CN106750454A - A kind of insulation one-way heat conduction polyimide film high and preparation method thereof - Google Patents

A kind of insulation one-way heat conduction polyimide film high and preparation method thereof Download PDF

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Publication number
CN106750454A
CN106750454A CN201611084297.XA CN201611084297A CN106750454A CN 106750454 A CN106750454 A CN 106750454A CN 201611084297 A CN201611084297 A CN 201611084297A CN 106750454 A CN106750454 A CN 106750454A
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polyimides
heat
heat conduction
coating
insulation
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蒋国辉
苏冠贤
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Dongguan Corehelm Electronic Material Technology Co Ltd
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Dongguan Corehelm Electronic Material Technology Co Ltd
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Abstract

The invention discloses a kind of insulation one-way heat conduction polyimide film high and preparation method thereof, the polyimide film is double-decker and including polyimides is heat-insulated, heat-conducting layer, thermal insulation layer is formed by the solidification of polyimides insulating moulding coating, and polyimides insulating moulding coating includes following weight portion material：Polyimide resin 6% 20%, solvent 30% 85%, thermal insulating filling 10% 60%；Heat-conducting layer is formed by the solidification of polyimides heat-conductive coating, and heat-conductive coating includes following weight portion material：Polyimide resin 6% 20%, solvent 30% 85%, heat filling 10% 60%；The film has insulation one-way heat conduction characteristic high and can make flexible heating film base material, to improve energy-saving effect.The preparation method is comprised the following steps：It is prepared by a, insulating moulding coating；B, in glass baseplate surface be coated with insulating moulding coating；C, low-temperature setting；D, prepare heat-conductive coating；E, heat-conductive coating is coated into thermal insulation layer；F, low-temperature setting are obtaining heat-conducting layer.

Description

A kind of insulation one-way heat conduction polyimide film high and preparation method thereof
Technical field
The present invention relates to polyimides technical field of membrane, more particularly to a kind of insulation one-way heat conduction polyimide film high and its Preparation method.
Background technology
Polyimides because with excellent heat resistance, mechanical characteristic, electrical insulating property, and with soft characteristic, and extensive Substrate as FPC, flexible heating film and solar cell etc..
Wherein, flexible heating film such as can significantly improve heating film energy-conservation as heating warm-keeping product with unidirectional heat generation characteristic Performance, the current polyimide film about unidirectional heat-transfer character has no report.
The content of the invention
The purpose of the present invention is to solve the shortcomings of the prior art and a kind of high insulation one-way heat conduction polyimide film is provided, Height insulation one-way heat conduction polyimide film has insulation one-way heat conduction characteristic high, can be effectively adapted to flexible heating film, Improve the energy-efficient performance of flexible heating film.
Another object of the present invention is to provide a kind of preparation method of insulation one-way heat conduction polyimide film high, the preparation Method can effectively be produced and prepare above-mentioned insulation one-way heat conduction polyimide film high.
To reach above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of insulation one-way heat conduction polyimide film high, includes stacking compound polyimides thermal insulation layer, polyimides Heat-conducting layer, polyimides thermal insulation layer is formed by the solidification of polyimides insulating moulding coating, and polyimides insulation thickness is 6 μm of -125 μ M, polyimides heat-conducting layer is formed by the solidification of polyimides heat-conductive coating, and polyimides heat-conducting layer thickness is 6 μm -125 μm；
Polyimides insulating moulding coating includes the material of following weight portion, specially：
Polyimide resin 6%-20%
Solvent 30%-85%
Thermal insulating filling 10%-60%；
Polyimides heat-conductive coating includes the material of following weight portion, specially：
Polyimide resin 6%-20%
Solvent 30%-85%
Heat filling 10%-60%.
Wherein, the thermal insulating filling is the one kind or at least two in hollow glass microbead, ceramic fine bead or floating bead The mixture for being constituted.
Wherein, the particle size values of the thermal insulating filling are 0.1 μm -5 μm.
Wherein, the heat filling is Al2O3, MgO, BeO, ZnO, CaO, AlN, BN, SiC or B4C3In one kind or The mixture that person at least two is constituted.
Wherein, the particle size values of the heat filling are 0.1 μm -5 μm.
Wherein, the heat filling is in spherical, sheet or bar-shaped.
Wherein, the solvent that the polyimides insulating moulding coating is used is dimethylacetylamide DMAC or crassitude Ketone NMP, the solvent that the polyimides heat-conductive coating is used is dimethylacetylamide DMAC or methyl pyrrolidone NMP.
A kind of preparation method of insulation one-way heat conduction polyimide film high, includes following processing step, specially：
A, polyimide resin, solvent, thermal insulating filling are sequentially added dispersion is stirred into dispersion machine, the rotating speed of dispersion machine It is point a 200 r/min -2000r/min, the h -10h of jitter time 1, to obtain polyimides insulating moulding coating；Wherein, solvent is Dimethylacetylamide DMAC or methyl pyrrolidone NMP, in thermal insulating filling in hollow glass micropearl, ceramic fine bead or floating bead A kind of or at least two mixtures for being constituted, polyimide resin, solvent, thermal insulating filling in polyimides insulating moulding coating The weight portion of three kinds of materials is followed successively by：6%-20%、30%-85%、10%-60%；
B, polyimides insulating moulding coating is spread evenly across glass baseplate surface；
C, the polyimides insulating moulding coating of the glass substrate film-forming under the cryogenic conditions less than 150 DEG C is coated, then taken off Glass substrate is removed, to obtain the polyimides thermal insulation layer with heat-insulating properties；
D, polyimide resin, solvent, heat filling are sequentially added dispersion is stirred into dispersion machine, the rotating speed of dispersion machine It is point a 200 r/min -2000r/min, the h -10h of jitter time 1, to obtain polyimides heat-conductive coating；Wherein, solvent is Dimethylacetylamide DMAC or methyl pyrrolidone NMP, heat filling is Al2O3、MgO、BeO、ZnO、CaO、AlN、BN、SiC Or B4C3In a kind of or at least two mixtures for being constituted, it is polyimide resin in polyimides heat-conductive coating, molten Agent, the weight portion of three kinds of materials of heat filling are followed successively by：6%-20%、30%-85%、10%-60%；
E, the surface that polyimides heat-conductive coating is spread evenly across polyimides thermal insulation layer by roll coating model；
F, the polyimides heat-conductive coating for coating polyimides thermal insulation layer surface are solidified under less than 150 DEG C of cryogenic conditions Film, to obtain the polyimides heat-conducting layer with thermal conductive property, polyimides thermal insulation layer is combined with polyimides heat conduction layer stackup In together, height insulation one-way heat conduction polyimides film preparation is completed.
Wherein, in the step a, the polyimides insulating moulding coating for being dispersed through being obtained after machine dispersed with stirring need to pass through DMAC or NMP regulation viscosity, and deaeration treatment is carried out by deaeration machine；In the step d, after being dispersed through machine dispersed with stirring And the polyimides heat-conductive coating for obtaining need to adjust viscosity by DMAC or NMP, and deaeration treatment is carried out by deaeration machine.
Wherein, the thickness of the polyimides thermal insulation layer is 6 μm -125 μm, and the thickness of the polyimides heat-conducting layer is 6 μm -125 μm, the thermal conductivity factor of polyimide film thermal insulation layer is less than 0.1w/m.k, and the thermal conductivity factor of polyimide film heat-conducting layer is big In 5w/m.k, polyimides thermal insulation layer is more than 5kv with polyimides heat conduction layer stackup composite membrane proof voltage.
Beneficial effects of the present invention are：A kind of insulation one-way heat conduction polyimide film high of the present invention, it is included Stacking compound polyimides thermal insulation layer, polyimides heat-conducting layer, polyimides thermal insulation layer are solidified by polyimides insulating moulding coating Form, polyimides heat-conducting layer is formed by the solidification of polyimides heat-conductive coating, polyimides thermal insulation layer, polyimides heat conduction thickness Degree is respectively 6 μm -125 μm, and polyimides insulating moulding coating includes the material of following weight portion：It is polyimide resin 6%-20%, molten Agent 30%-85%, thermal insulating filling 10%-60%；Polyimides heat-conductive coating includes the material of following weight portion：Polyimide resin 6%-20%, solvent 30%-85%, heat filling 10%-60%.Designed by said structure and material proportion, it is of the invention high absolutely Edge one-way heat conduction polyimide film has insulation one-way heat conduction characteristic high, i.e., can be effectively adapted to flexible heating film, improves Flexible heating film energy-efficient performance.
It is of the invention another to have the beneficial effect that：A kind of preparation of insulation one-way heat conduction polyimide film high of the present invention Method, it includes following processing step, specially：A, polyimide resin, solvent, thermal insulating filling are sequentially added to dispersion Dispersion is stirred in machine, the rotating speed of dispersion machine is point 200 r/min -2000r/min, the h -10h of jitter time 1, to obtain Polyimides insulating moulding coating；Wherein, solvent is dimethylacetylamide DMAC or methyl pyrrolidone NMP, during thermal insulating filling is A kind of or at least two mixtures for being constituted in empty glass microballoon, ceramic fine bead or floating bead, the heat-insulated painting of polyimides Polyimide resin, solvent, the weight portion of three kinds of materials of thermal insulating filling are followed successively by material：6%-20%、30%-85%、10%-60%； B, polyimides insulating moulding coating is spread evenly across glass baseplate surface；C, the polyimides insulating moulding coating for coating glass substrate The film-forming under less than 150 DEG C of cryogenic conditions, then sloughs glass substrate, with obtain with heat-insulating properties polyimides every Thermosphere；D, polyimide resin, solvent, heat filling are sequentially added dispersion is stirred into dispersion machine, dispersion machine turns Speed is point a 200 r/min -2000r/min, the h -10h of jitter time 1, to obtain polyimides heat-conductive coating；Wherein, solvent It is dimethylacetylamide DMAC or methyl pyrrolidone NMP, heat filling is Al2O3、MgO、BeO、ZnO、CaO、AlN、BN、 SiC or B4C3In a kind of or at least two mixtures for being constituted, polyimide resin in polyimides heat-conductive coating, Solvent, the weight portion of three kinds of materials of heat filling are followed successively by：6%-20%、30%-85%、10%-60%；E, will be poly- by roll coating model Acid imide heat-conductive coating is spread evenly across the surface of polyimides thermal insulation layer；F, the polyamides for coating polyimides thermal insulation layer surface Imines heat-conductive coating film-forming under less than 150 DEG C of cryogenic conditions, to obtain the polyimides heat-conducting layer with thermal conductive property, Together with polyimides thermal insulation layer is compound in polyimides heat conduction layer stackup, height insulation one-way heat conduction polyimides film preparation is complete Into.Designed by above-mentioned processing step, preparation method of the invention can effectively be produced and prepare above-mentioned insulation one-way heat conduction high Polyimide film.
Specific embodiment
With reference to specific embodiment, the present invention will be described.
Embodiment one, a kind of high insulation one-way heat conduction polyimide film, include the compound polyimides thermal insulation layer of stacking, Polyimides heat-conducting layer, polyimides thermal insulation layer is formed by the solidification of polyimides insulating moulding coating, and insulation thickness is 6 μm of -125 μ M, polyimides heat-conducting layer is formed by the solidification of polyimides heat-conductive coating, and heat-conducting layer thickness is 6 μm -125 μm；
Polyimides insulating moulding coating includes the material of following weight portion, specially：
Polyimide resin 8%
Dimethylacetylamide DMAC 35%
Hollow glass microbead（100nm） 57%；
Polyimides heat-conductive coating includes the material of following weight portion, specially：
Polyimide resin 10%
Dimethylacetylamide DMAC 40%
AlN（500nm） 50%.
Designed by said structure and material proportion, the thermal conductivity factor of polyimides thermal insulation layer is less than 0.1w/m.k, gathers The thermal conductivity factor of acid imide heat-conducting layer is more than 5w/m.k, and more than proof voltage 5kv；So, the insulation high of the present embodiment one is unidirectional Heat conduction polyimide film has insulation one-way heat conduction characteristic high, i.e., can be effectively adapted to flexible heating film.
It should further be noted that the insulation one-way heat conduction polyimide film high of the present embodiment one can use following preparation method It is prepared from, specifically, a kind of preparation method of insulation one-way heat conduction polyimide film high, it includes following processing step, Specially：
A, polyimide resin, dimethylacetylamide DMAC, hollow glass microbead are sequentially added and be stirred into dispersion machine Dispersion, the rotating speed of dispersion machine is set to 1000r/min, and jitter time is set to 5h, to obtain polyimides insulating moulding coating；Wherein, gather In acid imide insulating moulding coating polyimide resin, dimethylacetylamide DMAC, three kinds of weight portions of material of hollow glass microbead according to It is secondary to be：8%、35%、57%；
B, polyimides insulating moulding coating is spread evenly across glass baseplate surface；
C, the polyimides insulating moulding coating of the glass substrate film-forming under the conditions of 150 DEG C is coated, then sloughs glass substrate, To obtain the polyimides thermal insulation layer with heat-insulating properties；
D, polyimide resin, dimethylacetylamide DMAC, AlN are sequentially added dispersion is stirred into dispersion machine, disperseed Machine turns to be set to 1000r/min, and jitter time is set to 5h, to obtain polyimides heat-conductive coating；Wherein, polyimides heat-conductive coating Middle polyimide resin, the weight portion of tri- kinds of materials of dimethylacetylamide DMAC, AlN are followed successively by：10%、40%、50%；
E, the surface that polyimides heat-conductive coating is spread evenly across polyimides thermal insulation layer by roll coating model；
F, the polyimides heat-conductive coating of the polyimides thermal insulation layer surface film-forming under the conditions of 150 DEG C is coated, to obtain Polyimides heat-conducting layer with thermal conductive property is high together with polyimides thermal insulation layer is compound in polyimides heat conduction layer stackup The film preparation of insulation one-way heat conduction polyimides is completed.
Wherein, in the step a, the polyimides insulating moulding coating for being dispersed through being obtained after machine dispersed with stirring need to pass through DMAC or NMP regulation viscosity, and deaeration treatment is carried out by deaeration machine；In the step d, after being dispersed through machine dispersed with stirring And the polyimides heat-conductive coating for obtaining need to adjust viscosity by DMAC or NMP, and deaeration treatment is carried out by deaeration machine.
Embodiment two, plants insulation one-way heat conduction polyimide film high, includes the compound polyimides thermal insulation layer of stacking, polyamides sub- Amine heat-conducting layer, polyimides thermal insulation layer is formed by the solidification of polyimides insulating moulding coating, and insulation thickness is 6 μm -125 μm, polyamides Imines heat-conducting layer is formed by the solidification of polyimides heat-conductive coating, and heat-conducting layer thickness is 6 μm -125 μm；
Polyimides thermal insulation layer includes the material of following weight portion, specially：
Polyimide resin 12%
Dimethylacetylamide DMAC 30%
Hollow glass microbead（200nm） 58%；
Polyimides heat-conducting layer includes the material of following weight portion, specially：
Polyimide resin 10%
Dimethylacetylamide DMAC 40%
AlN（500nm） 50%.
Designed by said structure and material proportion, the thermal conductivity factor of polyimides thermal insulation layer is less than 0.1w/m.k, gathers The thermal conductivity factor of acid imide heat-conducting layer is more than 5w/m.k, and more than proof voltage 5kv；So, the insulation high of the present embodiment one is unidirectional Heat conduction polyimide film has insulation one-way heat conduction characteristic high, i.e., can be effectively adapted to flexible heating film.
It should further be noted that the insulation one-way heat conduction polyimide film high of the present embodiment two can use following preparation method It is prepared from, specifically, a kind of preparation method of insulation one-way heat conduction polyimide film high, it includes following processing step, Specially：
A, polyimide resin, dimethylacetylamide DMAC, hollow glass microbead are sequentially added and be stirred into dispersion machine Dispersion, the rotating speed of dispersion machine is set to 1000r/min, and jitter time is set to 5h, to obtain polyimides insulating moulding coating；Wherein, gather In acid imide insulating moulding coating polyimide resin, dimethylacetylamide DMAC, three kinds of weight portions of material of hollow glass microbead according to It is secondary to be：12%、30%、58%；
B, polyimides insulating moulding coating is spread evenly across glass baseplate surface；
C, the polyimides insulating moulding coating of the glass substrate film-forming under the conditions of 120 DEG C is coated, then sloughs glass substrate, To obtain the polyimides thermal insulation layer with heat-insulating properties；
D, polyimide resin, dimethylacetylamide DMAC, AlN are sequentially added dispersion is stirred into dispersion machine, disperseed Machine turns to be set to 1000r/min, and jitter time is set to 5h, to obtain polyimides heat-conductive coating；Wherein, polyimides heat-conductive coating Middle polyimide resin, the weight portion of tri- kinds of materials of dimethylacetylamide DMAC, AlN are followed successively by：10%、40%、50%；
E, the surface that polyimides heat-conductive coating is spread evenly across polyimides thermal insulation layer by roll coating model；
F, the polyimides heat-conductive coating of the polyimides thermal insulation layer surface film-forming under the conditions of 120 DEG C is coated, to obtain Polyimides heat-conducting layer with thermal conductive property is high together with polyimides thermal insulation layer is compound in polyimides heat conduction layer stackup The film preparation of insulation one-way heat conduction polyimides is completed.
Wherein, in the step a, the polyimides insulating moulding coating for being dispersed through being obtained after machine dispersed with stirring need to pass through DMAC or NMP regulation viscosity, and deaeration treatment is carried out by deaeration machine；In the step d, after being dispersed through machine dispersed with stirring And the polyimides heat-conductive coating for obtaining need to adjust viscosity by DMAC or NMP, and deaeration treatment is carried out by deaeration machine.
Embodiment three, plants insulation one-way heat conduction polyimide film high, includes the compound polyimides thermal insulation layer of stacking, polyamides sub- Amine heat-conducting layer, polyimides thermal insulation layer is formed by the solidification of polyimides insulating moulding coating, and insulation thickness is 6 μm -125 μm, polyamides Imines heat-conducting layer is formed by the solidification of polyimides heat-conductive coating, and heat-conducting layer thickness is 6 μm -125 μm；
Polyimides thermal insulation layer includes the material of following weight portion, specially：
Polyimide resin 10%
Dimethylacetylamide DMAC 35%
Ceramic fine bead 55%；
Polyimides heat-conducting layer includes the material of following weight portion, specially：
Polyimide resin 8%
Dimethylacetylamide DMAC 40%
SiC（Particle diameter is 500nm） 32%
BN（Particle diameter is 200nm） 20%.
Designed by said structure and material proportion, the thermal conductivity factor of polyimides thermal insulation layer<0.1w/m.k, polyamides is sub- The thermal conductivity factor of amine heat-conducting layer>5w/m.k, and more than proof voltage 5kv；So, the insulation one-way heat conduction polyamides high of the present embodiment one Imines film has insulation one-way heat conduction characteristic high, i.e., can be effectively adapted to flexible heating film.
It should further be noted that the insulation one-way heat conduction polyimide film high of the present embodiment three can use following preparation method It is prepared from, specifically, a kind of preparation method of insulation one-way heat conduction polyimide film high, it includes following processing step, Specially：
A, polyimide resin, dimethylacetylamide DMAC, hollow glass microbead are sequentially added and be stirred into dispersion machine Dispersion, the rotating speed of dispersion machine is set to 1000r/min, and jitter time is set to 5h, to obtain polyimides insulating moulding coating；Wherein, gather Polyimide resin, dimethylacetylamide DMAC, the weight portion of three kinds of materials of ceramic fine bead are followed successively by acid imide insulating moulding coating： 10%、35%、55%；
B, polyimides insulating moulding coating is spread evenly across glass baseplate surface；
C, the polyimides insulating moulding coating of the glass substrate film-forming under the conditions of 120 DEG C is coated, then sloughs glass substrate, To obtain the polyimides thermal insulation layer with heat-insulating properties；
D, polyimide resin, dimethylacetylamide DMAC, AlN are sequentially added dispersion is stirred into dispersion machine, disperseed Machine turns to be set to 1000r/min, and jitter time is set to 5h, to obtain polyimides heat-conductive coating；Wherein, polyimides heat-conductive coating Middle polyimide resin, the weight portion of tri- kinds of materials of dimethylacetylamide DMAC, SiC, BN are followed successively by：8%、40%、32%、20%；
E, the surface that polyimides heat-conductive coating is spread evenly across polyimides thermal insulation layer by roll coating model；
F, the polyimides heat-conductive coating of the polyimides thermal insulation layer surface film-forming under the conditions of 120 DEG C is coated, to obtain Polyimides heat-conducting layer with thermal conductive property is high together with polyimides thermal insulation layer is compound in polyimides heat conduction layer stackup The film preparation of insulation one-way heat conduction polyimides is completed.
Wherein, in the step a, the polyimides insulating moulding coating for being dispersed through being obtained after machine dispersed with stirring need to pass through DMAC or NMP regulation viscosity, and deaeration treatment is carried out by deaeration machine；In the step d, after being dispersed through machine dispersed with stirring And the polyimides heat-conductive coating for obtaining need to adjust viscosity by DMAC or NMP, and deaeration treatment is carried out by deaeration machine.
Example IV, plants insulation one-way heat conduction polyimide film high, includes the compound polyimides thermal insulation layer of stacking, polyamides sub- Amine heat-conducting layer, polyimides thermal insulation layer is formed by the solidification of polyimides insulating moulding coating, and insulation thickness is 6 μm -125 μm, polyamides Imines heat-conducting layer is formed by the solidification of polyimides heat-conductive coating, and heat-conducting layer thickness is 6 μm -125 μm；
Polyimides thermal insulation layer includes the material of following weight portion, specially：
Polyimide resin 10%
Dimethylacetylamide DMAC 35%
Ceramic fine bead 25%
Hollow glass microbead 15%
Floating bead 15%；
Polyimides heat-conducting layer includes the material of following weight portion, specially：
Polyimide resin 8%
Dimethylacetylamide DMAC 40%
SiC（Particle diameter is 500nm） 20%
BN（Particle diameter is 200nm） 20%
Al2O3（Particle diameter is 300nm） 12%.
Designed by said structure and material proportion, the thermal conductivity factor of polyimides thermal insulation layer is less than 0.1w/m.k, gathers The thermal conductivity factor of acid imide heat-conducting layer is more than 5w/m.k, and more than proof voltage 5kv；So, the insulation high of the present embodiment four is unidirectional Heat conduction polyimide film has insulation one-way heat conduction characteristic high, i.e., can be effectively adapted to flexible heating film.
It should further be noted that the insulation one-way heat conduction polyimide film high of the present embodiment four can use following preparation method It is prepared from, specifically, a kind of preparation method of insulation one-way heat conduction polyimide film high, it includes following processing step, Specially：
A, by polyimide resin, dimethylacetylamide DMAC, ceramic fine bead, hollow glass microbead, floating bead sequentially add to point Dispersion is stirred in powder, the rotating speed of dispersant sets a point 1000r/min, and jitter time is set to 8h, with obtain polyimides every Hot coating；Wherein, polyimide resin, dimethylacetylamide DMAC, ceramic fine bead, double glazing in polyimides insulating moulding coating Microballon, the weight portion of five kinds of materials of floating bead are followed successively by：10%、35%、25%、15%、15%；
B, polyimides insulating moulding coating is spread evenly across glass baseplate surface；
C, the polyimides insulating moulding coating of the glass substrate film-forming under the conditions of 150 DEG C is coated, then sloughs glass substrate, To obtain the polyimides thermal insulation layer with heat-insulating properties；
D, by polyimide resin, dimethylacetylamide DMAC, SiC, BN, Al2O3Sequentially add and be stirred into dispersant Dispersion, the rotating speed of dispersant is set to 1000r/min, and jitter time is set to 8h, to obtain polyimides heat-conductive coating；Wherein, gather Polyimide resin, dimethylacetylamide DMAC, SiC, BN, Al in acid imide heat-conductive coating2O3Five kinds of weight portions of material are successively For：8%、40%、20%、20%、12%；
E, the surface that polyimides heat-conductive coating is spread evenly across polyimides thermal insulation layer by roller applications；
F, the polyimides heat-conductive coating of the polyimides thermal insulation layer surface film-forming under the conditions of 150 DEG C is coated, to obtain Polyimides heat-conducting layer with thermal conductive property is high together with polyimides thermal insulation layer is compound in polyimides heat conduction layer stackup The film preparation of insulation one-way heat conduction polyimides is completed.
Wherein, in the step a, the polyimides insulating moulding coating for being dispersed through being obtained after machine dispersed with stirring need to pass through DMAC or NMP regulation viscosity, and deaeration treatment is carried out by deaeration machine；In the step d, after being dispersed through machine dispersed with stirring And the polyimides heat-conductive coating for obtaining need to adjust viscosity by DMAC or NMP, and deaeration treatment is carried out by deaeration machine.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to of the invention Thought, will change in specific embodiments and applications, and this specification content should not be construed as to the present invention Limitation.

Claims (10)

1. a kind of high insulation one-way heat conduction polyimide film, it is characterised in that：Include the compound polyimides thermal insulation layer of stacking, Polyimides heat-conducting layer, polyimides thermal insulation layer is formed by the solidification of polyimides insulating moulding coating, and polyimides insulation thickness is 6 μm -125 μm, polyimides heat-conducting layer is formed by the solidification of polyimides heat-conductive coating, and polyimides heat-conducting layer thickness is 6 μm - 125μm；
Polyimides insulating moulding coating includes the material of following weight portion, specially：
Polyimide resin 6%-20%
Solvent 30%-85%
Thermal insulating filling 10%-60%；
Polyimides heat-conductive coating includes the material of following weight portion, specially：
Polyimide resin 6%-20%
Solvent 30%-85%
Heat filling 10%-60%.
2. a kind of high insulation one-way heat conduction polyimide film according to claim 1, it is characterised in that：The thermal insulating filling A kind of or at least two mixtures for constituting in by hollow glass microbead, ceramic fine bead or floating bead.
3. one kind insulation one-way heat conduction polyimide film high according to claims 1 or 2, it is characterised in that：It is described every The particle size values of hot filler are 0.1 μm -5 μm.
4. a kind of high insulation one-way heat conduction polyimide film according to claim 1, it is characterised in that：The heat filling It is Al2O3, MgO, BeO, ZnO, CaO, AlN, BN, SiC or B4C3In a kind of or at least two mixtures for being constituted.
5. one kind insulation one-way heat conduction polyimide film high according to claim 1 or 4, it is characterised in that：It is described to lead The particle size values of hot filler are 0.1 μm -5 μm.
6. one kind insulation one-way heat conduction polyimide film high according to claim 1 or 4, it is characterised in that：It is described to lead Hot filler is in spherical, sheet or bar-shaped.
7. a kind of high insulation one-way heat conduction polyimide film according to claim 1, it is characterised in that：The polyimides The solvent that insulating moulding coating is used is dimethylacetylamide DMAC or methyl pyrrolidone NMP, and the polyimides heat conduction is applied The used solvent of material is dimethylacetylamide DMAC or methyl pyrrolidone NMP.
8. it is a kind of it is high insulation one-way heat conduction polyimide film preparation method, it is characterised in that include following processing step, have Body is：
A, polyimide resin, solvent, thermal insulating filling are added to successively be stirred dispersion in dispersion machine, the rotating speed of dispersion machine is Divide 200 r/min -2000r/min, the h -10h of jitter time 1, to obtain polyimides insulating moulding coating；Wherein, solvent is two Methylacetamide DMAC or methyl pyrrolidone NMP, thermal insulating filling is in hollow glass micropearl, ceramic fine bead or floating bead A kind of or at least two mixtures for being constituted, polyimide resin, solvent, thermal insulating filling three in polyimides insulating moulding coating The weight portion for planting material is followed successively by：6%-20%、30%-85%、10%-60%；
B, polyimides insulating moulding coating is spread evenly across glass baseplate surface；
C, the polyimides insulating moulding coating of the glass substrate film-forming under the cryogenic conditions less than 150 DEG C is coated, then taken off Glass substrate is removed, to obtain the polyimides thermal insulation layer with heat-insulating properties；
D, polyimide resin, solvent, heat filling are added to successively be stirred dispersion in dispersion machine, the rotating speed of dispersion machine is Divide 200 r/min -2000r/min, the h -10h of jitter time 1, to obtain polyimides heat-conductive coating；Wherein, solvent is two Methylacetamide DMAC or methyl pyrrolidone NMP, heat filling is Al2O3, MgO, BeO, ZnO, CaO, AlN, BN, SiC or Person B4C3In a kind of or at least two mixtures for being constituted, polyimide resin in polyimides heat-conductive coating, solvent, The weight portion of three kinds of materials of heat filling is followed successively by：6%-20%、30%-85%、10%-60%；
E, the surface that polyimides heat-conductive coating is spread evenly across polyimides thermal insulation layer by roll coating model；
F, the polyimides heat-conductive coating for coating polyimides thermal insulation layer surface are solidified under less than 150 DEG C of cryogenic conditions Film, to obtain the polyimides heat-conducting layer with thermal conductive property, polyimides thermal insulation layer is combined with polyimides heat conduction layer stackup In together, height insulation one-way heat conduction polyimides film preparation is completed.
9. it is according to claim 8 it is a kind of it is high insulation one-way heat conduction polyimide film preparation method, it is characterised in that：In In the step a, the polyimides insulating moulding coating for being dispersed through being obtained after machine dispersed with stirring need to adjust viscous by DMAC or NMP Degree, and deaeration treatment is carried out by deaeration machine；In the step d, the polyimides obtained after machine dispersed with stirring is dispersed through Heat-conductive coating need to adjust viscosity by DMAC or NMP, and carry out deaeration treatment by deaeration machine.
10. a kind of high insulation one-way heat conduction polyimide film Preparation Method according to claim 8, it is characterised in that：It is described The thickness of polyimides thermal insulation layer is 6 μm -125 μm, and the thickness of the polyimides heat-conducting layer is 6 μm -125 μm, and polyamides is sub- The thermal conductivity factor of amine film thermal insulation layer is less than 0.1w/m.k, and the thermal conductivity factor of polyimide film heat-conducting layer is more than 5w/m.k.
CN201611084297.XA 2016-11-30 2016-11-30 A kind of insulation one-way heat conduction polyimide film high and preparation method thereof Pending CN106750454A (en)

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CN108825078A (en) * 2018-06-13 2018-11-16 浙江西溪玻璃有限公司 Light-adjusting heat-insulating glass substrate and preparation process thereof
CN108859328A (en) * 2018-06-13 2018-11-23 浙江西溪玻璃有限公司 A kind of insulation system window substrate glass and its preparation process
CN109972398A (en) * 2019-04-16 2019-07-05 清华大学 A kind of high thermal conductivity flexible-epoxy insulating materials and the preparation method and application thereof
CN110626030A (en) * 2019-09-25 2019-12-31 桂林电子科技大学 High-thermal-conductivity polyimide multilayer composite film and preparation method thereof
CN112659695A (en) * 2020-12-21 2021-04-16 四川东材科技集团股份有限公司 High-thermal-conductivity polyaramide fiber paper polyimide film soft composite material and preparation method and application thereof
WO2021206775A1 (en) * 2020-04-09 2021-10-14 Hewlett-Packard Development Company Substrate coated with a thermal management material
CN113912883A (en) * 2021-10-27 2022-01-11 广东安利华新材料科技有限公司 Moisture-proof heat-conducting insulating film and preparation method thereof
CN116444838A (en) * 2023-04-24 2023-07-18 江苏汉华热管理科技有限公司 Voltage-resistant high-thermal-conductivity-coefficient organic silicon heat dissipation diaphragm and preparation method thereof

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Publication number Priority date Publication date Assignee Title
CN108825078A (en) * 2018-06-13 2018-11-16 浙江西溪玻璃有限公司 Light-adjusting heat-insulating glass substrate and preparation process thereof
CN108859328A (en) * 2018-06-13 2018-11-23 浙江西溪玻璃有限公司 A kind of insulation system window substrate glass and its preparation process
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CN109972398A (en) * 2019-04-16 2019-07-05 清华大学 A kind of high thermal conductivity flexible-epoxy insulating materials and the preparation method and application thereof
CN110626030A (en) * 2019-09-25 2019-12-31 桂林电子科技大学 High-thermal-conductivity polyimide multilayer composite film and preparation method thereof
WO2021206775A1 (en) * 2020-04-09 2021-10-14 Hewlett-Packard Development Company Substrate coated with a thermal management material
CN112659695A (en) * 2020-12-21 2021-04-16 四川东材科技集团股份有限公司 High-thermal-conductivity polyaramide fiber paper polyimide film soft composite material and preparation method and application thereof
CN113912883A (en) * 2021-10-27 2022-01-11 广东安利华新材料科技有限公司 Moisture-proof heat-conducting insulating film and preparation method thereof
CN113912883B (en) * 2021-10-27 2024-02-13 广东安利华新材料科技有限公司 Moisture-proof heat-conducting insulating film and preparation method thereof
CN116444838A (en) * 2023-04-24 2023-07-18 江苏汉华热管理科技有限公司 Voltage-resistant high-thermal-conductivity-coefficient organic silicon heat dissipation diaphragm and preparation method thereof
CN116444838B (en) * 2023-04-24 2023-12-01 江苏汉华热管理科技有限公司 Voltage-resistant high-thermal-conductivity-coefficient organic silicon heat dissipation diaphragm and preparation method thereof

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