CN106785695A - Earphone socket, headset plug, earphone and electronic equipment - Google Patents
Earphone socket, headset plug, earphone and electronic equipment Download PDFInfo
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- CN106785695A CN106785695A CN201510813255.4A CN201510813255A CN106785695A CN 106785695 A CN106785695 A CN 106785695A CN 201510813255 A CN201510813255 A CN 201510813255A CN 106785695 A CN106785695 A CN 106785695A
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- Prior art keywords
- earphone
- headset plug
- jack
- ground
- ground terminal
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Abstract
The disclosure is directed to a kind of earphone socket, headset plug, earphone and electronic equipment, the earphone socket includes：Earphone jack is formed in jack body, the jack body；Multiple ground terminals, are arranged in the earphone jack, can be contacted with the ground section on the headset plug when headset plug inserts the earphone jack.By the technical scheme of the disclosure, earphone crosstalk can be reduced, lift tonequality.
Description
Technical field
This disclosure relates to ear phone technology field, more particularly to a kind of earphone socket, headset plug, earphone and
Electronic equipment.
Background technology
With the requirement more and more higher to sound quality, user is no longer satisfied with intelligent terminal of oneself etc. and sets
It is standby only " sound to be sent ", it is also desirable to eliminate earphone crosstalk (CrossTalk) as much as possible caused
Tonequality reduction problem.When user listens to the sound from equipment such as intelligent terminals by earphone, earphone
Crosstalk may be caused by many reasons；And in the related art, often through increase earphone left and right acoustic channels
The mode of isolation reduces the direct crosstalk between left and right acoustic channels, but this causes the design difficulty of earphone
Greatly lifted with production cost, it is clear that not rational settling mode.
The content of the invention
The disclosure provides a kind of earphone socket, headset plug, earphone and electronic equipment, to solve related skill
The technical problem of the earphone crosstalk in art.
According to the first aspect of the embodiment of the present disclosure, there is provided a kind of earphone socket, including：
Earphone jack is formed in jack body, the jack body；
Multiple ground terminals, are arranged in the earphone jack, can insert the earphone in headset plug and insert
Kong Shi, contacts with the ground section on the headset plug.
Optionally, the multiple ground terminal is inserted in the direction of insertion of the headset plug with the earphone
The distance between the end in hole is equal.
Optionally, the multiple ground terminal is arranged along the circumferential uniform of the earphone jack.
Optionally, each described ground terminal includes：
The common ground structure that is arranged on the inwall of the earphone jack, can be inserted in the headset plug
The head that is contacted with the headset plug during earphone jack and it is arranged at the common ground structure
Elastic mechanism and head between.
Optionally, the head of the ground terminal is ball-type metal structure.
Optionally, each described ground terminal is resilient sheet-like structure.
According to the second aspect of the embodiment of the present disclosure, there is provided a kind of headset plug, including：
Header body；
Multiple ground terminals, are arranged at the ground section in the header body, can be inserted in the header body
When entering earphone jack, contacted with the common ground region on the earphone jack inwall.
Optionally, the multiple ground terminal is inserted in the direction of insertion of the headset plug with the earphone
The distance between the end of head is equal.
Optionally, the multiple ground terminal is arranged along the circumferential uniform of the headset plug.
Optionally, each described ground terminal includes：
It is arranged at common ground structure in the header body, the ear can be inserted in the headset plug
The head that is contacted with the common ground region during machine transplanting of rice hole and be arranged at the common ground structure and
Elastic mechanism between head.
Optionally, the header body is internally formed an axial accommodation space, and the common ground structure
In the axial accommodation space；And, it is additionally provided with the header body and the axial accommodation space
Multiple radial apertures of connection, and the ground terminal correspondingly be located at the plurality of radial aperture in.
Optionally, the head of the ground terminal is ball-type metal structure.
According to the third aspect of the embodiment of the present disclosure, there is provided a kind of earphone socket, with any of the above-described embodiment
Headset plug match；The earphone socket includes：
Earphone jack is formed in jack body, the jack body；
Common ground region, is arranged at the inwall of the earphone jack, can insert institute in the headset plug
When stating earphone jack, with the headset plug on ground section multiple ground terminal contacts.
Optionally, the common ground region is annular metal structure.
According to the fourth aspect of the embodiment of the present disclosure, there is provided a kind of earphone, including：Any implementation as described above
The headset plug of example.
The 5th aspect according to the embodiment of the present disclosure, there is provided a kind of electronic equipment, including：It is any as described above
The earphone socket of embodiment.
The technical scheme provided by this disclosed embodiment can include the following benefits：
The disclosure is contacted by multiple ground terminals with the ground section on headset plug, increased headset plug
The contact area of the earth terminal between earphone socket, so as to help to reduce headset plug and earphone socket
Between contact impedance, and thus reduce the earphone crosstalk that the mainboard side of the equipment such as intelligent terminal brings.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary and explanatory
, the disclosure can not be limited.
Brief description of the drawings
Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows and meets this public affairs
The embodiment opened, and it is used to explain the principle of the disclosure together with specification.
Fig. 1 is that earphone is connected to the impedance schematic diagram formed during electronic equipment.
Fig. 2 is axial sectional diagrammatical view illustration when headset plug in correlation technique is coordinated with earphone socket.
Fig. 3-4 is when headset plug according to an exemplary embodiment is coordinated with earphone socket
Axial sectional diagrammatical view illustration.
Fig. 5 is footpath when headset plug according to an exemplary embodiment is coordinated with earphone socket
To schematic cross-section.
When Fig. 6-7 is that headset plug according to another exemplary embodiment is coordinated with earphone socket
Axial sectional diagrammatical view illustration.
Fig. 8 is the dimensional structure diagram of the headset plug according to an exemplary embodiment.
Fig. 9 is the schematic cross-section of the ground terminal according to an exemplary embodiment.
When Figure 10 is that headset plug according to another exemplary embodiment is coordinated with earphone socket
Radial section schematic diagram.
Specific embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following
When description is related to accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous
Key element.Implementation method described in following exemplary embodiment does not represent the institute consistent with the disclosure
There is implementation method.Conversely, they are only with described in detail in such as appended claims, disclosure
The example of the consistent apparatus and method of a little aspects.
Fig. 1 is that earphone is connected to the impedance schematic diagram formed during electronic equipment.As shown in figure 1, Rl_Trance、
Rg_TranceAnd Rr_TranceIt is line impedance that the cabling of electronic equipment internal causes, Rl_Conduct、Rg_Conduct
And Rr_ConductIt is the contact impedance produced between earphone socket and headset plug, Rl1And Rl2、Rr1And Rr2
The impedance that expression left and right duct line is introduced respectively, and RleftAnd RrightIt is the impedance of left and right acoustic channels.Upper
State in impedance, the impedance for really causing earphone crosstalk is Rg_TranceAnd Rg_Conduct, the ear that its correspondence is produced
Machine crosstalk can be calculated by following formula (1)：
From formula (1)：By reducing R as much as possibleg_TranceAnd Rg_Conduct, you can reduce ear
Machine crosstalk.Wherein, Rg_TranceIt is the impedance that electronic equipment internal cabling is introduced, can be by shortening cabling
Length, increase cabling area, introduce the modes such as feedback signal to reduce the earphone crosstalk that the impedance causes；
However, having passed through reasonable line arrangement in correlation technique, it is already possible to so that Rg_TranceM Ω levels are down to,
The further space very little of optimization；But do not referred to R in correlation techniqueg_ConductOptimization processing.
Rg_ConductWhen actually between headset plug and earphone socket with, the contact resistance of generation
It is anti-, such as the axial direction when headset plug in the correlation technique shown in Fig. 2 is coordinated with earphone socket
In schematic cross-section, shell fragment is arranged in the earphone jack in earphone socket, when headset plug inserts the ear
Behind machine transplanting of rice hole, the shell fragment can produce corresponding impedance with the GND end in contact on headset plug
Rg_Conduct。
Therefore, by the technical scheme of the disclosure, it is proposed that new earphone socket, headset plug, earphone
With the structure of electronic equipment, to reduce above-mentioned impedance Rg_Conduct.In order in conjunction with the embodiments, to this public affairs
The technical scheme opened is described further.
First, earphone socket
In one embodiment, the present disclosure proposes the improvement to earphone socket.Correspondingly, Fig. 3 is basis
Axial sectional diagrammatical view illustration when headset plug shown in one exemplary embodiment is coordinated with earphone socket,
As shown in figure 3, earphone socket 1 includes：
Earphone jack 111 is formed in jack body 11, the jack body 11；
Multiple ground terminals 12, are arranged in the earphone jack 111, can insert institute in headset plug 2
When stating earphone jack 111, contacted with the ground section 20 on the headset plug 2.
In the present embodiment, ground section 20 is the GND ends (as shown in Figure 2) on headset plug 2,
When ground terminal 12 is contacted with ground section 20, you can produce above-mentioned impedance Rg_Conduct.Wherein,
In the correlation technique shown in Fig. 2, it is only necessary to ensure shell fragment (equivalent to a ground terminal) and GND
End in contact is being grounded；And in the above-mentioned technical proposal of the disclosure, by setting multiple ground connection
Terminal 12 is contacted with ground section 20 simultaneously so that corresponding contact area increases to the several times of correlation technique,
And resulting contact impedance Rg_Conduct(N is then correspondingly to be reduced to the 1/N of situation shown in Fig. 2
The quantity of ground terminal 12).
For the embodiment using multiple ground terminals 12 shown in Fig. 3, can be counted with reference to formula (1)
Calculate corresponding contact impedance；Wherein, because the impedance of the left and right acoustic channels of earphone is usually similar resistance,
That is Rleft=Rright=R, and due to can be by reasonable line arrangement by Rg_TranceIt is reduced to insignificant number
Magnitude, then formula (1) can be reduced to：
Further, due to R>>Rg_Conduct, then above formula can be further simplified as：
Crosstalk(dB)=20 × log (Rg_conduct)-20×log(R)
Such as when the quantity of ground terminal 12 is 8, earphone crosstalk reduction can be madeCan be used in meeting high request of the user to tonequality.
It should be noted that：
(1) in the headset plug structure shown in Fig. 2, headset plug includes four sections, is followed successively by：Correspond to
The first paragraph of left channel signals, the second segment corresponding to right-channel signals, corresponding to GND signals
Three sections and the 4th section corresponding to MIC (Microphone, microphone) signal.However, being only for ear
A kind of structure of machine transplanting of rice head, such as in another headset plug structure, corresponding to the of GND signals
Three sections and the 4th section corresponding to MIC signals；Or, headset plug is also possible to only comprising corresponding to left sound
The first paragraph of road signal, the second segment corresponding to right-channel signals, the 3rd section corresponding to GND signals.
In fact, the disclosure is only illustrated by taking the headset plug structure shown in Fig. 2 as an example, and it is not right
The type of headset plug is limited；Those skilled in the art should understand that be：The technical side of the disclosure
Case is applied to the structured headset plug of institute, and multiple ground terminals 12 can be used in earphone socket,
So as to by increasing the contact area with headset plug, reduce corresponding contact impedance, and finally reduce ear
Machine crosstalk, realizes more excellent tonequality.
(2) structure of ground terminal
Implementation method one
As shown in figure 4, after the insertion earphone jack 111 of headset plug 2, multiple ground terminals 12
Respectively contacted with the ground section 20 on headset plug 2, wherein, earphone each ground terminal 12 can be with
Including：
Be arranged at common ground structure 121 on the inwall of the earphone jack 111, can be in the earphone
The head 122, Yi Jishe contacted with the headset plug 2 when plug 2 inserts the earphone jack 111
The elastic mechanism 123 being placed between common ground structure 121 and head 122.Wherein, ground terminal 12
Head 122 can be ball-type metal structure, to realize reliable contact.
Compare by with the elastic piece structure shown in Fig. 2：Elastic piece structure is only by the mechanical deformation of itself
To produce elastic force, its elastic force is weaker；And in the ground terminal 12 shown in Fig. 4, by independent elasticity
Mechanism 123 (structure such as such as spring) can provide bigger pressure so that the head of ground terminal 12
Contacted with the ground section of headset plug 2 by bigger pressure, help further to reduce resulting
Contact impedance, so as to reduce earphone crosstalk.
Because ground section 20 is a bit of on headset plug 2, in order to ensure all of ground terminal 12
Can accurately be contacted with ground section 20, multiple ground terminals 12 can be made in the headset plug 1
In direction of insertion and the end (entrance or bottom surface, do not indicated in figure) of the earphone jack 111 between
Apart from equal.
When Fig. 5 shows the insertion earphone jack 111 of headset plug 2, multiple ground terminals 12 and ground section
The radial section schematic diagram coordinated between 20.As shown in figure 5, common ground structure 121 can be
The annular metal structure on the inwall of earphone jack 111 is arranged at, its inner side is connected with elastic construction 123,
And outside is connected with the mainboard (not shown) of electronic equipment.
Additionally, all of ground terminal 12 can be along the circumferential uniform arrangement of earphone jack 111, so that right
Headset plug 2 is formed " encirclement ", it is ensured that all ground terminals 12 can connect with ground section 20
Touch, and contact is suitable.
Implementation method two
It will be apparent to a skilled person that structure of the disclosure not to ground terminal 12 is limited
System, such as in addition to structure shown in Fig. 4, still can be using the resilient sheet-like structure in correlation technique (i.e.
Shell fragment shown in Fig. 2)
As shown in fig. 6, in an illustrative embodiments, setting many by the inwall of earphone jack 111
The ground terminal 12 of individual resilient sheet-like structure, then it is multiple when headset plug 2 inserts earphone jack 111
Ground terminal 12 can be as shown in Figure 7：Simultaneously earphone is contacted under the elastic force that the mechanical deformation of itself is produced
Ground section 20 on plug 2, by thus increased contact area, reduces corresponding contact impedance, subtracts
The earphone crosstalk of small generation.
2nd, headset plug and earphone socket
(1) headset plug
In one embodiment, the present disclosure proposes to headset plug and earphone socket improved while.Phase
Ying Di, Fig. 8 are the dimensional structure diagrams of the headset plug according to an exemplary embodiment, are such as schemed
Shown in 8, the headset plug 3 can include：
Header body 31；
Multiple ground terminals 32, are arranged at the ground section 30 in the header body 31, can be inserted described
During the head insertion earphone jack (not shown) of body 31, with the earphone jack inwall on public connect
The contact of ground region.
In the above-described embodiments, by setting multiple ground terminals in the header body 31 of headset plug 3
32 so that multiple ground terminals 32 can be contacted with the common ground region of earphone jack simultaneously, so that logical
The contact area crossed between the GND ends and the common ground region of earphone jack of increase headset plug 3,
Corresponding contact impedance is reduced, to reduce the earphone crosstalk of generation.
Due to headset plug 3 after earphone jack is inserted, it is necessary to headset plug 3 and earphone socket it
Between realize that multi-signal is transmitted, then the limited area in common ground region can be by making multiple earth terminals
The sub 32 distance phase in the direction of insertion of the headset plug 3 and between the end of the headset plug 3
Deng, it is ensured that all ground terminals 32 can come in contact with common ground region exactly.
Fig. 9 is the schematic cross-section of the ground terminal according to an exemplary embodiment, as shown in figure 9,
Each ground terminal 32 can include：
It is arranged at common ground structure 321 in the header body 31, can be inserted in the headset plug 3
The head 322 that is contacted with the common ground region when entering the earphone jack and it is arranged at public connecing
Elastic mechanism 323 between ground structure 321 and head 322.Wherein, the head 322 of ground terminal 32
Can be ball-type metal structure, to realize reliable contact；Or, naturally it is also possible to use other structures.
In this embodiment, it is similar with ground terminal 12 shown in Fig. 4, by using independent bullet
Property mechanism 323 (such as spring etc.), can provide bigger contact for ground terminal 32, help
In reduction contact impedance, reduce earphone crosstalk.
As shown in Figure 10, header body 31 is internally formed an axial accommodation space, and the common ground
Structure 321 is located in the axial accommodation space (not indicated in figure)；And, the header body 31
On be additionally provided with the multiple radial apertures (not indicated in figure) connected with the axial accommodation space, it is and described
Ground terminal 32 is located in the plurality of radial aperture correspondingly.
Wherein, as shown in Figure 10：When the earphone jack formed in the insertion earphone socket 4 of headset plug 3
When 41, multiple ground terminals 32 on headset plug 3 can with the inwall of earphone jack 41 on it is public
Ground area 40 comes in contact, and to increase contact area, reduces contact impedance.
Additionally, all of ground terminal 32 can arrange along the circumferential uniform of headset plug 3, so that
During the insertion earphone jack 41 of headset plug 3, common ground region 40 can be to all ground terminals 32
Formed " encirclement ", it is ensured that all ground terminals 32 can come in contact with common ground region 40,
And contact is suitable.
(2) earphone socket
As shown in Figure 10, corresponding to the structure of above-mentioned (one) headset plug 3, the present disclosure proposes phase
The earphone socket 4 of matching, the earphone socket 4 includes：
Earphone jack 41 is formed in jack body (not shown), the jack body；
Common ground region 40, is arranged at the inwall of the earphone jack 41, can be in the headset plug 3
During insertion (as shown in Figure 8) earphone jack 41, with the ground section 30 on the headset plug 3
Multiple ground terminals 32 contact.
Optionally, common ground region 40 can be annular metal structure.
Technical scheme based on the disclosure, it is also proposed that corresponding earphone, can include any reality as described above
Apply the headset plug of example.
Technical scheme based on the disclosure, it is also proposed that corresponding electronic equipment, can include appointing as described above
The earphone socket of one embodiment；The such as electronic equipment can be smart mobile phone, music player, flat board
Computer etc..
Those skilled in the art will readily occur to this after considering specification and putting into practice disclosure disclosed herein
Disclosed other embodiments.The application is intended to any modification, purposes or the adaptability of the disclosure
Change, these modifications, purposes or adaptations follow the general principle of the disclosure and including this public affairs
Open undocumented common knowledge or conventional techniques in the art.Description and embodiments only by
It is considered as exemplary, the true scope of the disclosure and spirit are pointed out by following claim.
It should be appreciated that the disclosure be not limited to be described above and be shown in the drawings it is accurate
Structure, and can without departing from the scope carry out various modifications and changes.The scope of the present disclosure is only by institute
Attached claim is limited.
Claims (16)
1. a kind of earphone socket, it is characterised in that including：
Earphone jack is formed in jack body, the jack body；
Multiple ground terminals, are arranged in the earphone jack, can insert the earphone in headset plug and insert
Kong Shi, contacts with the ground section on the headset plug.
2. earphone socket according to claim 1, it is characterised in that the multiple ground terminal exists
It is equal with the distance between the end of the earphone jack in the direction of insertion of the headset plug.
3. earphone socket according to claim 2, it is characterised in that the multiple ground terminal edge
The circumferential uniform arrangement of the earphone jack.
4. earphone socket according to claim 1, it is characterised in that each described earth terminal attached bag
Include：
The common ground structure that is arranged on the inwall of the earphone jack, can be inserted in the headset plug
The head that is contacted with the headset plug during earphone jack and it is arranged at the common ground structure
Elastic mechanism and head between.
5. earphone socket according to claim 4, it is characterised in that the head of the ground terminal
It is ball-type metal structure.
6. earphone socket according to claim 1, it is characterised in that each described ground terminal is
Resilient sheet-like structure.
7. a kind of headset plug, it is characterised in that including：
Header body；
Multiple ground terminals, are arranged at the ground section in the header body, can be inserted in the header body
When entering earphone jack, contacted with the common ground region on the earphone jack inwall.
8. headset plug according to claim 7, it is characterised in that the multiple ground terminal exists
It is equal with the distance between the end of the headset plug in the direction of insertion of the headset plug.
9. headset plug according to claim 8, it is characterised in that the multiple ground terminal edge
The circumferential uniform arrangement of the headset plug.
10. headset plug according to claim 7, it is characterised in that each described ground terminal
Including：
It is arranged at common ground structure in the header body, the ear can be inserted in the headset plug
The head that is contacted with the common ground region during machine transplanting of rice hole and be arranged at the common ground structure and
Elastic mechanism between head.
11. headset plugs according to claim 10, it is characterised in that inside the header body
An axial accommodation space is formed, and the common ground structure is located in the axial accommodation space；And,
The multiple radial apertures connected with the axial accommodation space are additionally provided with the header body, and described are connect
Ground terminal is located in the plurality of radial aperture correspondingly.
12. headset plugs according to claim 10, it is characterised in that the head of the ground terminal
Portion is ball-type metal structure.
13. a kind of earphone sockets, it is characterised in that with the earphone any one of claim 7-12
Plug matches；The earphone socket includes：
Earphone jack is formed in jack body, the jack body；
Common ground region, is arranged at the inwall of the earphone jack, can insert institute in the headset plug
When stating earphone jack, with the headset plug on ground section multiple ground terminal contacts.
14. earphone sockets according to claim 13, it is characterised in that the common ground region
It is annular metal structure.
A kind of 15. earphones, it is characterised in that including：As any one of claim 7 to 12
Headset plug.
16. a kind of electronic equipment, it is characterised in that including：As any one of claim 1 to 6,
Or the earphone socket described in claim 13 or 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510813255.4A CN106785695A (en) | 2015-11-20 | 2015-11-20 | Earphone socket, headset plug, earphone and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510813255.4A CN106785695A (en) | 2015-11-20 | 2015-11-20 | Earphone socket, headset plug, earphone and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106785695A true CN106785695A (en) | 2017-05-31 |
Family
ID=58886116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510813255.4A Pending CN106785695A (en) | 2015-11-20 | 2015-11-20 | Earphone socket, headset plug, earphone and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106785695A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103887643A (en) * | 2014-03-17 | 2014-06-25 | 小米科技有限责任公司 | Earphone socket, electronic device, electronic equipment and electronic system |
| CN104466544A (en) * | 2014-12-08 | 2015-03-25 | 小米科技有限责任公司 | Earphone socket, earphone plug, earphones and electronic device |
| CN104485557A (en) * | 2014-12-19 | 2015-04-01 | 深圳市中兴移动通信有限公司 | Earphone socket and terminal |
-
2015
- 2015-11-20 CN CN201510813255.4A patent/CN106785695A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103887643A (en) * | 2014-03-17 | 2014-06-25 | 小米科技有限责任公司 | Earphone socket, electronic device, electronic equipment and electronic system |
| CN104466544A (en) * | 2014-12-08 | 2015-03-25 | 小米科技有限责任公司 | Earphone socket, earphone plug, earphones and electronic device |
| CN104485557A (en) * | 2014-12-19 | 2015-04-01 | 深圳市中兴移动通信有限公司 | Earphone socket and terminal |
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