CN106774727B

CN106774727B - Multi-path server and board card interconnection structure thereof

Info

Publication number: CN106774727B
Application number: CN201710038942.2A
Authority: CN
Inventors: 宗艳艳; 贡维
Original assignee: Zhengzhou Yunhai Information Technology Co Ltd
Current assignee: Zhengzhou Yunhai Information Technology Co Ltd
Priority date: 2017-01-19
Filing date: 2017-01-19
Publication date: 2020-02-07
Anticipated expiration: 2037-01-19
Also published as: CN106774727A

Abstract

The invention discloses a board card interconnection structure of a multi-path server, which comprises a rigid backboard, a plurality of main boards and an elastic backboard arranged on the surface of the rigid backboard, wherein each main board is in signal connection with the elastic backboard through a data connector so as to realize data transmission among the main boards. The board card interconnection structure of the multi-path server disclosed by the invention is in signal connection with the main board through the elastic backboard, and the dielectric constant and the loss angle of the elastic backboard are lower compared with those of the rigid backboard, so that the dielectric loss is reduced to a certain extent when signals are transmitted on the elastic backboard, and the signal attenuation during board card interconnection can be effectively reduced. Moreover, the elastic back plate is thin, good in bending performance, small in occupied space, flexible in arrangement and suitable for narrow installation space in the server. The invention also discloses a multi-path server comprising the board card interconnection structure, and the multi-path server has the beneficial effects as described above.

Description

Multi-path server and board card interconnection structure thereof

Technical Field

The invention relates to the technical field of servers, in particular to a board card interconnection structure of a multi-path server. The invention also relates to a multi-path server comprising the board card interconnection structure.

Background

With the rapid development of scientific technology, more and more governments, universities and other institutions have generated more and more kinds of demands on servers.

Servers, also known as servers, are devices that provide computing services. Since the server needs to respond to and process the service request, the server generally has the capability of assuming and securing the service. The server is constructed to include a processor, a hard disk, a memory, a system bus, etc., similar to a general-purpose computer architecture, but requires high processing power, stability, reliability, security, scalability, manageability, etc., due to the need to provide highly reliable services. Under a network environment, the server is divided into a file server, a database server, an application server, a WEB server and the like according to different service types provided by the server.

With the development of information technology, a single server has become unable to meet the demands of different clients, and thus multiple servers are coming into the field of view of people. With the continuous improvement of the signal rate and the performance of the server, the server interconnection scheme is more complex and changeable. In the traditional server interconnection, a main board and a back board are interconnected through a high-speed connector, and the orthogonal connection is the shortest transmission path. However, not all types of motherboards and backplanes can adopt orthogonal connection, due to differences of transmission signals or interfaces, a part of data transmission signals have to be additionally provided with an extended data transmission path on the backplane, and in addition to losses of the motherboards and other interconnection boards, the data transmission signals are likely to be greatly attenuated in the transmission process on the backplane, so that the data transmission signals cannot be recovered when reaching a receiving end, and the problem of signal analysis errors occurs.

Therefore, how to reduce the signal attenuation when the boards in the multi-server are interconnected is a technical problem to be solved urgently by those skilled in the art.

Disclosure of Invention

The invention aims to provide a board card interconnection structure of a multi-path server, which can effectively reduce signal attenuation when board cards in the multi-path server are interconnected. Another object of the present invention is to provide a multi-server including the above board interconnection structure.

In order to solve the technical problem, the invention provides a board card interconnection structure of a multi-path server, which comprises a rigid backboard, a plurality of main boards and an elastic backboard arranged on the surface of the rigid backboard, wherein each main board is in signal connection with the elastic backboard through a data connector so as to realize data transmission among the main boards.

Preferably, the elastic back plate is arranged on the non-bearing surface of the rigid back plate.

Preferably, the rigid back plate is provided with a connecting hole corresponding to each main board, and the data connector is fixed to the connecting hole, so that each main board is directly connected with the elastic back plate through the connecting hole.

Preferably, the data connector is detachably coupled to the coupling hole by a fastener.

Preferably, the elastic back plate is a copper foil plate.

Preferably, the thickness of the elastic back plate is 1-2 mm.

The invention also provides a multi-path server which comprises the board card interconnection structure.

The invention provides a board card interconnection structure of a multi-path server, which mainly comprises a main board, a rigid backboard and an elastic backboard. The main board is the main structure of the server, and a CPU, an RAM and the like can be arranged on the main board. A plurality of mainboards may exist in the server at the same time, and if the mainboards are required to be interconnected and run together, the mainboards are required to be interconnected through a backboard to realize high-speed data transmission. The back plate comprises a rigid back plate and an elastic back plate, wherein the rigid back plate is high in rigidity and strength and is mainly used for mounting and bearing each main plate. The elastic backboard is arranged on the surface of the rigid backboard and is mainly used for realizing signal connection with each mainboard through the data connector, so that the data transmission between each mainboard and the elastic backboard is realized through the connector. The elastic backboard is connected with the mainboard through signals, and the dielectric constant and the loss angle of the elastic backboard are lower than those of the rigid backboard, so that the dielectric loss is reduced to a certain extent when the signals are transmitted on the elastic backboard, and the signal attenuation during the interconnection of the boards can be effectively reduced. Moreover, the elastic back plate is thin, good in bending performance, small in occupied space, flexible in arrangement and suitable for narrow installation space in the server.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a schematic overall structure diagram of an embodiment of the present invention;

fig. 2 is a schematic plan view of the rigid backplate shown in fig. 1.

Wherein, in fig. 1-2:

rigid backboard-1, connecting hole-101, mainboard-2, elastic backboard-3, data connector-4.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.

In a specific embodiment provided by the present invention, the board card interconnection structure of the multi-path server mainly includes a rigid backplane 1, an elastic backplane 3, and a plurality of main boards 2.

The main board 2 is a main structure of the server, and a CPU, an RAM, and the like may be disposed thereon. A plurality of motherboards 2 may exist in the server at the same time, and if the motherboards 2 need to be interconnected to operate together, the motherboards 2 need to be interconnected through a backplane to realize high-speed data transmission.

The backboard comprises a rigid backboard 1 and an elastic backboard 3, wherein the rigid backboard 1 is high in rigidity and strength and is mainly used for mounting and bearing each mainboard 2. The elastic backboard 3 is arranged on the surface of the rigid backboard 1 and is mainly used for realizing signal connection with each mainboard 2 through the data connector 4, so that each mainboard 2 realizes mutual data transmission with the elastic backboard 3 through the connector. Importantly, this embodiment is connected with 2 signal of mainboard through elastic backplate 3, because the dielectric constant and the loss angle of elastic backplate 3 are lower for rigid backplate 1, therefore when the signal is transmitted on elastic backplate 3, dielectric loss obtains reducing to a certain extent, and then can effectively reduce the signal attenuation when the integrated circuit board interconnects. Moreover, the elastic back plate 3 is thin, good in bending performance, small in occupied space, flexible in arrangement and suitable for narrow installation space in a server.

Considering that the rigid backplate 1 needs to carry the rest of the components such as the motherboard 2, the elastic backplate 3 can be disposed on a non-carrying surface of the rigid backplate 1, such as the back surface of the rigid backplate 1, so as to avoid the obstruction of the installation position of the motherboard 2 and the like caused by the existence of the elastic backplate 3.

As shown in fig. 2, fig. 2 is a schematic plan view of the rigid backplate 1 shown in fig. 1.

Furthermore, in order to further reduce the signal attenuation, the present embodiment provides several connection holes 101 on the rigid backplane 1, considering that the data connector 4 itself also has some signal attenuation. The installation position of the connection hole 101 on the rigid back plate 1 corresponds to the installation position of the main plate 2 and the rigid back plate 1. The connection hole 101 is a through hole, and the rigid backplate 1 is penetrated through from both sides thereof, so that the main board 2 can directly contact the elastic backplate 3 through the connection hole 101. Meanwhile, the data connector 4 is fixed at the position of the connecting hole 101, so that each main board 2 at the corresponding position can be directly connected with the elastic backboard 3 through the data connector 4 on the connecting hole 101. With such an arrangement, the actual function of the rigid backplane 1 is only that of the bearing component, and due to the existence of the connection hole 101, the motherboard 2 can be directly connected with the elastic backplane 3 through the connection hole 101 in a signal manner, that is, the signal connection between the motherboard 2 and the elastic backplane 3 is the same as that between the motherboard 2 and the elastic backplane 1 in the previous signal connection manner, and can be completed by only one data connector 4. After the mainboard 2 is connected with the rigid backboard 1 through the data connector 4, the mainboard 2 is connected with the elastic backboard 3 through the other data connector 4, so that the signal attenuation is correspondingly reduced.

The data connector 4 is fixed to the connection hole 101, and preferably, the data connector 4 is mounted on the connection hole 101 by a fastening member, such as a guide pin or a bolt. So set up, for can dismantling the connection between data connector 4 and the connecting hole 101, to the mainboard 2 or the interface of different grade type, can dismantle the change at any time to make the elasticity backplate 3 adapt to more types of mainboard 2.

In addition, it is considered that the material of the flexible backplane 3 also has an influence on signal attenuation. For this reason, the flexible backplane 3 in this embodiment may be a copper foil board, so that the signal loss rate is reduced to some extent.

Meanwhile, the thickness of the material of the elastic backboard 3 also affects the signal attenuation. Therefore, the thickness of the elastic back plate 3 in the present embodiment may be 1 to 2 mm. Of course, the thickness of the resilient back-plate 3 may also be adjusted in view of its strength, brittleness, etc.

The present embodiment further provides a multi-path server, which mainly includes various boards and a board interconnection structure, where the board interconnection structure is the same as the related content, and is not described herein again.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A board card interconnection structure of a multi-path server comprises a rigid backboard (1) and a plurality of main boards (2), and is characterized by further comprising an elastic backboard (3) arranged on the surface of the rigid backboard (1), wherein each main board (2) is in signal connection with the elastic backboard (3) through a data connector (4) so as to realize data transmission among the main boards (2);

a connecting hole (101) is formed in the rigid backboard (1) corresponding to each mainboard (2), and the data connector (4) is fixed to the connecting hole (101) so that each mainboard (2) is directly connected with the elastic backboard (3) through the connecting hole (101);

the elastic back plate (3) is arranged on the non-bearing surface of the rigid back plate (1);

the data connector (4) is detachably connected to the connecting hole (101) through a fastener;

the elastic back plate (3) is a copper foil plate;

the thickness of the elastic back plate (3) is 1-2 mm.

2. A multi-way server comprising the board interconnect structure of claim 1.