CN106686877A - High-thermal conduction circuit board assembly - Google Patents
High-thermal conduction circuit board assembly Download PDFInfo
- Publication number
- CN106686877A CN106686877A CN201510751734.8A CN201510751734A CN106686877A CN 106686877 A CN106686877 A CN 106686877A CN 201510751734 A CN201510751734 A CN 201510751734A CN 106686877 A CN106686877 A CN 106686877A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- ceramic plate
- semiconductor substrate
- heat
- conduction circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The invention relates to a high-thermal conduction circuit board assembly, and belongs to the semiconductor technology industry. A semiconductor substrate is arranged, a plurality of heat generation components are arranged on the semiconductor substrate, a ceramic plate is arranged on the heat generation components, copper plating layers are respectively arranged on an upper surface and a lower surface of the ceramic plate, tin paste is coated on the copper plating layers, a heat sink is fixedly connected onto the ceramic plate, copper plating layers are respectively arranged on an upper surface and a lower surface of the heat sink, and tin paste is also coated on the upper surface and the lower surface of the heat sink. The high-thermal conduction circuit board has the beneficial effects that the semiconductor substrate is arranged, the heat generation components are arranged on the semiconductor substrate, the ceramic plate is arranged on the heat generation components and is fixedly connected onto the heat generation components by the tin paste, the heat sink is arranged on the ceramic plate, thus, the problem that the ceramic plate is easy to damage is solved, and the heat conduction of the circuit board assembly is also improved by the ceramic plate. The high-thermal conduction circuit board assembly is simple in structure and relatively low in cost and is convenient to operate.
Description
Technical field
The present invention relates to a kind of high heat conduction circuit board assemblies, belong to semiconductor technology industry.
Background technology
In high power semi-conductor, in the circuit that heater element is constituted, in order to by high power semi-conductor, the heat that heater element is produced is distributed, needs use the radiator of diverging heat, in order to can ensure that circuit isolation performance again, also need to insulating heat-conduction material liner between radiator and pyrotoxin, but the heat-conducting insulation material for generally adopting at present, in addition to a few ceramics, the heat-conducting silicone grease that the overwhelming majority is adopted, the actual capacity of heat transmission of insulating heat-conductive film is extremely low, only less than the capacity of heat transmission of 1W/ (mK), there is metal powder in only a few, the extremely low pressure heat-conducting silicone grease of graphite powder filling and the composite of costliness are slightly higher, also only have less than 5 W/ (mK), in addition, the circuit board material capacity of heat transmission for connecting circuit is also not enough, actual in addition to ceramic substrate is all heat-insulating material, as heat conductivility, the all splendid ceramic material of insulating properties, the capacity of heat transmission with tens or even hundreds of W/ (mK), but its also one defect of generally existing：It is hard and crisp.Ceramic material finished product hardness is generally higher than 9（Diamond 10）, it is impossible to deform under conventional environment, it is impossible to which deformation means that out-of-flatness, there is gap.And once deformation is crushed immediately, so after actual Ceramics Heat Conduction Material, the soft material that must continue to fill the bad heat conduction such as heat-conducting silicone grease on ceramic two sides plays buffer mechanism stress and the effect of filling gap so that the high thermal conductivity of ceramics significantly loses.
The content of the invention
The technical problem to be solved is：A kind of high heat conduction circuit board assemblies are provided, to solve current industry in problems faced.
In order to solve above-mentioned technical problem, the present invention is achieved by the following technical solutions：A kind of high heat conduction circuit board assemblies, are provided with semiconductor substrate.
Preferably, being provided with multiple heater elements on the semiconductor substrate, on the heater element ceramic wafer is provided with.
Preferably, two surfaces up and down of the ceramic wafer are respectively arranged with copper plate, tin cream tin slurry is coated with the copper plate.
Preferably, being fixedly connected with radiator on the ceramic wafer.
Preferably, two surfaces up and down of the radiator are respectively arranged with copper plate, two surfaces up and down of the radiator are also coated with tin cream tin slurry.
Compared with prior art, usefulness of the present invention is：The present invention is by arranging semiconductor substrate, heater element is provided with a semiconductor substrate, ceramic wafer is provided with heater element, and by the way that ceramic wafer is fixedly attached on heater element with tin cream tin slurry, and radiator is provided with ceramic wafer, and then not only solve the brittle problem of ceramic wafer, the Heat Conduction Problems of circuit board assemblies are also increased by ceramic wafer, present configuration is simple, and easy to operate, cost is relatively low.
Description of the drawings
Below in conjunction with the accompanying drawings the present invention is further described.
Fig. 1 is the structural representation of the present invention.
In figure：1st, semiconductor substrate；2nd, heater element；3rd, ceramic wafer；4th, copper plate；5th, tin cream tin slurry；6th, radiator.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment describes the present invention：A kind of high heat conduction circuit board assemblies according to Fig. 1, it is provided with semiconductor substrate 1, multiple heater elements 2 are provided with the semiconductor substrate 1, ceramic wafer 3 is provided with the heater element 2, two surfaces up and down of the ceramic wafer 3 are respectively arranged with copper plate 4, tin cream tin slurry 5 is coated with the copper plate 4, radiator 6 is fixedly connected with the ceramic wafer 3.
Two surfaces up and down of the radiator 6 are respectively arranged with copper plate 4, and two surfaces up and down of the radiator 6 are also coated with tin cream tin slurry 5.
In circuit board assemblies commonly used at present, the insulating heat-conduction material arranged between heater element 2 and radiator 6 is heat-conducting silicone grease, and minority uses metal powder, these material heat conductivilitys are poor, and the present invention is that ceramic wafer 3 is provided between semiconductor substrate 1 and radiator 6, ceramic wafer 3 has very strong conductive force, and also with stronger insulating effect, by arranging tin cream tin slurry 5 between ceramic wafer 3 and semiconductor substrate 1, solve ceramic wafer 3 and compare crisp flimsy problem, the structure provided by the present invention, solve problems faced in industry.
It is emphasized that：The above is only presently preferred embodiments of the present invention, not make any pro forma restriction to the present invention, any simple modification, equivalent variations and modification that every technical spirit according to the present invention is made to above example, still fall within the range of technical solution of the present invention.
Claims (2)
1. a kind of high heat conduction circuit board assemblies, are provided with semiconductor substrate（1）, it is characterised in that：The semiconductor substrate（1）On be provided with multiple heater elements（2）, the heater element（2）On be provided with ceramic wafer（3）, the ceramic wafer（3）Two surfaces up and down be respectively arranged with copper plate（4）, the copper plate（4）On be coated with tin cream tin slurry（5）, the ceramic wafer（3）On be fixedly connected with radiator（6）.
2. high heat conduction circuit board assemblies according to claim 1, it is characterised in that：The radiator（6）Two surfaces up and down be respectively arranged with copper plate（4）, the radiator（6）Two surfaces up and down be also coated with tin cream tin slurry（5）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510751734.8A CN106686877A (en) | 2015-11-09 | 2015-11-09 | High-thermal conduction circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510751734.8A CN106686877A (en) | 2015-11-09 | 2015-11-09 | High-thermal conduction circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106686877A true CN106686877A (en) | 2017-05-17 |
Family
ID=58862810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510751734.8A Pending CN106686877A (en) | 2015-11-09 | 2015-11-09 | High-thermal conduction circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106686877A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1313724A (en) * | 2001-02-22 | 2001-09-19 | 上海大唐移动通信设备有限公司 | Method for installing high-power device |
| CN201568934U (en) * | 2009-10-22 | 2010-09-01 | 上海彩煌光电科技有限公司 | Composite radiator structure of LED lamp |
| CN201741694U (en) * | 2010-01-07 | 2011-02-09 | 林礼裕 | Ceramic radiator |
| CN101975343A (en) * | 2010-10-07 | 2011-02-16 | 东莞市万丰纳米材料有限公司 | Light source module and preparation method thereof |
| CN103500787A (en) * | 2013-10-16 | 2014-01-08 | 北京大学东莞光电研究院 | Ceramic COB (Chip-on-Board) packaged LED (light-emitting diode) light source with bottom capable of being directly soldered on heat sink |
| CN104110590A (en) * | 2013-04-19 | 2014-10-22 | 重庆桑耐美光电科技有限公司 | Low-thermal-resistance radiating LED lamp |
| CN104919585A (en) * | 2013-01-22 | 2015-09-16 | 三菱综合材料株式会社 | Power module substrate, power module substrate with heat sink, and power module with heat sink |
-
2015
- 2015-11-09 CN CN201510751734.8A patent/CN106686877A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1313724A (en) * | 2001-02-22 | 2001-09-19 | 上海大唐移动通信设备有限公司 | Method for installing high-power device |
| CN201568934U (en) * | 2009-10-22 | 2010-09-01 | 上海彩煌光电科技有限公司 | Composite radiator structure of LED lamp |
| CN201741694U (en) * | 2010-01-07 | 2011-02-09 | 林礼裕 | Ceramic radiator |
| CN101975343A (en) * | 2010-10-07 | 2011-02-16 | 东莞市万丰纳米材料有限公司 | Light source module and preparation method thereof |
| CN104919585A (en) * | 2013-01-22 | 2015-09-16 | 三菱综合材料株式会社 | Power module substrate, power module substrate with heat sink, and power module with heat sink |
| CN104110590A (en) * | 2013-04-19 | 2014-10-22 | 重庆桑耐美光电科技有限公司 | Low-thermal-resistance radiating LED lamp |
| CN103500787A (en) * | 2013-10-16 | 2014-01-08 | 北京大学东莞光电研究院 | Ceramic COB (Chip-on-Board) packaged LED (light-emitting diode) light source with bottom capable of being directly soldered on heat sink |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170517 |