CN106757043A - A kind of red copper polishing fluid and its application method - Google Patents
A kind of red copper polishing fluid and its application method Download PDFInfo
- Publication number
- CN106757043A CN106757043A CN201611181135.8A CN201611181135A CN106757043A CN 106757043 A CN106757043 A CN 106757043A CN 201611181135 A CN201611181135 A CN 201611181135A CN 106757043 A CN106757043 A CN 106757043A
- Authority
- CN
- China
- Prior art keywords
- red copper
- polishing
- polishing fluid
- concentration
- application method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention belongs to chemical technology process field, particularly a kind of red copper polishing fluid and its application method.The red copper polishing fluid that red copper polishing fluid provided by the present invention is prepared using the middle strong acid such as orthophosphoric acid, glacial acetic acid and hydrogen peroxide combination, polishing fluid stable components, use process is simple, any gas is not produced in polishing process, it is the mantoquitas such as cupric phosphate, copper nitrate to polish the waste liquid main component for producing, and waste liquid is to environment non-hazardous.
Description
Technical field
The invention belongs to chemical technology process field, particularly a kind of red copper polishing fluid and its application method.
Technical background
Red copper is a kind of tough and tensile, soft, rich malleable metal, is widely used in making conductive, heat conduction equipment.In work
Usually need to carry out surface polishing to red copper in industry production, when the metallographic specimen of red copper is studied, it is also desirable to red copper table
Face is processed by shot blasting.Chemically polishing method makes that red copper surface is smooth, light merely with chemical reaction, has not both needed complexity to set
Standby, operating efficiency is again high；Meet polishing operation facility, simple to operate, polished surface it is more bright and clean on the premise of, chemical polishing
Method is shown one's talent in terms of red copper polishing technology.
The chemically polishing method core of red copper is the preparation of polishing fluid, and traditional chemical polishing solution typically contains high concentration
Chromic acid, the strong oxidizer such as nitric acid, hydrochloric acid.The waste liquid that chromic acid Series Polishing Liquid is produced after use easily causes chromium dirty to environment
Dye；Nitric acid Series Polishing Liquid easily causes excessive erosion to red copper because Trait of Oxidative Nitric Acid is too strong, can also produce in use
Environmentally harmful nitrogen carrier of oxygen, thus it is higher to the operation requirement such as time, temperature in polishing process.In document《Metal
Chemical polishing technology》(plating and covering with paint, 2005,24 (10)：Phosphoric acid acetic acid Series Polishing Liquid, the polishing are disclosed in 36-41)
Liquid quality of finish is good, but the polishing fluid has that composition transfer is fast, the defect such as service life is short.
Therefore red copper polishing fluid of the prior art is unstable in the presence of complex process, composition is used, and waste liquid causes environment dirty
Dye, during use the problems such as generation pernicious gas.
The content of the invention
It is an object of the invention to provide a kind of red copper polishing fluid and its application method, the polishing fluid is polished for red copper surface
When, stable components, using process is simple, do not produce pernicious gas, waste liquid not to pollute environment during use.
In order to solve the above technical problems, the technical scheme that the present invention is provided is a kind of red copper polishing fluid, contain orthophosphoric acid, ice
Acetic acid, nitric acid, hydrogen peroxide, absolute ethyl alcohol, urea and water；Orthophosphoric acid concentration is 1.29~1.34mol/L, and glacial acetic acid concentration is
0.66~0.72mol/L, concentration of nitric acid is 0.67~0.71mol/L, and concentration of hydrogen peroxide is 9.32~9.45mol/L, anhydrous
Concentration of alcohol is 0.60~0.69mol/L, and urea concentration is 12g/L.
The application method of above-mentioned red copper polishing fluid is comprised the following steps：
1) nonmetallic vessel that will fill red copper polishing fluid is placed in thermostat water bath, and water bath with thermostatic control pot temperature is 30~60
℃；
2) red copper surface of polishing will be needed to be immersed in polishing solution, red copper is rocked in polishing process, it is to avoid polishing is produced
Thing is attached to red copper surface, is persistently polished to red copper surface smooth；
3) red copper after polishing is placed in dust technology after soaking 5~10s and is rushed red copper surface dust technology with deionized water
Wash away and remove.
Beneficial effects of the present invention：
Red copper polishing fluid provided by the present invention is prepared using the middle strong acid such as orthophosphoric acid, glacial acetic acid and hydrogen peroxide combination
Red copper polishing fluid, polishing fluid stable components, using process is simple, any gas are not produced in polishing process, it is useless that polishing is produced
Liquid main component is the mantoquitas such as cupric phosphate, copper nitrate, and waste liquid is to environment non-hazardous.
Brief description of the drawings
The polishing fluid application method flow chart that Fig. 1 is provided for the present invention；
Fig. 2 is shape appearance figure of the red copper plate surface after partially polished under stereomicroscope；
Fig. 3 is shape appearance figure of the copper sheet surface after partially polished under stereomicroscope；
Fig. 4 is the graph of a relation of loss quality and polish temperature after copper plate sample and the polishing of copper sheet sample.
Specific embodiment
Embodiment 1：
The red copper polishing fluid that the present invention is provided, contains orthophosphoric acid, glacial acetic acid, nitric acid, hydrogen peroxide, absolute ethyl alcohol, urea
And water, orthophosphoric acid concentration is 1.30mol/L, and glacial acetic acid concentration is 0.68mol/L, and concentration of nitric acid is 0.67mol/L, hydrogen peroxide
Concentration is 9.34mol/L, and absolute ethyl alcohol concentration is 0.62mol/L, and urea concentration is 12g/L.
The present embodiment is polished to copper plate, copper sheet respectively, is comprised the following steps that：
1) beaker that will be equipped with red copper polishing fluid is placed in thermostat water bath, and water bath with thermostatic control pot temperature is 42 DEG C；
2) dried up after being cleaned to polished sample (copper plate, copper sheet) with absolute ethyl alcohol, deionized water successively；
3) polished sample is gripped with wooden tweezers, one end is immersed in red copper polishing fluid, and slowly rock.When surface is flat
After whole, the sample after polishing be placed in 10s is soaked in dust technology, then washed sample surfaces dust technology with deionized water
Remove, polishing is finished.
Fig. 2 be shape appearance figure of the red copper plate surface after partially polished under stereomicroscope, polishing area with do not polish
There is substantially boundary in region, and polishing area is brighter, smooth；It can be seen that copper plate polishing area reaches surface-brightening, it is smooth
Effect, polishing area without black hair mist or point corrosion.
Fig. 3 be shape appearance figure of the copper sheet surface after partially polished under stereomicroscope, polishing area with do not polish
There is substantially boundary in region, polishing area is more smooth, light；It can be seen that copper sheet polishing area reaches surface-brightening, smooth effect
Really, polishing area is without hair mist or the point corrosion of blacking.
Other polish temperatures are additionally used in polishing process, and chooses the copper plate and copper sheet sample of formed objects
Product, obtain the graph of a relation of loss quality and polish temperature after sample polishing as shown in Figure 4.Sample need to all be submerged during polishing
In polishing fluid, specific polishing step reference implementation example 1, polishing time is 30s.As seen from the figure, two samples are in different temperatures
Under be polished after, have Mass lost；And when polish temperature is 42 DEG C, mass loss is most.So determining optimal
Polish temperature is 42 DEG C.
The red copper polishing fluid that the present invention is provided, the waste liquid main component for not producing any gas, generation in polishing process is
The mantoquitas such as cupric phosphate, copper nitrate, waste liquid is to environment non-hazardous.It is water insoluble according to cupric phosphate, the characteristic of acid is dissolved in, adjust waste liquid
Ph values, cupric phosphate can also be reclaimed, used as organic reaction catalyst, emulsifying agent, fertilizer refers to metal surface antioxidant；And
Copper nitrate can also be recycled with nitrating agent useful in the mixture of acetic anhydride or organic synthesis, therefore waste liquid.
Claims (3)
1. a kind of red copper polishing fluid, contains orthophosphoric acid, glacial acetic acid, nitric acid, hydrogen peroxide, absolute ethyl alcohol, urea and water；Its feature
Be, orthophosphoric acid concentration be 1.29~1.34mol/L, glacial acetic acid concentration be 0.66~0.72mol/L, concentration of nitric acid be 0.67~
0.71mol/L, concentration of hydrogen peroxide is 9.32~9.45mol/L, and absolute ethyl alcohol concentration is 0.60~0.69mol/L, and urea is dense
It is 12g/L to spend.
2. the application method of red copper polishing fluid as claimed in claim 1, it is characterised in that comprise the following steps：
1) nonmetallic vessel that will fill red copper polishing fluid is placed in thermostat water bath, and water bath with thermostatic control pot temperature is 30~60 DEG C；
2) red copper surface of polishing will be needed to be immersed in polishing solution, red copper is rocked in polishing process, it is to avoid polishing product is attached
In red copper surface, be persistently polished to red copper surface smooth；
3) red copper after polishing is placed in after soaking 5~10s in dust technology and is washed red copper surface dust technology with deionized water
Remove.
3. the application method of red copper polishing fluid as claimed in claim 2, it is characterised in that：Step 1) in thermostat water bath temperature
Spend is 42 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611181135.8A CN106757043A (en) | 2016-12-20 | 2016-12-20 | A kind of red copper polishing fluid and its application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611181135.8A CN106757043A (en) | 2016-12-20 | 2016-12-20 | A kind of red copper polishing fluid and its application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106757043A true CN106757043A (en) | 2017-05-31 |
Family
ID=58891022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611181135.8A Pending CN106757043A (en) | 2016-12-20 | 2016-12-20 | A kind of red copper polishing fluid and its application method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106757043A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296887A (en) * | 2018-04-16 | 2018-07-20 | 佛山市捷亚塑料五金制品有限公司 | A kind of handware polishing process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101851470A (en) * | 2009-04-03 | 2010-10-06 | 比亚迪股份有限公司 | Chemical polishing liquid and polishing method |
| CN102747371A (en) * | 2012-07-17 | 2012-10-24 | 许泽波 | Chemical polish for copper and alloy surface treatment and preparation method thereof |
| CN103849876A (en) * | 2012-12-03 | 2014-06-11 | 浙江伟星实业发展股份有限公司 | Chemical polishing method |
| CN104651842A (en) * | 2014-04-28 | 2015-05-27 | 严振 | Chemical polishing method for copper and alloys thereof |
| CN104711577A (en) * | 2013-12-14 | 2015-06-17 | 三达奥克化学股份有限公司 | Copper and copper alloy workpiece chemical polishing working solution and production method thereof |
| CN106011866A (en) * | 2016-07-01 | 2016-10-12 | 百色学院 | Chemical polishing surface treatment method of copper tube workpiece |
-
2016
- 2016-12-20 CN CN201611181135.8A patent/CN106757043A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101851470A (en) * | 2009-04-03 | 2010-10-06 | 比亚迪股份有限公司 | Chemical polishing liquid and polishing method |
| CN102747371A (en) * | 2012-07-17 | 2012-10-24 | 许泽波 | Chemical polish for copper and alloy surface treatment and preparation method thereof |
| CN103849876A (en) * | 2012-12-03 | 2014-06-11 | 浙江伟星实业发展股份有限公司 | Chemical polishing method |
| CN104711577A (en) * | 2013-12-14 | 2015-06-17 | 三达奥克化学股份有限公司 | Copper and copper alloy workpiece chemical polishing working solution and production method thereof |
| CN104651842A (en) * | 2014-04-28 | 2015-05-27 | 严振 | Chemical polishing method for copper and alloys thereof |
| CN106011866A (en) * | 2016-07-01 | 2016-10-12 | 百色学院 | Chemical polishing surface treatment method of copper tube workpiece |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296887A (en) * | 2018-04-16 | 2018-07-20 | 佛山市捷亚塑料五金制品有限公司 | A kind of handware polishing process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104593793B (en) | A kind of aluminium and aluminum alloy surface pre-process neutralizer | |
| CN102260461B (en) | Smoke-free polishing treatment solution for high-gloss aluminum sectional material and use method thereof | |
| CN101935863B (en) | Aluminum alloy electrolytic polishing solution, preparation method and aluminum alloy electrolytic polishing method | |
| CN106283056A (en) | A kind of it is applicable to taking off plating solution and taking off electroplating method of the surface of the work coat of metal | |
| CN104762622A (en) | A treatment method for brightening surfaces of copper nickel alloy tubes | |
| CN102154638B (en) | Brass part blackening solution and preparation method and application thereof | |
| CN110158067A (en) | One Albatra metal purification process | |
| KR20090007081A (en) | Conductivity anodizing method | |
| CN108559985A (en) | A kind of copper and copper alloy bearing retainer surface cleaning activation methods | |
| CN102747351A (en) | Magnesium alloy black oxidation technique | |
| CN112519099B (en) | Surface treatment method for aluminum alloy before injection molding | |
| CN106757043A (en) | A kind of red copper polishing fluid and its application method | |
| CN105350005B (en) | A kind of compounding pickle containing passivator and preparation method thereof | |
| CN110093608B (en) | Surface polishing solution for additive manufacturing of aluminum alloy and application | |
| CN104032343A (en) | Novel electroplating pre-treatment technology for titanium and titanium alloy | |
| CN105088248A (en) | Oxidative corrosion resistance treatment method for copper-based part | |
| CN104313533A (en) | Ultrasonic frequency induction heating technology based quick hot-dipping aluminizing technology | |
| CN107267970A (en) | A kind of steelwork aqueous, environmental protective antirust agent and its preparation method and application | |
| CN103266326A (en) | Wire rope pickling method | |
| CN102851662B (en) | Metal anti-rust treatment liquid and application method thereof | |
| CN103397322B (en) | Stainless steel Blackening Oxidation | |
| CN105603502A (en) | Degreasing method of metal plate surface | |
| CN102747354B (en) | Magnesium alloy black oxidation liquid | |
| CN110205618B (en) | Method for preparing high-hardness film layer on surface of magnesium alloy in short process | |
| CN110484921A (en) | Decoating liquid and the method for stripping titanium-containing film using the decoating liquid |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170531 |