CN106659019A - Missile-borne stacked cold-guiding machine case with heat flow impact resistance - Google Patents
Missile-borne stacked cold-guiding machine case with heat flow impact resistance Download PDFInfo
- Publication number
- CN106659019A CN106659019A CN201611103671.6A CN201611103671A CN106659019A CN 106659019 A CN106659019 A CN 106659019A CN 201611103671 A CN201611103671 A CN 201611103671A CN 106659019 A CN106659019 A CN 106659019A
- Authority
- CN
- China
- Prior art keywords
- framework
- top cover
- base
- heat
- missile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
Abstract
The invention discloses a missile-borne stacked cold-guiding machine case with heat flow impact resistance. The missile-borne stacked cold-guiding machine case comprises a heat resistant layer (1), a top cover (2), a framework (3), a base (4), a main module (5) and a backup module (6), wherein the heat generated by the main module (5) and the backup module (6) is transferred to the top cover (2) and the framework (3) through rectangular lug bosses; heat transfer between the top cover (2) and the framework (3) and between the framework (3) and base (4) is realized through an annular matching surface; and under the protection effect of the heat resistant layer (1), high temperature generated by engine fuel gas jet flow can be effectively blocked outside equipment. The missile-borne equipment structure with heat flow impact resistance is simplified; and on the basis of satisfying internal temperature control requirement of the equipment, by adopting a thermal control measure for lowering external heat flow impact through a thermal insulation method, size and weight of the equipment are reduced, and development requirements of high integration and light weight of cold-guiding heat dissipation and missile-borne equipment are satisfied.
Description
Technical field
The present invention relates to a kind of missile-borne conduction cooling cabinet, particularly a kind of missile-borne stacking conduction cooling machine with the impact of anti-heat-flash stream
Case.
Background technology
In the past missile-borne conduction cooling cabinet was made up of top cover and base more, and the caloric value of the high power device of box house is mainly led to
Crossing base or top cover carries out heat conduction, simultaneously because the outside hot-fluid impact that in the past missile propulsive plant was produced is relatively low, because
This, by heat sink method the impact of outside hot-fluid can be resisted, but causes that equipment volume is big, quality weight, with missile weapon system
Integrated development, the lighting and miniaturization to control system electronic equipment, and hot-fluid environmental protection performance are proposed more
High request, heat sink method can not meet highly integrated and the impact of heat-flash stream the development trend of on-board electronics.
The content of the invention
Present invention aim at providing a kind of missile-borne stacking conduction cooling cabinet with the impact of anti-heat-flash stream, conventional missile-borne is solved
Equipment volume is big, quality is heavy, need to rely on structure as heat sink problem.
A kind of missile-borne stacking conduction cooling cabinet with the impact of anti-heat-flash stream, including：Primary module and spare module, also wrap
Include：Top cover, framework, base and thermal barrier coatings.Described thermal barrier coatings are fibrous composite, are internal high containing larger porosity
Molecular material, with relatively low density and thermal conductivity；There are annular boss, framework and base upper surface in top cover and framework lower surface
There is corresponding annular recess, between top cover and framework and between framework and base, carried out by annular boss and annular recess
Positioning and assembling, top cover, framework and base are installed successively from top to bottom, and stacking conduction cooling cabinet is formed by being spirally connected, and framework is single
Layer or multilayer；Thermal barrier coatings are bonding with stacking conduction cooling cabinet outer surface to be connected；Top cover is close near the edge and framework of annular boss
There are screwed hole, top cover and primary module mode connects for screw, framework and spare module mode connects for screw in the edge of annular recess；Top cover and frame
There is the boss of multiple rectangles at frame middle part, is connected with high-power component contact in primary module and spare module respectively.
During work, it is laminated conduction cooling cabinet and is connected with body by the installation journal stirrup at four angles of base, thermal barrier coatings is because have
Compared with low thermal conductivity, under transient state heat-flash stream percussion, external heat is blocked in outside casing by overcoat, primary module and
The caloric value of spare module high-power component is conducted to top cover, framework and base by rectangular boss, between top cover and framework and
The transmission of heat is realized between framework and base by annular boss and annular recess, by top cover, framework and base itself
Heat sink enough load bearing equipment internal calorific powers on the premise of, it is not necessary to increase excessive weight, structure reduced on the whole
Weight and volume.
This invention simplifies heat resistanceheat resistant stream impacts the type of attachment of missile-borne casing structure, the volume and weight of equipment is reduced,
By inside configuration thermal control and outside hot-fluid safeguard procedures, equipment thermal design requirement is met, meet missile weapon system pair
Missile equipment is minimized and light-weight design demand.
Description of the drawings
A kind of missile-borne stacking conduction cooling cabinet composition schematic diagram of heat resistanceheat resistant stream impacts of Fig. 1；
Conduction cooling cabinet composition schematic diagram is laminated described in a kind of missile-borne stacking conduction cooling cabinet of heat resistanceheat resistant stream impacts of Fig. 2.
The spare module of 2. top cover of thermal barrier coatings, 3. framework, 4. 5. primary module of base 6.
Specific embodiment
A kind of missile-borne stacking conduction cooling cabinet with the impact of heat resistanceheat resistant stream, including：Primary module 5 and spare module 6, also wrap
Include：Top cover 2, framework 3, base 4 and thermal barrier coatings 1.Described thermal barrier coatings 1 are fibrous composite, are that larger hole is contained in inside
Gap rate macromolecular material, with relatively low density and thermal conductivity；There are annular boss, framework 3 and bottom in top cover 2 and the lower surface of framework 3
There is corresponding annular recess 4 upper surfaces of seat, between top cover 2 and framework 3 and between framework 3 and base 4, by annular boss and ring
Shape groove is positioned and assembled, and top cover 2, framework 3 and base 4 are installed successively from top to bottom, and stacking conduction cooling is formed by being spirally connected
Cabinet, framework 3 is multilayer；Thermal barrier coatings 1 and stacking conduction cooling cabinet outer surface bonding are connected；Top cover 2 is near the edge of annular boss
There are screwed hole, top cover 2 and the mode connects for screw of primary module 5, framework 3 and the spiral shell of spare module 6 near the edge of annular recess with framework 3
Nail connection；There is the boss of multiple rectangles at top cover 2 and the middle part of framework 3, respectively with high power device in primary module 5 and spare module 6
Part contact connection.
During work, it is laminated conduction cooling cabinet and is connected with body by the installation journal stirrup at 4 four angles of base, thermal barrier coatings 1 is because tool
Have compared with low thermal conductivity, under transient state heat-flash stream percussion, external heat is blocked in outside cabinet by thermal barrier coatings 1, primary mould
The caloric value of high-power component is conducted to top cover 2 and framework 3 by rectangular boss in block 5 and spare module 6, top cover 2 and framework 3
Between and framework 3 and base 4 between realize that heat conducts by annular boss and annular recess, by top cover 2, framework 3
On the premise of heat sink enough load bearing equipment internal calorific powers of base 4 itself, it is not necessary to increase excessive weight, reduction finishes
The weight and volume of structure.
Claims (1)
1. a kind of missile-borne with the impact of heat resistanceheat resistant stream is laminated conduction cooling cabinet, including：Primary module (5) and spare module (6), it is special
Levy is also to include：Top cover (2), framework (3), base (4) and thermal barrier coatings (1)；Described thermal barrier coatings (1) are fiber composite material
Material, is internal containing larger porosity macromolecular material, with relatively low density and thermal conductivity；Under top cover (2) and framework (3)
End face has an annular boss, and there is a corresponding annular recess framework (3) and base (4) upper surface, top cover (2) and framework (3) it
Between and framework (3) and base (4) between, positioned and assembled by annular boss and annular recess, top cover (2), framework (3)
Install successively from top to bottom with base (4), stacking conduction cooling cabinet is formed by being spirally connected, framework (3) is single or multiple lift；Thermal barrier coatings
(1) it is bonding with stacking conduction cooling cabinet outer surface to be connected；Top cover (2) is recessed near ring-type near the edge and framework (3) of annular boss
There are screwed hole, top cover (2) and primary module (5) mode connects for screw, framework (3) and spare module (6) mode connects for screw in the edge of groove；
There are multiple rectangular boss at top cover (2) and framework (3) middle part, respectively with high-power component in primary module (5) and spare module (6)
Contact connection；
During work, it is laminated conduction cooling cabinet and is connected with body by the installation journal stirrup at (4) four angles of base, thermal barrier coatings (1) is because tool
Have compared with low thermal conductivity, under transient state heat-flash stream percussion, external heat is blocked in outside casing by overcoat, primary module
(5) caloric value of the high-power component and in spare module (6) is conducted to top cover (2), framework (3) and base by rectangular boss
(4), heat is realized by annular boss and annular recess between top cover (2) and framework (3) and between framework (3) and base (4)
Transmission, in the premise by top cover (2), framework (3) and base (4) the heat sink enough load bearing equipment internal calorific powers of itself
Under, it is not necessary to increase excessive weight, the weight and volume of structure is reduced on the whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611103671.6A CN106659019A (en) | 2016-12-05 | 2016-12-05 | Missile-borne stacked cold-guiding machine case with heat flow impact resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611103671.6A CN106659019A (en) | 2016-12-05 | 2016-12-05 | Missile-borne stacked cold-guiding machine case with heat flow impact resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106659019A true CN106659019A (en) | 2017-05-10 |
Family
ID=58818415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611103671.6A Pending CN106659019A (en) | 2016-12-05 | 2016-12-05 | Missile-borne stacked cold-guiding machine case with heat flow impact resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106659019A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110199748A1 (en) * | 2010-02-17 | 2011-08-18 | Kabushiki Kaisha Toshiba | Semiconductor storage device and electronic device |
| CN202906237U (en) * | 2012-11-20 | 2013-04-24 | 杭州万禾电力科技有限公司 | Heat insulation box-type substation |
| CN105934141A (en) * | 2016-06-28 | 2016-09-07 | 北京无线电测量研究所 | Modular airtight cold guide case |
-
2016
- 2016-12-05 CN CN201611103671.6A patent/CN106659019A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110199748A1 (en) * | 2010-02-17 | 2011-08-18 | Kabushiki Kaisha Toshiba | Semiconductor storage device and electronic device |
| CN202906237U (en) * | 2012-11-20 | 2013-04-24 | 杭州万禾电力科技有限公司 | Heat insulation box-type substation |
| CN105934141A (en) * | 2016-06-28 | 2016-09-07 | 北京无线电测量研究所 | Modular airtight cold guide case |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |