CN106695259A - Machining method for semicircular target material - Google Patents
Machining method for semicircular target material Download PDFInfo
- Publication number
- CN106695259A CN106695259A CN201710004617.4A CN201710004617A CN106695259A CN 106695259 A CN106695259 A CN 106695259A CN 201710004617 A CN201710004617 A CN 201710004617A CN 106695259 A CN106695259 A CN 106695259A
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- semi
- circular target
- machining
- target material
- processing method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
Abstract
The invention relates to the technical field of silicon target material production, in particular to a machining method for a semicircular target material. According to the method, a blank is cut with reserved allowance according to the size requirement of a finished product of the semicircular target material, plane machining is carried out on the right-angle edges, two semicircular sheets are bonded into a whole circular sheet, cylindrical grinding machining is carried out, the whole circular sheet is disassembled back into the two semicircular sheets, and fine grinding machining of a plane surface is carried out. According to the machining method for the semicircular target material, the circular target material is effectively disassembled into the semi-circular sheets to be machined, the semi-circular sheets are effectively combined into the circular sheet to be machined, and therefore the machining problem of the semicircular target material can be effectively solved; and the machining precision diameter R of the semicircular target material is +/- 0.1mm, the thickness H of the semicircular target material is less than 0.03mm, the roughness Ra of the semicircular target material is less than 1.6, the machining yield can reach above 85%, and therefore the problems of semi-circle production precision and roughness are effectively solved.
Description
Technical field
The present invention relates to silicon target production technical field, more particularly to a kind of processing method of semi-circular target.
Background technology
Semi-circular target processing is carried out frequently with the processing method of Wire EDM or high pressure waterjet, both approaches side
Face precision and roughness be not high, it is impossible to meets the market demand.
The content of the invention
To overcome the deficiencies in the prior art, the present invention to provide a kind of processing method of semi-circular target.The present invention is realization
The technical scheme that above-mentioned purpose is used is：A kind of processing method of semi-circular target, it is characterized in that：According to semi-circular target into
Product size requirement reserved margin cutting blank, right-angle side carries out plane machining, and two semicircles are bonded into full circle, attrition process mill
It is cylindrical, full circle is disassembled into back two semicircles, carry out the fine grinding of plane surface.
A kind of processing method of semi-circular target, specifically includes following steps：
The first step：The cutting processing of blank is carried out according to the requirement of semi-circular target finished size, reserved margin cutting blank,
Reserved size diameter is more than 5mm；
Second step：Multi-disc semicircle two ends precision brank clamping is fixed, right-angle side is placed in parallel in surface grinding machine, entered
Row plane machining；
3rd step：Two semicircles are bonded into full circle in frock, full circle is fixed, outer centering, externally
Circle size is ground processing according to the common process technique of cylindrical grinding；
4th step：After machining, full circle is disassembled into back two semicircles, carry out the fine grinding of plane surface；
5th step：Grinding is completed, and workpiece is cleaned, and is checked, and forms semi-circular target.
Cutting uses high pressure waterjet in the first step, reserves size diameter and is more than 10mm.
Cutting uses Wire EDM in the first step, reserves size diameter and is more than 5mm.
Bonding is in 3rd step：Using the aluminum disk for processing, halfround bar slice is entered on aluminum disk with 502 glue
Row bonding, full circle is constituted by semicircle, is then bonded over there with another piece of aluminum disk, is fixed on lathe and looked for
Just.
Machining accuracy diameter ± the 0.1mm of the final semi-circular target for processing, thickness is less than 0.03mm, roughness
Less than 1.6.
Of the invention that halfround bar slice processing is effectively resolved into circle target, halfround bar slice is combined into disk processing, effectively solves
Semi-circular target processes problem；By this scheme, semi-circular target machining accuracy diameter R ± 0.1mm, thickness H<0.03mm, slightly
Rugosity Ra<1.6, machining yield can reach more than 85%, efficiently solve the problems, such as that semicircle produces precision and roughness.
Brief description of the drawings
Fig. 1 is process chart of the invention.
Specific embodiment
Below in conjunction with accompanying drawing, the present invention will be further described, but the present invention is not limited to specific embodiment.
Embodiment 1
A kind of processing method of semi-circular target, according to semi-circular target finished size requirement reserved margin cutting blank,
Right-angle side carries out plane machining, and two semicircles are bonded into full circle, and full circle is disassembled back two semicircles by attrition process cylindrical grinding,
The fine grinding of plane surface is carried out, following steps are specifically included：
The first step：The cutting processing of blank is carried out according to the requirement of semi-circular target finished size, reserved margin cutting blank,
Cutting uses high pressure waterjet, reserves size diameter 15mm；
Second step：Multi-disc semicircle two ends precision brank clamping is fixed, right-angle side is placed in parallel in surface grinding machine, entered
Row plane machining；
3rd step：Using the aluminum disk for processing, halfround bar slice is bonded on aluminum disk with 502 glue, will be partly
Circle composition full circle, is then bonded over there with another piece of aluminum disk, centering is fixed on lathe, to foreign round size
Common process technique according to cylindrical grinding is ground processing；
4th step：After machining, full circle is disassembled into back two semicircles, carry out the fine grinding of plane surface；
5th step：Grinding is completed, and workpiece is cleaned, and is checked, and forms semi-circular target, the semi-circular target for finally processing
Machining accuracy the diameter ± 0.1mm, thickness 0.02mm, roughness 1.5 of material.
Embodiment 2
Each step of the processing method of a kind of semi-circular target described in the present embodiment is in the same manner as in Example 1, no
With technical parameter be：
1) cutting uses Wire EDM in the first step, reserves size diameter 6mm；
2) machining accuracy the diameter ± 0.1mm, thickness 0.01mm, roughness 1.2 of the final semi-circular target for processing.
Embodiment 3
Each step of the processing method of a kind of semi-circular target described in the present embodiment is in the same manner as in Example 2, no
With technical parameter be：
1) cutting uses high pressure waterjet in the first step, reserves size diameter 20mm；
2) the machining accuracy diameter ± 0.1mm of the final semi-circular target for processing, roughness 1.0.
General principle of the invention and principal character has been shown and described above, those skilled in the art should be recognized that this
Invention is not restricted to the described embodiments, the above embodiments and specification description merely illustrate the principles of the invention, not
On the premise of departing from spirit and scope of the invention, the present invention has various changes and modifications, and these changes and improvements both fall within this
In the claimed scope of invention, the claimed scope of the invention is by appending claims and equivalent thereof.
Claims (6)
1. a kind of processing method of semi-circular target, it is characterized in that：Cut according to semi-circular target finished size requirement reserved margin
Blank is cut, right-angle side carries out plane machining, two semicircles are bonded into full circle, full circle is disassembled back two by attrition process cylindrical grinding
Individual semicircle, carries out the fine grinding of plane surface.
2. the processing method of a kind of semi-circular target according to claim 1, it is characterized in that：A kind of semi-circular target
Processing method, specifically include following steps：
The first step：The cutting processing of blank is carried out according to the requirement of semi-circular target finished size, reserved margin cutting blank is reserved
Size diameter is more than 5mm；
Second step：Multi-disc semicircle two ends precision brank clamping is fixed, right-angle side is placed in parallel in surface grinding machine, put down
Face processes；
3rd step：Two semicircles are bonded into full circle in frock, full circle is fixed, outer centering, to foreign round chi
The very little common process technique according to cylindrical grinding is ground processing；
4th step：After machining, full circle is disassembled into back two semicircles, carry out the fine grinding of plane surface；
5th step：Grinding is completed, and workpiece is cleaned, and is checked, and forms semi-circular target.
3. the processing method of a kind of semi-circular target according to claim 2, it is characterized in that：Cutting makes in the first step
With high pressure waterjet, reserve size diameter and be more than 10mm.
4. the processing method of a kind of semi-circular target according to claim 2, it is characterized in that：Cutting makes in the first step
With Wire EDM, reserve size diameter and be more than 5mm.
5. the processing method of a kind of semi-circular target according to claim 2, it is characterized in that：It is bonded in 3rd step
For：Using the aluminum disk for processing, halfround bar slice is bonded on aluminum disk with 502 glue, semicircle is constituted into full circle, so
It is bonded over there with another piece of aluminum disk afterwards, centering is fixed on lathe.
6. according to the processing method of any described a kind of semi-circular targets of claim 1-5, it is characterized in that：The final processing
Machining accuracy diameter+the 0.1mm of the semi-circular target for going out, thickness is less than 0.03mm, and roughness is less than 1.6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710004617.4A CN106695259A (en) | 2017-01-04 | 2017-01-04 | Machining method for semicircular target material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710004617.4A CN106695259A (en) | 2017-01-04 | 2017-01-04 | Machining method for semicircular target material |
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| CN106695259A true CN106695259A (en) | 2017-05-24 |
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| CN201710004617.4A Pending CN106695259A (en) | 2017-01-04 | 2017-01-04 | Machining method for semicircular target material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805173A (en) * | 2020-06-16 | 2020-10-23 | 中铁工程装备集团隧道设备制造有限公司 | Combined machining process for shield edge scraper 45-degree die forging blank |
| CN114472931A (en) * | 2022-02-18 | 2022-05-13 | 西安航天发动机有限公司 | Single-hinge type titanium alloy diaphragm turning method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838139A (en) * | 1981-09-01 | 1983-03-05 | Arai Pump Mfg Co Ltd | Method of molding o-ring with roughened surface |
| CN101823202A (en) * | 2009-12-31 | 2010-09-08 | 沈机集团昆明机床股份有限公司 | Machining method of semicircular rack part |
| CN102152074A (en) * | 2011-03-14 | 2011-08-17 | 沈阳飞机工业（集团）有限公司 | Processing method of seamless joint of aluminum alloy |
| CN102962769A (en) * | 2012-10-26 | 2013-03-13 | 西安航空动力控制科技有限公司 | Surface grinding fixture and method for processing semi-circular pump swash plate |
| CN103624497A (en) * | 2013-11-27 | 2014-03-12 | 沈阳黎明航空发动机(集团)有限责任公司 | Method for machining large-radius thin-wall semi-annular part |
-
2017
- 2017-01-04 CN CN201710004617.4A patent/CN106695259A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838139A (en) * | 1981-09-01 | 1983-03-05 | Arai Pump Mfg Co Ltd | Method of molding o-ring with roughened surface |
| CN101823202A (en) * | 2009-12-31 | 2010-09-08 | 沈机集团昆明机床股份有限公司 | Machining method of semicircular rack part |
| CN102152074A (en) * | 2011-03-14 | 2011-08-17 | 沈阳飞机工业（集团）有限公司 | Processing method of seamless joint of aluminum alloy |
| CN102962769A (en) * | 2012-10-26 | 2013-03-13 | 西安航空动力控制科技有限公司 | Surface grinding fixture and method for processing semi-circular pump swash plate |
| CN103624497A (en) * | 2013-11-27 | 2014-03-12 | 沈阳黎明航空发动机(集团)有限责任公司 | Method for machining large-radius thin-wall semi-annular part |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805173A (en) * | 2020-06-16 | 2020-10-23 | 中铁工程装备集团隧道设备制造有限公司 | Combined machining process for shield edge scraper 45-degree die forging blank |
| CN111805173B (en) * | 2020-06-16 | 2021-12-10 | 中铁工程装备集团隧道设备制造有限公司 | Combined machining process for shield edge scraper 45-degree die forging blank |
| CN114472931A (en) * | 2022-02-18 | 2022-05-13 | 西安航天发动机有限公司 | Single-hinge type titanium alloy diaphragm turning method |
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Application publication date: 20170524 |