CN106747222A - A kind of heat sink material and preparation method thereof - Google Patents
A kind of heat sink material and preparation method thereof Download PDFInfo
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- CN106747222A CN106747222A CN201611100916.XA CN201611100916A CN106747222A CN 106747222 A CN106747222 A CN 106747222A CN 201611100916 A CN201611100916 A CN 201611100916A CN 106747222 A CN106747222 A CN 106747222A
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- paraffin
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- sink material
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/24—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing alkyl, ammonium or metal silicates; containing silica sols
- C04B28/26—Silicates of the alkali metals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
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- Thermal Sciences (AREA)
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Abstract
The invention discloses a kind of heat sink material and preparation method thereof, it is made up of following mass fraction formula components：14 16 parts of graphite, 13 parts of vulcanizing agent, 12 parts of hexagonal boron nitride, 10 12 parts of carbon fiber, 13 parts of cristobalite, 15 25 parts of silica gel, 57 parts of polyamide, 15 25 parts of carbon nano-fiber, 68 parts of heat conduction viscose, 15 25 parts of kaolin, 68 parts of borazon, 8 12 parts of paraffin, 12 14 parts of paraffin, 24 parts of water-soluble silicate, the present invention has preparation convenient, simple production process, the advantage of good heat dissipation effect.
Description
Technical field
The present invention relates to heat sink material field, in particular to a kind of heat sink material and preparation method thereof.
Background technology
Heat dissipation film, that is, be used in one layer of film of heat conduction and heat radiation above the electronic devices such as mobile phone, panel computer, in the industry greatly
Cause is divided into four kinds：Native graphite, electrographite graphite is dilute and CNT heat dissipation film.The scattered price of native graphite is very cheap, but
Radiating effect is undesirable.The dilute good heat dissipation effect of graphite, but too expensive, thousands of units easily.
Radiating membrane material in the market is essentially all to utilize graphite flake, using graphite high heat conduction, high-cooling property
Can, reach the cooling requirements of electronic device.But because graphite is conductive material, and graphite is form of powdery particles article.As directly
Attached in electronic product surface radiating using graphite flake, powdered graphite can drop to electronic product the inside, cause electronic product short
Road.
The content of the invention
In order to solve the defect of prior art, the present invention provides a kind of formula of Novel heat dissipation material and preparation method thereof,
Convenient, simple production process, the advantage of good heat dissipation effect with preparing.
The invention provides a kind of heat sink material and preparation method thereof, one kind of the present invention is coated on metal surface material, energy
Enough strengthen the heat conductivility and radiance of metal, docile is reached for electronic product cooling on electronic product surface, and radiating is made
With.
To achieve the above object, the present invention provides following technical scheme：
A kind of heat sink material and preparation method thereof, is made up of following mass fraction formula components：Graphite 14-16 parts, vulcanization
Agent 1-3 parts, hexagonal boron nitride 1-2 parts, carbon fiber 10-12 parts, cristobalite 1-3 parts, silica gel 15-25 parts, polyamide 5-7 parts, receive
15-25 parts of carbon fiber of rice, 6-8 parts of heat conduction viscose, kaolin 15-25 parts, borazon 6-8 parts, paraffin 8-12 parts, paraffin 12-
14 parts, water-soluble silicate 2-4 parts.
Further：It is made up of following mass fraction formula components：14 parts of graphite, 1 part of vulcanizing agent, 1 part of hexagonal boron nitride, carbon
10 parts of fiber, 1 part of cristobalite, 15 parts of silica gel, 5 parts of polyamide, 15 parts of carbon nano-fiber, 6 parts of heat conduction viscose, 15 parts of kaolin,
6 parts of borazon, 8 parts of paraffin, 12 parts of paraffin, 2 parts of water-soluble silicate.
Further：It is made up of following mass fraction formula components：15 parts of graphite, 2 parts of vulcanizing agent, 1.5 parts of hexagonal boron nitride,
11 parts of carbon fiber, 2 parts of cristobalite, 20 parts of silica gel, polyamide 6 part, 20 parts of carbon nano-fiber, 7 parts of heat conduction viscose, kaolin 20
Part, 7 parts of borazon, 10 parts of paraffin, 13 parts of paraffin, 3 parts of water-soluble silicate.
Further：It is made up of following mass fraction formula components：16 parts of graphite, 3 parts of vulcanizing agent, 2 parts of hexagonal boron nitride, carbon
12 parts of fiber, 3 parts of cristobalite, 25 parts of silica gel, 7 parts of polyamide, 25 parts of carbon nano-fiber, 8 parts of heat conduction viscose, 25 parts of kaolin,
8 parts of borazon, 12 parts of paraffin, 14 parts of paraffin, 4 parts of water-soluble silicate.
Further：Preparation method of the present invention has following steps：
Step one, heat sink material is sprayed on base material, entered in high temperature sintering casing by streamline；
Step 2, radiating sinter box body in, 3~5 hours high-temperature heatings are carried out by A.T.C system；
Step 3, sub-cooled, time are carried out again：Aftershaping both obtains finished product within 1.5~2.5 hours.
The beneficial effects of the invention are as follows：One kind of the present invention is coated on metal surface material, can strengthen the thermal conductivity of metal
Energy and radiance, docile are reached for electronic product cooling, thermolysis on electronic product surface.
Specific embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of protection of the invention.
Embodiment one：
A kind of heat sink material is made up of following mass fraction formula components：Graphite 14-16 parts, vulcanizing agent 1-3 parts, six side's nitrogen
Change 1-2 parts of boron, carbon fiber 10-12 parts, cristobalite 1-3 parts, silica gel 15-25 parts, polyamide 5-7 parts, carbon nano-fiber 15-25
Part, 6-8 parts of heat conduction viscose, kaolin 15-25 parts, borazon 6-8 parts, paraffin 8-12 parts, paraffin 12-14 parts, water-soluble silicon
Hydrochlorate 2-4 parts.
Embodiment two：
A kind of heat sink material is made up of following mass fraction formula components：14 parts of graphite, 1 part of vulcanizing agent, hexagonal boron nitride 1
Part, 10 parts of carbon fiber, 1 part of cristobalite, 15 parts of silica gel, 5 parts of polyamide, 15 parts of carbon nano-fiber, 6 parts of heat conduction viscose, kaolin
15 parts, 6 parts of borazon, 8 parts of paraffin, 12 parts of paraffin, 2 parts of water-soluble silicate.
Embodiment three：
A kind of heat sink material is made up of following mass fraction formula components：15 parts of graphite, 2 parts of vulcanizing agent, hexagonal boron nitride
1.5 parts, 11 parts of carbon fiber, 2 parts of cristobalite, 20 parts of silica gel, polyamide 6 part, 20 parts of carbon nano-fiber, 7 parts of heat conduction viscose, kaolinite
20 parts of soil, 7 parts of borazon, 10 parts of paraffin, 13 parts of paraffin, 3 parts of water-soluble silicate.
Example IV：
A kind of heat sink material is made up of following mass fraction formula components：16 parts of graphite, 3 parts of vulcanizing agent, hexagonal boron nitride 2
Part, 12 parts of carbon fiber, 3 parts of cristobalite, 25 parts of silica gel, 7 parts of polyamide, 25 parts of carbon nano-fiber, 8 parts of heat conduction viscose, kaolin
25 parts, 8 parts of borazon, 12 parts of paraffin, 14 parts of paraffin, 4 parts of water-soluble silicate.
Embodiment five：
A kind of preparation method preparation method of heat sink material comprises the following steps：
Step one, heat sink material is sprayed on base material, entered in high temperature sintering casing by streamline；
Step 2, radiating sinter box body in, 3~5 hours high-temperature heatings are carried out by A.T.C system；
Step 3, sub-cooled, time are carried out again：Aftershaping both obtains finished product within 1.5~2.5 hours.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each implementation method is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Specification an as entirety, the technical scheme in each embodiment can also be formed into those skilled in the art through appropriately combined
May be appreciated other embodiment.
Claims (5)
1. a kind of heat sink material, it is characterised in that：It is made up of following mass fraction formula components：
Graphite 14-16 parts, vulcanizing agent 1-3 parts, hexagonal boron nitride 1-2 parts, carbon fiber 10-12 parts, cristobalite 1-3 parts, silica gel 15-
25 parts, polyamide 5-7 parts, carbon nano-fiber 15-25 parts, 6-8 parts of heat conduction viscose, kaolin 15-25 parts, borazon 6-8 parts,
Paraffin 8-12 parts, paraffin 12-14 parts, water-soluble silicate 2-4 parts.
2. a kind of heat sink material according to claim 1, it is characterised in that：It is made up of following mass fraction formula components：
14 parts of graphite, 1 part of vulcanizing agent, 1 part of hexagonal boron nitride, 10 parts of carbon fiber, 1 part of cristobalite, 15 parts of silica gel, 5 parts of polyamide,
15 parts of carbon nano-fiber, 6 parts of heat conduction viscose, 15 parts of kaolin, 6 parts of borazon, 8 parts of paraffin, 12 parts of paraffin, water-soluble silicic acid
2 parts of salt.
3. a kind of heat sink material according to claim 1, it is characterised in that：It is made up of following mass fraction formula components：
15 parts of graphite, 2 parts of vulcanizing agent, 1.5 parts of hexagonal boron nitride, 11 parts of carbon fiber, 2 parts of cristobalite, 20 parts of silica gel, polyamide 6
Part, 20 parts of carbon nano-fiber, 7 parts of heat conduction viscose, 20 parts of kaolin, 7 parts of borazon, 10 parts of paraffin, 13 parts of paraffin, water solubility
3 parts of silicate.
4. a kind of heat sink material according to claim 1, it is characterised in that：It is made up of following mass fraction formula components：
16 parts of graphite, 3 parts of vulcanizing agent, 2 parts of hexagonal boron nitride, 12 parts of carbon fiber, 3 parts of cristobalite, 25 parts of silica gel, 7 parts of polyamide,
25 parts of carbon nano-fiber, 8 parts of heat conduction viscose, 25 parts of kaolin, 8 parts of borazon, 12 parts of paraffin, 14 parts of paraffin, water-soluble silicon
4 parts of hydrochlorate.
5. a kind of a kind of preparation method of heat sink material according to claim 1, it is characterised in that：Comprise the following steps：
Step one, heat sink material is sprayed on base material, entered in high temperature sintering casing by streamline；
Step 2, radiating sinter box body in, 3~5 hours high-temperature heatings are carried out by A.T.C system；
Step 3, sub-cooled, time are carried out again：Aftershaping both obtains finished product within 1.5~2.5 hours.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611100916.XA CN106747222A (en) | 2016-12-05 | 2016-12-05 | A kind of heat sink material and preparation method thereof |
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| CN201611100916.XA CN106747222A (en) | 2016-12-05 | 2016-12-05 | A kind of heat sink material and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101899289A (en) * | 2009-05-31 | 2010-12-01 | 鸿富锦精密工业（深圳）有限公司 | Wave-absorbing heat dissipation material |
| CN103402342A (en) * | 2013-07-29 | 2013-11-20 | 江西祥能科技有限公司 | Cooling material |
| CN103725019A (en) * | 2012-10-16 | 2014-04-16 | 神讯电脑(昆山)有限公司 | Heat dissipating material and preparation method thereof |
| CN104691042A (en) * | 2015-03-27 | 2015-06-10 | 东莞市闻誉实业有限公司 | Novel heat dissipation material |
| CN104694086A (en) * | 2013-12-04 | 2015-06-10 | 苏州环明电子科技有限公司 | Formula and preparation method for novel heat-dissipation material |
-
2016
- 2016-12-05 CN CN201611100916.XA patent/CN106747222A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101899289A (en) * | 2009-05-31 | 2010-12-01 | 鸿富锦精密工业（深圳）有限公司 | Wave-absorbing heat dissipation material |
| CN103725019A (en) * | 2012-10-16 | 2014-04-16 | 神讯电脑(昆山)有限公司 | Heat dissipating material and preparation method thereof |
| CN103402342A (en) * | 2013-07-29 | 2013-11-20 | 江西祥能科技有限公司 | Cooling material |
| CN104694086A (en) * | 2013-12-04 | 2015-06-10 | 苏州环明电子科技有限公司 | Formula and preparation method for novel heat-dissipation material |
| CN104691042A (en) * | 2015-03-27 | 2015-06-10 | 东莞市闻誉实业有限公司 | Novel heat dissipation material |
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