CN106671346A - 一种聚二甲基硅氧烷微流控芯片的注射成型方法 - Google Patents

一种聚二甲基硅氧烷微流控芯片的注射成型方法 Download PDF

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CN106671346A
CN106671346A CN201611253778.9A CN201611253778A CN106671346A CN 106671346 A CN106671346 A CN 106671346A CN 201611253778 A CN201611253778 A CN 201611253778A CN 106671346 A CN106671346 A CN 106671346A
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injection moulding
polydimethylsiloxane
mould
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范强
范一强
高峰
庄俭
张亚军
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Beijing University of Chemical Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
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    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/78—Measuring, controlling or regulating of temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76498—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76531—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76595—Velocity
    • B29C2945/76605—Velocity rotational movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material

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Abstract

本发明公开了一种聚二甲基硅氧烷微流控芯片的注射成型方法，将聚二甲基硅氧烷前聚体和固化剂混合均匀；将混合均匀的聚二甲基硅氧烷前聚体和固化剂混合物在密封装置中进行抽真空处理，直至混合物中的气泡完全消失；对注射机上的模具进行预加热，然后进行抽真空去除气泡的聚二甲基硅氧烷前聚体和固化剂混合物注塑至注射机的模具，在注射机的模具上进行注射成型。注射成型完成后，使用氯仿、二氯甲烷或甲苯等有机溶剂对注射后的注射机模具进行清洗。整个制备过程简单、周期较短，无需用到复杂的设备，成本低廉且成型精度高；尤其是能够实现聚二甲基硅氧烷微流控芯片的规模化、批量化生产。

Description

一种聚二甲基硅氧烷微流控芯片的注射成型方法
技术领域
本发明涉及一种聚二甲基硅氧烷(PDMS)微流控芯片成型方法，具体是一种聚二甲基硅氧烷微流控芯片的注射成型方法，属于微流控芯片制备技术领域。
背景技术
微流控的研究起源于上世纪九十年代，至今已飞速发展二十余年，吸引了生物、化学、物理、机械等多方面的研究力量，已经发展成为一个集成高效的技术体系。微流控芯片又称为芯片实验室(Lab-on-a-chip)，是把生物、化学、医学分析过程的样品制备、反应、分离、检测等基本操作单元集成到一块微纳米尺度的芯片上，具有强大的分析能力，服务于现代分析科学、生物学、生命科学、临床医学和诊断学、环境科学等领域。
常见的制作微流控芯片的材料有单晶硅、玻璃、石英和各种有机聚合物。其中有机聚合物具有成型方面、价格便宜的特点，近年来开始大量用于微流控芯片的制作中。聚二甲基硅氧烷(PDMS)具有优异的生物兼容性和气体通透性，且具有光学透明、电学绝缘、化学惰性以及热稳定性好等优良特性，同时其成本低，使用方便，是微流控芯片广泛应用的加工材料。
目前，微流控芯片的加工常采用软光刻技术，使用SU-8光刻胶制作微通道阳模，由聚二甲基硅氧烷(PDMS)固化成型倒模后与玻璃或有机聚合物基板键合形成芯片。这种方法加工过程繁琐、时间周期较长，成本较高，不适合大规模批量制作微流控芯片。因此，如何实现PDMS微流控芯片快速大批量的生产，是本领域技术人员亟待解决的技术问题。
发明内容
鉴于以上微流控芯片制备方法过程复杂、设备要求高、时间周期较长、不适合大规模批量生产等缺点，本发明的目的是提出一种适用于工业化大规模生产基于聚二甲基硅氧烷材料微流控芯片的制备方法，且具有成本低、流程简单的特点。
为实现上述目的，本发明采用的技术方案为一种聚二甲基硅氧烷微流控芯片的注射成型方法，该方法包括下列步骤：
步骤1.将聚二甲基硅氧烷前聚体和固化剂混合均匀；
步骤2.将步骤1中混合均匀的聚二甲基硅氧烷前聚体和固化剂混合物在密封装置中进行抽真空处理，直至混合物中的气泡完全消失；
步骤3.对注射机上的模具进行预加热，然后将步骤2中进行抽真空去除气泡的聚二甲基硅氧烷前聚体和固化剂混合物注塑至注射机的模具，在注射机的模具上进行注射成型。
步骤4.注射成型完成后，使用氯仿、二氯甲烷或甲苯等有机溶剂对注射后的注射机模具进行清洗。
进一步地，上述步骤1中聚二甲基硅氧烷前聚体和固化剂按照单位质量为(3-20):1比例进行混合；混合过程在液体混合搅拌装置中进行，搅拌时间为3min-5min。
步骤2中的聚二甲基硅氧烷前聚体和固化剂混合物进行抽真空处理在抽真空装置中进行，直至混合物中的气泡完全消失后结束。
步骤3中注射成型工艺流程图如图1所示。注射机的模具预热温度为110℃-150℃；固化时间为30s-60s；注射机料筒前部温度设置为20℃-50℃，注射机料筒中部温度设置为30℃-50℃，注射机料筒后部温度设置为30℃-50℃；注射压力设置为20Mpa-50Mpa，螺杆转速设置为20r/pm-100r/pm，保压压力为4Mpa-10Mpa。
注射成型过程包括加料、合模、注射、保压、固化、开模、顶出制品、清理模具。整个注射过程在无尘或低尘环境中进行，避免对微流控芯片造成污染。
与现有技术相比较，本发明具有如下有益效果。
本发明通过注射成型的方式制作基于聚二甲基硅氧烷材料的微流控芯片，整个制备过程简单、周期较短，无需用到复杂的设备，成本低廉且成型精度高；尤其是能够实现聚二甲基硅氧烷微流控芯片的规模化、批量化生产，为基于聚二甲基硅氧烷材料的微流控芯片在生命科学和医学领域的大规模应用奠定了技术基础。
由于有保压过程，使得这种方法制作的聚二甲基硅氧烷微流控芯片具有良好的机械稳定性，克服了传统制约PDMS芯片制备的力学瓶颈。
从上述发明描述中可以看出，首先配置好聚二甲基硅氧烷前聚体和固化剂混合物后，整个聚二甲基硅氧烷微流控芯片的注射成型过程在1分钟左右完成，效率极高，可重复性极高；所制得的微流控芯片性能优良，适合大规模生产。
附图说明
图1为本发明的实施流程图。
具体实施方式
如图1所示，本发明涉及一种聚二甲基硅氧烷微流控芯片成型方法，具体是一种聚二甲基硅氧烷微流控芯片的注射成型方法。它包括下列步骤：
步骤1.将聚二甲基硅氧烷前聚体和固化剂按照质量比(3-20):1比例进行混合，具体质量值由实际需要制作的聚二甲基硅氧烷微流控芯片数量决定，混合过程在混合过程在液体混合搅拌装置中进行，时间为3min-5min。
步骤2.将步骤1中聚二甲基硅氧烷前聚体和固化剂混合物进行抽真空处理在抽真空装置中进行，注意观察混合物中气泡情况，抽真空处理结束依据为混合物中的气泡完全消失。
步骤3.将步骤2中的聚二甲基硅氧烷前聚体和固化剂混合物在注射机的模具上进行注射成型。其中模具预热温度为110℃-150℃；固化时间为30s-60s；注射机料筒前部温度设置为20℃-50℃，注射机料筒中部温度设置为30-50℃，注射机料筒后部温度设置为30℃-50℃；注射压力设置为20Mpa-50Mpa，螺杆转速设置为20r/pm-100r/pm，保压压力为4Mpa-10Mpa。
步骤4.注射完成后，使用氯仿、二氯甲烷、甲苯等有机溶剂对注射后的注射机进行清洗。

Claims (5)

1.一种聚二甲基硅氧烷微流控芯片的注射成型方法，其特征在于：该方法包括下列步骤：
步骤1.将聚二甲基硅氧烷前聚体和固化剂混合均匀；
步骤2.将步骤1中混合均匀的聚二甲基硅氧烷前聚体和固化剂混合物在密封装置中进行抽真空处理，直至混合物中的气泡完全消失；
步骤3.对注射机上的模具进行预加热，然后将步骤2中进行抽真空去除气泡的聚二甲基硅氧烷前聚体和固化剂混合物注塑至注射机的模具，在注射机的模具上进行注射成型；
步骤4.注射成型完成后，使用氯仿、二氯甲烷或甲苯等有机溶剂对注射后的注射机模具进行清洗。
2.根据权利要求1所述的一种聚二甲基硅氧烷微流控芯片的注射成型方法，其特征在于：步骤1中聚二甲基硅氧烷前聚体和固化剂按照单位质量为(3-20):1比例进行混合；混合过程在液体混合搅拌装置中进行，搅拌时间为3min-5min。
3.根据权利要求1所述的一种聚二甲基硅氧烷微流控芯片的注射成型方法，其特征在于：步骤2中的聚二甲基硅氧烷前聚体和固化剂混合物进行抽真空处理在抽真空装置中进行，直至混合物中的气泡完全消失后结束。
4.根据权利要求1所述的一种聚二甲基硅氧烷微流控芯片的注射成型方法，其特征在于：注射机的模具预热温度为110℃-150℃；固化时间为30s-60s；注射机料筒前部温度设置为20℃-50℃，注射机料筒中部温度设置为30℃-50℃，注射机料筒后部温度设置为30℃-50℃；注射压力设置为20Mpa-50Mpa，螺杆转速设置为20r/pm-100r/pm，保压压力为4Mpa-10Mpa。
5.根据权利要求1所述的一种聚二甲基硅氧烷微流控芯片的注射成型方法，其特征在于：注射成型过程包括加料、合模、注射、保压、固化、开模、顶出制品、清理模具；整个注射过程在无尘或低尘环境中进行，避免对微流控芯片造成污染。
CN201611253778.9A 2016-12-30 2016-12-30 一种聚二甲基硅氧烷微流控芯片的注射成型方法 Pending CN106671346A (zh)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN109590035A (zh) * 2018-12-04 2019-04-09 中国农业大学 微流控芯片的制备方法及微流体驱动装置

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CN105538587A (zh) * 2016-01-22 2016-05-04 苏州汶颢芯片科技有限公司 软质芯片注塑系统和制作软质芯片的方法

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Publication number Priority date Publication date Assignee Title
CN101468506A (zh) * 2008-06-18 2009-07-01 中国检验检疫科学研究院 微流控芯片的批量生产方法
US20110254199A1 (en) * 2008-10-31 2011-10-20 Massachusetts Institute Of Technology Fast curable liquid resin procedure for the manufacture of micro/nano featured parts
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CN105538587A (zh) * 2016-01-22 2016-05-04 苏州汶颢芯片科技有限公司 软质芯片注塑系统和制作软质芯片的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109590035A (zh) * 2018-12-04 2019-04-09 中国农业大学 微流控芯片的制备方法及微流体驱动装置

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Application publication date: 20170517