CN106744979A - A kind of method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar - Google Patents
A kind of method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar Download PDFInfo
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- CN106744979A CN106744979A CN201710004763.7A CN201710004763A CN106744979A CN 106744979 A CN106744979 A CN 106744979A CN 201710004763 A CN201710004763 A CN 201710004763A CN 106744979 A CN106744979 A CN 106744979A
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- Prior art keywords
- mortar
- reclaimed
- purity silicon
- waste mortar
- solid
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/037—Purification
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
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- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Abstract
The method that HIGH-PURITY SILICON is reclaimed in a kind of polysilicon cutting waste mortar of the present invention, comprises the following steps:Step 1, carries out, except iron treatment, obtaining except the mortar after iron first by magnetic method to waste mortar;Step 2, adds thinner in the mortar obtained to step 1, and is stirred, and reacts 13 hours;Step 3, the mortar obtained to step 2 by suction method carries out separation of solid and liquid, after precipitation, takes bottom solid;Step 4, the solid isolated to step 3 is washed with water;Step 5, to being purified by the solid after step 4 washing, obtains HIGH-PURITY SILICON.Polysilicon cutting liquid is reclaimed using processing method of the invention and utilization can be obtained certain economic benefit, and reached the purpose of energy-conserving and environment-protective.
Description
Technical field
The present invention relates to technical field of polysilicon production, more particularly to a kind of recovery method of polysilicon cutting liquid waste liquid.
Background technology
Polysilicon is during being cut, it is necessary to using hardness is high, granularity is small and centralized particle diameter carborundum is micro-
Powder is used as main Cutting Medium.To make silicon carbide micro-powder be uniformly dispersed in working angles, while working angles can be taken away in time
The huge frictional heat of middle generation, generally needs that first carbonization micro mist is added to polyethylene glycol as primary raw material according to a certain percentage
Water solubility or oil-soluble solar silicon wafers cutting liquid in, it is and fully dispersed, used again after being configured to uniform and stable cutting mortar
In silicon chip cutting.Whole cutting process proposes high requirement and technical standard to the quality of solar silicon wafers cutting liquid.By
In solar silicon wafers cutting liquid be with wellability is good, that row cuts ability is strong and have excellent dispersing characteristic to carborundum class abrasive material
Polyethylene glycol groups or oil base are the synthetic of main component, thus polyethylene glycol performance characteristics to silicon chip cutting fluid in itself, with
And the process of silicon chip plays an important role.
After cutting liquid is used, wherein the polyethylene glycol for containing and silicon carbide micro-powder are hesitated to discard, so the recovery to it
Purification is just particularly important, and can substantially reduce the cutting cost of enterprise using the cutting liquid for reclaiming purification, silicon carbide micro-powder
Also there is extensive use, can be circulated benignly in the development of enterprise.Recycling turns waste into wealth, and benefits the nation, favorable to the people, sharp enterprise.
The content of the invention
Goal of the invention:In order to overcome the deficiencies in the prior art, the present invention to provide a kind of polysilicon cutting liquid waste liquid
The treatment recovery method of middle mortar.
Technical scheme:To achieve the above object, the technical solution adopted by the present invention is:
A kind of method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar, comprises the following steps:
Step 1, carries out, except iron treatment, obtaining except the mortar after iron first by magnetic method to waste mortar;
Step 2, adds thinner in the mortar obtained to step 1, and is stirred, and reacts 1-3 hour;
Step 3, the mortar obtained to step 2 by suction method carries out separation of solid and liquid, after precipitation, takes bottom solid;
Step 4, the solid isolated to step 3 is washed with water;
Step 5, to being purified by the solid after step 4 washing, obtains HIGH-PURITY SILICON.
In step 1, magnetic method is carried out to waste mortar except magnetic field intensity is 0.6-0.8T when iron is processed.
In step 2, thinner is water or ethanol.
The addition of thinner is 1-1.5 times of mortar volume.
In step 5, purification uses floatation or settled process.
The floatation is:Particle loaded fluid and calcium chloride solution are mixed, centrifuge is put into.
Beneficial effect:Contained HIGH-PURITY SILICON, the simple in production process operation, the rate of recovery in the extractable waste mortar of this technique
Height, profit is considerable.Wastewater discharge in process of production is few, conditional recyclable, unconditional to do at sewage
Reason.Polysilicon cutting liquid is reclaimed and utilization can be obtained certain economic benefit, and reached the mesh of energy-conserving and environment-protective
's.
Specific embodiment
With reference to specific embodiment, the present invention will be further described.
A kind of method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar, comprises the following steps:
Step 1, carries out, except iron treatment, obtaining except the mortar after iron first by magnetic method to waste mortar;
Step 2, adds thinner in the mortar obtained to step 1, and is stirred, and reacts 1-3 hour;
Step 3, the mortar obtained to step 2 by suction method carries out separation of solid and liquid, after precipitation, takes bottom solid;
Step 4, the solid isolated to step 3 is washed with water;
Step 5, to being purified by the solid after step 4 washing, obtains HIGH-PURITY SILICON.
In step 1, magnetic method is carried out to waste mortar except magnetic field intensity is 0.6-0.8T when iron is processed.
In step 2, thinner is water or ethanol.
The addition of thinner is 1-1.5 times of mortar volume.
In step 5, purification uses floatation or settled process.
The floatation is:Particle loaded fluid and calcium chloride solution are mixed, centrifuge is put into.
The above is only the preferred embodiment of the present invention, it should be pointed out that:For the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (6)
1. a kind of method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar, it is characterised in that comprise the following steps:
Step 1, carries out, except iron treatment, obtaining except the mortar after iron first by magnetic method to waste mortar;
Step 2, adds thinner in the mortar obtained to step 1, and is stirred, and reacts 1-3 hour;
Step 3, the mortar obtained to step 2 by suction method carries out separation of solid and liquid, after precipitation, takes bottom solid;
Step 4, the solid isolated to step 3 is washed with water;
Step 5, to being purified by the solid after step 4 washing, obtains HIGH-PURITY SILICON.
2. the method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar as claimed in claim 1, it is characterised in that in step 1,
Magnetic method is carried out to waste mortar except magnetic field intensity is 0.6-0.8T when iron is processed.
3. the method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar as claimed in claim 1, it is characterised in that in step 2,
Thinner is water or ethanol.
4. the method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar as claimed in claim 3, it is characterised in that thinner
Addition is 1-1.5 times of mortar volume.
5. the method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar as claimed in claim 1, it is characterised in that in step 5,
Purification uses floatation or settled process.
6. the method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar as claimed in claim 5, it is characterised in that the flotation
Method is:Particle loaded fluid and calcium chloride solution are mixed, centrifuge is put into.
Priority Applications (1)
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CN201710004763.7A CN106744979A (en) | 2017-01-04 | 2017-01-04 | A kind of method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar |
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CN201710004763.7A CN106744979A (en) | 2017-01-04 | 2017-01-04 | A kind of method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar |
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CN201710004763.7A Pending CN106744979A (en) | 2017-01-04 | 2017-01-04 | A kind of method that HIGH-PURITY SILICON is reclaimed in polysilicon cutting waste mortar |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114407214A (en) * | 2022-01-28 | 2022-04-29 | 广东高景太阳能科技有限公司 | Automatic regulating system for concentration of large-size silicon wafer cutting mortar liquid |
-
2017
- 2017-01-04 CN CN201710004763.7A patent/CN106744979A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114407214A (en) * | 2022-01-28 | 2022-04-29 | 广东高景太阳能科技有限公司 | Automatic regulating system for concentration of large-size silicon wafer cutting mortar liquid |
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PB01 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170531 |
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WD01 | Invention patent application deemed withdrawn after publication |