CN106783671A - Silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production - Google Patents
Silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production Download PDFInfo
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- CN106783671A CN106783671A CN201611058775.XA CN201611058775A CN106783671A CN 106783671 A CN106783671 A CN 106783671A CN 201611058775 A CN201611058775 A CN 201611058775A CN 106783671 A CN106783671 A CN 106783671A
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- cleaning
- welded
- frame
- silicon chip
- guide rod
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- 238000004140 cleaning Methods 0.000 title claims abstract description 109
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 45
- 239000010703 silicon Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims description 20
- 230000002787 reinforcement Effects 0.000 claims description 16
- 244000309464 bull Species 0.000 claims description 14
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 241000127225 Enceliopsis nudicaulis Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Silicon chip high-efficiency cleaning equipment is used the present invention relates to a kind of Wafer Cleaning equipment, more particularly to a kind of production of silicon solar.The technical problem to be solved in the present invention is to provide the silicon solar production silicon chip high-efficiency cleaning equipment that a kind of cleaning performance is good, cleaning speed is fast, workload is small.In order to solve the above-mentioned technical problem, the invention provides such a silicon solar production silicon chip high-efficiency cleaning equipment, hollow out cleaning case, hinge, case lid, cylinder, the first guide rod, the first guide pin bushing, motor, the second guide rod, the second guide pin bushing, top board, movable frame, support etc. are included；Base plate top left is welded with left frame, and left frame lower right side is welded with fixed plate, and the mode that fixed plate top is bolted is connected with water tank.The effect good invention achieves cleaning performance, cleaning speed is fast, workload is small, and the important function that this equipment is played does not only have good cleaning performance, also improves operating efficiency, it is safe.
Description
Technical field
Set the present invention relates to a kind of Wafer Cleaning equipment, more particularly to a kind of silicon solar production silicon chip high-efficiency washing
It is standby.
Background technology
Solar energy, refers to the infrared radiant energy of the sun（Referring to three kinds of modes that heat energy is propagated:Radiation）, main performance is exactly normal
The sunray said.It is typically used as generating electricity or for water heater provides the energy in the modern times.It is just main since being born from life on earth
The infrared radiant energy to be provided with the sun is survived, and is also understood from ancient human with sun dry part, and as the side of making food
Method, such as salt manufacturing and solarization cured fish.In the case where fossil fuel is reduced increasingly, solar energy has turned into the mankind and has used the important of the energy
Part, and be constantly developed.The utilization of solar energy has photothermal deformation and opto-electronic conversion two ways, and solar power generation is
A kind of emerging regenerative resource.Sensu lato solar energy is also including tellurian wind energy, chemical energy, water energy etc..
The chip that silicon chip is made is famous " miraculous foresight ", there is surprising operational capability.No matter how complicated mathematics
Problem, physical problem and engineering problem, the workload for also no matter calculating have much, as long as staff passes through computer keyboard handle
Problem tells it, and assigns the thinking and instruction solved a problem, and computer just can tell you within the extremely short time answer.So,
Those artificial calculating need to spend several years, the problem of tens of years, and computer may only need to a few minutes can just be solved.Very
The problem of result cannot be calculated to some manpowers, computer also can quickly tell you answer.
Existing silicon solar production Wafer Cleaning equipment has that cleaning performance is not good, cleaning speed is slow, workload is big
Shortcoming, therefore need that a kind of cleaning performance of research and development is good, cleaning speed is fast, workload is small silicon solar production silicon chip is efficient badly
Cleaning equipment.
The content of the invention
（1）The technical problem to be solved
Cleaning performance is good, cleaning speed in order to overcome existing silicon solar production Wafer Cleaning equipment to exist for the present invention
Slowly, the big shortcoming of workload, the technical problem to be solved in the present invention is to provide that a kind of cleaning performance is good, cleaning speed fast, work
Silicon chip high-efficiency cleaning equipment is used in the small silicon solar production of amount.
（2）Technical scheme
In order to solve the above-mentioned technical problem, the invention provides such a silicon solar production silicon chip high-efficiency cleaning equipment,
Include hollow out cleaning case, hinge, case lid, cylinder, the first guide rod, the first guide pin bushing, motor, the second guide rod, the second guide pin bushing, top
Plate, movable frame, support, bull stick, water tank, fixed plate, left frame, water pump, flexible pipe, cleaning frame, base plate, outlet pipe, valve and right shelf,
Base plate top left is welded with left frame, and left frame lower right side is welded with fixed plate, the mode that fixed plate top is bolted
Water tank is connected with, the mode being bolted in the middle of water tank inner bottom part is connected with water pump, the side connected by flange on water pump
Formula is connected with flexible pipe, and base plate top right side is placed with cleaning frame, and the delivery port of flexible pipe is located at cleaning frame top, under cleaning frame right wall
Portion is welded with outlet pipe, and outlet pipe is provided with valve, and base plate top right-hand member is welded with right shelf, and left frame and right shelf welded top have top
Plate, top board bottom is welded with the second guide pin bushing, support and the first guide pin bushing successively from left to right, and the second guide pin bushing inner sliding type is provided with second
Guide rod, the first guide pin bushing inner sliding type is provided with the first guide rod, and movable frame, support bottom are welded between the second guide rod and the first guide rod
The mode being bolted is fixedly connected with motor, evenly spaced on the output shaft of motor to be welded with bull stick, bull stick and shifting
Dynamic frame coordinates, and the mode being bolted in the middle of mobile frame bottom is connected with cylinder, the side that cylinder end is bolted
Formula is connected with hollow out cleaning case, and the mode that hollow out cleaning right wall of box top is connected by screw is connected with hinge, passes through on hinge
The mode of mode connects for screw is connected with case lid, and hollow out cleaning case is located at directly over cleaning frame.
Preferably, filter screen is also included, the other end of flexible pipe is connected with filter screen.
Preferably, reinforcement is also included, left frame right upper portion is welded with reinforcement, and reinforcement right-hand member is left with top board bottom
Side welded type connection.
Preferably, baseboard material is stainless steel.
Preferably, the material of cleaning frame is Q235 steel.
Preferably, the material of flexible pipe is PVC materials.
Operation principle：During using this equipment, workman opens case lid first, pours into a certain amount of silicon chip for needing cleaning and is engraving
In empty cleaning case, then case lid is closed.Then pump working is controlled, now the water in water tank enters cleaning inframe by flexible pipe,
Equipped with after appropriate clear water, control water pump is stopped cleaning inframe.Control cylinder to extend again, so drive hollow out cleaning case to
Lower motion, after hollow out cleaning case is located at cleaning inframe correct position, control cylinder is stopped.Then controlled motor up time again
Pin rotates, and motor drives bull stick to turn clockwise, and then bull stick drives movable frame or so fortune by the second guide rod and the first guide rod
Dynamic, so that movable frame drives cylinder and device side-to-side movement thereon, so repeatedly, hollow out cleaning case constantly swings, and makes
Obtain clear water of the silicon chip in hollow out cleaning case fully with cleaning inframe to contact, and cause the more thorough of Wafer Cleaning.Work as hollow out
After Wafer Cleaning in cleaning case is complete, and hollow out cleaning case, when moving to original position, controlled motor is stopped, and then controls again
Cylinder shrinks, and then drives hollow out cleaning case to move upwards, and after hollow out cleaning case resets, control cylinder is stopped, Ran Hougong
People opens valve, and the water for now cleaning after inframe cleaning silicon chip is flowed out by outlet pipe, after inframe cleaning silicon chip is cleaned
All after outflow, valve closing is then opened case lid to water by workman again, and the silicon chip after being cleaned completely in hollow out cleaning case is taken
Go out, then case lid is closed.
Because also including filter screen, the other end of flexible pipe is connected with filter screen, can prevent the impurity in water from entering by flexible pipe
Water pump, in order to avoid damage water pump.
Because also including reinforcement, left frame right upper portion is welded with reinforcement, reinforcement right-hand member and top board bottom left
Welded type is connected, and increased the intensity of left frame right upper portion and top board bottom left faying face, makes this service life of equipment longer.
Because baseboard material is stainless steel, stainless steel corrosion resistance and acid resistance are strong, make the service life of this equipment longer.
Because the material for cleaning frame is Q235 steel, Q235 steel hardness is high, and is unlikely to deform, and makes the service life of this equipment more
It is long.
Because the material of flexible pipe is PVC materials, with mechanical strength higher, elongation percentage is high, and product is soft, and with good
Good corrosion resistance and electrical insulating property.
（3）Beneficial effect
The effect good invention achieves cleaning performance, cleaning speed is fast, workload is small, and the important function that this equipment is played is not
Only good cleaning performance, also improves operating efficiency, safe, and with advanced in performance, reliability advantage high.
Brief description of the drawings
Fig. 1 is the first main structure diagram of the invention.
Fig. 2 is second main structure diagram of the invention.
Fig. 3 is the third main structure diagram of the invention.
Mark in accompanying drawing for：1- hollow out cleaning cases, 2- hinges, 3- case lids, 4- cylinders, the guide rods of 5- first, 6- first leads
Set, 7- motors, the guide rods of 8- second, the guide pin bushings of 9- second, 10- top boards, 11- movable frames, 12- supports, 13- bull sticks, 14- water tanks, 15-
Fixed plate, the left framves of 16-, 17- water pumps, 18- flexible pipes, 19- cleaning frames, 20- base plates, 21- outlet pipes, 22- valves, 23- right shelfs,
24- filter screens, 25- reinforcements.
Specific embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples.
Embodiment 1
Silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production, as Figure 1-3, includes hollow out cleaning case 1, hinge 2, case
Lid 3, cylinder 4, the first guide rod 5, the first guide pin bushing 6, motor 7, the second guide rod 8, the second guide pin bushing 9, top board 10, movable frame 11, support
12nd, bull stick 13, water tank 14, fixed plate 15, left frame 16, water pump 17, flexible pipe 18, cleaning frame 19, base plate 20, outlet pipe 21, valve
22 and right shelf 23, the top left of base plate 20 is welded with left frame 16, and the lower right side of left frame 16 is welded with fixed plate 15, and fixed plate 15 is pushed up
The mode that portion is bolted is connected with water tank 14, and the mode being bolted in the middle of the inner bottom part of water tank 14 is connected with water pump
17, flexible pipe 18 is connected with water pump 17 by way of flange is connected, the top right side of base plate 20 is placed with cleaning frame 19, flexible pipe 18
Delivery port be located at cleaning frame 19 top, the cleaning right wall lower weld of frame 19 has outlet pipe 21, and outlet pipe 21 is provided with valve 22,
The top right-hand member of base plate 20 is welded with right shelf 23, and left frame 16 and the welded top of right shelf 23 have top board 10, and the bottom of top board 10 is from left to right
The second guide pin bushing 9, the guide pin bushing 6 of support 12 and first are welded with successively, and the inner sliding type of the second guide pin bushing 9 is provided with the second guide rod 8, the first guide pin bushing
6 inner sliding types are provided with the first guide rod 5, and movable frame 11 is welded between the second guide rod 8 and the first guide rod 5, and the bottom of support 12 passes through
Bolted mode is fixedly connected with motor 7, evenly spaced on the output shaft of motor 7 to be welded with bull stick 13, bull stick 13 with
Movable frame 11 coordinates, and the mode being bolted in the middle of the bottom of movable frame 11 is connected with cylinder 4, and the bottom of cylinder 4 passes through bolt
The mode of connection is connected with hollow out cleaning case 1, and the mode that the right wall top of hollow out cleaning case 1 is connected by screw is connected with hinge 2,
The mode being connected by screw on hinge 2 is connected with case lid 3, and hollow out cleaning case 1 is located at directly over cleaning frame 19.
Filter screen 24 is also included, the other end of flexible pipe 18 is connected with filter screen 24.
Reinforcement 25 is also included, the right upper portion of left frame 16 is welded with reinforcement 25, the right-hand member of reinforcement 25 and the bottom of top board 10
The welded type connection of portion left side.
The material of base plate 20 is stainless steel.
The material for cleaning frame 19 is Q235 steel.
The material of flexible pipe 18 is PVC materials.
Operation principle：During using this equipment, workman opens case lid 3 first, pours into a certain amount of silicon chip for needing cleaning and exists
In hollow out cleaning case 1, then case lid 3 is closed.Then control water pump 17 is worked, and now the water in water tank 14 is entered by flexible pipe 18
In cleaning frame 19, after cleaning frame 19 is built with appropriate clear water, control water pump 17 is stopped.Cylinder 4 is controlled to extend again, and then
Hollow out cleaning case 1 is driven to move downward, after hollow out cleaning case 1 is located at correct position in cleaning frame 19, control cylinder 4 stops work
Make.Then controlled motor 7 turns clockwise again, and motor 7 drives bull stick 13 to turn clockwise, and then bull stick 13 passes through the second guide rod
8 and the first guide rod 5 drive the side-to-side movement of movable frame 11 so that movable frame 11 drive cylinder 4 and device side-to-side movement thereon, so
Repeatedly, hollow out cleaning case 1 constantly swings so that silicon chip in hollow out cleaning case 1 fully with cleaning frame 19 in clear water
Contact, and cause the more thorough of Wafer Cleaning.After the Wafer Cleaning in hollow out cleaning case 1 is complete, and hollow out cleaning case 1 is transported
Move during to original position, controlled motor 7 is stopped, then control cylinder 4 to shrink again, and then drive the motion upwards of hollow out cleaning case 1,
After hollow out cleaning case 1 resets, control cylinder 4 is stopped, and then workman opens valve 22, now cleans cleaning silicon in frame 19
Water after piece is flowed out by outlet pipe 21, and all after outflow, workman closes valve 22 to water after cleaning silicon chip in frame 19 is cleaned
Close, case lid 3 is then opened again, by the silicon chip extracting after cleaning completely in hollow out cleaning case 1, then case lid 3 is closed.
Because also including filter screen 24, the other end of flexible pipe 18 is connected with filter screen 24, can prevent the impurity in water by soft
Pipe 18 enters water pump 17, in order to avoid damage water pump 17.
Because also including reinforcement 25, the right upper portion of left frame 16 is welded with reinforcement 25, the right-hand member of reinforcement 25 and top board
10 bottom left welded types are connected, and increased the intensity of the right upper portion of left frame 16 and the bottom left faying face of top board 10, make originally to set
Standby service life is longer.
Because the material of base plate 20 is stainless steel, stainless steel corrosion resistance and acid resistance are strong, make the service life of this equipment more
It is long.
Because the material for cleaning frame 19 is Q235 steel, Q235 steel hardness is high, and is unlikely to deform, and makes the service life of this equipment
It is longer.
Because the material of flexible pipe 18 is PVC materials, with mechanical strength higher, elongation percentage is high, and product is soft, and has
Good corrosion resistance and electrical insulating property.
Embodiment described above only expresses the preferred embodiment of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformations, improvement can also be made and substituted, these belong to this hair
Bright protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production, it is characterised in that include hollow out cleaning case（1）, hinge
（2）, case lid（3）, cylinder（4）, the first guide rod（5）, the first guide pin bushing（6）, motor（7）, the second guide rod（8）, the second guide pin bushing（9）、
Top board（10）, movable frame（11）, support（12）, bull stick（13）, water tank（14）, fixed plate（15）, left frame（16）, water pump（17）、
Flexible pipe（18）, cleaning frame（19）, base plate（20）, outlet pipe（21）, valve（22）And right shelf（23）, base plate（20）Top left is welded
It is connected to left frame（16）, left frame（16）Lower right side is welded with fixed plate（15）, fixed plate（15）The side that top is bolted
Formula is connected with water tank（14）, water tank（14）The mode being bolted in the middle of inner bottom part is connected with water pump（17）, water pump（17）
On flange connect by way of be connected with flexible pipe（18）, base plate（20）Top right side is placed with cleaning frame（19）, flexible pipe（18）
Delivery port be located at cleaning frame（19）Top, cleans frame（19）Right wall lower weld has outlet pipe（21）, outlet pipe（21）On set
There is valve（22）, base plate（20）Top right-hand member is welded with right shelf（23）, left frame（16）And right shelf（23）Welded top has top board
（10）, top board（10）Bottom is welded with the second guide pin bushing successively from left to right（9）, support（12）With the first guide pin bushing（6）, the second guide pin bushing
（9）Inner sliding type is provided with the second guide rod（8）, the first guide pin bushing（6）Inner sliding type is provided with the first guide rod（5）, the second guide rod（8）With
One guide rod（5）Between be welded with movable frame（11）, support（12）The mode that bottom is bolted is fixedly connected with motor
（7）, motor（7）Output shaft on evenly spaced be welded with bull stick（13）, bull stick（13）With movable frame（11）Coordinate, movable frame
（11）The mode being bolted in the middle of bottom is connected with cylinder（4）, cylinder（4）The mode that bottom is bolted is connected
There is hollow out cleaning case（1）, hollow out cleaning case（1）The mode that right wall top is connected by screw is connected with hinge（2）, hinge（2）
On the mode that is connected by screw be connected with case lid（3）, hollow out cleaning case（1）Positioned at cleaning frame（19）Surface.
2. silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production according to claim 1, it is characterised in that also included
There is filter screen（24）, flexible pipe（18）The other end be connected with filter screen（24）.
3. silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production according to claim 1, it is characterised in that also included
There is reinforcement（25）, left frame（16）Right upper portion is welded with reinforcement（25）, reinforcement（25）Right-hand member and top board（10）Bottom is left
Side welded type connection.
4. silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production according to claim 1, it is characterised in that base plate
（20）Material is stainless steel.
5. silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production according to claim 1, it is characterised in that cleaning frame
（19）Material be Q235 steel.
6. silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production according to claim 1, it is characterised in that flexible pipe
（18）Material be PVC materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611058775.XA CN106783671A (en) | 2016-11-28 | 2016-11-28 | Silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611058775.XA CN106783671A (en) | 2016-11-28 | 2016-11-28 | Silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106783671A true CN106783671A (en) | 2017-05-31 |
Family
ID=58912645
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611058775.XA Pending CN106783671A (en) | 2016-11-28 | 2016-11-28 | Silicon chip high-efficiency cleaning equipment is used in a kind of silicon solar production |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538761A (en) * | 2018-04-09 | 2018-09-14 | 绍兴文理学院 | A kind of photovoltaic panel silicon chip processing cleaning device |
| CN115254764A (en) * | 2022-09-26 | 2022-11-01 | 苏州卓樱自动化设备有限公司 | Cleaning equipment used after grinding of silicon wafer |
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2016
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538761A (en) * | 2018-04-09 | 2018-09-14 | 绍兴文理学院 | A kind of photovoltaic panel silicon chip processing cleaning device |
| CN115254764A (en) * | 2022-09-26 | 2022-11-01 | 苏州卓樱自动化设备有限公司 | Cleaning equipment used after grinding of silicon wafer |
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Application publication date: 20170531 |