CN106750438A - A kind of water/oxygen barrier polymer based composites and its preparation method and application - Google Patents
A kind of water/oxygen barrier polymer based composites and its preparation method and application Download PDFInfo
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- CN106750438A CN106750438A CN201710083615.9A CN201710083615A CN106750438A CN 106750438 A CN106750438 A CN 106750438A CN 201710083615 A CN201710083615 A CN 201710083615A CN 106750438 A CN106750438 A CN 106750438A
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- water
- polymer
- oxygen barrier
- based composite
- inorganic layered
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 130
- 230000004888 barrier function Effects 0.000 title claims abstract description 106
- 229920000642 polymer Polymers 0.000 title claims abstract description 106
- 239000001301 oxygen Substances 0.000 title claims abstract description 93
- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 93
- 239000002131 composite material Substances 0.000 title claims abstract description 72
- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 title claims abstract 23
- 239000000945 filler Substances 0.000 claims abstract description 36
- 230000002687 intercalation Effects 0.000 claims abstract description 28
- 238000009830 intercalation Methods 0.000 claims abstract description 28
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 16
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000003607 modifier Substances 0.000 claims abstract description 8
- 229920000620 organic polymer Polymers 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 87
- 239000000463 material Substances 0.000 claims description 75
- 239000000178 monomer Substances 0.000 claims description 72
- 238000003756 stirring Methods 0.000 claims description 58
- 150000004985 diamines Chemical class 0.000 claims description 46
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 33
- 239000002344 surface layer Substances 0.000 claims description 30
- 239000002245 particle Substances 0.000 claims description 18
- 239000000725 suspension Substances 0.000 claims description 18
- 229920001721 polyimide Polymers 0.000 claims description 17
- 239000004642 Polyimide Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000002244 precipitate Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 238000006116 polymerization reaction Methods 0.000 claims description 11
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 9
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 claims description 7
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- -1 octadecyl trimethyl ammonium bromide Ammonium chloride Chemical compound 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 5
- 150000001408 amides Chemical class 0.000 abstract 1
- 239000010408 film Substances 0.000 description 105
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 70
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical group O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 46
- 229910052901 montmorillonite Inorganic materials 0.000 description 40
- 239000000243 solution Substances 0.000 description 32
- 230000005540 biological transmission Effects 0.000 description 23
- 239000002904 solvent Substances 0.000 description 22
- SXGMVGOVILIERA-UHFFFAOYSA-N (2R,3S)-2,3-diaminobutanoic acid Natural products CC(N)C(N)C(O)=O SXGMVGOVILIERA-UHFFFAOYSA-N 0.000 description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 14
- 239000011521 glass Substances 0.000 description 14
- 229910021642 ultra pure water Inorganic materials 0.000 description 14
- 239000012498 ultrapure water Substances 0.000 description 14
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- YDYSEBSNAKCEQU-UHFFFAOYSA-N 2,3-diamino-n-phenylbenzamide Chemical compound NC1=CC=CC(C(=O)NC=2C=CC=CC=2)=C1N YDYSEBSNAKCEQU-UHFFFAOYSA-N 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 238000010992 reflux Methods 0.000 description 7
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 238000010907 mechanical stirring Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- RLGQACBPNDBWTB-UHFFFAOYSA-N cetyltrimethylammonium ion Chemical compound CCCCCCCCCCCCCCCC[N+](C)(C)C RLGQACBPNDBWTB-UHFFFAOYSA-N 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ISWNAMNOYHCTSB-UHFFFAOYSA-N methanamine;hydrobromide Chemical compound [Br-].[NH3+]C ISWNAMNOYHCTSB-UHFFFAOYSA-N 0.000 description 1
- 238000012704 multi-component copolymerization Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000009512 pharmaceutical packaging Methods 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 235000021404 traditional food Nutrition 0.000 description 1
- SZEMGTQCPRNXEG-UHFFFAOYSA-M trimethyl(octadecyl)azanium;bromide Chemical compound [Br-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C SZEMGTQCPRNXEG-UHFFFAOYSA-M 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/34—Silicon-containing compounds
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- C08K3/346—Clay
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- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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Abstract
本发明公开了一种水/氧阻隔聚合物基复合材料,其由无机物层状填料经与表面改性剂和插层剂反应后分散于聚合物基体材料中所构成,聚合物基体材料为含有酰胺键或羟基或羧基的有机聚合物。本发明的优点在于:水/氧阻隔层的结构简单且有效;制备方法为溶液态制程,制备过程中不需要涉及真空工艺,制备方法简单;水/氧阻隔聚合物基复合材料的制备成本低,并且应用范围广泛。
The invention discloses a water/oxygen barrier polymer-based composite material, which is composed of an inorganic layered filler dispersed in a polymer matrix material after reacting with a surface modifier and an intercalation agent, and the polymer matrix material is Organic polymers containing amide linkages or hydroxyl or carboxyl groups. The invention has the advantages of: the structure of the water/oxygen barrier layer is simple and effective; the preparation method is a solution state process, and the preparation process does not need to involve a vacuum process, and the preparation method is simple; the preparation cost of the water/oxygen barrier polymer-based composite material is low , and has a wide range of applications.
Description
技术领域technical field
本发明涉及柔性电子与显示器件领域。The invention relates to the fields of flexible electronics and display devices.
背景技术Background technique
随着科学技术日新月异的发展,具有阻隔性能封装材料的应用从传统食品、药品包装领域迅速向电子产品封装领域扩展,各种高科技电子产品对封装材料的阻隔性能有着越来越严格的要求。不同领域下的水氧阻隔性能的要求如下表1:With the rapid development of science and technology, the application of packaging materials with barrier properties has rapidly expanded from the traditional food and pharmaceutical packaging fields to the packaging of electronic products. Various high-tech electronic products have increasingly strict requirements on the barrier properties of packaging materials. The requirements for water and oxygen barrier properties in different fields are shown in Table 1:
表1.不同领域对封装材料阻隔性能的需求范围Table 1. Range of requirements for barrier properties of packaging materials in different fields
在有机电致发光器件(OLED)领域,对封装材料的阻隔性能要求尤为苛刻。有机发光二极管又称为有机电激光显示(Organic Light-Emitting Diode,OLED),由美籍华裔教授邓青云在实验室中发现,由此展开了对OLED的研究。OLED具有制作成本低、全固态、主动发光、亮度高、对比度高、低电压直流驱动、功耗低、视角宽、响应速度快、厚度薄、工作温度范围宽、可实现柔性显示等特点。传统液晶显示(LCD)封装对水蒸汽渗透率(WVTR)和氧气渗透率(OTR)的要求分别为小于0.1g/m2/day和0.1cm3/m2/day。但OLED中有机发光材料和阴极对水蒸汽和氧气特别敏感。OLED器件为了获得有效电子的注入,其阴极层材料往往采用低功函数的金属(如Ca,Li)。这类金属材料化学性质较活泼,易被环境中的水气以及氧气腐蚀。若环境中的水气和氧气使阴极金属层发生氧化,影响金属层和氧化层的界面,致使电子无法有效发射,导致像素收缩,严重缩短OLED器件的寿命。如果OLED器件在制作出来后没有得到妥善封装,就会在很短时间内失去其发光性能,导致其无法工作。因此,为了阻隔水氧对器件的影响,我们需要在器件与基板之间加入一个防水氧的阻隔结构。若OLED寿命以1万小时计,并以OLED低功函数阴极失效所需水和氧量最低值来估算水和氧气对OLED封装的渗透率,要求OLED封装的WVTR和OTR分别小于10-6g/m2/day及10-5~10-3cm3/m2/day。为了减小封装材料的气体渗透率,In the field of organic electroluminescent devices (OLEDs), the barrier performance requirements for encapsulation materials are particularly stringent. Organic Light-Emitting Diode (OLED), also known as Organic Light-Emitting Diode (OLED), was discovered in the laboratory by Chinese-American professor Deng Qingyun, and the research on OLED was launched. OLED has the characteristics of low production cost, all solid state, active light emission, high brightness, high contrast, low voltage DC drive, low power consumption, wide viewing angle, fast response, thin thickness, wide operating temperature range, and flexible display. Traditional liquid crystal display (LCD) packaging requires water vapor transmission rate (WVTR) and oxygen transmission rate (OTR) to be less than 0.1g/m 2 /day and 0.1cm 3 /m 2 /day respectively. However, organic light-emitting materials and cathodes in OLEDs are particularly sensitive to water vapor and oxygen. In order to obtain effective electron injection in OLED devices, metals with low work function (such as Ca, Li) are often used as materials for the cathode layer. The chemical properties of this kind of metal materials are relatively active, and they are easily corroded by water vapor and oxygen in the environment. If the water vapor and oxygen in the environment oxidize the cathode metal layer and affect the interface between the metal layer and the oxide layer, electrons cannot be emitted effectively, resulting in pixel shrinkage and seriously shortening the life of the OLED device. If the OLED device is not properly packaged after it is produced, it will lose its light-emitting performance in a short time, causing it to fail to work. Therefore, in order to block the influence of water and oxygen on the device, we need to add a waterproof and oxygen barrier structure between the device and the substrate. If the lifetime of an OLED is calculated as 10,000 hours, and the minimum water and oxygen required for OLED low work function cathode failure are used to estimate the permeability of water and oxygen to the OLED package, the WVTR and OTR of the OLED package are required to be less than 10 -6 g /m 2 /day and 10 -5 ~ 10 -3 cm 3 /m 2 /day. In order to reduce the gas permeability of the packaging material,
高分子阻隔材料相对于无机阻隔材料来说,具有比重小、具柔性、可进行多层复合、低介电、绝缘性能优良、功能化等多种优势,在阻隔材料中占据着十分重要的地位。但利用高分子做阻隔材料的缺点也十分明显,绝大多数高分子材料的透气性均高于无机材料,离实现高阻隔特别是OLED封装领域的要求还有非常大的距离。所以研制一种具有高阻隔性能,同时兼具高机械性、高耐热性、透明性的高分子薄膜材料就有着十分巨大的市场应用前景。Compared with inorganic barrier materials, polymer barrier materials have many advantages such as small specific gravity, flexibility, multi-layer composite, low dielectric, excellent insulation performance, and functionalization, and occupy a very important position in barrier materials. . However, the shortcomings of using polymers as barrier materials are also very obvious. The air permeability of most polymer materials is higher than that of inorganic materials, and there is still a long way to go to achieve high barriers, especially in the field of OLED packaging. Therefore, the development of a polymer film material with high barrier properties, high mechanical properties, high heat resistance, and transparency has a very huge market application prospect.
聚酰亚胺(PI)是一种极好的耐高温材料,具有优良的力学性能、介电性能、耐辐射性能和耐溶剂性能等。新型PI材料同时具有高阻隔性、高机械性、高耐热性、高玻璃化转变温度、低成本易制备等特点,能够广泛应用在电子封装等高科技领域,其重要意义不言而喻。聚酰亚胺作为一种具有高耐热性、高Tg、高机械性能、一定透明性的高分子材料,其氧气透过率约为30cm3/m2/day、水的透过率为50g/m2/day,相比于其它高分子材料,阻隔性能良好,将其作为高阻隔材料进行研究应用具有较好的优势。采用共混改性、多元共聚、纳米粒子杂化、添加填料等方法可以有效地降低聚酰亚胺树脂的阻隔性能,改善其性能。Polyimide (PI) is an excellent high temperature resistant material with excellent mechanical properties, dielectric properties, radiation resistance and solvent resistance. The new PI material has the characteristics of high barrier properties, high mechanical properties, high heat resistance, high glass transition temperature, low cost and easy preparation, etc. It can be widely used in high-tech fields such as electronic packaging, and its significance is self-evident. As a polymer material with high heat resistance, high T g , high mechanical properties and certain transparency, polyimide has an oxygen transmission rate of about 30cm 3 /m 2 /day and a water transmission rate of 50g/m 2 /day, compared with other polymer materials, the barrier performance is good, and it has a good advantage in research and application as a high barrier material. The barrier properties of polyimide resin can be effectively reduced and its properties can be improved by methods such as blending modification, multi-component copolymerization, nanoparticle hybridization, and adding fillers.
近些年来阻隔性高分子复合材料的主要制备方法根据其加工工艺的不同,可以分为表面处理法、多层复合法、层状共混法及纳米材料共混法。国内外学者研究制出了氮化硅薄膜、光聚合聚丙烯酰胺薄膜、Barix薄膜等一系列对水蒸汽和氧气具有高阻隔性的材料。但是这样的技术工艺复杂、成本较高,难以实现大规模应用。因此,实现工艺简单且成本低廉的高效柔性防水氧的阻隔层的封装技术,是相当的重要的。In recent years, the main preparation methods of barrier polymer composites can be divided into surface treatment method, multilayer composite method, layered blending method and nanomaterial blending method according to their different processing techniques. Scholars at home and abroad have researched and produced a series of materials with high barrier properties to water vapor and oxygen, such as silicon nitride film, photopolymerized polyacrylamide film, and Barix film. However, such a technology is complicated and expensive, and it is difficult to realize large-scale application. Therefore, it is quite important to realize the encapsulation technology of an efficient flexible waterproof oxygen barrier layer with simple process and low cost.
本专利利用无机片层材料大大延长气体分子在材料内部的扩散路径的原理来提高聚合物基材的阻隔性,同时,利用聚合物结构中特殊的“酰胺键”、“羟基”、“羧基”等极性基团,在延长气体分子扩散路径的同时,大大提高了进行扩散的水分子与高分子链段中极性官能团接触的几率,从而使“锁水”、阻水的效果得到最大程度的体现,最大限度地提高材料的水/氧阻隔性能。This patent uses the principle that the inorganic sheet material greatly prolongs the diffusion path of gas molecules inside the material to improve the barrier properties of the polymer substrate. At the same time, it uses the special "amide bond", "hydroxyl" and "carboxyl" in the polymer structure Equipolar groups, while prolonging the diffusion path of gas molecules, greatly increase the probability of contact between the diffusing water molecules and the polar functional groups in the polymer chain segment, so that the effect of "water locking" and water blocking can be maximized , to maximize the water/oxygen barrier properties of the material.
发明内容Contents of the invention
本发明的目的在于提供一种应用于柔性电子与显示器件的水/氧阻隔聚合物基复合材料及其制造方法,确保生成的水/氧阻隔聚合物基复合材料具有良好的水氧阻隔性能。The purpose of the present invention is to provide a water/oxygen barrier polymer-based composite material and its manufacturing method for flexible electronics and display devices, so as to ensure that the produced water/oxygen barrier polymer-based composite material has good water and oxygen barrier performance.
本发明的另一目的在于提供一种应用于柔性电子与显示器件的水/氧阻隔聚合物基复合薄膜。Another object of the present invention is to provide a water/oxygen barrier polymer-based composite film applied to flexible electronics and display devices.
为了实现上述发明目的,本发明采用了以下技术方案:一种水/氧阻隔聚合物基复合材料,由无机物层状填料经表面改性剂和插层剂反应后分散于聚合物基体材料中所构成,聚合物基体材料为含有酰胺键或羟基或羧基的有机聚合物。In order to achieve the purpose of the above invention, the present invention adopts the following technical scheme: a water/oxygen barrier polymer-based composite material, which is dispersed in the polymer matrix material after the inorganic layered filler is reacted with a surface modifier and an intercalation agent Constituted, the polymer matrix material is an organic polymer containing amide bonds or hydroxyl or carboxyl groups.
所述有机聚合物为二酐单体与含有酰胺键或羟基或羧基的二胺单体经聚合反应合成的聚酰亚胺材料。The organic polymer is a polyimide material synthesized by polymerizing dianhydride monomers and diamine monomers containing amide bonds or hydroxyl or carboxyl groups.
所述无机物层状填料具有多种不同长径比与片层间距,无机物层状填料可以为蒙脱土、或石英、或云母、或石墨烯、或氮化硼无机物填料。这里的片层间距是指在分散进聚合物基体之前,无机材料本身片层之间由于堆叠而产生的间距。The inorganic layered filler has various aspect ratios and lamellar spacings, and the inorganic layered filler can be montmorillonite, or quartz, or mica, or graphene, or boron nitride inorganic filler. Interlamellar spacing here refers to the spacing between the lamellar layers of the inorganic material itself due to stacking before being dispersed into the polymer matrix.
所述表面改性剂为硅烷偶联剂或具有氨基基团可参与聚合反应的二胺单体;所述插层剂为包括十六烷基三甲基氯化铵,或十六烷基三甲基溴化铵,或十八烷基三甲基氯化铵,或十八烷基三甲基溴化铵的具有氨基基团可参与聚合反应的二胺单体的有机季铵盐。将二胺单体作为插层剂的好处是一方面二胺单体可以进入蒙脱土片层内部,对片层之间的间距可以起到扩张的作用。另一方面在进行聚合反应的时候,片层之间的二胺单体也可以参与聚合,原理类似原位反应,这样聚酰亚胺基体与蒙脱土材料的相容性也会在一定程度上得到增强,有助于提高薄膜材料的各项性能。正是由于使用二胺单体作为插层剂,蒙脱土与聚酰亚胺之间的界面作用也会大大减小。所述聚合物基体材料为由以下式(I)的二胺单体参与聚合反应所制备的聚酰亚胺材料。The surface modifier is a silane coupling agent or a diamine monomer having an amino group that can participate in a polymerization reaction; the intercalation agent includes cetyltrimethylammonium chloride, or cetyltrimethylammonium Methyl ammonium bromide, or octadecyltrimethylammonium chloride, or an organic quaternary ammonium salt of a diamine monomer having an amino group that can participate in a polymerization reaction of octadecyltrimethylammonium bromide. The advantage of using the diamine monomer as an intercalation agent is that on the one hand, the diamine monomer can enter the interior of the montmorillonite sheet and expand the distance between the sheets. On the other hand, during the polymerization reaction, the diamine monomer between the layers can also participate in the polymerization, the principle is similar to the in-situ reaction, so the compatibility between the polyimide matrix and the montmorillonite material will also be to a certain extent It is enhanced, which helps to improve the performance of thin film materials. It is precisely because of the use of diamine monomers as intercalation agents that the interfacial interaction between montmorillonite and polyimide will be greatly reduced. The polymer matrix material is a polyimide material prepared by participating in a polymerization reaction of a diamine monomer of the following formula (I).
注:R、R”表示烷基链段;Ar、Ar’表示芳香链段。Note: R, R" represent alkyl segments; Ar, Ar' represent aromatic segments.
上述体系中使用含有酰胺键或羟基或羧基的二胺单体进行合成,酰胺键、羟基、羧基是具有氢键作用的结构。在高分子链段运动中氢键的存在可以增强链段之间的相互作用力,通过高温退火过程让PI分子链段恢复运动,氢键的相互作用可以使高分子链堆砌更加紧密,从而减少了聚合物的自由体积。降低了气体分子在聚合物中可以透过的空间,从而达到提高阻隔性能的目的。通过酰胺键或羟基或羧基结构与水分子的氢键作用可以阻碍水分子在材料内部的扩散,从而达到提高材料阻隔性能的目的。酰胺键或羟基或羧基结构与水分子形成氢键作用后,使水分子趋于凝聚态,这种形态的水分子在材料内部的扩散远远小于非凝聚态的自由水在聚合物材料内部的扩散速度,利用酰胺键或羟基或羧基这种锁水功效来减小PI薄膜材料的水气透过率。In the above system, diamine monomers containing amide bonds or hydroxyl or carboxyl groups are used for synthesis. Amide bonds, hydroxyl groups, and carboxyl groups are structures with hydrogen bonds. The existence of hydrogen bonds in the movement of polymer chain segments can enhance the interaction force between segments, and the high temperature annealing process can restore the movement of PI molecular segments, and the interaction of hydrogen bonds can make the polymer chains more tightly packed, thereby reducing the free volume of the polymer. The space that gas molecules can pass through in the polymer is reduced, so as to achieve the purpose of improving the barrier performance. The hydrogen bond between the amide bond or the hydroxyl or carboxyl structure and the water molecule can hinder the diffusion of the water molecule inside the material, so as to achieve the purpose of improving the barrier performance of the material. After the amide bond or hydroxyl or carboxyl structure forms hydrogen bonds with water molecules, the water molecules tend to condense. The diffusion of this form of water molecules in the material is much smaller than that of non-condensed free water in the polymer material. Diffusion speed, using the water-locking effect of amide bonds or hydroxyl or carboxyl groups to reduce the water vapor transmission rate of PI film materials.
一种水/氧阻隔聚合物基复合材料的制造方法,其包括以下步骤:A method of manufacturing a water/oxygen barrier polymer-based composite material, comprising the steps of:
(1)取无机物层状填料与水搅拌制成悬浮液,静置后取上层悬浮液离心得到小粒径无机物层状填料;(1) Stir the inorganic layered filler with water to make a suspension, and after standing, take the upper layer of the suspension and centrifuge to obtain the small particle size inorganic layered filler;
(2)插层处理:将小粒径无机物层状填料分散到插层剂中,充分反应后取反应沉淀物,洗涤后100℃干燥24h得到插层无机物层状填料;(2) Intercalation treatment: disperse the small particle size inorganic layered filler into the intercalation agent, take the reaction precipitate after fully reacting, wash and dry at 100°C for 24 hours to obtain the intercalated inorganic layered filler;
(3)将插层无机物层状填料加入有机改性剂中,充分搅拌后过滤取沉淀物,烘干研磨后得到经有机改性的插层无机物层状填料;(3) adding the intercalated inorganic layered filler into the organic modifier, fully stirring, filtering to take the precipitate, drying and grinding to obtain the organically modified intercalated inorganic layered filler;
(4)聚合物基体材料的预聚物的制备:取聚合物基体材料的预聚物单体,充分混合形成溶胶;(4) Preparation of the prepolymer of the polymer matrix material: take the prepolymer monomer of the polymer matrix material, fully mix to form a sol;
(5)在步骤(4)的溶胶中加入步骤(3)所得到的经有机改性的插层无机物层状填料,超声机械搅拌5h,得到混合溶胶;(5) Adding the organically modified intercalation inorganic layered filler obtained in step (3) to the sol in step (4), and ultrasonically mechanically stirring for 5 hours to obtain a mixed sol;
(6)将步骤(5)所得到的混合溶胶布涂于所需制备的材料表面,得到水/氧阻隔层。(6) Coating the mixed sol obtained in step (5) on the surface of the material to be prepared to obtain a water/oxygen barrier layer.
一种水/氧阻隔聚合物基复合薄膜,由上、中、下三层复合而成,中层为前文任一所述的水/氧阻隔层,上层及下层为以不含酰胺键、羟基、羧基的有机聚合物所构成的聚合物表层。A water/oxygen barrier polymer-based composite film, which is composed of upper, middle and lower layers, the middle layer is the water/oxygen barrier layer described above, and the upper and lower layers do not contain amide bonds, hydroxyl groups, A polymer surface layer composed of carboxyl organic polymers.
所述水/氧阻隔聚合物基复合薄膜的制备方法,其包括以下步骤:The preparation method of the water/oxygen barrier polymer-based composite film comprises the following steps:
S1.制备聚合物表层溶液并涂布或熔融加形成薄膜,固化后获得下聚合物表层;S1. Prepare the polymer surface layer solution and apply or melt to form a thin film, and obtain the lower polymer surface layer after solidification;
S2.制备水/氧阻隔层的混合溶胶,将混合溶胶涂布于S1所制得的聚合物下表层表面,固化后在下聚合物表层表面形成水/氧阻隔层;S2. Prepare the mixed sol of the water/oxygen barrier layer, apply the mixed sol on the surface of the lower surface layer of the polymer prepared in S1, and form a water/oxygen barrier layer on the surface of the lower polymer surface layer after curing;
S3.制备聚合物表层溶液并涂布于S2所制得的水/氧阻隔层表面,固化后在水/氧阻隔层表面形成上聚合物表层;S3. Prepare a polymer surface layer solution and apply it on the surface of the water/oxygen barrier layer prepared in S2, and form an upper polymer surface layer on the surface of the water/oxygen barrier layer after curing;
S4.将S3得到的复合薄膜进行热处理,即得。S4. heat-treating the composite film obtained in S3.
一种前文任一所述的水/氧阻隔聚合物基复合材料在多层封装结构上的应用。An application of the water/oxygen barrier polymer-based composite material described above in a multilayer encapsulation structure.
一种所述的水/氧阻隔聚合物基复合材料在柔性电子或柔性显示器件中的应用,所述的柔性电子或柔性显示器件优选为电子纸、柔性TFT器件、柔性OLED器件、传感器或印刷电子器件。An application of the water/oxygen barrier polymer-based composite material in flexible electronics or flexible display devices, the flexible electronics or flexible display devices are preferably electronic paper, flexible TFT devices, flexible OLED devices, sensors or printing electronic devices.
本发明的优点在于:The advantages of the present invention are:
1.所述水/氧阻隔层的结构简单且有效;1. The structure of the water/oxygen barrier layer is simple and effective;
2.所述制备方法为溶液态制程,制备过程中不需要涉及真空工艺,制备方法简单;2. The preparation method is a solution-state process, and no vacuum process is involved in the preparation process, and the preparation method is simple;
3.所述水/氧阻隔聚合物基复合材料的制备成本低,并且应用范围广泛。3. The preparation cost of the water/oxygen barrier polymer-based composite material is low, and it has a wide range of applications.
附图说明Description of drawings
图1是本发明的复合薄膜材料的结构示意图。Fig. 1 is a schematic structural view of the composite film material of the present invention.
其中,聚合物上表层1,水/氧阻隔层2,聚合物下表层3Among them, polymer upper surface layer 1, water/oxygen barrier layer 2, polymer lower surface layer 3
具体实施方式detailed description
实施例1Example 1
本例为水/氧阻隔聚合物基复合薄膜材料的制备例。This example is a preparation example of a water/oxygen barrier polymer-based composite film material.
水/氧阻隔聚合物基复合薄膜材料按以下步骤制备:The water/oxygen barrier polymer-based composite film material is prepared according to the following steps:
1.制备上层与下层聚合物表层的预聚物:取0.8049g(4.02mmol)二胺单体二氨基二苯醚ODA加入10mLDMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入0.8943g(4.10mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌6小时至体系形成溶胶。1. Prepare the prepolymer of the upper and lower polymer surface layers: take 0.8049g (4.02mmol) of diamine monomer diaminodiphenyl ether ODA and add it to 10mL of DMF solution, and continue stirring for a period of time to fully mix the system; add to the above system 0.8943g (4.10mmol) of the dianhydride monomer 1,2,4,5-pyromellitic dianhydride PMDA was added and stirred at a medium speed for 6 hours until the system formed a sol.
2.无机物层状填料的改性与插层:取10g钠基蒙脱土与100mL超纯水在超声搅拌条件下制成5%-10%悬浮液,室温下静置24h沉降后,取上层悬浮液离心处理,得到粒径较小的蒙脱土;将1g小粒径蒙脱土分散到50mL的1mol/L十六烷基三甲基溴化铵水溶液中,90℃搅拌回流24h,取反应沉淀物,用超纯水进行多次洗涤,100℃干燥24h得到插层蒙脱土材料。2. Modification and intercalation of inorganic layered fillers: take 10g of sodium montmorillonite and 100mL of ultrapure water to make a 5%-10% suspension under ultrasonic stirring conditions, and after standing at room temperature for 24h to settle, take Centrifuge the upper suspension to obtain montmorillonite with smaller particle size; disperse 1 g of montmorillonite with small particle size into 50 mL of 1 mol/L cetyltrimethylammonium bromide aqueous solution, stir and reflux at 90 ° C for 24 h, The reaction precipitate was taken, washed several times with ultrapure water, and dried at 100° C. for 24 hours to obtain an intercalated montmorillonite material.
按硅烷偶联剂(KH-550)20%+乙醇72%+水8%的质量比例配成溶液,将1g插层蒙脱土材料加入50mL溶液中搅拌1h,抽滤,120℃烘箱烘干,得到有机改性的插层蒙脱土材料。Prepare a solution according to the mass ratio of silane coupling agent (KH-550) 20% + ethanol 72% + water 8%, add 1g of intercalated montmorillonite material into 50mL solution and stir for 1h, filter with suction, and oven dry at 120°C , to obtain organically modified intercalated montmorillonite materials.
3中间层聚合物层预聚物的制备:3. Preparation of the polymer layer prepolymer in the middle layer:
取1.0504g(4.62mmol)二胺单体二氨基苯酰替苯胺DABA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.0284g(4.71mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌1小时至体系形成溶胶;向溶胶体系中加入单体重量(二胺+二酐的总重量)1%的有机改性的插层蒙脱土材料0.0208g,超声机械搅拌5h,得到防水氧阻隔层混合溶胶。Take 1.0504g (4.62mmol) diamine monomer diaminobenzoanilide DABA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; add 1.0284g (4.71mmol) dianhydride monomer 1 to the above system , 2,4,5-Pyromellitic dianhydride PMDA, after adding, stir at a medium speed for 1 hour until the system forms a sol; add 1% of the monomer weight (total weight of diamine + dianhydride) to the sol system. 0.0208g of intercalation montmorillonite material, ultrasonic mechanical stirring for 5h, to obtain a waterproof oxygen barrier layer mixed sol.
4.使用步骤1中的溶胶涂覆在表面干燥洁净的玻璃板上,在烘箱150℃温度下干燥30min除溶剂,得到干燥的PAA胶膜,此为聚合物下表层1;4. Use the sol in step 1 to coat on a glass plate with a dry and clean surface, and dry it in an oven at 150°C for 30 minutes to remove the solvent to obtain a dry PAA film, which is the polymer lower surface layer 1;
将步骤3中的防水氧阻隔层混合溶胶涂覆在上述干燥的PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的双层PAA胶膜;Coat the mixed sol of the waterproof oxygen barrier layer in step 3 on the surface of the above-mentioned dry PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry double-layer PAA film;
使用步骤1中溶胶涂覆于上述干燥的双层PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的三层PAA胶膜;Use the sol in step 1 to coat the surface of the above-mentioned dry double-layer PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry three-layer PAA film;
将上述三层PAA胶膜放入150℃烘箱内,升温至250℃保持1h、升温至350℃保持1h;自然冷却至室温后用热水浸泡使复合薄膜从玻璃板上剥离,得到多层的水/氧阻隔聚合物基复合薄膜。Put the above three layers of PAA film into an oven at 150°C, raise the temperature to 250°C for 1 hour, and raise the temperature to 350°C for 1 hour; after natural cooling to room temperature, soak the composite film in hot water to peel off the composite film from the glass plate to obtain a multilayer Water/oxygen barrier polymer based composite film.
对所获得的水/氧阻隔复合薄膜样品进行水蒸气阻隔测试,结果如下表2~表5所示。The water vapor barrier test was carried out on the obtained water/oxygen barrier composite film samples, and the results are shown in Table 2 to Table 5 below.
实施例2Example 2
本例为水/氧阻隔聚合物基复合薄膜材料的制备例。This example is a preparation example of a water/oxygen barrier polymer-based composite film material.
水/氧阻隔聚合物基复合薄膜材料按以下步骤制备:The water/oxygen barrier polymer-based composite film material is prepared according to the following steps:
1.制备上层与下层聚合物表层的预聚物:取1.0248g(4.74mmol)二胺单体4,4’一二氨基二苯硫醚SDA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.0540g(4.83mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌6小时至体系形成溶胶。1. Prepare the prepolymer of the upper and lower polymer surface layers: take 1.0248g (4.74mmol) diamine monomer 4,4'-diaminodiphenyl sulfide SDA and add it to 10mL DMF solution, and keep stirring for a period of time to make the system fully Mixing; add 1.0540 g (4.83 mmol) of dianhydride monomer 1,2,4,5-pyromellitic dianhydride PMDA to the above system, and stir at a medium speed for 6 hours after the addition until the system forms a sol.
2.无机物层状填料的改性与插层:取10g钠基蒙脱土与100mL超纯水在超声搅拌条件下制成5%-10%悬浮液,室温下静置24h沉降后,取上层悬浮液离心处理,得到粒径较小的蒙脱土;将1g小粒径蒙脱土分散到50mL的1mol/L十六烷基三甲基溴化铵水溶液中,90℃搅拌回流24h,取反应沉淀物,用超纯水进行多次洗涤,100℃干燥24h得到插层蒙脱土材料。2. Modification and intercalation of inorganic layered fillers: take 10g of sodium montmorillonite and 100mL of ultrapure water to make a 5%-10% suspension under ultrasonic stirring conditions, and after standing at room temperature for 24h to settle, take Centrifuge the upper suspension to obtain montmorillonite with smaller particle size; disperse 1 g of montmorillonite with small particle size into 50 mL of 1 mol/L cetyltrimethylammonium bromide aqueous solution, stir and reflux at 90 ° C for 24 h, The reaction precipitate was taken, washed several times with ultrapure water, and dried at 100° C. for 24 hours to obtain an intercalated montmorillonite material.
按硅烷偶联剂(KH-550)20%+乙醇72%+水8%的质量比例配成溶液,将1g插层蒙脱土材料加入50mL溶液中搅拌1h,抽滤,120℃烘箱烘干,得到有机改性的插层蒙脱土材料。Prepare a solution according to the mass ratio of silane coupling agent (KH-550) 20% + ethanol 72% + water 8%, add 1g of intercalated montmorillonite material into 50mL solution and stir for 1h, filter with suction, and oven dry at 120°C , to obtain organically modified intercalated montmorillonite materials.
3中间层聚合物层预聚物的制备:3. Preparation of the polymer layer prepolymer in the middle layer:
取1.0504g(4.62mmol)二胺单体二氨基苯酰替苯胺DABA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.0284g(4.71mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌1小时至体系形成溶胶;向溶胶体系中加入单体重量(二胺+二酐的总重量)1%的有机改性的插层蒙脱土材料0.0208g,超声机械搅拌5h,得到防水氧阻隔层混合溶胶。Take 1.0504g (4.62mmol) diamine monomer diaminobenzoanilide DABA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; add 1.0284g (4.71mmol) dianhydride monomer 1 to the above system , 2,4,5-Pyromellitic dianhydride PMDA, after adding, stir at a medium speed for 1 hour until the system forms a sol; add 1% of the monomer weight (total weight of diamine + dianhydride) to the sol system. 0.0208g of intercalation montmorillonite material, ultrasonic mechanical stirring for 5h, to obtain a waterproof oxygen barrier layer mixed sol.
4.使用步骤1中的溶胶涂覆在表面干燥洁净的玻璃板上,在烘箱150℃温度下干燥30min除溶剂,得到干燥的PAA胶膜,此为聚合物下表层1;4. Use the sol in step 1 to coat on a glass plate with a dry and clean surface, and dry it in an oven at 150°C for 30 minutes to remove the solvent to obtain a dry PAA film, which is the polymer lower surface layer 1;
将步骤3中的防水氧阻隔层混合溶胶涂覆在上述干燥的PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的双层PAA胶膜;Coat the mixed sol of the waterproof oxygen barrier layer in step 3 on the surface of the above-mentioned dry PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry double-layer PAA film;
使用步骤1中溶胶涂覆于上述干燥的双层PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的三层PAA胶膜;Use the sol in step 1 to coat the surface of the above-mentioned dry double-layer PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry three-layer PAA film;
将上述三层PAA胶膜放入150℃烘箱内,升温至250℃保持1h、升温至350℃保持1h;自然冷却至室温后用热水浸泡使复合薄膜从玻璃板上剥离,得到多层的水/氧阻隔聚合物基复合薄膜。Put the above three layers of PAA film into an oven at 150°C, raise the temperature to 250°C for 1 hour, and raise the temperature to 350°C for 1 hour; after natural cooling to room temperature, soak the composite film in hot water to peel off the composite film from the glass plate to obtain a multilayer Water/oxygen barrier polymer based composite film.
对所获得的水/氧阻隔聚合物基复合薄膜样品进行水蒸气阻隔测试,结果如下表2~表5所示。A water vapor barrier test was performed on the obtained water/oxygen barrier polymer-based composite film samples, and the results are shown in Tables 2 to 5 below.
实施例3Example 3
本例为水/氧阻隔聚合物基复合薄膜材料的制备例。This example is a preparation example of a water/oxygen barrier polymer-based composite film material.
水/氧阻隔聚合物基复合薄膜材料按以下步骤制备:The water/oxygen barrier polymer-based composite film material is prepared according to the following steps:
1.制备上层与下层聚合物表层的预聚物:取1.3841g(3.28mmol)二胺单体2,2'-双(4-氨基苯氧基苯基)丙烷BAPP加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入0.7307g(3.35mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌6小时至体系形成溶胶。1. Prepare the prepolymer of the upper and lower polymer surface layers: take 1.3841g (3.28mmol) diamine monomer 2,2'-bis(4-aminophenoxyphenyl)propane BAPP and add it to 10mL DMF solution, and continue Stir for a period of time to fully mix the system; add 0.7307g (3.35mmol) of dianhydride monomer 1,2,4,5-pyromellitic dianhydride PMDA to the above system, and stir at a medium speed for 6 hours until the system is formed Sol.
2.无机物层状填料的改性与插层:取10g钠基蒙脱土与100mL超纯水在超声搅拌条件下制成5%-10%悬浮液,室温下静置24h沉降后,取上层悬浮液离心处理,得到粒径较小的蒙脱土;将1g小粒径蒙脱土分散到50mL的1mol/L十六烷基三甲基溴化铵水溶液,90℃搅拌回流24h,取反应沉淀物,用超纯水进行多次洗涤,100℃干燥24h得到插层蒙脱土材料。2. Modification and intercalation of inorganic layered fillers: take 10g of sodium montmorillonite and 100mL of ultrapure water to make a 5%-10% suspension under ultrasonic stirring conditions, and after standing at room temperature for 24h to settle, take Centrifuge the upper suspension to obtain montmorillonite with smaller particle size; disperse 1 g of montmorillonite with small particle size into 50 mL of 1 mol/L cetyltrimethylammonium bromide aqueous solution, stir and reflux at 90 ° C for 24 h, take The reaction precipitate was washed several times with ultrapure water, and dried at 100° C. for 24 hours to obtain an intercalated montmorillonite material.
按硅烷偶联剂(KH-550)20%+乙醇72%+水8%的质量比例配成溶液,将1g插层蒙脱土材料加入50mL溶液中搅拌1h,抽滤,120℃烘箱烘干,得到有机改性的插层蒙脱土材料。Prepare a solution according to the mass ratio of silane coupling agent (KH-550) 20% + ethanol 72% + water 8%, add 1g of intercalated montmorillonite material into 50mL solution and stir for 1h, filter with suction, and oven dry at 120°C , to obtain organically modified intercalated montmorillonite materials.
3中间层聚合物层预聚物的制备:3. Preparation of the polymer layer prepolymer in the middle layer:
取1.0504g(4.62mmol)二胺单体二氨基苯酰替苯胺DABA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.0284g(4.71mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌1小时至体系形成溶胶;向溶胶体系中加入单体重量(二胺+二酐的总重量)1%的有机改性的插层蒙脱土材料0.0208g,超声机械搅拌5h,得到防水氧阻隔层混合溶胶。Take 1.0504g (4.62mmol) diamine monomer diaminobenzoanilide DABA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; add 1.0284g (4.71mmol) dianhydride monomer 1 to the above system , 2,4,5-Pyromellitic dianhydride PMDA, after adding, stir at a medium speed for 1 hour until the system forms a sol; add 1% of the monomer weight (total weight of diamine + dianhydride) to the sol system. 0.0208g of intercalation montmorillonite material, ultrasonic mechanical stirring for 5h, to obtain a waterproof oxygen barrier layer mixed sol.
4.使用步骤1中的溶胶涂覆在表面干燥洁净的玻璃板上,在烘箱150℃温度下干燥30min除溶剂,得到干燥的PAA胶膜,此为聚合物下表层1;4. Use the sol in step 1 to coat on a glass plate with a dry and clean surface, and dry it in an oven at 150°C for 30 minutes to remove the solvent to obtain a dry PAA film, which is the polymer lower surface layer 1;
将步骤3中的防水氧阻隔层混合溶胶涂覆在上述干燥的PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的双层PAA胶膜;Coat the mixed sol of the waterproof oxygen barrier layer in step 3 on the surface of the above-mentioned dry PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry double-layer PAA film;
使用步骤1中溶胶涂覆于上述干燥的双层PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的三层PAA胶膜;Use the sol in step 1 to coat the surface of the above-mentioned dry double-layer PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry three-layer PAA film;
将上述三层PAA胶膜放入150℃烘箱内,升温至250℃保持1h、升温至350℃保持1h;自然冷却至室温后用热水浸泡使复合薄膜从玻璃板上剥离,得到多层的防水氧复合薄膜。Put the above three layers of PAA film into an oven at 150°C, raise the temperature to 250°C for 1 hour, and raise the temperature to 350°C for 1 hour; after natural cooling to room temperature, soak the composite film in hot water to peel off the composite film from the glass plate to obtain a multilayer Waterproof oxygen composite film.
实施例4Example 4
本例为水/氧阻隔聚合物基复合薄膜材料的制备例。This example is a preparation example of a water/oxygen barrier polymer-based composite film material.
水/氧阻隔聚合物基复合薄膜材料按以下步骤制备:The water/oxygen barrier polymer-based composite film material is prepared according to the following steps:
1.制备上层与下层聚合物表层的预聚物:取0.8319g(4.15mmol)二胺单体二氨基二苯醚ODA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.2469g(4.23mmol)的二酐单体3,3',4,4'-联苯四甲酸二酐BPDA,加入后中等速度搅拌6小时至体系形成溶胶。1. Prepare the prepolymer of the upper and lower polymer surface layers: Take 0.8319g (4.15mmol) diamine monomer diaminodiphenyl ether ODA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; Add 1.2469g (4.23mmol) of dianhydride monomer 3,3',4,4'-biphenyltetracarboxylic dianhydride BPDA, and stir at a medium speed for 6 hours after the addition until the system forms a sol.
2.无机物层状填料的改性与插层:取10g钠基蒙脱土与100mL超纯水在超声搅拌条件下制成5%-10%悬浮液,室温下静置24h沉降后,取上层悬浮液离心处理,得到粒径较小的蒙脱土;将1g小粒径蒙脱土分散到50mL的1mol/L十六烷基三甲基溴化铵水溶液中,90℃搅拌回流24h,取反应沉淀物,用超纯水进行多次洗涤,100℃干燥24h得到插层蒙脱土材料。2. Modification and intercalation of inorganic layered fillers: take 10g of sodium montmorillonite and 100mL of ultrapure water to make a 5%-10% suspension under ultrasonic stirring conditions, and after standing at room temperature for 24h to settle, take Centrifuge the upper suspension to obtain montmorillonite with smaller particle size; disperse 1 g of montmorillonite with small particle size into 50 mL of 1 mol/L cetyltrimethylammonium bromide aqueous solution, stir and reflux at 90 ° C for 24 h, The reaction precipitate was taken, washed several times with ultrapure water, and dried at 100° C. for 24 hours to obtain an intercalated montmorillonite material.
按硅烷偶联剂(KH-550)20%+乙醇72%+水8%的质量比例配成溶液,将1g插层蒙脱土材料加入50mL溶液中搅拌1h,抽滤,120℃烘箱烘干,得到有机改性的插层蒙脱土材料。Prepare a solution according to the mass ratio of silane coupling agent (KH-550) 20% + ethanol 72% + water 8%, add 1g of intercalated montmorillonite material into 50mL solution and stir for 1h, filter with suction, and oven dry at 120°C , to obtain organically modified intercalated montmorillonite materials.
3.中间层聚合物层预聚物的制备:3. Preparation of the middle layer polymer layer prepolymer:
取0.8958g(3.94mmol)二胺单体二氨基苯酰替苯胺DABA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.1830g(4.02mmol)的二酐单体3,3',4,4'-联苯四甲酸二酐BPDA,加入后中等速度搅拌1小时至体系形成溶胶;向溶胶体系中加入单体重量(二胺+二酐的总重量)1%的有机改性的插层蒙脱土材料0.0208g,超声机械搅拌5h,得到水/氧阻隔层混合溶胶。Take 0.8958g (3.94mmol) diamine monomer diaminobenzoanilide DABA and add it to 10mL DMF solution, and keep stirring for a period of time to make the system fully mixed; add 1.1830g (4.02mmol) dianhydride monomer 3 to the above system , 3',4,4'-biphenyltetracarboxylic dianhydride BPDA, after adding, stir at a medium speed for 1 hour until the system forms a sol; add 1% of monomer weight (total weight of diamine + dianhydride) to the sol system 0.0208 g of the organically modified intercalation montmorillonite material was stirred ultrasonically for 5 hours to obtain a mixed sol of the water/oxygen barrier layer.
4.使用步骤1中的溶胶涂覆在表面干燥洁净的玻璃板上,在烘箱150℃温度下干燥30min除溶剂,得到干燥的PAA胶膜,此为聚合物下表层1;4. Use the sol in step 1 to coat on a glass plate with a dry and clean surface, and dry it in an oven at 150°C for 30 minutes to remove the solvent to obtain a dry PAA film, which is the polymer lower surface layer 1;
将步骤3中的防水氧阻隔层混合溶胶涂覆在上述干燥的PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的双层PAA胶膜;Coat the mixed sol of the waterproof oxygen barrier layer in step 3 on the surface of the above-mentioned dry PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry double-layer PAA film;
使用步骤1中溶胶涂覆于上述干燥的双层PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的三层PAA胶膜;Use the sol in step 1 to coat the surface of the above-mentioned dry double-layer PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry three-layer PAA film;
将上述三层PAA胶膜放入150℃烘箱内,升温至250℃保持1h、升温至350℃保持1h;自然冷却至室温后用热水浸泡使复合薄膜从玻璃板上剥离,得到多层的水/氧阻隔复合薄膜。对所获得的水/氧阻隔复合薄膜样品进行水蒸气阻隔测试,结果如下表2~表5所示。Put the above three layers of PAA film into an oven at 150°C, raise the temperature to 250°C for 1 hour, and raise the temperature to 350°C for 1 hour; after natural cooling to room temperature, soak the composite film in hot water to peel off the composite film from the glass plate to obtain a multilayer Water/oxygen barrier composite film. The water vapor barrier test was carried out on the obtained water/oxygen barrier composite film samples, and the results are shown in Table 2 to Table 5 below.
实施例5Example 5
本例为水/氧阻隔聚合物基复合薄膜材料的制备例。This example is a preparation example of a water/oxygen barrier polymer-based composite film material.
水/氧阻隔聚合物基复合薄膜材料按以下步骤制备:The water/oxygen barrier polymer-based composite film material is prepared according to the following steps:
1.制备上层与下层聚合物表层的预聚物:取0.7870g(3.93mmol)二胺单体二氨基二苯醚ODA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.2918g(4.01mmol)的二酐单体3,3’,4,4’-二苯酮四酸二酐BTDA,加入后中等速度搅拌6小时至体系形成溶胶。1. Prepare the prepolymer of the upper and lower polymer surface layers: Take 0.7870g (3.93mmol) diamine monomer diaminodiphenyl ether ODA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; Add 1.2918 g (4.01 mmol) of dianhydride monomer 3,3',4,4'-benzophenonetetraacid dianhydride BTDA, and stir at a medium speed for 6 hours after the addition until the system forms a sol.
2.无机物层状填料的改性与插层:取10g钠基蒙脱土与100mL超纯水在超声搅拌条件下制成5%-10%悬浮液,室温下静置24h沉降后,取上层悬浮液离心处理,得到粒径较小的蒙脱土;将1g小粒径蒙脱土分散到50mL的1mol/L十六烷基三甲基溴化铵水溶液中,90℃搅拌回流24h,取反应沉淀物,用超纯水进行多次洗涤,100℃干燥24h得到插层蒙脱土材料。2. Modification and intercalation of inorganic layered fillers: take 10g of sodium montmorillonite and 100mL of ultrapure water to make a 5%-10% suspension under ultrasonic stirring conditions, and after standing at room temperature for 24h to settle, take Centrifuge the upper suspension to obtain montmorillonite with smaller particle size; disperse 1 g of montmorillonite with small particle size into 50 mL of 1 mol/L cetyltrimethylammonium bromide aqueous solution, stir and reflux at 90 ° C for 24 h, The reaction precipitate was taken, washed several times with ultrapure water, and dried at 100° C. for 24 hours to obtain an intercalated montmorillonite material.
按硅烷偶联剂(KH-550)20%+乙醇72%+水8%的质量比例配成溶液,将1g插层蒙脱土材料加入50mL溶液中搅拌1h,抽滤,120℃烘箱烘干,得到有机改性的插层蒙脱土材料。Prepare a solution according to the mass ratio of silane coupling agent (KH-550) 20% + ethanol 72% + water 8%, add 1g of intercalated montmorillonite material into 50mL solution and stir for 1h, filter with suction, and oven dry at 120°C , to obtain organically modified intercalated montmorillonite materials.
3.中间层聚合物层预聚物的制备:3. Preparation of the middle layer polymer layer prepolymer:
取0.8498g(3.74mmol)二胺单体二氨基苯酰替苯胺DABA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.2290g(3.81mmol)的二酐单体3,3’,4,4’-二苯酮四酸二酐BTDA,加入后中等速度搅拌1小时至体系形成溶胶;向溶胶体系中加入单体重量(二胺+二酐的总重量)1%的有机改性的插层蒙脱土材料0.0208g,超声机械搅拌5h,得到水/氧阻隔层混合溶胶。Take 0.8498g (3.74mmol) diamine monomer diaminobenzoanilide DABA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; add 1.2290g (3.81mmol) dianhydride monomer 3 to the above system , 3',4,4'-Benzophenonetetraacid dianhydride BTDA, after adding, stir at a medium speed for 1 hour until the system forms a sol; add 1% of monomer weight (total weight of diamine + dianhydride) to the sol system 0.0208 g of the organically modified intercalated montmorillonite material was stirred ultrasonically for 5 hours to obtain a water/oxygen barrier layer mixed sol.
4.使用步骤1中的溶胶涂覆在表面干燥洁净的玻璃板上,在烘箱150℃温度下干燥30min除溶剂,得到干燥的PAA胶膜,此为聚合物下表层1;4. Use the sol in step 1 to coat on a glass plate with a dry and clean surface, and dry it in an oven at 150°C for 30 minutes to remove the solvent to obtain a dry PAA film, which is the polymer lower surface layer 1;
将步骤3中的防水氧阻隔层混合溶胶涂覆在上述干燥的PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的双层PAA胶膜;Coat the mixed sol of the waterproof oxygen barrier layer in step 3 on the surface of the above-mentioned dry PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry double-layer PAA film;
使用步骤1中溶胶涂覆于上述干燥的双层PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的三层PAA胶膜;Use the sol in step 1 to coat the surface of the above-mentioned dry double-layer PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry three-layer PAA film;
将上述三层PAA胶膜放入150℃烘箱内,升温至250℃保持1h、升温至350℃保持1h;自然冷却至室温后用热水浸泡使复合薄膜从玻璃板上剥离,得到多层的水/氧阻隔复合薄膜。Put the above three layers of PAA film into an oven at 150°C, raise the temperature to 250°C for 1 hour, and raise the temperature to 350°C for 1 hour; after natural cooling to room temperature, soak the composite film in hot water to peel off the composite film from the glass plate to obtain a multilayer Water/oxygen barrier composite film.
实施例6Example 6
本例为水/氧阻隔聚合物基复合薄膜材料的制备例。This example is a preparation example of a water/oxygen barrier polymer-based composite film material.
水/氧阻隔聚合物基复合薄膜材料按以下步骤制备:The water/oxygen barrier polymer-based composite film material is prepared according to the following steps:
1.制备上层与下层聚合物表层的预聚物:取0.8049g(4.02mmol)二胺单体二氨基二苯醚ODA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入0.8943g(4.10mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌6小时至体系形成溶胶。1. Prepare the prepolymer of the upper and lower polymer surface layers: Take 0.8049g (4.02mmol) diamine monomer diaminodiphenyl ether ODA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; Add 0.8943g (4.10mmol) of the dianhydride monomer 1,2,4,5-pyromellitic dianhydride PMDA, and stir at a medium speed for 6 hours after the addition until the system forms a sol.
2.无机物层状填料的改性与插层:取10g钠基蒙脱土与100mL超纯水在超声搅拌条件下制成5%-10%悬浮液,室温下静置24h沉降后,取上层悬浮液离心处理,得到粒径较小的蒙脱土;将1g小粒径蒙脱土分散到50mL的0.1mol/L二氨基二苯醚ODA的盐酸水溶液中,60℃搅拌回流24h,取反应沉淀物,用超纯水进行多次洗涤,60℃干燥24h得到二胺插层蒙脱土材料。2. Modification and intercalation of inorganic layered fillers: take 10g of sodium montmorillonite and 100mL of ultrapure water to make a 5%-10% suspension under ultrasonic stirring conditions, and after standing at room temperature for 24h to settle, take Centrifuge the upper suspension to obtain montmorillonite with smaller particle size; disperse 1 g of montmorillonite with small particle size into 50 mL of 0.1 mol/L diaminodiphenyl ether ODA hydrochloric acid aqueous solution, stir and reflux at 60 ° C for 24 h, take The reaction precipitate was washed several times with ultrapure water, and dried at 60° C. for 24 hours to obtain a diamine-intercalated montmorillonite material.
按硅烷偶联剂(KH-550)20%+乙醇72%+水8%的质量比例配成溶液,将1g插层蒙脱土材料加入50mL溶液中搅拌1h,抽滤,60℃烘箱烘干,得到有机改性的插层蒙脱土材料。Prepare a solution according to the mass ratio of silane coupling agent (KH-550) 20% + ethanol 72% + water 8%, add 1g of intercalated montmorillonite material into 50mL solution and stir for 1h, filter with suction, and dry in an oven at 60°C , to obtain organically modified intercalated montmorillonite materials.
3中间层聚合物层预聚物的制备:3. Preparation of the polymer layer prepolymer in the middle layer:
取1.0504g(4.62mmol)二胺单体二氨基苯酰替苯胺DABA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.0284g(4.71mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌1小时至体系形成溶胶;向溶胶体系中加入单体重量(二胺+二酐的总重量)1%的有机改性的插层蒙脱土材料0.0208g,超声机械搅拌5h,得到防水氧阻隔层混合溶胶。Take 1.0504g (4.62mmol) diamine monomer diaminobenzoanilide DABA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; add 1.0284g (4.71mmol) dianhydride monomer 1 to the above system , 2,4,5-Pyromellitic dianhydride PMDA, after adding, stir at a medium speed for 1 hour until the system forms a sol; add 1% of the monomer weight (total weight of diamine + dianhydride) to the sol system. 0.0208g of intercalation montmorillonite material, ultrasonic mechanical stirring for 5h, to obtain a waterproof oxygen barrier layer mixed sol.
4.使用步骤1中的溶胶涂覆在表面干燥洁净的玻璃板上,在烘箱150℃温度下干燥30min除溶剂,得到干燥的PAA胶膜,此为聚合物下表层1;4. Use the sol in step 1 to coat on a glass plate with a dry and clean surface, and dry it in an oven at 150°C for 30 minutes to remove the solvent to obtain a dry PAA film, which is the polymer lower surface layer 1;
将步骤3中的水/氧阻隔层混合溶胶涂覆在上述干燥的PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的双层PAA胶膜;Coat the mixed sol of the water/oxygen barrier layer in step 3 on the surface of the above-mentioned dry PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry double-layer PAA film;
使用步骤1中溶胶涂覆于上述干燥的双层PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的三层PAA胶膜;Use the sol in step 1 to coat the surface of the above-mentioned dry double-layer PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry three-layer PAA film;
将上述三层PAA胶膜放入150℃烘箱内,升温至250℃保持1h、升温至350℃保持1h;自然冷却至室温后用热水浸泡使复合薄膜从玻璃板上剥离,得到多层的水/氧阻隔复合薄膜。Put the above three layers of PAA film into an oven at 150°C, raise the temperature to 250°C for 1 hour, and raise the temperature to 350°C for 1 hour; after natural cooling to room temperature, soak the composite film in hot water to peel off the composite film from the glass plate to obtain a multilayer Water/oxygen barrier composite film.
实施例7Example 7
本例为水/氧阻隔聚合物基复合薄膜材料的制备例。This example is a preparation example of a water/oxygen barrier polymer-based composite film material.
水/氧阻隔聚合物基复合薄膜材料按以下步骤制备:The water/oxygen barrier polymer-based composite film material is prepared according to the following steps:
1.制备上层与下层聚合物表层的预聚物:取0.8049g(4.02mmol)二胺单体二氨基二苯醚ODA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入0.8943g(4.10mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌6小时至体系形成溶胶。1. Prepare the prepolymer of the upper and lower polymer surface layers: Take 0.8049g (4.02mmol) of diamine monomer diaminodiphenyl ether ODA and add it to 10mL of DMF solution, and keep stirring for a period of time to fully mix the system; Add 0.8943g (4.10mmol) of the dianhydride monomer 1,2,4,5-pyromellitic dianhydride PMDA, and stir at a medium speed for 6 hours after the addition until the system forms a sol.
2.无机物层状填料的改性与插层:100g绢云母粉末在马弗炉800℃条件下保温1h,得到热活化绢云母;取10g热活化绢云母在100mL5mol/L的硝酸溶液中于95℃下搅拌反应4h,抽滤并在60℃下干燥得到酸化绢云母;取1g酸化绢云母在50mL6mol/L的NaCl溶液中于95℃下搅拌反应1h,重复3次后使用超纯水多次洗涤,抽滤并在60℃下干燥得到钠化绢云母;将1g钠化绢云母分散到50mL的1mol/L十六烷基三甲基溴化铵水溶液中,90℃搅拌回流24h,取反应沉淀物,用超纯水进行多次洗涤,100℃干燥24h得到插层绢云母材料。2. Modification and intercalation of inorganic layered fillers: 100g of sericite powder was incubated at 800°C in a muffle furnace for 1 hour to obtain thermally activated sericite; 10g of thermally activated sericite was dissolved in 100mL5mol/L nitric acid solution in Stir and react at 95°C for 4h, filter with suction and dry at 60°C to obtain acidified sericite; take 1g of acidified sericite in 50mL6mol/L NaCl solution and stir for 1h at 95°C, repeat 3 times and use ultrapure water Wash once, filter with suction and dry at 60°C to obtain sodium sericite; disperse 1g of sodium sericite into 50mL of 1mol/L cetyltrimethylammonium bromide aqueous solution, stir and reflux at 90°C for 24h, take The reaction precipitate was washed several times with ultrapure water, and dried at 100° C. for 24 hours to obtain an intercalated sericite material.
按硅烷偶联剂(KH-550)20%+乙醇72%+水8%的质量比例配成溶液,将1g插层绢云母材料加入50mL溶液中搅拌1h,抽滤,120℃烘箱烘干,得到有机改性的插层绢云母材料。Prepare a solution according to the mass ratio of silane coupling agent (KH-550) 20% + ethanol 72% + water 8%, add 1g of intercalated sericite material into 50mL solution and stir for 1h, filter with suction, and dry in an oven at 120°C. An organically modified intercalation sericite material is obtained.
3中间层聚合物层预聚物的制备:3. Preparation of the polymer layer prepolymer in the middle layer:
取1.0504g(4.62mmol)二胺单体二氨基苯酰替苯胺DABA加入10mL DMF溶液中,持续搅拌一段时间使体系充分混合;向上述体系中加入1.0284g(4.71mmol)的二酐单体1,2,4,5-均苯四甲酸二酐PMDA,加入后中等速度搅拌1小时至体系形成溶胶;向溶胶体系中加入单体重量(二胺+二酐的总重量)1%的有机改性的插层绢云母材料0.0208g,超声机械搅拌5h,得到水/氧阻隔层混合溶胶。Take 1.0504g (4.62mmol) diamine monomer diaminobenzoanilide DABA and add it to 10mL DMF solution, and keep stirring for a period of time to fully mix the system; add 1.0284g (4.71mmol) dianhydride monomer 1 to the above system , 2,4,5-Pyromellitic dianhydride PMDA, after adding, stir at a medium speed for 1 hour until the system forms a sol; add 1% of the monomer weight (total weight of diamine + dianhydride) to the sol system. 0.0208g of intercalation sericite material, ultrasonic mechanical stirring for 5h, to obtain a mixed sol of water/oxygen barrier layer.
4.使用步骤1中的溶胶涂覆在表面干燥洁净的玻璃板上,在烘箱150℃温度下干燥30min除溶剂,得到干燥的PAA胶膜,此为聚合物下表层1;4. Use the sol in step 1 to coat on a glass plate with a dry and clean surface, and dry it in an oven at 150°C for 30 minutes to remove the solvent to obtain a dry PAA film, which is the polymer lower surface layer 1;
将步骤3中的防水氧阻隔层混合溶胶涂覆在上述干燥的PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的双层PAA胶膜;Coat the mixed sol of the waterproof oxygen barrier layer in step 3 on the surface of the above-mentioned dry PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry double-layer PAA film;
使用步骤1中溶胶涂覆于上述干燥的双层PAA胶膜表面,在烘箱150℃温度下干燥30min除溶剂,得到干燥的三层PAA胶膜;Use the sol in step 1 to coat the surface of the above-mentioned dry double-layer PAA film, dry in an oven at 150°C for 30 minutes to remove the solvent, and obtain a dry three-layer PAA film;
将上述三层PAA胶膜放入150℃烘箱内,升温至250℃保持1h、升温至350℃保持1h;自然冷却至室温后用热水浸泡使复合薄膜从玻璃板上剥离,得到多层的水/氧阻隔复合薄膜。Put the above three layers of PAA film into an oven at 150°C, raise the temperature to 250°C for 1 hour, and raise the temperature to 350°C for 1 hour; after natural cooling to room temperature, soak the composite film in hot water to peel off the composite film from the glass plate to obtain a multilayer Water/oxygen barrier composite film.
对使用不同的二胺及二酐单体聚合反应后的上、下聚合物表层及中间层进行水蒸汽透过测试,结果如下表2~表5所示。Water vapor transmission tests were performed on the upper and lower polymer surface layers and the middle layer after polymerization using different diamines and dianhydride monomers, and the results are shown in Tables 2 to 5 below.
表2.薄膜水蒸汽透过测试Table 2. Film Water Vapor Transmission Test
注:Note:
WVTR为实际测得薄膜的水蒸气透过率,括号中为薄膜实际厚度t;WVTR is the actual measured water vapor transmission rate of the film, and the actual thickness t of the film is in brackets;
WVTR’为通过公式WVTR’=WVTR*t/t’计算得到的水蒸气透过率,t’=50μm,即表示薄膜厚度统一转换为50μm时水蒸气透过率。WVTR' is the water vapor transmission rate calculated by the formula WVTR'=WVTR*t/t', t'=50μm, which means the water vapor transmission rate when the film thickness is uniformly converted to 50μm.
表2中使用的不含酰胺键的二胺单体为ODA,含酰胺键的二胺单体为DABA,二酐单体为PMDA。表中8ODA-2DABA代表的是ODA与DABA以8:2的质量含量进行混合后与PMDA经聚合反应所合成的聚酰亚胺材料。同理,7ODA-3DABA代表的是ODA与DABA以7:3的质量含量进行混合。The diamine monomer not containing an amide bond used in Table 2 is ODA, the diamine monomer containing an amide bond is DABA, and the dianhydride monomer is PMDA. 8ODA-2DABA in the table represents the polyimide material synthesized by mixing ODA and DABA at a mass content of 8:2 and then polymerizing with PMDA. Similarly, 7ODA-3DABA means that ODA and DABA are mixed at a mass content of 7:3.
表3.薄膜水蒸汽透过测试Table 3. Film Water Vapor Transmission Test
注:Note:
WVTR为实际测得薄膜的水蒸气透过率,括号中为薄膜实际厚度t;WVTR is the actual measured water vapor transmission rate of the film, and the actual thickness t of the film is in brackets;
WVTR’为通过公式WVTR’=WVTR*t/t’计算得到的水蒸气透过率,t’=50μm,即表示薄膜厚度统一转换为50μm时水蒸气透过率。WVTR' is the water vapor transmission rate calculated by the formula WVTR'=WVTR*t/t', t'=50μm, which means the water vapor transmission rate when the film thickness is uniformly converted to 50μm.
表3中使用的不含酰胺键的二胺单体为SDA,含酰胺键的二胺单体为DABA,二酐单体为PMDA。The diamine monomer not containing an amide bond used in Table 3 is SDA, the diamine monomer containing an amide bond is DABA, and the dianhydride monomer is PMDA.
表4.薄膜水蒸汽透过测试Table 4. Film Water Vapor Transmission Test
注:Note:
WVTR为实际测得薄膜的水蒸气透过率,括号中为薄膜实际厚度t;WVTR is the actual measured water vapor transmission rate of the film, and the actual thickness t of the film is in brackets;
WVTR’为通过公式WVTR’=WVTR*t/t’计算得到的水蒸气透过率,t’=50μm,即表示薄膜厚度统一转换为50μm时水蒸气透过率。WVTR' is the water vapor transmission rate calculated by the formula WVTR'=WVTR*t/t', t'=50μm, which means the water vapor transmission rate when the film thickness is uniformly converted to 50μm.
表4中使用的不含酰胺键的二胺单体为BAPP,含酰胺键的二胺单体为DABA,二酐单体为BPDA。The diamine monomer not containing an amide bond used in Table 4 is BAPP, the diamine monomer containing an amide bond is DABA, and the dianhydride monomer is BPDA.
表5薄膜水蒸汽透过测试Table 5 Film Water Vapor Transmission Test
注:Note:
WVTR为实际测得薄膜的水蒸气透过率,括号中为薄膜实际厚度t;WVTR is the actual measured water vapor transmission rate of the film, and the actual thickness t of the film is in brackets;
WVTR’为通过公式WVTR’=WVTR*t/t’计算得到的水蒸气透过率,t’=50μm,即表示薄膜厚度统一转换为50μm时水蒸气透过率。WVTR' is the water vapor transmission rate calculated by the formula WVTR'=WVTR*t/t', t'=50μm, which means the water vapor transmission rate when the film thickness is uniformly converted to 50μm.
表5中使用的不含酰胺键的二胺单体为ODA,含酰胺键的二胺单体为DABA,二酐单体为BPDA。The diamine monomer not containing an amide bond used in Table 5 is ODA, the diamine monomer containing an amide bond is DABA, and the dianhydride monomer is BPDA.
表2至表5的数据显示随着二胺单体中DABA相对比例的增加,所得到聚酰亚胺材料的WVTR(水蒸气通过率)呈下降趋势,证明了单体DABA中酰胺键结构能够有效减少水的透过,有助于提高材料的水蒸气阻隔性能。实验结果与实验原理中推断的结果保持一致,即DABA中酰胺键“锁水”的机理和DABA中酰胺键有助于聚酰亚胺分子链段间相互作用提高。The data in Table 2 to Table 5 shows that with the increase of the relative proportion of DABA in the diamine monomer, the WVTR (water vapor transmission rate) of the obtained polyimide material is in a downward trend, which proves that the amide bond structure in the monomer DABA can Effectively reduce the penetration of water and help to improve the water vapor barrier performance of the material. The experimental results are consistent with the results deduced in the experimental principle, that is, the mechanism of "water-locking" of the amide bond in DABA and the amide bond in DABA contribute to the improvement of the interaction between polyimide molecular segments.
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