CN106750049A - A kind of 3D printing rapid shaping photocurable resin material and its preparation method and application - Google Patents
A kind of 3D printing rapid shaping photocurable resin material and its preparation method and application Download PDFInfo
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- CN106750049A CN106750049A CN201611075134.5A CN201611075134A CN106750049A CN 106750049 A CN106750049 A CN 106750049A CN 201611075134 A CN201611075134 A CN 201611075134A CN 106750049 A CN106750049 A CN 106750049A
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- printing
- rapid shaping
- resin material
- photocurable resin
- parts
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- 238000010146 3D printing Methods 0.000 title claims abstract description 49
- 239000011347 resin Substances 0.000 title claims abstract description 48
- 229920005989 resin Polymers 0.000 title claims abstract description 48
- 239000000463 material Substances 0.000 title claims abstract description 36
- 238000007493 shaping process Methods 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000000178 monomer Substances 0.000 claims abstract description 7
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000003112 inhibitor Substances 0.000 claims abstract description 6
- 239000000314 lubricant Substances 0.000 claims abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 239000002202 Polyethylene glycol Substances 0.000 claims description 8
- 229920001223 polyethylene glycol Polymers 0.000 claims description 8
- LJRSZGKUUZPHEB-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxypropoxy)propoxy]propyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COC(C)COC(=O)C=C LJRSZGKUUZPHEB-UHFFFAOYSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 6
- HOCOIDRZLNGZMV-UHFFFAOYSA-N ethoxy(oxido)phosphanium Chemical compound CCO[PH2]=O HOCOIDRZLNGZMV-UHFFFAOYSA-N 0.000 claims description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 6
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 5
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 claims description 4
- 238000010792 warming Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- YFPJFKYCVYXDJK-UHFFFAOYSA-N Diphenylphosphine oxide Chemical compound C=1C=CC=CC=1[P+](=O)C1=CC=CC=C1 YFPJFKYCVYXDJK-UHFFFAOYSA-N 0.000 claims description 2
- 239000012188 paraffin wax Substances 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- XVZXOLOFWKSDSR-UHFFFAOYSA-N Cc1cc(C)c([C]=O)c(C)c1 Chemical group Cc1cc(C)c([C]=O)c(C)c1 XVZXOLOFWKSDSR-UHFFFAOYSA-N 0.000 claims 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 2
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 claims 1
- 241001502050 Acis Species 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000012752 auxiliary agent Substances 0.000 claims 1
- 238000005461 lubrication Methods 0.000 claims 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000008676 import Effects 0.000 abstract description 5
- 230000001419 dependent effect Effects 0.000 abstract description 3
- 238000010276 construction Methods 0.000 abstract 1
- 238000007711 solidification Methods 0.000 description 9
- 230000008023 solidification Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 125000004386 diacrylate group Chemical group 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical group CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- ZMDDERVSCYEKPQ-UHFFFAOYSA-N Ethyl (mesitylcarbonyl)phenylphosphinate Chemical class C=1C=CC=CC=1P(=O)(OCC)C(=O)C1=C(C)C=C(C)C=C1C ZMDDERVSCYEKPQ-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- HPAFOABSQZMTHE-UHFFFAOYSA-N phenyl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)C1=CC=CC=C1 HPAFOABSQZMTHE-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 2
- JMWGZSWSTCGVLX-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.CCC(CO)(CO)CO JMWGZSWSTCGVLX-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000000110 selective laser sintering Methods 0.000 description 1
- -1 silicic acid Ester Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
- C08F283/105—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule on to unsaturated polymers containing more than one epoxy radical per molecule
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
- C08F283/008—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00 on to unsaturated polymers
Abstract
The present invention discloses a kind of 3D printing rapid shaping photocurable resin material and its preparation method and application, including following raw material is made by weight ratio：10 99 parts of polymerized monomer, 0.5 1 parts of lubricant, 10 81 parts of auxiliary curing agent, 16 parts of light trigger, 0.1 0.5 parts of polymerization inhibitor.Its preparation method is simple, and easy to operate, yield is high.The consumptive material for solving current 3D printing DLP, SLA equipment relies on the present situation of import substantially, further solve the problems, such as that 3D printing material construction is high, so that China's 3D printing light-cured resin is no longer dependent on import, with great scientific meaning and application value.
Description
Technical field
The invention belongs to photocurable resin material field, more particularly to a kind of rapid shaping photocuring for being applied to 3D printing
Resin material and preparation method thereof.
Background technology
Light-cured resin superior performance, the material is similar to traditional engineering plastics (including ABS and PBT etc.).It can quilt
Preferably apply in automobile, medicine equipment, the exemplar of daily electronic product makes, be also apply to water-carrying capacity analysis, room temperature sulphur
The aspects such as SiClx rubber cast, the conceptual model that can be deposited, airduct test, quick cast model.3D light-cured resins in contrast to
Conventional thermoplastic's 3D printing material, short (be its 1/20) with the time-write interval, product surface is smooth without wire drawing, and quality is full, produces
Product surface is fine and smooth, many advantages, such as can be used for biomaterial.
Photocuring system has the advantages that pollution-free, non-toxic, non-stimulated and production safety, is more active at present grinding
Study carefully and development field, oneself turns into one of main development direction of UV-curing technology.3D printing is alternatively referred to as increasing material manufacturing skill
Art, the appearance of 3D printing makes manufacture complex parts become easily and quickly.At present, the 3D printing technique of comparative maturity mainly has
" fuse deposition rapid forming ", " quires layer rapid shaping ", " selective laser sintering rapid forming " and " stereolithography is rapid-result soon
Type ".Earliest, it is stereolithography rapid shaping to be most widely used for industrial 3D printing technique, and it is purple using computer controls
Outer laser presses the shape point by point scanning of two-dimensional section on photosensitive resin liquid level, makes resin solidification, and the resin after solidification is just formed
One X-Y scheme, so successively scans, solidification, and final is that can obtain complete 3D solid (to be commonly called as:Part).Part quality
Quality depend primarily on the quality of photosensitive resin performance, the good photosensitive resin of exploitation performance is 3D printing, and three-dimensional printing is quick
Forming technique study hotspot.Three-dimensional Quick-forming 3D printing technique with photosensitive resin as raw material, with low cost, high precision,
The advantages of being molded fast, is widely used in every field.
The content of the invention
Rapid shaping light-cured resin of 3D printing and preparation method thereof is applied to it is an object of the invention to provide a kind of.
The consumptive material for solving current 3D printing DLP, SLA equipment relies on the present situation of import substantially, further solves 3D printing material
Cost problem high so that China's 3D printing light-cured resin is no longer dependent on import, with great scientific meaning and
Application value.And preparation method is simple, easy to operate, yield is high.
The technical solution adopted by the present invention is：
A kind of 3D printing rapid shaping photocurable resin material, including following raw material is made by weight ratio：Polymerization
Monomer 10-99 parts, lubricant 0.5-1 parts, auxiliary curing agent 10-81 parts, light trigger 1-6 parts, polymerization inhibitor 0.1-0.5 parts.
A kind of described 3D printing rapid shaping photocurable resin material, described polymerized monomer is epoxy acrylic tree
Fat and/or urethane acrylate.
A kind of described 3D printing rapid shaping photocurable resin material, described auxiliary curing agent is the hex- 3- first of 1- penta
Base imidazoles perrhenate, 1- amyl group -3- methylimidazoles acetate, polyethylene glycol (400) diacrylate, trihydroxy first propane three
The combination of one or two or more kinds in acrylate, tri (propylene glycol) diacrylate.
A kind of described 3D printing rapid shaping photocurable resin material, described auxiliary curing agent is by the hex- 3- first of 1- penta
Base imidazoles perrhenate, 1- amyl group -3- methylimidazole acetate, polyethylene glycol (400) diacrylate, trimethylolpropane tris
Methacrylate and tri (propylene glycol) diacrylate 0.1-0.2 by ratio of weight and the number of copies：0.1-0.2：10-30：5-20：
The ratio composition of 10-30
A kind of described 3D printing rapid shaping photocurable resin material, the light trigger is 2,4,6- trimethylbenzenes
Double (the 2,4,6- trimethylbenzene first of Fonnylphenyl phosphinic acid ethyl ester, (2,4,6- trimethylbenzoyls) diphenyl phosphine oxide, phenyl
Acyl group) combination of one or two or more kinds in phosphine oxide.
A kind of described 3D printing rapid shaping photocurable resin material, the light trigger by 2,4,6- trimethylbenzenes
Fonnylphenyl phosphinic acid ethyl ester and double (2,4,6- trimethylbenzoyls) phosphine oxides by ratio of weight and the number of copies 1 of phenyl:1 ratio group
Into.
A kind of described 3D printing rapid shaping photocurable resin material, described lubricant is zinc stearate, silicic acid
Ester, paraffin or it is stearic one or two or more kinds.
A kind of described 3D printing rapid shaping photocurable resin material, described polymerization inhibitor is for phenol and/or to first
Epoxide phenol.
A kind of 3D printing preparation method of rapid shaping photocurable resin material, comprises the following steps：
1) by polymerized monomer addition reactor, nitrogen is passed through, is stirred, 50-80 DEG C of controlling reaction temperature；
2) 80-100 DEG C is warming up to auxiliary curing agent and lubricant is slowly added in reactor again, is stirred；
3) and then to being slowly added to light trigger and polymerization inhibitor in reactor, keeping temperature, stirring reaction is after 0.5 hour,
Reaction terminates, cooling, obtains target product.
A kind of application of the described 3D printing with rapid shaping photocurable resin material in 3D printer.
The beneficial effects of the invention are as follows：3D printing rapid shaping light-cured resin of the invention, preparation technology has method
Simply, easy to operate, yield is high, the advantages of environmental pollution is small.The present invention solves the conjunction of 3D printing rapid shaping light-cured resin
Into difficulty, the problem of low yield, and further solve that 3D printing resin cost is high, the halfway problem of curing reaction, from
And cause that China's 3D printing resin is no longer dependent on import, with great scientific meaning and application value.
Specific embodiment
A kind of 3D printing rapid shaping photocurable resin material, is made up by weight ratio of following raw material：
The above-mentioned 3D printing preparation method of rapid shaping photocurable resin material, comprises the following steps：
1) in the reactor equipped with agitator, condenser, thermometer and charging spout, add epoxy acrylic resin and gather
Urethane acrylate, is passed through nitrogen, stirs, and is slowly added dropwise polyethylene glycol (400) diacrylate, controlling reaction temperature
50-80 DEG C, continue to stir after completion of dropping；
2) trimethylol-propane trimethacrylate, tri (propylene glycol) diacrylate, the hex- 3- of 1- penta are slowly added to
Methylimidazole perrhenate, 1- amyl group -3- methylimidazole acetate, zinc stearate is warming up to 80-100 DEG C, stirs；
3) 2,4,6- trimethylbenzoyl phenyl phosphinic acid ethyl esters, double (2,4, the 6- trimethylbenzoyls of phenyl are slowly added to
Base) phosphine oxide, p methoxy phenol, keeping temperature, after 0.5 hour, reaction terminates stirring reaction, cooling, obtains target product.
A kind of 3D printing rapid shaping photocurable resin material of embodiment 1
(1) it is made up by weight ratio of following raw material：25 parts of epoxy acrylic resin, 20 parts of urethane acrylate,
20 parts of polyethylene glycol (400) diacrylate, 15 parts of trimethylol-propane trimethacrylate, the propylene of tripropylene glycol two
25 parts of acid esters, 0.5 part of zinc stearate, 0.1 part of the hex- 3- methylimidazoles perrhenates of 1- penta, 2,4,6- trimethylbenzoyl benzene
1 part of base phosphinic acid ethyl ester, double 1 part of (2,4, the 6- trimethylbenzoyl) phosphine oxides of phenyl, 0.2 part of p methoxy phenol.
(2) preparation method
1) in the reactor equipped with agitator, condenser, thermometer and charging spout, add epoxy acrylic resin and gather
Urethane acrylate, is passed through nitrogen, stirs, and is slowly added dropwise polyethylene glycol (400) diacrylate, controlling reaction temperature 70
DEG C, continue to stir after completion of dropping；
2) it is slowly added to trimethylol-propane trimethacrylate, tri (propylene glycol) diacrylate, zinc stearate,
The hex- 3- methylimidazole perrhenates of 1- penta, are warming up to 90 DEG C, stir；
3) 2,4,6- trimethylbenzoyl phenyl phosphinic acid ethyl esters, double (2,4, the 6- trimethylbenzoyls of phenyl are slowly added to
Base) phosphine oxide, p methoxy phenol, keeping temperature, after 0.5 hour, reaction terminates stirring reaction, cooling, obtains target product.
(3) testing result
Product is clear pale yellow color thick liquid, density:1.08-1.13g/cm3, boiling point before solidification:>100 DEG C, before solidification
Flash-point:>100 DEG C, viscosity before solidification:700-950CPS(25℃).
(4) apply
Prepared 3D printing is injected in the liquid bath of printer with rapid shaping light-cured resin, treats that its liquid level flows naturally
After flat, start printing.The product that this resin is printed, quality is full, and hardness is higher, and surface is fine and smooth, existing without wire drawing
As will not further solidify after printing is complete.
A kind of 3D printing rapid shaping photocurable resin material of embodiment 2
(1) it is made up by weight ratio of following raw material：50 parts of epoxy acrylic resin, 10 parts of urethane acrylate,
30 parts of polyethylene glycol (400) diacrylate, 20 parts of trimethylol-propane trimethacrylate, the propylene of tripropylene glycol two
30 parts of acid esters, 0.5 part of zinc stearate, 0.2 part of the hex- 3- methylimidazoles perrhenates of 1- penta, 2,4,6- trimethylbenzoyl benzene
2 parts of base phosphinic acid ethyl ester, double 1 part of (2,4, the 6- trimethylbenzoyl) phosphine oxides of phenyl, 0.3 part of p methoxy phenol.
(2) preparation method
With embodiment 1.
(3) testing result
Product is clear pale yellow color thick liquid, density:1.08-1.13g/cm3, boiling point before solidification:>100 DEG C, before solidification
Flash-point:>100 DEG C, viscosity before solidification:760-1050CPS(25℃).
(4) apply
Prepared 3D printing is injected in the liquid bath of printer with rapid shaping light-cured resin, treats that its liquid level flows naturally
After flat, start printing.The product that this resin is printed, quality is full, and hardness is higher, and surface is fine and smooth, existing without wire drawing
As will not further solidify after printing is complete.
Claims (10)
1. a kind of 3D printing rapid shaping photocurable resin material, it is characterised in that including following raw material by weight ratio
It is made：Polymerized monomer 10-99 parts, lubricant 0.5-1 parts, auxiliary curing agent 10-81 parts, light trigger 1-6 parts, polymerization inhibitor 0.1-
0.5 part.
2. a kind of 3D printing rapid shaping photocurable resin material as claimed in claim 1, it is characterised in that described is poly-
It is epoxy acrylic resin and/or urethane acrylate to close monomer.
3. a kind of 3D printing rapid shaping photocurable resin material as claimed in claim 1, it is characterised in that described consolidates
It is the hex- 3- methylimidazoles perrhenates of 1- penta, 1- amyl group -3- methylimidazoles acetate, the propylene of polyethylene glycol (400) two to change auxiliary agent
The combination of one or two or more kinds in acid esters, trihydroxy first propane triacrylate, tri (propylene glycol) diacrylate.
4. a kind of 3D printing rapid shaping photocurable resin material as described in claim 1 or 3, it is characterised in that described
Auxiliary curing agent by the hex- 3- methylimidazole perrhenates of 1- penta, 1- amyl group -3- methylimidazole acetate, polyethylene glycol (400) two
Acrylate, trimethylol-propane trimethacrylate and tri (propylene glycol) diacrylate 0.1- by ratio of weight and the number of copies
0.2：0.1-0.2：10-30：5-20：The ratio composition of 10-30.
5. a kind of 3D printing rapid shaping photocurable resin material as claimed in claim 1, it is characterised in that the light draws
Hair agent is 2,4,6- trimethylbenzoyl phenyls phosphinic acid ethyl ester, (2,4,6- trimethylbenzoyls) diphenyl phosphine oxide, benzene
The combination of one or two or more kinds in double (2,4,6- trimethylbenzoyls) phosphine oxides of base.
6. a kind of 3D printing rapid shaping photocurable resin material as described in claim 1 or 5, it is characterised in that described
Light trigger is aoxidized by 2,4,6- trimethylbenzoyl phenyls phosphinic acid ethyl ester and phenyl double (2,4,6- trimethylbenzoyls)
Phosphine by ratio of weight and the number of copies 1:1 ratio composition.
7. a kind of 3D printing rapid shaping photocurable resin material as claimed in claim 1, it is characterised in that described profit
Lubrication prescription be zinc stearate, esters of silicon acis, paraffin or it is stearic one or two or more kinds.
8. a kind of 3D printing rapid shaping photocurable resin material as claimed in claim 1, it is characterised in that described resistance
Poly- agent is phenol and/or p methoxy phenol.
9. a kind of 3D printing as claimed in claim 1 preparation method of rapid shaping photocurable resin material, it is characterised in that
Comprise the following steps：
1) by polymerized monomer addition reactor, nitrogen is passed through, is stirred, 50-80 DEG C of controlling reaction temperature；
2) 80-100 DEG C is warming up to auxiliary curing agent and lubricant is slowly added in reactor again, is stirred；
3) and then to light trigger and polymerization inhibitor is slowly added in reactor, keeping temperature, stirring reaction is reacted after 0.5 hour
Terminate, cooling obtains target product.
10. a kind of rapid shaping photocurable resin material of the 3D printing as described in claim 1-8 in 3D printer should
With.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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