CN106738641A - A kind of new microfluidic chip mould and method - Google Patents
A kind of new microfluidic chip mould and method Download PDFInfo
- Publication number
- CN106738641A CN106738641A CN201611099080.6A CN201611099080A CN106738641A CN 106738641 A CN106738641 A CN 106738641A CN 201611099080 A CN201611099080 A CN 201611099080A CN 106738641 A CN106738641 A CN 106738641A
- Authority
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- China
- Prior art keywords
- guide pillar
- push rod
- core rod
- cylinder
- matched moulds
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 30
- -1 dimethyl radical siloxane Chemical class 0.000 claims abstract description 22
- 238000000465 moulding Methods 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 238000007493 shaping process Methods 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 239000006227 byproduct Substances 0.000 claims 2
- 239000000047 product Substances 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000004134 energy conservation Methods 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910021389 graphene Inorganic materials 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7331—Heat transfer elements, e.g. heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention proposes a kind of new microfluidic chip mould and method, belongs to micro Process field.The mould mainly includes molding assembly, demoulding component, matched moulds cylinder, fixed support, M5 × 15 hexagon-headed bolt, guide pillar, guide pillar connecting plate, M5 × 30 hexagon-headed bolt, temperature controller, moving platen, estrade, backform cylinder, push rod push pedal, core rod fixed block, push rod, spring housing, copper briquetting, core rod, dc source.The forming method of the new microfluidic chip is：Matched moulds, mold cavity is injected by liquid dimethyl radical siloxane；Mold cavity surface is heated using dc source；Product solidifies, and demoulding component ejects product after die sinking；Product is obtained after removal charge bar, overlap.The characteristics of micro-fluidic chip novel forming method has energy-conservation, safety, formed precision high.
Description
Technical field
The invention belongs to micro Process field, it is related to a kind of Novel hot imprinting moulding technology and equipment, application field mainly to have：
The fields such as micron/nano processing, microelectronics, material science, optics, microelectromechanical systems, surface chemistry.
Background technology
In recent years by microstructural articles are applied by more industries, sharply increase its demand, required precision
More and more higher, existing microstructural articles shaping is mostly the method that hot padding is carried out using final polymer at present, and is used
Thermoplastic polymer, its general principle is：Polymer matrix film is heated to more than its glass transition temperature first, then in a level pressure
In the presence of power, impressing mould is pressed on polymer matrix film, in making micro-structural of the polymer-filled to mould, cooling and shaping
The demoulding afterwards, reaches the purpose of graph copying transfer.But there are the following problems to carry out hot padding using thermoplastic polymer：Impressing
Need under conditions of HTHP realize, even and if under conditions of high temperature, high pressure, may still result in polymer can not
It is filled up completely with cavity；Material heating cool time is long when press mold material does not have a sufficiently high thermal conductivity.Because these problems are deposited
So that the extensive use of polymer hot press printing technology is restricted.Dimethyl silicone polymer inertia, nontoxic, nonflammable, tool
There is good optical characteristics, good insulating properties is often applied to micro-structural with micro-fluidic field.
The content of the invention
The deficiency present invention for existing hot pressing printing apparatus provides a kind of hot padding forming method of graphite ene coatings heating,
In being injected into the dimethyl silicone polymer of liquid with micro-structural and plate the silicon mould of a layer graphene, using Graphene
The characteristics of high conductivity and low sheet resistance, makes liquid under the driving of dc source only to the graphite ene coatings heating of mould
Dimethyl siloxane curing molding product, this method heated by graphite ene coatings substantially shortens the technique week of impressing
Phase, the former for simplifying hot padding, improve the efficiency of hot padding, greatly save the energy.And due to silicon face ratio
More smooth, mobile performance is preferable in a mold for the dimethyl siloxane of liquid, and micro-structural is easy to filling, and duplication degree is high, and solidification
Product afterwards is easy to the demoulding, and micro-structural is difficult to be damaged.
The technical scheme for being used to achieve the above object is：A kind of new microfluidic chip mould, mainly includes：
Molding assembly, demoulding component, matched moulds cylinder, fixed support, M5 × 15 hexagon-headed bolt, guide pillar, guide pillar connecting plate, M5 × 30 6
Hex bolt, temperature controller, moving platen, estrade, backform cylinder, push rod push pedal, core rod fixed block, push rod, spring housing, copper pressure
Block, core rod, dc source.Wherein molding assembly includes：Core rod fixed block, core rod, copper briquetting, core rod are embedded in core rod fixed block
The latter half, the top half that copper briquetting is placed on core rod in core rod fixed block compresses core rod；Demoulding component includes：Backform cylinder,
Push rod push pedal, push rod, spring housing, the cylinder cap of backform cylinder are connected by bolt with below fixed support, the work of matched moulds cylinder
Stopper rod is connected through a screw thread with push rod push pedal, and one end of push rod loads the ejection hole of core rod, and spring housing is filled after being located at push rod one end
Enter the ejection passage of core rod；Molding assembly is installed on fixed support, is connected with support bracket fastened side by bolt；Four
The two ends of guide pillar connect guide pillar push pedal and moving platen respectively；The cylinder cap of matched moulds cylinder is by phase above bolt and fixed support
Even, piston rod and the guide pillar push pedal of matched moulds cylinder are connected through a screw thread；Guide pillar is penetrated in the guide hole of guide pillar push pedal and led to moving platen
Cross threaded connection；Electric wire is connected through the wire hole one end on core rod fixed block with copper briquetting, the other end respectively with dc source
It is connected with temperature controller.
In whole micro-fluidic chip mould, molding assembly is installed on support bracket fastened side as clamping
Fixing end, guide pillar one end is installed on the moving platen end of clamping.Guide pillar play the guiding role during matched moulds and die sinking.Into
Moving platen is moved under the drive of guide pillar to molding assembly during type, after the completion of matched moulds, from injection device in mold cavity
Injection liquid polydimethyl siloxane material, completion to be injected sets temperature on temperature controller, opens the switch of dc source,
Mould is heated, after liquid dimethyl radical siloxane solidification after, moving platen guide pillar drive lower open die, backform cylinder drive
Push rod push pedal then promotes push rod to eject product, while spring is compressed, backform cylinder drives push rod push pedal bar to withdraw, spring
Resilience causes that push rod resets.
It is using a kind of method of new microfluidic chip mould manufacture micro-fluidic chip of the invention：
The first step：Liquid dimethyl radical siloxane is placed in evacuator and is vacuumized, vacuum time is 1 ~ 5 hour, it
After take out mixing liquid imported into injection device.
Second step：Mould matched moulds, is injected into mold cavity, after injection terminates by liquid dimethyl radical siloxane by pouring buccal mass
Pressurize, dwell time are carried out until after the shaping of liquid dimethyl radical siloxane cured article.
3rd step：Temperature is set on temperature controller, the switch of dc source is opened, mould is heated,：Treat liquid two
Methylsiloxane curing molding, stops pressurize.
4th step：After pressurize terminates, dc source is closed, backform cylinder drive push rod push pedal promotion knock-pin will after die sinking
Product is ejected.Meanwhile, runner is reclaimed by uncured material, uncured liquid dimethyl radical siloxane is reclaimed to repeat profit
With.
5th step：The charge bar of moulded products is removed, final microstructural articles are obtained.
A kind of hot padding mould of graphite ene coatings heating of the present invention and the beneficial effect of method：
1. using the high conductivity and low sheet resistance of Graphene the characteristics of only heats to the Graphene coating of silicon chip surface,
The efficiency of heating surface is high, and molding cycle is greatly shortened and save energy.
2. heated using dc source, energy-conservation, safety can fully improve active power.
3. silicon chip coating surface is smooth, and liquid dimethyl radical siloxane flow resistance in mold cavity is small, and micro-structural is easy to
It is full of, duplication degree is high.
4. silicon chip coating surface is smooth, and the demoulding is easy to after the solidification of liquid dimethyl radical siloxane, and micro-structural is difficult to be damaged, essence
Degree is high.
Brief description of the drawings:
Fig. 1 is a kind of three dimensional structure diagram of new microfluidic chip mould of the invention.
Fig. 2 is a kind of explosive view of new microfluidic chip mould of the invention.
Fig. 3 is a kind of enlarged drawing of new microfluidic chip molding assembly of the invention.
Fig. 4 is a kind of enlarged drawing of new microfluidic chip demoulding component of the invention.
In figure：1- molding assemblies, 2- demoulding components, 3- matched moulds cylinders, 4- fixed supports, 5-M5 × 15 hexagon-headed bolt,
6- guide pillars, 7- guide pillar connecting plates, 8-M5 × 30 hexagon-headed bolt, 9- temperature controllers, 10- moving platens, 11- M5 × 15 hexagonal
Hook bolt, 12- estrades, 13- backform cylinders, 14- push rod push pedals, 15- core rod fixed blocks, 16- push rods, 17- spring housings, 18- copper
Briquetting, 19- core rods, 20- dc sources.
Specific embodiment:
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the mould mainly includes a kind of new microfluidic chip mould of the present invention：Into
Type component 1, demoulding component 2, matched moulds cylinder 3, fixed support 4, M5X15 hexagon-headed bolts 5 and 11, guide pillar 6, guide pillar connecting plate 7,
M5X30 hexagon-headed bolts 8, temperature controller 9, moving platen 10, estrade 12, backform cylinder 13, push rod push pedal 14, core rod fixed block
15th, push rod 16, spring housing 17, copper briquetting 18, core rod 19, dc source 20.Wherein molding assembly 1 includes：Core rod fixed block 15,
Core rod 19, copper briquetting 18, core rod 19 are embedded in the inner the latter half of core rod fixed block 15, and copper briquetting 18 is placed on the inner mould of core rod fixed block 15
The top half of core compresses core rod；Demoulding component 2 includes：Backform cylinder 13, push rod push pedal 14, push rod 16, spring housing 17, backform
The cylinder cap of cylinder 13 is connected by bolt with below fixed support 4, and piston rod and the push rod push pedal 14 of matched moulds cylinder 3 pass through spiral shell
Line is connected, and one end of push rod 16 loads the ejection hole of core rod 19, and spring housing 17 is located at the ejection of loading core rod 19 behind push rod one end
Passage；Molding assembly 1 is installed on fixed support 4, is connected with the side of fixed support 4 by bolt；Four the two of guide pillar 6
End connects guide pillar push pedal 14 and moving platen 10 respectively；The cylinder cap of matched moulds cylinder 3 is connected by bolt with above fixed support 4,
The piston rod of matched moulds cylinder 3 is connected through a screw thread with guide pillar push pedal 14；Guide pillar 6 is penetrated in the guide hole of guide pillar push pedal and moving platen 10
It is connected through a screw thread；Electric wire is connected through the wire hole one end on core rod fixed block 15 with copper briquetting 18, the other end respectively with directly
Stream power supply 20 is connected with temperature controller 9.
In whole micro-fluidic chip mould, molding assembly 1 is installed on the side of fixed support 4 as clamping
Fixing end, the one end of guide pillar 6 is installed on the moving platen end of clamping.Guide pillar 6 play the guiding role during matched moulds and die sinking.
Moving platen 10 is moved under the drive of guide pillar to molding assembly 1 in forming process, after the completion of matched moulds, from injection device to mould
Injection liquid polydimethyl siloxane material in die cavity, completion to be injected sets temperature on temperature controller, opens dc source 20
Switch, mould is heated, after liquid dimethyl radical siloxane solidification after, moving platen guide pillar drive lower open die, backform
Cylinder 13 drives push rod push pedal 14 then to promote push rod 16 to eject product, while spring housing 17 is compressed, the band of backform cylinder 13
Dynamic push rod push pedal bar 14 withdraws, and the resilience of spring housing 17 causes that push rod 16 resets.
It is using a kind of method of new microfluidic chip mould manufacture micro-fluidic chip of the invention：
The first step：Liquid dimethyl radical siloxane is placed in evacuator and is vacuumized, vacuum time is 1 ~ 5 hour, it
After take out mixing liquid imported into injection device.
Second step：Mould matched moulds, is injected into mold cavity, after injection terminates by liquid dimethyl radical siloxane by pouring buccal mass
Pressurize, dwell time are carried out until after the shaping of liquid dimethyl radical siloxane cured article.
3rd step：Temperature is set on temperature controller, the switch of dc source is opened, mould is heated,：Treat liquid two
Methylsiloxane curing molding, stops pressurize.
4th step：After pressurize terminates, dc source is closed, backform cylinder drive push rod push pedal promotion knock-pin will after die sinking
Product is ejected.Meanwhile, runner is reclaimed by uncured material, uncured liquid dimethyl radical siloxane is reclaimed to repeat profit
With.
5th step：The charge bar of moulded products is removed, final microstructural articles are obtained.
Claims (2)
1. a kind of new microfluidic chip mould, it is characterised in that mainly include：Molding assembly（1）, demoulding component（2）、
Matched moulds cylinder（3）, fixed support（4）, M5 × 15 hexagon-headed bolt（5）With（11）, guide pillar（6）, guide pillar connecting plate（7）、M5×
30 hexagon-headed bolts（8）, temperature controller（9）, moving platen（10）, estrade（12）, backform cylinder（13）, push rod push pedal（14）、
Core rod fixed block（15）, push rod（16）, spring housing（17）, copper briquetting（18）, core rod（19）, dc source（20）；
Wherein molding assembly（1）Including：Core rod fixed block（15）, core rod（19）, copper briquetting（18）, core rod（19）Core rod is embedded in consolidate
Determine block（15）In the latter half, copper briquetting（18）It is placed on core rod fixed block（15）In core rod（19）Top half compress core rod
（19）；Demoulding component（2）Including：Backform cylinder（13）, push rod push pedal（14）, push rod（16）, spring housing（17）, backform cylinder
（13）Cylinder cap pass through M5 × 15 hexagon-headed bolt（5）With fixed support（4）Below be connected, matched moulds cylinder（3）Piston rod
With push rod push pedal（14）It is connected through a screw thread, push rod（16）One end load core rod（19）Ejection hole, spring housing（17）It is located at
Push rod（16）Load core rod behind one end（19）Ejection passage；Molding assembly（1）It is installed on fixed support（4）On, by M5 ×
30 hexagon-headed bolts（8）With fixed support（4）Side be connected；Four guide pillars（6）Two ends connect guide pillar connecting plate respectively（7）
And moving platen（10）；Matched moulds cylinder（3）Cylinder cap pass through M5 × 15 hexagon-headed bolt（11）With fixed support（4）Above phase
Even, matched moulds cylinder（3）Piston rod and guide pillar connecting plate（7）It is connected through a screw thread；Guide pillar（6）Penetrate guide pillar connecting plate（7）'s
In guide hole and moving platen（10）It is connected through a screw thread；Electric wire passes through core rod fixed block（15）On wire hole one end and copper briquetting
（18）Be connected, the other end respectively with dc source（20）And temperature controller（9）It is connected；
In whole micro-fluidic chip mould, molding assembly（1）It is installed on fixed support（4）Side as clamping
Fixing end, guide pillar（6）One end is installed on the moving platen end of clamping；Guide pillar（6）Guiding is played during matched moulds and die sinking
Effect；The moving platen in forming process（10）In guide pillar（6）Drive under to molding assembly（1）It is mobile, after the completion of matched moulds, by noting
Injection device is to injection liquid polydimethyl siloxane material in mold cavity, completion to be injected, in temperature controller（9）Upper setting
Temperature, opens dc source（20）Switch, mould is heated, after liquid dimethyl radical siloxane solidification after, moving platen
（10）In guide pillar（6）Drive lower open die, backform cylinder（13）Drive push rod push pedal（14）Then push rod is promoted（16）By product
Ejection, while spring housing（17）Compressed, backform cylinder（13）Drive push rod push pedal（14）Withdraw, spring housing（17）Resilience is caused
Push rod resets.
2. using a kind of method of the new microfluidic chip mould moulded products described in claim 1, it is characterised in that
The first step：Liquid dimethyl radical siloxane is placed in evacuator and is vacuumized, vacuum time is 1 ~ 5 hour, Zhi Houqu
Go out and mixing liquid is imported into injection device；
Second step：Mould matched moulds, mold cavity is injected into by liquid dimethyl radical siloxane by pouring buccal mass, and injection is carried out after terminating
Pressurize, dwell time are until after the shaping of liquid dimethyl radical siloxane cured article；
3rd step：Temperature is set on temperature controller, the switch of dc source is opened, mould is heated,：Treat liquid dimethyl base
Cured silicone is molded, and stops pressurize；
4th step：After pressurize terminates, dc source is closed, backform cylinder drives push rod push pedal to promote knock-pin by product after die sinking
Ejection；Meanwhile, runner is reclaimed by uncured material, uncured liquid dimethyl radical siloxane is reclaimed to reuse；
5th step：The charge bar of moulded products is removed, final microstructural articles are obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611099080.6A CN106738641A (en) | 2016-12-04 | 2016-12-04 | A kind of new microfluidic chip mould and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611099080.6A CN106738641A (en) | 2016-12-04 | 2016-12-04 | A kind of new microfluidic chip mould and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106738641A true CN106738641A (en) | 2017-05-31 |
Family
ID=58884648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611099080.6A Pending CN106738641A (en) | 2016-12-04 | 2016-12-04 | A kind of new microfluidic chip mould and method |
Country Status (1)
| Country | Link |
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| CN (1) | CN106738641A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108081555A (en) * | 2017-12-28 | 2018-05-29 | 太仓朗盛金属制品有限公司 | A kind of undercut loose-core injection mould and its method of work |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103203837A (en) * | 2013-04-27 | 2013-07-17 | 北京化工大学 | Photo-curing injection molding mould and method |
| CN204604751U (en) * | 2015-04-10 | 2015-09-02 | 北京化工大学 | Based on Graphene coating rapid thermal cycles Coinjection molding apparatus |
-
2016
- 2016-12-04 CN CN201611099080.6A patent/CN106738641A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103203837A (en) * | 2013-04-27 | 2013-07-17 | 北京化工大学 | Photo-curing injection molding mould and method |
| CN204604751U (en) * | 2015-04-10 | 2015-09-02 | 北京化工大学 | Based on Graphene coating rapid thermal cycles Coinjection molding apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108081555A (en) * | 2017-12-28 | 2018-05-29 | 太仓朗盛金属制品有限公司 | A kind of undercut loose-core injection mould and its method of work |
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