CN106766667B - Liquid refrigerating and heating device - Google Patents
Liquid refrigerating and heating device Download PDFInfo
- Publication number
- CN106766667B CN106766667B CN201710022617.7A CN201710022617A CN106766667B CN 106766667 B CN106766667 B CN 106766667B CN 201710022617 A CN201710022617 A CN 201710022617A CN 106766667 B CN106766667 B CN 106766667B
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- Prior art keywords
- water
- refrigerating
- heating
- unit
- water outlet
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
- F25D31/005—Combined cooling and heating devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a liquid refrigerating and heating device, which is provided with a refrigerating unit, a heating unit, input equipment, display equipment and a switching power supply, wherein the refrigerating unit and the heating unit are connected with a processor; the heating unit comprises a liquid tank provided with a water filling port, a water inlet hole and a water outlet hole, the water inlet hole is connected with a water inlet pipe, the water outlet hole is connected with a water outlet pipe, and a ceramic heating sheet is arranged in the liquid tank; the semiconductor refrigerating device is communicated with the water inlet pipe and the liquid tank and is connected with the water outlet pipe through a water cooling pipe; the semiconductor refrigerating device is also provided with a water pump which is communicated with the liquid tank and the semiconductor refrigerating device; the water inlet pipe is provided with a corresponding electromagnetic valve for controlling the flow direction of the water. The invention can integrate the refrigeration and heating functions of the heat exchange medium, can conveniently convert between the refrigeration and heating functions, and can be suitable for various water-cooled heat exchange devices.
Description
Technical Field
The present invention relates to a liquid chiller.
Background
At present, when cooling/heating electronic equipment, such as a heat dissipation device and a water cooling mattress, by means of hydrothermal conduction, the volume of refrigeration/heating equipment is overlarge, the energy consumption is generally overhigh, the noise is large, and the electronic equipment is unfavorable for daily use in general life. In addition, the conventional portable refrigeration device performs cooling and heat dissipation through the honeycomb plate and the fan, and the device with the structure is large and heavy, is inconvenient to move, is easy to leak water, cannot perform temperature setting generally, and is very inconvenient to use.
Disclosure of Invention
The invention provides a liquid refrigerating and heating device which can integrate the refrigerating and heating functions of a heat exchange medium, has small volume and can conveniently convert between the refrigerating and heating functions.
The liquid refrigerating device comprises a refrigerating unit, a heating unit, input equipment, display equipment and a switching power supply, wherein the refrigerating unit and the heating unit are connected with a processor;
the heating unit comprises a liquid tank provided with a water filling port, a water inlet hole and a water outlet hole, the water inlet hole is connected with a water inlet pipe, the water outlet hole is connected with a water outlet pipe, and a ceramic heating sheet connected with the relay is arranged in the liquid tank;
the semiconductor refrigerating device is communicated with the water inlet pipe and the liquid tank and is connected with the water outlet pipe through a water cooling pipe;
the semiconductor refrigerating device is also provided with a water pump which is communicated with the liquid tank and the semiconductor refrigerating device;
the water inlet pipe is provided with a third electromagnetic valve for controlling the flow direction of water, the part of the water outlet pipe connected with the water outlet hole of the heating unit is provided with a first electromagnetic valve, and the part of the water outlet pipe connected with the water cooling pipe of the refrigerating unit is provided with a second electromagnetic valve.
The processor can adopt a singlechip or a CPU and other devices for controlling the states of other components. The power supply adopts a switching power supply, the power supply can be generally divided into a switching power supply and a linear power supply, the switching power supply can ensure constant voltage or current through a self structure, and the linear power supply can change along with the change of an electric appliance, so that the switching power supply is not suitable for equipment with higher precision. The switching power supply in the device respectively provides 12V stable voltage for the relay and 5V stable voltage for the processor. The ceramic heating sheet in the heating unit and the semiconductor refrigerating device in the refrigerating unit are all commonly used equipment with 12V rated voltage at present, and the working states of the ceramic heating sheet and the semiconductor refrigerating device are controlled through a relay. The liquid tank is filled with and stores the heat exchange medium through the water filling port. The three electromagnetic valves are normally closed electromagnetic valves, the second electromagnetic valve is opened during refrigeration, and all pipelines are only connected with the refrigeration unit. When heating, the first electromagnetic valve and the third electromagnetic valve are opened, and all pipelines are only connected with the heating unit, so that the influence of temperature change on different units can be avoided.
Further, in order to facilitate observation of the liquid level in the liquid tank, a water level indicating pipe communicated with the liquid tank may be provided in the heating unit, the water level indicating pipe may be provided as a transparent whole or with a transparent observation window, and corresponding scales may be provided on the water level indicating pipe as required.
Further, the water inlet pipe is provided with a temperature sensor connected with the processor, the temperature of the heat exchange medium returned from the external heat exchange equipment through the water inlet pipe is sensed, the sensing signal is transmitted to the processor, the processor controls the on time of the relay according to the temperature difference between the sensing signal and the set temperature, so that the refrigerating or heating temperature is controlled, when the relay is connected for a corresponding time, or the temperature difference is detected to be in an allowable range through the temperature sensor, the relay is disconnected, and the refrigerating or heating is stopped, so that the refrigerating or heating temperature is more accurate, and blindness and coarseness are reduced.
Preferably, a fan corresponding to the heat dissipating device is arranged in the refrigeration unit and is used for performing air cooling heat dissipation on the heat dissipating device, and the heat dissipating device generally comprises a heat dissipating fin structure.
In order to perform better heat transfer and heat dissipation when the semiconductor refrigeration device works, a heat dissipation device in the refrigeration unit can be further arranged to be connected with the semiconductor refrigeration device through heat conduction silica gel.
Meanwhile, a heat insulation pad can be arranged below the semiconductor refrigerating device of the refrigerating unit so as to insulate the water cooling pipe and prevent the external temperature from influencing the water cooling pipe when the semiconductor refrigerating device works.
On the basis, the input device comprises a function key connected with the processor, wherein the function key can be a movable function key connected with the processor through a limited or wireless mode, and can also be a keyboard type function key arranged on the device shell.
Further, the display device comprises a display screen and an indicator light which are connected with the processor and are used for displaying various information, prompting different working states and the like.
The liquid refrigerating and heating device can integrate the refrigerating and heating functions of the heat exchange medium, can conveniently convert between the refrigerating and heating functions, and can be suitable for various water-cooled heat exchange devices.
The foregoing of the invention will be described in further detail with reference to the following detailed description of the examples. It should not be understood that the scope of the above subject matter of the present invention is limited to the following examples only. Various substitutions and alterations are also possible, without departing from the spirit of the invention, and are intended to be within the scope of the invention.
Drawings
Fig. 1 is an electrical block diagram of a liquid chiller according to the present invention.
Fig. 2 is a schematic structural diagram of a heating unit and a refrigerating unit in the liquid refrigerating and heating device of the present invention.
Fig. 3 is a schematic view of fig. 2 in a direction.
Fig. 4 is a schematic diagram of the heating unit in fig. 2.
Fig. 5 is a sectional view of B-B of fig. 4.
Fig. 6 is a schematic diagram of the refrigeration unit of fig. 2.
Fig. 7 is a schematic view of the external shape of the liquid cooling and heating device of the present invention.
Detailed Description
The liquid refrigerating and heating device disclosed by the invention as shown in fig. 1 is provided with a refrigerating unit and a heating unit which are connected with a processor of a singlechip structure, an input device, a display device and a switching power supply, wherein the switching power supply is connected with the refrigerating unit and the heating unit through a relay. The refrigerating unit and the heating unit are respectively output to external heat exchange equipment. The system is also provided with wireless control equipment connected with the processor through Bluetooth and used for setting various parameters, controlling the states of the refrigerating unit and the heating unit and the like.
As shown in fig. 2 to 4, the heating unit includes a liquid tank 26 provided with a water filling port 22, a water inlet 25 and a water outlet 24. The water inlet hole 25 is connected with the water inlet pipe 6, the water outlet hole 24 is connected with the water outlet pipe 5, the liquid tank 26 is used for storing heat exchange media, and the common ceramic heating plate 23 with 12V rated voltage connected with the relay is arranged in the liquid tank 26. A water level indicating pipe 21 is also provided in communication with the liquid tank 26 for facilitating the observation of the liquid level in the liquid tank 26.
As shown in fig. 2, 3 and 6, the refrigerating unit is provided with a semiconductor refrigerating device 14 connected to the heat sink 12 of the heat sink structure and the relay, and the semiconductor refrigerating device 14 is a semiconductor refrigerating device of a common 12V rated voltage, and the heat dissipation device 12 dissipates heat at the temperature at which the semiconductor refrigerating device 14 operates. A heat conducting silica gel 12 is also arranged between the semiconductor refrigerating device 14 and the heat radiating device 12, a heat insulating pad 16 is arranged below the semiconductor refrigerating device 14, and a fan 11 is arranged at a position corresponding to the heat radiating device 12, so that the heat radiating device 12 can be conveniently cooled. The semiconductor refrigerating device 14 is communicated with the water inlet pipe 6 and the liquid tank 26, and is connected with the water outlet pipe 5 through a water cooling pipe 15. A water pump 10 is also provided in communication with the liquid tank 26 and the semiconductor refrigeration device 14 for delivering the heat exchange medium in the liquid tank 26 to the refrigeration unit.
The water inlet pipe 6 is provided with a temperature sensor 4 connected with the processor, and is used for sensing the temperature of a heat exchange medium returned from external heat exchange equipment through the water inlet pipe 6, transmitting sensing signals to the processor, and controlling the refrigeration or heating by the processor according to the temperature difference between the sensing signals and the set temperature, so that the refrigeration or heating temperature is more accurate. The water inlet pipe 6 is provided with a third electromagnetic valve 33 for controlling the water inlet flow direction, the part of the water outlet pipe 5 connected with the water outlet hole 24 of the heating unit is provided with a first electromagnetic valve 31, and the part of the water outlet pipe 5 connected with the water cooling pipe 15 of the refrigerating unit is provided with a second electromagnetic valve 32. The three solenoid valves are normally closed solenoid valves, the second solenoid valve 32 is opened during refrigeration, and all pipelines are only connected with the refrigeration unit. When heating, the first electromagnetic valve 31 and the third electromagnetic valve 33 are opened, and all pipelines are only connected with the heating unit, so that the influence of temperature change on different units can be avoided.
As shown in fig. 7, an input device having a function key 7 structure connected to a processor and a display device including a display 9 and an indicator lamp 8 connected to the processor are provided on a casing of the liquid chiller. The water outlet pipe 5, the water inlet pipe 6 and the water filling port 22 extend out of the shell, so that the operation is convenient. A drain port 51 is provided in communication with the water outlet pipe 5, and the heat exchange medium in the liquid tank 26 can be discharged through the drain port 51 or the water outlet pipe 5.
Claims (7)
1. The liquid refrigerating and heating device is characterized in that: the device comprises a refrigerating unit and a heating unit which are connected with a processor, an input device, a display device and a switching power supply, wherein the switching power supply is connected with the refrigerating unit and the heating unit through a relay;
the heating unit comprises a liquid tank (26) provided with a water filling port (22), a water inlet hole (25) and a water outlet hole (24), wherein the water inlet hole (25) is connected with a water inlet pipe (6), the water outlet hole (24) is connected with a water outlet pipe (5), and a ceramic heating sheet (23) connected with the relay is arranged in the liquid tank (26);
the refrigerating unit is internally provided with a semiconductor refrigerating device (14) which is respectively connected with the heat radiating device (12) and the relay, the semiconductor refrigerating device (14) is communicated with the water inlet pipe (6) and the liquid tank (26), and is connected with the water outlet pipe (5) through a water cooling pipe (15);
a water pump (10) which is communicated with the liquid tank (26) and the semiconductor refrigerating device (14) is also arranged;
a third electromagnetic valve (33) for controlling the flow direction of the water is arranged on the water inlet pipe (6), a first electromagnetic valve (31) is arranged at the part of the water outlet pipe (5) connected with the water outlet hole (24) of the heating unit, and a second electromagnetic valve (32) is arranged at the part of the water outlet pipe (5) connected with the water cooling pipe (15) of the refrigerating unit;
the water inlet pipe (6) is provided with a temperature sensor (4) connected with the processor.
2. A liquid chiller according to claim 1 wherein: the heating unit is provided with a water level indicating pipe (21) communicated with the liquid tank (26).
3. A liquid chiller according to claim 1 wherein: a fan (11) corresponding to the heat radiating device (12) is arranged in the refrigerating unit.
4. A liquid chiller according to claim 1 wherein: the heat dissipation device (12) in the refrigerating unit is connected with the semiconductor refrigerating device (14) through the heat conduction silica gel (12).
5. A liquid chiller according to claim 1 wherein: a heat insulating pad (16) is arranged below a semiconductor refrigerating device (14) of the refrigerating unit.
6. A liquid chiller as claimed in any one of claims 1 to 5 wherein: the input device comprises a function key (7) connected with the processor.
7. A liquid chiller as claimed in any one of claims 1 to 5 wherein: the display device comprises a display screen (9) and an indicator lamp (8) which are connected with the processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710022617.7A CN106766667B (en) | 2017-01-12 | 2017-01-12 | Liquid refrigerating and heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710022617.7A CN106766667B (en) | 2017-01-12 | 2017-01-12 | Liquid refrigerating and heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106766667A CN106766667A (en) | 2017-05-31 |
| CN106766667B true CN106766667B (en) | 2023-08-15 |
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ID=58947943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710022617.7A Active CN106766667B (en) | 2017-01-12 | 2017-01-12 | Liquid refrigerating and heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106766667B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107238230B (en) * | 2017-07-04 | 2019-04-19 | 青岛大学 | A kind of dual temperature area semiconductor thermostatic and temperature device |
| CN107894115A (en) * | 2017-11-09 | 2018-04-10 | 北京电子工程总体研究所 | A kind of portable miniaturized CO2Laser tube electronic refrigeration plant |
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| CN2281780Y (en) * | 1996-11-08 | 1998-05-20 | 牟国晨 | Electronic medical cold and hot compress apparatus |
| CN2511533Y (en) * | 2001-11-19 | 2002-09-18 | 陆岳如 | Small water drinker for automobile |
| CN2569048Y (en) * | 2002-08-22 | 2003-08-27 | 深圳市唯亚太科技股份有限公司 | Small semiconductor air conditioner |
| CN2684711Y (en) * | 2004-03-31 | 2005-03-16 | 乔永清 | Special cool and hot water drinker using pipeline direct drinking water |
| JP2007225252A (en) * | 2006-02-27 | 2007-09-06 | Toto Ltd | Electric water heater with water purifier |
| CN201229508Y (en) * | 2008-05-20 | 2009-04-29 | 陶子中 | Frequency conversion temperature control circuit for cooling and warming mattress |
| CN201278966Y (en) * | 2008-09-01 | 2009-07-29 | 潘能亮 | Cold warm water cushion |
| KR20100003931U (en) * | 2008-10-06 | 2010-04-15 | 김재희 | Apparatus For hot and cool water supply having peltier element |
| KR101314295B1 (en) * | 2011-08-16 | 2013-10-02 | 동아전기부품 주식회사 | Portable type cooling and heating device |
| CN102709616B (en) * | 2012-05-31 | 2014-09-17 | 杭州万好万家新能源科技有限公司 | Distributed thermal management system for battery modules |
| CN203848545U (en) * | 2014-01-24 | 2014-09-24 | 赛伦（厦门）新材料科技有限公司 | Semiconductor liquid recirculating water cooling machine |
| CN104976859B (en) * | 2014-04-01 | 2017-05-10 | 杨然森 | Electronic cold-hot integrated cabinet |
| CN105310816A (en) * | 2014-07-18 | 2016-02-10 | 西安蓝茗医疗科技有限公司 | Medical semiconductor cold and hot compress machine and cold and hot compress technology thereof |
| CN104274309B (en) * | 2014-09-29 | 2016-06-08 | 唐佩福 | One can automatic water temperature regulation hot and cold water contrast bath apparatus |
| CN205491620U (en) * | 2016-03-17 | 2016-08-17 | 安徽四创电子股份有限公司 | Electronic equipment liquid refrigeration source system |
| CN205509228U (en) * | 2016-03-21 | 2016-08-24 | 北京为世联合科技有限公司 | Laser instrument heat dissipation refrigerating plant |
| CN206430449U (en) * | 2017-01-12 | 2017-08-22 | 攀枝花学院 | Liquid refrigerating thermal |
-
2017
- 2017-01-12 CN CN201710022617.7A patent/CN106766667B/en active Active
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| CN106766667A (en) | 2017-05-31 |
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