 2017-02-27 | 2017-02-27 | Low-sensitivity test equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023075743A1 (en) * | 2021-10-25 | 2023-05-04 | Hewlett-Packard Development Company, L.P. | Thermal resistance determination |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101344572B (en) * | 2008-09-04 | 2010-06-09 | 铁道部运输局 | Chopped wave test circuit and method for semiconductor power device |
| CN102064161B (en) * | 2010-11-12 | 2013-09-04 | 嘉兴斯达微电子有限公司 | Optimized power package structure of intelligent power module |
| JP2016011952A (en) * | 2014-06-04 | 2016-01-21 | 株式会社Ｔｏｐ | Power semiconductor test apparatus |
| CN204832440U (en) * | 2015-07-13 | 2015-12-02 | 许继电气股份有限公司 | IGBT connection in series -parallel test system |
| CN206584012U (en) * | 2017-02-27 | 2017-10-24 | 扬州国扬电子有限公司 | A kind of low sense test equipment |
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