CN106793557A - Material collocation method and device, SMT production methods and production system - Google Patents
Material collocation method and device, SMT production methods and production system Download PDFInfo
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- CN106793557A CN106793557A CN201710041125.2A CN201710041125A CN106793557A CN 106793557 A CN106793557 A CN 106793557A CN 201710041125 A CN201710041125 A CN 201710041125A CN 106793557 A CN106793557 A CN 106793557A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
Material collocation method and device for SMT product manufacturings of the invention, SMT production methods and system, are collected by will need the BOM of multiple product of mixed production, the total material variety needed for obtaining the multiple product manufacture；According to the First Speed chip mounter and the placement speed ratio of second speed chip mounter, calculate the first material species for First Speed chip mounter and the second material species for second speed chip mounter, wherein, the ratio of the second material quantity of the first material quantity of the first material species and second material species is close or equal to the placement speed ratio；Mounting position and/or its corresponding material quantity according to various types of material, each material of the second material species of each material and second speed chip mounter to the first material species for First Speed chip mounter optimize arrangement to obtain material configuration result respectively；Shorten the tangent line time, greatly promote production efficiency, also reduce material and go out to be put in storage number of times.
Description
Technical field
The present invention relates to SMT manufacturing technology fields, more particularly to for the material collocation method and dress of SMT product manufacturings
Put, SMT production methods and system.
Background technology
At present, market constantly increases personalization of product and diversified demand, what traditional single variety was produced in batches
Large-scale production and stock mode, gradually less adapt to the individual demand of client, easily cause stock.Following hair
Exhibition changes towards multi items, small lot batch manufacture and mode with short production cycle.
With widely using for high speed placement system, a SMT production line need to undertake the SMT production tasks of multiple product.
During multiple product mixed production, for traditional multi items SMT modes of production, when different product is produced, first product
Need before manufacture according to production singly re-start materiel warehouse-out and configuration, need to process material after manufacture, otherwise without
Method carries out the production of next product, and the material treatment is specially the spray gun that will be equipped with material by product personnel and is taken from bin
Getting off, and material is removed from spray gun, and give component warehouse personnel by material carries out biscuit registration and storage；Then
Also need to, to next product dispensing and biscuit, SMT producing line personnel be given by material after the completion of dispensing, by producing line personnel by material
Load spray gun, and be put into bin, change the steel mesh of the next product of correspondence and debug corresponding SMT attachments program, then carry out
Paster operation, needs the time oversize so as to cause different product to switch circuit production, causes low production efficiency, in SMT tangent lines frequently
It is particularly evident in the case of numerous；Also, material loss is produced during tangent line, biscuit produces artificial waste during tangent line；As fully visible, mesh
Preceding SMT production systems obviously have no idea well to meet to the Production requirement of multi items, small lot.
The content of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide the material for SMT product manufacturings
, there is the different products of correspondence for solving SMT production systems in the prior art in collocation method and device, SMT production methods and system
The problems such as product tangent line slowly causes inefficiency.
In order to achieve the above objects and other related objects, the present invention provides a kind of material configuration for SMT product manufacturings
Method, is applied to include the SMT production systems of First Speed chip mounter and second speed chip mounter；Methods described includes：Need to
The BOM of the multiple product of mixed production is wanted to collect, the total material variety needed for obtaining the multiple product manufacture；According to
The placement speed ratio of the First Speed chip mounter and second speed chip mounter, for the first speed in calculating total material variety
The first material species and the second material species for second speed chip mounter of chip mounter are spent, wherein, the first material
The ratio of the first material quantity of species and the second material quantity of second material species is close or equal to the placement speed ratio,
To make First Speed chip mounter closest with the time that second speed chip mounter completes single product paster；According to various types of material
Mounting position and/or its corresponding material quantity, to each material of the first material species for First Speed chip mounter
Arrangement is optimized respectively to obtain material configuration result with each material of the second material species of second speed chip mounter；Its
In, the material configuration result with as the First Speed chip mounter and second speed chip mounter are placed material according to
According to make the time of First Speed chip mounter and second speed chip mounter completion single product paster most short.
In one embodiment of the invention, the First Speed chip mounter is high speed placement system, the second speed paster
Machine is low speed chip mounter.
In one embodiment of the invention, the First Speed chip mounter is with the placement speed ratio of second speed chip mounter
2：1.
In order to achieve the above objects and other related objects, the present invention provides a kind of SMT product processes, including：According to
Material configuration result obtained by described material collocation method, puts to the First Speed chip mounter and second speed chip mounter
Glove material；Paster operation is carried out to produce institute respectively by the First Speed chip mounter and second speed chip mounter of having placed material
State multiple product.
In one embodiment of the invention, the First Speed chip mounter and second speed paster by having placed material
Machine carries out paster operation to produce the multiple product respectively, including：The different replacement of products steel mesh of correspondence；The different product of correspondence
Product carry out SMT attachment program debuggings.
In one embodiment of the invention, the First Speed chip mounter and second speed paster by having placed material
Machine carries out paster operation to produce the multiple product respectively, also includes：The different product of correspondence performs following steps respectively：It is logical
Cross First Speed chip mounter and second speed Placement element；Check attachment situation；The special-shaped component of attachment；Reflow Soldering
Connect；The inspection of the product completed to initial workpiece welding；The passed examination of the product completed to initial workpiece welding, carries out batch attachment.
In order to achieve the above objects and other related objects, the present invention provides a kind of material configuration for SMT product manufacturings
Material configuration device, be applied to include the SMT production systems of First Speed chip mounter and second speed chip mounter；Described device
Including：BOM aggregation process module, for the BOM of multiple product of mixed production will to be needed to collect, obtains described
Total material variety needed for multiple product manufacture；First processing module, for according to the First Speed chip mounter and the second speed
Spend the placement speed ratio of chip mounter, calculate first material species in total material variety for First Speed chip mounter, with
And for the second material species of second speed chip mounter, wherein, the first material quantity and second of the first material species
The ratio of the second material quantity of material variety is close or equal to the placement speed ratio, to make First Speed chip mounter with second
The time that speed chip mounter completes single product paster is closest；Second processing module, for the attachment according to various types of material
Position and/or its corresponding material quantity, to each material and second of the first material species for First Speed chip mounter
Each material of the second material species of speed chip mounter optimizes arrangement to obtain material configuration result respectively；Wherein, institute
Material configuration result is stated with as the foundation that material is placed to the First Speed chip mounter and second speed chip mounter, to make
The time that First Speed chip mounter and second speed chip mounter complete single product paster is most short.
In order to achieve the above objects and other related objects, the present invention provides a kind of SMT product production systems, including：First
Speed chip mounter；Second speed chip mounter；Processing unit, for the BOM of multiple product of mixed production will to be needed to converge
Always, the total material variety needed for obtaining the multiple product manufacture；According to the First Speed chip mounter and second speed paster
The placement speed ratio of machine, is used for the first material species of First Speed chip mounter and is used in calculating total material variety
The second material species of second speed chip mounter, wherein, the first material quantity and second material kind of the first material species
The ratio of the second material quantity of class is close or equal to the placement speed ratio, to make First Speed chip mounter be pasted with second speed
The time that piece machine completes single product paster is closest；Mounting position and/or its corresponding material number according to various types of material
Amount, the second material species of each material and second speed chip mounter to the first material species for First Speed chip mounter
Each material optimize respectively arrangement to obtain material configuration result；Wherein, the material configuration result is with as right
The First Speed chip mounter and second speed chip mounter place the foundation of material, to make First Speed chip mounter and second speed
The time that chip mounter completes single product paster is most short.
As described above, material collocation method and device for SMT product manufacturings of the invention, SMT production methods and being
System, is collected by will need the BOM of multiple product of mixed production, the total thing needed for obtaining the multiple product manufacture
Material species；According to the First Speed chip mounter and the placement speed ratio of second speed chip mounter, total material variety is calculated
In for First Speed chip mounter first material species and the second material species for second speed chip mounter, wherein,
The ratio of the first material quantity of the first material species and the second material quantity of second material species is close or equal to institute
Placement speed ratio is stated, to make First Speed chip mounter closest with the time that second speed chip mounter completes single product paster；
Mounting position and/or its corresponding material quantity according to various types of material, to the first material for First Speed chip mounter
Each material of each material of species and the second material species of second speed chip mounter optimizes arrangement to obtain respectively
Material configuration result；Wherein, the material configuration result is with as to the First Speed chip mounter and second speed paster
Machine places the foundation of material, with make First Speed chip mounter and second speed chip mounter complete single product paster time most
It is short；, without dispensing, without treatment material after production, shorten the tangent line time so as to before tangent line production different product, carry significantly
Production efficiency is risen, material is also reduced and is gone out to be put in storage number of times.
Brief description of the drawings
The flow that Fig. 1 is shown as material collocation method for SMT product manufacturing of the present invention in an embodiment is illustrated
Figure.
Fig. 2 is shown as the schematic flow sheet of SMT product processes of the present invention in another embodiment.
Fig. 3 is shown as the modular structure of material configuration device for SMT product manufacturing of the present invention in an embodiment
Schematic diagram.
Component label instructions
301 BOM aggregation process modules
302 first processing modules
303 Second processing modules
S11~S13, S21~S22, method and step
S221~S228
Specific embodiment
Embodiments of the present invention are illustrated below by way of specific instantiation, those skilled in the art can be by this specification
Disclosed content understands other advantages of the invention and effect easily.The present invention can also be by specific realities different in addition
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under spirit of the invention.It should be noted that, in the case where not conflicting, following examples and implementation
Feature in example can be mutually combined.
It should be noted that the diagram provided in following examples only illustrates basic structure of the invention in a schematic way
Think, component count, shape and size when only display is with relevant component in the present invention rather than according to actual implementation in schema then
Draw, it is actual when the implementing kenel of each component, quantity and ratio can be a kind of random change, and its assembly layout kenel
It is likely more complexity.
Fig. 1 is referred to, the present invention provides a kind of material collocation method for SMT product manufacturings, is applied to include first
The SMT production systems of speed chip mounter and second speed chip mounter, wherein, the First Speed chip mounter is high speed placement system,
The second speed chip mounter is low speed chip mounter, and the high speed placement system can be located at the low speed chip mounter upstream, i.e. PCB
Plate arrives low speed chip mounter and carries out paster again after high speed placement system completes paster；The low speed be for high speed,
The paster speed of the general low speed chip mounter is 30 000 flake products (pcb board etc.) per hour, and the 30 of high speed placement system
000~60000 flake products.
Methods described includes：
Step S11：The BOM of the multiple product of mixed production will be needed to collect, obtain the multiple product manufacture institute
The total material variety for needing.
In one embodiment of the invention, due to multiple product needed mixed productions, therefore, before manufacture first by all products
BOM needed for product production collects to obtain the quantity of total material variety and each species material.
Step S12：According to the First Speed chip mounter and the placement speed ratio of second speed chip mounter, calculate described total
It is used for the first material species and the second material kind for second speed chip mounter of First Speed chip mounter in material variety
Class, wherein, the ratio of the first material quantity of the first material species and the second material quantity of second material species is approached
Or equal to the placement speed ratio, to make First Speed chip mounter that the time of single product paster is completed with second speed chip mounter
It is closest.
In one embodiment of the invention, the First Speed chip mounter is with the placement speed ratio of second speed chip mounter
2：1, it is certainly not so limited, or 1.5:1、1.7：1 etc., can be changed according to the actual requirements, 2:1 is through Shen
Ask someone test after a kind of preferred embodiment.
If the time that First Speed chip mounter completes single product paster with second speed chip mounter is close or identical, the
When one speed chip mounter completes a piece of single product paster and the single product is passed into second speed paster, second speed
Paster function be exactly completed or on close time point completes a piece of single product paster so that at once can be with reception processing
The single product that the transmission comes, without waiting for the long period until second speed chip mounter has processed the patch of upper a piece of single product
Piece, can greatly promote SMT paster efficiency.
Specifically, providing specific calculating process：
1) the total public material variety of multiple products described in total material variety, remaining i.e. not common material kind are counted
Class, wherein, every kind of public material variety or not common material variety are to that should have material quantity；
2) the every kind of product of correspondence, according to the placement speed ratio, it is determined that for the first theoretical thing of First Speed chip mounter
Material quantity and the second theoretical material quantity for second speed chip mounter, obtain theoretical proportions value；Assuming that placement speed ratio is
2：1, then the first theoretical material quantity is 2 times of the second theoretical material quantity, and theoretical proportions value is then 2 times；
3) material of the public material variety of initial setting is used for First Speed chip mounter, the thing of other not common material varieties
Expect for second speed chip mounter, if first material quantity is actual ratio value than the ratio of upper second material quantity；Assuming that public
The material quantity of material variety is 400 altogether, and the material quantity of not common material variety is 80, then actual ratio value is 5
Times；
4) change part not common material variety makes it be used for First Speed chip mounter and/or changes the public material kind in part
Class makes it be used for second speed chip mounter, to adjust the actual ratio value, until it is consistent with the theoretical value.
For example, for example shown in following table：
In table 1, the public material variety and not common material variety in every kind of type product are determined, such as product 1 is manufactured
Be related to 44 kinds of materials, wherein 28 kinds of public materials for product 1~5,16 kinds be product 1 not common material.
Table 1
The BOM of 5 products for needing mixed production collects by more than, the total material needed for obtaining 5 kinds of product manufacturings
Species, its value is 72 kinds.Then calculate in 72 kinds for the first material species of First Speed chip mounter and for the second speed
Spend the second material species of chip mounter.Concrete configuration process is as follows：
Assume initially that the first material species that 28 kinds of public materials are used for First Speed chip mounter, remaining not common thing
Material species is used for the second material species of second speed chip mounter.
In table 2, show the theoretic material distribution of every kind of type product and actual material distribution, every kind of type product life
Produce needed for material variety, and required every kind of material variety material.
Table 2
As known from Table 2, actual ratio value has deviation with theoretical proportions value, need to be by predesignated First Speed chip mounter
The material of partial material species is transferred to second speed chip mounter, and that sees last row needs configuration item.
Assuming that 6 kinds of larger-size material varieties of 28 kinds of public material kinds are first moved into second speed chip mounter, as a result
As shown in table 3：
Table 3
As seen from Table 3, after once adjusting, actual ratio value is already close to theoretical proportions value；Then one is carried out again
Or repeatedly adjustment, until as shown in table 4；
Table 4
With postponing more than, first material species (for 48), the Yi Jiyong for First Speed chip mounter have been calculated
In the second material species (being 24) of second speed chip mounter
It is therefrom visible, by after repeatedly adjustment, actual ratio value is consistent with theoretical proportions value.
Step S13：Mounting position and/or its corresponding material quantity according to various types of material, to for First Speed
Each material of each material of the first material species of chip mounter and the second material species of second speed chip mounter enters respectively
Row optimizes the arrangement of to obtain material configuration result；Wherein, the material configuration result is with as to the First Speed paster
Machine and second speed chip mounter place the foundation of material, to make First Speed chip mounter and second speed chip mounter complete single product
The time of product paster is most short.
In one embodiment of the invention, can be excellent by the close material variety of the patch location on a PCB single products
Paster together is first come, to lift paster efficiency, and the material variety being closely located to can also be ranked up according to paster quantity,
Can wherein there are various sortords, it is only necessary to ensure that First Speed chip mounter and second speed chip mounter complete single product paster
Time is most short.
Configured before SMT is produced by the material collocation method and completed, during multiple product SMT mixed productions, without right
Material is changed, and only supply supplement need to be carried out to material by line side storehouse, and biscuit can be with scheduled time slot (such as
Month) carry out once, greatly optimize material and go out to be put in storage flow.
As shown in Fig. 2 the present invention provides a kind of SMT product processes, including：
Step S21：According to the material configuration result for obtaining, to the First Speed chip mounter and second speed paster
Machine places material；
Step S22：By the First Speed chip mounter and second speed chip mounter of having placed material carry out paster operation with
The multiple product is produced respectively.
For example need to carry out the production of product 1 and product 2, after the production list of product 1 and product 2 is received, perform institute
S22 is stated, is specifically included：
Step S221：The correspondence replacement of products steel mesh to be produced；For example change for producing the steel mesh of product 1 for carrying out
The production of product 1, has produced and has changed the steel mesh of corresponding product 2 after product 1 again for carrying out the production of product 2；
Step S222：The correspondence product to be produced carries out SMT attachment program debuggings；Such as corresponding product 1 or product 2 are carried out
Correspondence SMT attachment program debuggings.
Preferably, the correspondence product to be produced, also includes afterwards：
Step S223：By First Speed chip mounter and second speed Placement element；
Step S224：Check attachment situation；
Step S225：In the case where there is special-shaped component, the special-shaped component of attachment；
Step S226：Reflow soldering；
Step S227：The inspection of the product completed to initial workpiece welding；
Step S228：In the case where the product examination that initial workpiece welding is completed is qualified, batch attachment is carried out.
For the product 1 and product 2, after the production for completing product 1, the steel mesh that need to only carry out corresponding product 2 is changed
After SMT program debuggings, you can start the production of product 2, the material without needing to unload product 1 such as prior art is incorporated to
Storehouse, then reconfigures the material of product 2, in this way, the tangent line time is substantially shorter, so as to greatly optimize multiple product
The SMT mixed production times, can freely be produced according to customer order substantially, give full play to the production capacity of SMT producing lines, it is adaptable to many product
Kind, short cycle, the Flexible Production of small lot.
As shown in figure 3, the present invention provides a kind of material configuration device of the material configuration for SMT product manufacturings, application
In the SMT production systems including First Speed chip mounter and second speed chip mounter, due to the material configuration device with it is described
Material collocation method principle is essentially identical, therefore ins and outs general between embodiment are not repeated and repeat；Described device includes：
BOM aggregation process module 301, for the BOM of multiple product of mixed production will to be needed to collect, obtains described many
Total material variety needed for planting product manufacturing；First processing module 302, for according to the First Speed chip mounter and the second speed
Spend the placement speed ratio of chip mounter, calculate first material species in total material variety for First Speed chip mounter, with
And for the second material species of second speed chip mounter, wherein, the first material quantity and second of the first material species
The ratio of the second material quantity of material variety is close or equal to the placement speed ratio, to make First Speed chip mounter with second
The time that speed chip mounter completes single product paster is closest；Second processing module 303, for the patch according to various types of material
Holding position and/or its corresponding material quantity, each material to the first material species for First Speed chip mounter and
Each material of the second material species of two speed chip mounters optimizes arrangement to obtain material configuration result respectively；Wherein,
The material configuration result with as the foundation that material is placed to the First Speed chip mounter and second speed chip mounter, with
Make the time of First Speed chip mounter and second speed chip mounter completion single product paster most short.
It is of the invention that a kind of SMT product production systems are also provided based on above-mentioned, including：First Speed chip mounter；Second speed
Chip mounter；And
Processing unit, for the BOM of multiple product of mixed production will to be needed to collect, obtains the multiple product
Total material variety needed for manufacture；Calculate in total material variety for the first material species of First Speed chip mounter and right
The first material quantity answered and the second material species for second speed chip mounter and corresponding second material quantity；Root
According to the mounting position of various types of material and/or its corresponding material quantity, to the first material kind for First Speed chip mounter
Each material of each material of class and the second material species of second speed chip mounter optimizes arrangement to obtain thing respectively
Material configuration result；Wherein, the material configuration result is with as to the First Speed chip mounter and second speed chip mounter
The foundation of material is placed, to make the time of First Speed chip mounter and second speed chip mounter completion single product paster most short.
The processing unit is the electronic installation with data-handling capacity, for example server computer, desktop computer, pen
Remember this computer, panel computer and/or smart mobile phone etc., its can operation program and realize material configuration side as shown in Figures 1 and 3
Method and device；And it is conllinear to obtain that SMT productions flow as shown in Figure 2 is performed by the SMT product production systems
The multiple product of production.
As described above, material collocation method and device for SMT product manufacturings of the invention, SMT production methods and being
System, is collected by will need the BOM of multiple product of mixed production, the total thing needed for obtaining the multiple product manufacture
Material species；According to the First Speed chip mounter and the placement speed ratio of second speed chip mounter, total material variety is calculated
In for First Speed chip mounter first material species and the second material species for second speed chip mounter, wherein,
The ratio of the first material quantity of the first material species and the second material quantity of second material species is close or equal to institute
Placement speed ratio is stated, to make First Speed chip mounter closest with the time that second speed chip mounter completes single product paster；
Mounting position and/or its corresponding material quantity according to various types of material, to the first material for First Speed chip mounter
Each material of each material of species and the second material species of second speed chip mounter optimizes arrangement to obtain respectively
Material configuration result；Wherein, the material configuration result is with as to the First Speed chip mounter and second speed paster
Machine places the foundation of material, with make First Speed chip mounter and second speed chip mounter complete single product paster time most
It is short；, without dispensing, without treatment material after production, shorten the tangent line time so as to before tangent line production different product, carry significantly
Production efficiency is risen, material is also reduced and is gone out to be put in storage number of times.
The present invention effectively overcomes various shortcoming of the prior art and has high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
The personage for knowing this technology all can carry out modifications and changes under without prejudice to spirit and scope of the invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete with institute under technological thought without departing from disclosed spirit such as
Into all equivalent modifications or change, should be covered by claim of the invention.
Claims (8)
1. a kind of material collocation method for SMT product manufacturings, it is characterised in that be applied to include First Speed chip mounter and
The SMT production systems of second speed chip mounter；Methods described includes：
The BOM of the multiple product of mixed production will be needed to collect, the total material kind needed for obtaining the multiple product manufacture
Class；
According to the First Speed chip mounter and the placement speed ratio of second speed chip mounter, used in calculating total material variety
First material species in First Speed chip mounter and the second material species for second speed chip mounter, wherein, it is described
The ratio of the first material quantity of first material species and the second material quantity of second material species is close or equal to described
Placement speed ratio, to make First Speed chip mounter closest with the time that second speed chip mounter completes single product paster；
Mounting position and/or its corresponding material quantity according to various types of material, to first for First Speed chip mounter
Each material of each material of material variety and the second material species of second speed chip mounter optimize respectively arrangement with
Obtain material configuration result；Wherein, the material configuration result is with as to the First Speed chip mounter and second speed
Chip mounter places the foundation of material, to make First Speed chip mounter and second speed chip mounter complete the time of single product paster
It is most short.
2. material collocation method according to claim 1, it is characterised in that the First Speed chip mounter is high-speed paster
Machine, the second speed chip mounter is low speed chip mounter.
3. material collocation method according to claim 2, it is characterised in that the First Speed chip mounter and second speed
The placement speed ratio of chip mounter is 2：1.
4. a kind of SMT product processes, it is characterised in that including：
According to the material configuration result obtained by material collocation method as claimed any one in claims 1 to 3, to described
One speed chip mounter and second speed chip mounter place material；
It is described to produce respectively to carry out paster operation by the First Speed chip mounter and second speed chip mounter of having placed material
Multiple product.
5. SMT product processes according to claim 4, it is characterised in that it is described by having placed material first
Speed chip mounter and second speed chip mounter carry out paster operation to produce the multiple product respectively, including：
The different replacement of products steel mesh of correspondence；
The different product of correspondence carries out SMT attachment program debuggings.
6. SMT product processes according to claim 5, it is characterised in that it is described by having placed material first
Speed chip mounter and second speed chip mounter carry out paster operation to produce the multiple product respectively, also include：
The different product of correspondence performs following steps respectively：
By First Speed chip mounter and second speed Placement element；
Check attachment situation；
The special-shaped component of attachment；
Reflow soldering；
The inspection of the product completed to initial workpiece welding；
The passed examination of the product completed to initial workpiece welding, carries out batch attachment.
7. the material configuration device that a kind of material for SMT product manufacturings is configured, it is characterised in that be applied to include the first speed
The SMT production systems of degree chip mounter and second speed chip mounter；Described device includes：
BOM aggregation process module, for the BOM of multiple product of mixed production will to be needed to collect, obtains described
Total material variety needed for multiple product manufacture；
First processing module, for the placement speed ratio according to the First Speed chip mounter and second speed chip mounter, calculates
It is used for the first material species and for second speed chip mounter second of First Speed chip mounter in total material variety
Material variety, wherein, the first material quantity of the first material species and the second material quantity of second material species
Ratio is close or equal to the placement speed ratio, is pasted with making First Speed chip mounter complete single product with second speed chip mounter
The time of piece is closest；
Second processing module, for the mounting position according to various types of material and/or its corresponding material quantity, to for first
Each material of each material of the first material species of speed chip mounter and the second material species of second speed chip mounter point
Arrangement is not optimized to obtain material configuration result；Wherein, the material configuration result is with as to the First Speed
Chip mounter and second speed chip mounter place the foundation of material, to make First Speed chip mounter and second speed chip mounter complete single
The time of individual product paster is most short.
8. a kind of SMT product production systems, it is characterised in that including：
First Speed chip mounter；
Second speed chip mounter；
Processing unit, for the BOM of multiple product of mixed production will to be needed to collect, obtains the multiple product manufacture
Required total material variety；According to the First Speed chip mounter and the placement speed ratio of second speed chip mounter, calculate described
For the first material species and the second material for second speed chip mounter of First Speed chip mounter in total material variety
Species, wherein, the ratio of the first material quantity of the first material species and the second material quantity of second material species connects
It is near or equal to the placement speed ratio, with make First Speed chip mounter with second speed chip mounter complete single product paster when
Between it is closest；Mounting position and/or its corresponding material quantity according to various types of material, to for First Speed chip mounter
Each material of each material of first material species and the second material species of second speed chip mounter row of optimizing respectively
Arrange to obtain material configuration result；Wherein, the material configuration result is with as to the First Speed chip mounter and second
Speed chip mounter places the foundation of material, to make First Speed chip mounter and second speed chip mounter complete single product paster
Time is most short.
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Inventor after: Ma Haiju Inventor after: Zhao Junkang Inventor after: Chen Zhen Inventor after: Wang Enxian Inventor after: Chen Chuxin Inventor before: Ma Haiju Inventor before: Zhao Junkang Inventor before: Chen Zhen Inventor before: Wang Enxian Inventor before: Chen Chuxin |