CN106797700A - The conductor circuit designs of the metal material in the ceramic bases of optimization - Google Patents
The conductor circuit designs of the metal material in the ceramic bases of optimization Download PDFInfo
- Publication number
- CN106797700A CN106797700A CN201580053845.XA CN201580053845A CN106797700A CN 106797700 A CN106797700 A CN 106797700A CN 201580053845 A CN201580053845 A CN 201580053845A CN 106797700 A CN106797700 A CN 106797700A
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- Prior art keywords
- metal level
- ceramic bases
- outer rim
- relative
- composite
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
Abstract
The present invention relates to a kind of composite, the composite includes that at least one metal level M at least one surface of ceramic bases S and ceramic bases S, wherein metal level M have specific shape on horizontal direction and/or vertical direction.Layout and its application the invention further relates to a kind of corresponding conductor circuit, a kind of method for producing at least one conductor circuit, a kind of circuit board and a kind of stamping tool and/or coining tool.
Description
Technical field
The present invention relates to a kind of composite, the composite includes ceramic bases S and the ceramic bases S is at least one
On individual surface have at least one metal level M, wherein the metal level M on horizontal direction and/or vertical direction have it is specific
Shape.
Background technology
Ceramic circuit board is especially applied in high power module because high power module must endure as until 250 DEG C or
Operating temperature higher, such as in the case of by wind turbine power generation, regulation and control railroad train, high-power machinery or
It is in the case of being applied in electronics movement instrument in the future.
These ceramic circuit boards generally include ceramic bases, are provided with the metal level of conduction, for example, be made of copper
Metal level.A kind of method being commonly used in reference to two kinds of materials is " directly covering copper method " (DCB-Verfahren), and the method will
Scale copper is placed on a ceramic substrate and compressed, and 1020 DEG C to 1040 DEG C are heated in oxygen atmosphere.In said temperature
In the case of, the surface of copper and oxygen reaction form cupric oxide, cupric oxide again with Ceramic bond.It is consequently formed a kind of Slow cooling
Stabilization material combine compound.
Generally, the thermal coefficient of expansion that the ceramics for using have is very big (for example with the difference of thermal expansion coefficients of the metal for using：
Al2O3The thermal coefficient of expansion of-ceramics is 8.5*10-61/K, and the thermal coefficient of expansion of copper is 17.3*10-61/K).This causes, leads to
To cross directly cover and thermomechanical tension force is produced in compound obtained in copper method, and the compound can bend.Meanwhile, in metallic conductor
The edge of circuit occurs stress increases (being referred to as Stress singularity).Ceramic circuit board both can set metal knot in side thereon
Structure, it is also possible to which metal structure is set on the downside of it, therefore above-mentioned bending can be the problem of receiving.However, stress is at edge
The service life to circuit board is concentrated, is especially conclusive for the thermal cycle cycle.
Having had some in the prior art increases building for circuit board service life by reducing Stress singularity as far as possible
View.
In the T5 of DE 11 2,009 000 555, such as in order to avoid the crackle that the difference of above-mentioned thermal expansion index is caused,
Advise that the metal surface of conductor circuit is set to the polygonal shape with circular edge.Because the outer shape of metal level does not have
There is corner, thermal stress cannot be concentrated on corner, so as to extend the service life of circuit board.It is also specifically mentioned in the publication
Circular, the oval or polygonal shape of metal level.
Be also illustrate that in the A1 of DE 10 2,006 014 609, when edge is circular, it is to avoid stress is limited to metal portion
Edge situation.
On the other hand, the B2 of US 6798060 illustrate a kind of method, wherein the stress shape in order to improve ceramic circuit board
State, the edge of metal level is vertically molded.In this case, it is proposed that the edge of 30 ° to 60 ° of setting is oblique in vertical direction
Face.
The A1 of DE 44 06 397 are mentioned, by covering up and etching the original metal portion in substrate to construct the metal portion,
Spill arch or spill angle are upwardly formed in the Vertical Square on substrate.But above-mentioned document by this point be considered as it is unfavorable because
Vertical side is at least part of to be not easy to be applied to the adjuvant (coating, Tu paint) used in follow-up process, and
Vertical side or sharp edge so that the follow-up concentration that electric-field intensity occurs when using circuit, so as to cause compressive resistance
Reduce.Therefore, the document proposes a kind of method for changing existing shape.
The A2 of EP 1 061 783 also illustrate that, such as because different thermal coefficient of expansions forms the stress parallel with surface
Gradient, particularly in metal covering and the transitional region of non-metal surfaces.In order to avoid the fracture of substrate, it is proposed that along metal covering
The downside at edge sets edge weakenings.In this case, metal volume content, i.e. each volume are reduced towards the edge of metal level
Amount of metal in unit.Clearly suggestion sets the inclined-plane of the metal covering less than 45 ° herein.The document is mentioned that poroid or groove
The combination of the depressed part and arrangement of apertures of shape.Further, it is suggested that the thickness of metal level successively decreases in stepped.In addition, it is also mentioned
Direction towards the edge of metal level sets open depressed part, and these depressed parts form full of twists and turns edge.Then, it is described
Structure still shows the region at the edge with edge trend, i.e., with acute angle.
Advise in the C1 of DE 4 004 844, by the corner rounding of copper conductor circuit, and the edge of layers of copper is chamfer, to keep away
Exempt from the breach or crackle of ceramics.In this case, the STRESS VARIATION in the transitional region from metal covering to non-metal surfaces is reduced
Gradient.
Although these suggestions of the prior art reduce Stress singularity to a certain extent, this is not completely eliminated
The situation of kind.Therefore, it is necessary to further reduce the decline of stress.
The content of the invention
Based on prior art, task of the invention is to eliminate of the prior art at least one, is preferably eliminated all
Shortcoming.Especially, task of the invention is to provide a kind of composite, and the composite includes thering is at least one conductor electricity
The ceramic bases on road, the Stress singularity of the conductor circuit is less than any prior art.
By the composite of the invention for hereinafter illustrating, the layout of conductor circuit of the invention
(Layout) and its application, it is of the invention for produce at least one conductor circuit method, circuit of the invention
Plate and stamping tool of the invention and/or coining tool, realize above-mentioned task.
Particularly, it has therefore proved that by the layout of conductor circuit of the invention, conduct can compared with the prior art be reduced
Stress singularity between the ceramic bases and metal level of conductor circuit application.Particularly, show by FEM calculation, according to
Layout of the invention causes that elastic deformation only occurs in the contact area of metal level and ceramic bases.Preferably, in this case
No more than the yield point of copper.Thereby, it is possible to the appearance of Stress singularity is reduced into minimum value.Composite of the invention
Service life therefore be obviously prolonged.
Composite
The present invention provides a kind of composite, and the composite includes ceramic bases S, and ceramic bases S at it at least
Having at least one metal level M, wherein metal level M on one surface substantially has the vertical direction relative to ceramic bases S
On layer thickness h, and shapes of the metal level M on the horizontal direction relative to ceramic bases walked by the outer rim L of metal level M
To limitation, it is characterised in that trends of the flank F of the outer rim L of metal level M in the vertical direction of relative ceramic bases and/or
The profile on the horizontal direction of relative ceramic bases of the outer rim L of metal level is at least 10 μ in its circuit distance (Strecke)
Be able to be represented by continuously differentiable function in the arbitrary region of m, wherein flank F being extended at h=h from h=0, and
The continuously differentiable function and non-rectilinear (f (x)=mx+b).
Improvement project of the invention, advantage and application scheme are drawn by the following explanation to embodiment and accompanying drawing.Principle
On, all explanatory notes and/or picture specification features are individually or mode in any combination is used as of the invention substantially interior
Appearance, the summary being independent of in claim or its adduction relationship.The content of claim is also the part of specification.
Especially, vertical direction of the flank F according to the currently preferred outer rim for being metal level M in relative ceramic bases
On trend and metal level outer rim L the profile on the horizontal direction of relative ceramic bases circuit distance at least 10 μm
Arbitrary region in be able to be described by continuously differentiable function.All designs of the invention first relate to outer
The setting of the trend of the flank of edge and the profile of outer rim and its modification.In all these designs, above-mentioned setting and its change
Type is preferred.
Within the framework of the invention, " ceramic bases S " is preferably what is be made up of ceramic raw material, preferably fuel plate,
The fuel plate is provided with one to two surfaces or can set metal level (metal portion).In this case, " pottery
The surface of porcelain substrate S " is preferably at least one side of fuel plate, at least one other side of its size than fuel plate
Face is bigger.
Ceramic bases may, for example, be the substrate being made up of aluminum oxide, aluminium nitride, silicon nitride or carborundum.Similarly suitable work
For ceramic bases be for example containing about 2% to 30% zirconium oxide (ZrO2) aluminium oxide ceramics (Al2O3), or for example with
Yittrium oxide as additive aluminium nitride ceramics, or be silicon nitride ceramics, wherein aluminium nitride ceramics and/or silicon nitride ceramics
For example there is the superficial layer of oxidation, the superficial layer being for example made up of aluminum oxide.The thickness of ceramic bases preferably in 0.2mm extremely
Between 1.5mm.
In the present invention, " metal level M " be preferably it is a kind of substantially its extend laterally and be at least equal to its vertically extending unit
Element.Here " transverse direction " and " vertical " is relative to for ceramic bases S.
This metal level is included for example by the alloy of copper, copper alloy or cupric, or by aluminium, aluminium alloy or containing aluminium
Metal film or sheet metal that alloy is made.
Composite of the invention includes that ceramic bases S, ceramic bases S have gold at least one surface thereof
Category layer M.Metal level M substantially has relative to the layer thickness h in the vertical direction of ceramic bases (referring to Fig. 1).
The statement of relevant " substantially " in the present invention it is preferably meant that the deviation of each exact value is +/- 10%, preferably
+/- 5% and/or be the inessential deviation for the function.Particularly, a layer thickness h is further comprises substantially to exist
In the limited range of metal level M, and towards outer rim L direction reduce situation (for example metal level M is relative to ceramic bases S
Vertical direction on substantially hemispherical shape, wherein h is consistent with the radius of the hemisphere).
Preferably, h is 10 to 950 μm, particularly preferably more preferably 100 to 600 μm, 300 to 400 μm.
Additionally, metal level M has outer rim L, outer rim L represents metal level M on the horizontal direction relative to ceramic bases
Shape (referring to Fig. 2).Therefore outer rim L limits the phase and the phase of air of the metal of metal level M in the horizontal.Metal
The shape of layer M essentially refers to shape designs of the metal level M on ceramic bases S.Outer rim L is on the whole height of metal level
H extends.However, the present invention is in the case of the height h for limiting, set metal level M's on the profile of the outer rim L of metal level M
Shape.Preferably, height h is set to the circuit distance height most long of the profile for making outer rim L.Thus, metal level relative to
Shape on the horizontal direction of ceramic bases is two dimensional image, and it is for example used as shade and obtains by the illumination of metal level M, wherein
Light source (thus light source and metal layer vertical, and parallel with h) substantially aligned vertically relative to ceramic layer S (but reality is not considered herein
The size on border, such as circular shade of spherical generation, shade has spherical diameter such that it is able to measure spherical height and ball
Shape in the case that shape radius is consistent).Preferably, outer rim L is more than layer thickness h.It is also preferred that the outer rim L of metal level M
Profile in the vertical direction relative to ceramic bases in h=0 more than h=h when outer rim L profile.Thus, outer rim L
The circuit distance of profile reduced with the increase of layer thickness h on the direction vertical relative to ceramic bases S.Additionally, side
The trend of wing F is preferably spill.It is also preferred that the trend of flank F is convex.
In addition, metal level M also flank F of the outer rim L with metal level M in the vertical direction relative to ceramic bases.
Outer rim L during outer rim L during flank F articulamentum thickness h=0 and thickness degree h=h.According to the present invention, the trend of flank F is also
There is shape.Trends of the flank F in the vertical direction relative to ceramic bases is the section between h=0 to h=h, and it is for example
It is used as shade by the illumination of metal level M to obtain, wherein light source is laterally directed at (thus light source and metal relative to ceramic layer S
Layer is laterally aligned to, and at a right angle with h) (but do not consider actual size herein；For example it is big when the profile of outer rim L is as h=0
(referring to Fig. 1) in the case of profile when as h=h, can produce and shade as class of a curve (such as parabola).
According to the present invention, the trend of the flank F of the outer rim of metal level M in the vertical direction of relative ceramic bases is in circuit
Can be represented by continuously differentiable function in the arbitrary region of at least 10 μm of distance, wherein the continuously differentiable function and non-rectilinear
(f (x)=mx+b).Likewise, according to the present invention, the wheel on the horizontal direction of relative ceramic bases of the outer rim L of metal level M
It is wide to be represented by continuously differentiable function in the arbitrary region of at least 10 μm of circuit distance, the wherein continuously differentiable function
And non-rectilinear (f (x)=mx+b).
The present invention refers to the arbitrary region of at least 10 μm of circuit distance.This region can be located at outer rim L on and/or
It is the arbitrary region on flank F.Or this region is vertically moved towards with respect to ceramic bases S, it is close to the trend of flank F；
Laterally moved towards with respect to ceramic bases S, be close to the profile of outer rim L.In this case at least 10 μm of the circuit distance for being considered,
It is preferred at least 15 μm, it is particularly preferred at least 20 μm, especially particularly preferred at least 25 μm.The region clearly shows that, existing
The condition that the metal level of technology is for example produced from it technique is limited, slight with " corner " that is included in layout or edge
Rounding, without the profile of the outer rim that can be represented by continuously differentiable function.These known metal levels are at least in this hair
(not in arbitrary region) also includes corner, edge and/or straight line in bright described region.Therefore these designs cannot
Meet trends of the flank F of requirement of the invention, the i.e. outer rim of metal level M in the vertical direction of relative ceramic bases and/or
The profile on the horizontal direction of relative ceramic bases of the outer rim L of metal level is in its circuit distance at least 10 μm of any area
Can be represented by continuously differentiable function in domain, wherein the function and non-rectilinear (f (x)=mx+b).
Particularly preferably it is estimated to measure by the shooting metallography microscope picture in light microscope and to it
State arbitrary region.It is also preferred that measuring any area by observing in electronic scanner microscope sample and taking pictures
Domain.The arbitrary region of at least 10 μm of circuit distance is disintegrated by this way, i.e., 10 μm equivalent at least 1cm, preferably
At least 1.5cm, particularly preferred at least 2cm.
Continuously differentiable function known to those skilled in the art.It is continuously differentiable to mean that function be micro-, and its derivative is continuous.
Especially, ABS function f (x)=│ x │ be discontinuously can be micro-.Likewise, it is all with " kink " (i.e. corner and/or
Edge) function be also discontinuously can be micro-.According to the present invention, because they can not be represented by continuously differentiable function, therefore
Eliminate the trend of the flank F with corner and/or the profile of outer rim L.
In accordance with the invention it is possible to use all continuously differentiable functions without straight line., but it is preferred that flank can be represented
The function of the trend of F and/or the profile of outer rim L from parabolic function, e functions, trigonometric function, spline function, Bezier,
Selected in the group that NURBS and higher order mathematical equations are constituted.In particular it is preferred that the trend and/or outer rim L of flank F can be represented
The function of profile be high-order parabola function.Especially it is particularly preferred that the trend of flank F and the wheel of outer rim L can be represented
Wide function is high-order parabola function.
Amazing is to find, by using the profile on the horizontal direction or vertical direction of relative ceramic bases,
Or the profile on the horizontal direction and vertical direction of relative ceramic bases, metal level M and ceramic bases S can be reduced
Between vertical and horizontal Stress singularity.Feature is not damaged in this case.Composite of the invention
Only there is the elastic deformation of metal level in the contact area of metal level and ceramic bases.Preferably, no more than metal (preferably
Copper) yield point.Composite thus, it is possible to obtain long service life, particularly than composite of the prior art high
Composite with longer service life in the case of thermal cycle.
According to the present invention, due to eliminating the situation of straight line trend, the circuit distance of the trend of flank F is always more long than h.It is excellent
Choosing, the circuit distance of the trend of flank F is than h to 1.1 to 20 times of the youthful and the elderly, and 1.1 to 15 times of especially preferred length is particularly preferred
It is long 1.1 to 10 times.
Layout (Layout)
The design and scheme of conductor circuit on a ceramic substrate known to those skilled in the art.The present invention provides one kind and exists
The layout of the conductor circuit on ceramic bases S, wherein conductor circuit are made up of at least one metal level M, and metal level M substantially exists
There is layer thickness h in vertical direction with respect to ceramic bases S, and metal level M is on the horizontal direction relative to ceramic bases
Shape by metal level M outer rim L move towards limitation, wherein the layout only including metal level M outer rim in relative ceramic bases
Vertical direction on flank F trend and/or the profiles of the outer rim L on the horizontal direction of relative ceramic bases of metal level,
The trend and/or profile can be represented in circuit at least 10 μm of arbitrary region of distance by continuously differentiable function, its
Middle flank F is extended at h=h from h=0, and the continuously differentiable function and non-rectilinear (f (x)=mx+b).Therefore, according to this
The placement Service of invention is in production composite of the invention.The optimum condition of all about composite of the invention is all same
Suitable for layout of the invention.
For example, showing the layout of the invention compared with the layout of prior art in Fig. 3.Preferably, this hair
Bright layout is contemplated that continuously differentiable function includes or excludes (such as in the prior art, rectangular) region of plan easily.
In this case, different functions is arranged as have identical gradient at transition point.Thus ensure that in the present embodiment,
The outer rim L of trends and metal level of the flank F of the outer rim of metal level M in the vertical direction of relative ceramic bases relative
Profile on the horizontal direction of ceramic bases can be represented (without straight line) in each arbitrary region by continuously differentiable function.
It is particularly preferred that layout of the invention shape with bone-shaped (epiphysis shape) on transverse area, and existing skill
There is corner in art on transverse area.
Subject of the present invention also includes the application to layout designs of the invention, to manufacture for controlling high voltage or electric current
Power model circuit board.According to the present invention, " high voltage " preferably refers to the voltage of 1000V to 30000V, especially excellent
Choosing be 1250V to 25000V voltage, the especially particularly preferably voltage of 1500V to 20000V.Invention technician
Known power module.In this case, the supply of the requirement or electric organ according to customer is referred to first, by the existing of electric energy
State is changed into the electrical equipment of other states, for example, high voltage is changed into low-voltage, while frequency conversion high is changed into low change
Frequently.Change the task of electric energy preferably by wind turbine generator (wind load of change causes the parameters of electric power being continually changing), the sun
Energy field, house are solved with the power model in Machinery Control System or distribution system.
Method
Subject of the present invention further relates to a kind of for producing the compound of at least one conductor circuit including on ceramic bases S
The method of material, wherein conductor circuit are made up of at least one metal level M, and metal level M substantially has relative to ceramic bases S
Vertical direction on layer thickness h, and shapes of the metal level M on the horizontal direction relative to ceramic bases is by metal level M
Outer rim L move towards limitation, the described method comprises the following steps：
(1) ceramic bases S and metal are provided, the metal constitutes metal level M, and
(2) layout of the invention, the metal is applied on the ceramic bases S, to obtain at least one gold medal
Category layer M.
Here, all above-mentioned optimum conditions for referring to all are equally applicable to the method for the present invention.
In one embodiment, by etch process implementation method step (2).In this case, ability is especially used
Method known to field technique personnel sprays on the metal layer photosensitive, particularly ultraviolet-sensitive photoresist.First by
Be applied to metal level on ceramic bases S by method known to those skilled in the art, preferred to use " directly covering copper method ".By
Photomask, photoresist layer is preferably exposed in automatic exposure device as follows, that is, keep the position of conductor circuit not have
There is light, the position without conductor circuit is then exposed in ultraviolet light.In this case, photomask is at least relative to ceramics
There is layout of the invention in the transverse direction of substrate.During flushing, by the photoresist removal on exposure position.In ensuing erosion
In carving technology, the metal not being photo-etched on the position of glue protection is only removed.Realized by etch process of the invention relative
In the layout for extending vertically of ceramic bases.Thus, when the outer rim in view of metal level M is vertical relative to ceramic bases
The profile of the trend of the flank F on direction and the outer rim L of metal level on the horizontal direction relative to ceramic bases, metal level
Just become metal level M of the invention.Otherwise, metal level only just becomes according to the present invention in a wherein step of above-mentioned steps
Metal level M (shape-designing in the vertical direction or transverse direction of metal level).Preferably, formed vertically by multiple etching steps
Layout on direction.Especially, stopped etching earlier technique by than prior art, can realize flank F's of the invention
Trend.Particularly, etching step can also be then taken, to form flank F of the invention.
In another embodiment, by punch steps and/or imprint step methods ＆＆ steps of implementation (2).In this case,
Sheet metal is exposed to stamping tool and/or coining tool first, thus by flank F of the invention relative to ceramic base
The profile of trend and/or outer rim L in the vertical direction at bottom on the horizontal direction relative to ceramic bases is transformed into metal level
On.By this method, sheet metal becomes metal level M of the invention.
In the present embodiment, next the metal level M of formation is applied on ceramic bases S.This is by using ability
Method known to field technique personnel is completed.Preferably, the metal level M of acquisition is applied to ceramic base by " directly covering copper method "
On the S of bottom.
Accordingly, the present invention provides a kind of presser for producing at least one conductor circuit on ceramic bases S
Tool and/or coining tool, wherein conductor circuit is made up of at least one metal level M, it is characterised in that the stamping tool and/
Or coining tool is designed as, punching press is carried out by the stamping tool and/or coining tool and/or impressing will be of the invention
Layout is set onto metal level M.Thus, the stamping tool and/or coining tool have the shape opposite with layout of the invention.
It includes each information for extending laterally relative to ceramic bases S of the conductor circuits that are made of metal level M and/or extends vertically
Information.Shape or the shape-designing of general stamping tool known to those skilled in the art and/or coining tool.Next,
The conductor circuit for obtaining will be suppressed to be applied on ceramic bases S, to obtain composite of the invention.
Circuit board
Subject of the present invention also includes the circuit board of composite of the invention.In this case, the present invention
Composite can be used in above-mentioned all designs.
List of reference signs
S ceramic bases
M metal levels
The thickness degree of h metal levels
The outer rim (relative to the horizontal direction of ceramic bases) of L metal levels
The flank (relative to the vertical direction of ceramic bases) of F metal level outer rims
Brief description of the drawings
Fig. 1 schematically shows the composite including the metal level M on ceramic bases S, wherein the layer and ceramics
Extending laterally for substrate is parallel.The metal level M has impartial layer thickness h in all region is shown.Flank F is from h=0
Extend at h=h.Here, flank is configured to spill and can be described by parabolic function；
Fig. 2 schematically shows the composite of the metal level M being included on ceramic bases S, wherein the layer and pottery
Extending vertically for porcelain substrate is parallel (top view).The metal level M has outer rim L, and outer rim L is for example by projecting to ceramic base
It is visible on the S of bottom.Here, the profile of outer rim L can (left field be in bone-shaped, and right side area is in parabolic by multiple function representations
Wire), wherein to be adjusted to each gradient identical for transition of the function on each aspect；
Fig. 3 shows the layout (dotted line) and corresponding conductor circuit of the invention of the conductor circuit of prior art
Layout (solid line) contrast；
Fig. 4 shows the shape-designing of the conductor circuit end calculated in embodiment (respectively with top view and sectional view
Show)：
A () is in a lateral direction two right angles, and have vertical flank in vertical direction；
B () has vertical flank in vertical direction in a lateral direction in the curve of 2mm；
C () is in a lateral direction two right angles, and have in vertical direction in 45 ° of inclined planes of gradient as flank；
(d) parabolically shape in a lateral direction, and there is parabola as shown in Figure 1 schematically in vertical direction
The flank of shape.
Specific embodiment
In four different implementation methods, the cooling according to analysis of finite element method in the cooling 400K of manufacturing process is walked
The plastic elongation of the copper bar in ceramic bases after rapid and internal stress.
All implementation methods all reach maximum manufacture temperature Tmax in the first step first, are set in unstressed normal temperature
It is set in the case of 420 DEG C, copper reaches Tmax and plays (thermal coefficient of expansion in temperature：17.3*10-61/K；Elastic modelling quantity 125*
109Pa；Poisson's ratio：0.35；Flow stress starts at value：50MPa：Isotropism tangent modulus:500MPa) stick to ceramic bases
(Al2O3；Thermal coefficient of expansion：8.5*10-61/K；Elastic modelling quantity 390*109Pa；Poisson's ratio：0.23) on.Then, the chemical combination
Thing cooling 400K, is cooled to room temperature (20 DEG C), wherein each part is mutually tightened because of different thermal coefficient of expansions.Such case
Under, Temperature Distribution is still all at any time uniform (being cooled down without part).At this moment the copper of conductor circuit fringe region is calculated
The Plastic Flow of material.For this using the Static finite element analysis method of geometrical non-linearity.Any fixation and external force (part are not used
Being capable of free forming).There is symmetrical limitation in each boundary.
Checked shape-designing mode is shown in table 1 below：
Table 1：The shape-designing mode of the copper bar checked；Using the end of copper bar, used as the object of observation, (shape also can be found in
Fig. 4)
In order to ensure result can contrastive, choose fringe region (plasticized region) constant least member size.Make
With 15.0 editionsProgram is calculating.Per-unit system has then used metric size t, mm, s；And enter by finite element
Row discretization.Volume component is connected with volume element by a square displacement method.
Examine tensile stress and thrust.Correlated results is summarized in Fig. 3.
Fig. 3：As a result (contact result)
These results are clearly illustrated, in shape-designing 4, the load of copper is minimum (to exceed stream of the copper in the case of 50MPa
Change limiting value is more, and the possibility blocked is higher).Shape-designing 4 even shows that load is less than the rheology limiting value of copper so that
Only there is the elastic deformation of copper.
In contrast, shape-designing 1 and the value shown in shape-designing 3 are substantially than less favorable.
Claims (10)
1. a kind of composite, the composite includes ceramic bases (S), and the ceramic bases (S) are in its at least one table
There is at least one metal level (M) on face, wherein
The metal level (M) substantially has thickness degree (h) in the vertical direction relative to the ceramic bases (S), and
Shape of the metal level (M) on relative to the horizontal direction of the ceramic bases is walked by outer rim (L) of the metal level M
To limitation,
Characterized in that,
Trend of the flank (F) of the outer rim (L) of the metal level (M) in the vertical direction of relatively described ceramic bases
And/or profile of the outer rim (L) of the metal level on the horizontal direction of relative ceramic bases its circuit distance at least
To be able to represent in 10 μm of arbitrary regions by continuously differentiable function,
Wherein described flank (F) being extended at h=h from h=0, and the continuously differentiable function and non-rectilinear, i.e. f (x)=
mx+b。
2. composite according to claim 1, it is characterised in that the trend that the flank (F) can be represented and/
Or the function of the profile of the outer rim (L) from parabolic function, e functions, trigonometric function, spline function, Bezier,
Selected in the group that NURBS and higher order mathematical equations are constituted.
3. composite according to claim 1 and 2, it is characterised in that the trend that the flank (F) can be represented
And/or the function of the profile of the outer rim (L) is high-order parabola function.
4. composite as claimed in any of claims 1 to 3, it is characterised in that the metal level (M) it is described
Profile of the outer rim (L) in the vertical direction relative to ceramic bases in h=0 more than h=h when the outer rim (L) wheel
It is wide.
5. composite as claimed in any of claims 1 to 4, it is characterised in that the trend of the flank (F)
Circuit distance is than h to 1.1 to 20 times of the youthful and the elderly.
6. the layout of conductor circuit of the one kind in ceramic bases (S), wherein the conductor circuit is by least one metal level (M)
Composition, the metal level M has thickness degree (h), and institute substantially in the vertical direction relative to the ceramic bases (S)
Shape of the metal level (M) on relative to the horizontal direction of the ceramic bases is stated to be walked by outer rim (L) of the metal level (M)
To limitation,
Characterized in that,
The layout only side of the outer rim including the metal level (M) on relative to the vertical direction of the ceramic bases
The profile of the trend of the wing (F) and/or the outer rim L of the metal level on the horizontal direction of relative ceramic bases, it is described walk
To and/or profile can be represented by continuously differentiable function in its circuit at least 10 μm of arbitrary region of distance,
Wherein described flank (F) is extended at h=h from h=0, and the continuously differentiable function and non-rectilinear, i.e. f (x)=mx
+b。
7. a kind of for producing the method for including the composite of at least one conductor circuit in ceramic bases (S), wherein
The conductor circuit is made up of at least one metal level (M), and the metal level (M) substantially has relative to the ceramic bases
(S) thickness degree (h) in vertical direction, and the metal level (M) is on relative to the horizontal direction of the ceramic bases
Shape by the metal level (M) outer rim (L) move towards limitation, the described method comprises the following steps：
(1) ceramic bases (S) and metal are provided, the metal constitutes the metal level (M), and
(2) metal is applied in the ceramic bases (S), to obtain at least one metal level (M).
8. a kind of application to layout according to claim 6, to manufacture the power mould for controlling high voltage or electric current
The circuit board of block.
9. a kind of circuit board, the circuit board includes composite as claimed in any of claims 1 to 5.
10. one kind is used to produce the stamping tool and/or coining tool of at least one conductor circuit in ceramic bases (S),
Wherein described conductor circuit is made up of at least one metal level (M), it is characterised in that
The stamping tool and/or coining tool are designed as, by the stamping tool and/or coining tool carry out punching press and/
Or impressing sets onto the metal level (M) layout according to claim 6.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014220650.2A DE102014220650A1 (en) | 2014-10-13 | 2014-10-13 | Optimized trace design of metallic materials on ceramic substances |
| DE102014220650.2 | 2014-10-13 | ||
| PCT/EP2015/073516 WO2016058970A1 (en) | 2014-10-13 | 2015-10-12 | Optimized conducting track design of metal materials on ceramic substances |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106797700A true CN106797700A (en) | 2017-05-31 |
Family
ID=54337254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580053845.XA Pending CN106797700A (en) | 2014-10-13 | 2015-10-12 | The conductor circuit designs of the metal material in the ceramic bases of optimization |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3207771A1 (en) |
| CN (1) | CN106797700A (en) |
| DE (1) | DE102014220650A1 (en) |
| WO (1) | WO2016058970A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017107116A1 (en) * | 2017-04-03 | 2018-10-04 | Semikron Elektronik Gmbh & Co. Kg | Substrate having a cornered first metal layer region |
| DE102017215048A1 (en) * | 2017-08-29 | 2019-02-28 | Conti Temic Microelectronic Gmbh | Circuit carrier for power electronics and power electronics module with a circuit carrier |
| DE102018104532B4 (en) | 2018-02-28 | 2023-06-29 | Rogers Germany Gmbh | Metal-ceramic substrate and method of manufacturing a metal-ceramic substrate |
| DE102018104521B4 (en) | 2018-02-28 | 2022-11-17 | Rogers Germany Gmbh | metal-ceramic substrates |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030068537A1 (en) * | 2001-09-28 | 2003-04-10 | Nobuyoshi Tsukaguchi | Metal/ceramic circuit board |
| US20040238483A1 (en) * | 2003-05-30 | 2004-12-02 | Nobuyoshi Tsukaguchi | Metal/ceramic circuit board and method for producing same |
| CN1653874A (en) * | 2002-03-29 | 2005-08-10 | 英特尔公司 | Multi-layer integrated circuit package |
| CN103733329A (en) * | 2011-08-12 | 2014-04-16 | 三菱综合材料株式会社 | Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module |
| US20140110159A1 (en) * | 2012-10-18 | 2014-04-24 | Tong Hsing Electronic Industries, Ltd. | Stress-reduced circuit board and method for forming the same |
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|---|---|---|---|---|
| US2401472A (en) * | 1945-03-24 | 1946-06-04 | Albert W Franklin | Structural unit |
| DE4004844C1 (en) | 1990-02-16 | 1991-01-03 | Abb Ixys Semiconductor Gmbh | Copper metallisation on ceramic substrate - obtd. by bonding copper foil directly to whole surface of substrate, then masking and etching |
| DE4406397A1 (en) | 1994-02-26 | 1995-08-31 | Curamik Electronics Gmbh | Electrical circuit substrate |
| DE19927046B4 (en) | 1999-06-14 | 2007-01-25 | Electrovac Ag | Ceramic-metal substrate as a multi-substrate |
| US6586682B2 (en) * | 2000-02-23 | 2003-07-01 | Kulicke & Soffa Holdings, Inc. | Printed wiring board with controlled line impedance |
| ES2170708B1 (en) * | 2000-11-20 | 2003-12-16 | Lear Automotive Eeds Spain | PROCEDURE TO INCREASE DIELECTRIC RIGIDITY AND INSULATION RESISTANCE BETWEEN TRACKS OF PRINTED CIRCUIT PLATES. |
| DE10147890B4 (en) * | 2001-09-28 | 2006-09-28 | Infineon Technologies Ag | A method of making a substrate of ceramic material having a patterned metal layer and such substrate |
| US6670216B2 (en) | 2001-10-31 | 2003-12-30 | Ixys Corporation | Method for manufacturing a power semiconductor device and direct bonded substrate thereof |
| DE102006014609B4 (en) | 2006-03-29 | 2021-03-18 | Infineon Technologies Ag | Semiconductor component carriers |
| JP2009100353A (en) * | 2007-10-18 | 2009-05-07 | Nippon Dempa Kogyo Co Ltd | Quartz crystal device |
| WO2009119438A1 (en) | 2008-03-25 | 2009-10-01 | 昭和電工株式会社 | Insulating substrate and method for producing the same |
-
2014
- 2014-10-13 DE DE102014220650.2A patent/DE102014220650A1/en not_active Ceased
-
2015
- 2015-10-12 EP EP15781900.4A patent/EP3207771A1/en not_active Withdrawn
- 2015-10-12 CN CN201580053845.XA patent/CN106797700A/en active Pending
- 2015-10-12 WO PCT/EP2015/073516 patent/WO2016058970A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030068537A1 (en) * | 2001-09-28 | 2003-04-10 | Nobuyoshi Tsukaguchi | Metal/ceramic circuit board |
| CN1653874A (en) * | 2002-03-29 | 2005-08-10 | 英特尔公司 | Multi-layer integrated circuit package |
| US20040238483A1 (en) * | 2003-05-30 | 2004-12-02 | Nobuyoshi Tsukaguchi | Metal/ceramic circuit board and method for producing same |
| CN103733329A (en) * | 2011-08-12 | 2014-04-16 | 三菱综合材料株式会社 | Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module |
| US20140110159A1 (en) * | 2012-10-18 | 2014-04-24 | Tong Hsing Electronic Industries, Ltd. | Stress-reduced circuit board and method for forming the same |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3207771A1 (en) | 2017-08-23 |
| DE102014220650A1 (en) | 2016-04-14 |
| WO2016058970A1 (en) | 2016-04-21 |
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