CN106649193A - Mainboard and mainboard electrifying and managing method - Google Patents

Mainboard and mainboard electrifying and managing method Download PDF

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Publication number
CN106649193A
CN106649193A CN201611238929.3A CN201611238929A CN106649193A CN 106649193 A CN106649193 A CN 106649193A CN 201611238929 A CN201611238929 A CN 201611238929A CN 106649193 A CN106649193 A CN 106649193A
Authority
CN
China
Prior art keywords
mainboard
nios
electricity
sopc
upper electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611238929.3A
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Chinese (zh)
Inventor
郝志彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Xingyun Interconnect Technology Co Ltd
Original Assignee
Beijing Xingyun Interconnect Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Xingyun Interconnect Technology Co Ltd filed Critical Beijing Xingyun Interconnect Technology Co Ltd
Priority to CN201611238929.3A priority Critical patent/CN106649193A/en
Publication of CN106649193A publication Critical patent/CN106649193A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00Digital computers in general; Data processing equipment in general
    • G06F15/76Architectures of general purpose stored program computers
    • G06F15/78Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7803System on board, i.e. computer system on one or more PCB, e.g. motherboards, daughterboards or blades
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof

Abstract

The invention discloses a mainboard and a mainboard electrifying and managing method. The cost can be reduced, the design difficulty can be reduced, the mainboard space can be saved, and the mainboard achieves electrifying and managing functions through an SOPC; the SOPC comprises an electrifying module and Nios II, the electrifying module is used for controlling the mainboard to be electrified, and the Nios II is used for managing the mainboard.

Description

Electricity and management method on mainboard, mainboard
Technical field
The present invention relates to mother board technologies field, and in particular to electricity and management method on a kind of mainboard, mainboard.
Background technology
At present the upper electricity of server master board is controlled using a fpga chip, and mainboard management is come real with BMC chip Existing (can be found in the mainboard structure shown in Fig. 1), that is, employ 2 chips to realize, design comparison is complicated, takes motherboard space, And it is relatively costly.
The content of the invention
In view of the shortcomings of the prior art and defect, the present invention provides electricity and management method on a kind of mainboard, mainboard.
On the one hand, the embodiment of the present invention proposes a kind of mainboard, and the mainboard, should by electricity and management function in SOPC realizations SOPC includes:
Upper electric module and Nios II;Wherein,
The upper electric module, for controlling the upper electricity of the mainboard;
The Nios II, for managing the mainboard.
On the other hand, the embodiment of the present invention proposes electricity and management method on a kind of mainboard, including:
Using electricity in the upper electric module control mainboard of mainboard, and the Nios II using the mainboard realize that mainboard is managed, its In, the mainboard includes that SOPC, the SOPC include upper electric module and Nios II.
Electricity and management method on mainboard provided in an embodiment of the present invention, mainboard, should by the upper electric module control of SOPC The upper electricity of mainboard, by the Nios II of SOPC mainboard is managed, i.e., be only capable of achieving the upper electricity and management work(of mainboard by SOPC Can, so as to compared to electricity and the prior art of management on mainboard is realized using 2 chips, both save cost, reduce again Design difficulty, saves motherboard space.
Description of the drawings
Fig. 1 is the structural representation of existing mainboard;
Fig. 2 is the structural representation of the embodiment of mainboard of the present invention;
Fig. 3 is the schematic flow sheet of electricity and the embodiment of management method one on mainboard of the present invention.
Specific embodiment
To make purpose, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention In accompanying drawing, the technical scheme in the embodiment of the present invention is explicitly described, it is clear that described embodiment be the present invention A part of embodiment, rather than the embodiment of whole.Based on the embodiment in the present invention, those of ordinary skill in the art are not having The every other embodiment obtained under the premise of creative work is made, the scope of protection of the invention is belonged to.
Referring to Fig. 2, the present embodiment discloses a kind of mainboard, and the mainboard, should by electricity and management function in SOPC1 realizations SOPC1 includes:
Upper electric module 10 and Nios II11;Wherein,
The upper electric module 10, for controlling the upper electricity of the mainboard;
Specifically, the upper electric logic of the upper electric module 10 can be write using verilog.
The Nios II11, for managing the mainboard.
As shown in Fig. 2 the Nios II11 can be communicated by I2C with the sensor of the mainboard, by monitoring the biography Sensor realizes the management function of the mainboard.The sensor includes:For monitoring the sensor of the mainboard temperature and for supervising Survey the sensor of the board status.For example, when the sensor includes temperature sensor, Nios II11 can pass through I2C obtains the mainboard temperature of temperature sensor monitors, and mainboard temperature is made less than setting according to the rotating speed of temperature adjustment fan Threshold value.The Nios II11 can be communicated by I2C with the sensor of the mainboard, it is also possible to according to the design customization need of mainboard The interface wanted.
Mainboard provided in an embodiment of the present invention, controls the upper electricity of the mainboard, by SOPC's by the upper electric module of SOPC Nios II manage mainboard, i.e., only the upper electricity and management function of mainboard are capable of achieving by SOPC, so as to compared to using 2 Chip had both saved cost realizing on mainboard the prior art of electricity and management, and design difficulty is reduced again, saved mainboard empty Between.
Referring to Fig. 3, the present embodiment discloses electricity and management method on a kind of mainboard, including:
S1, using in the upper electric module control mainboard of mainboard electricity, and using the mainboard Nios II realize mainboard manage, Wherein, the mainboard includes that SOPC, the SOPC include upper electric module and Nios II.
Electricity and management method, by the upper electric module of SOPC the mainboard is controlled on mainboard provided in an embodiment of the present invention Upper electricity, by the Nios II of SOPC mainboard is managed, i.e., be only capable of achieving the upper electricity and management function of mainboard by SOPC, from And compared to electricity and the prior art of management on mainboard is realized using 2 chips, cost had both been saved, it is difficult that design is reduced again Degree, saves motherboard space.
On the basis of preceding method embodiment, the Nios II using the mainboard realize that mainboard is managed, and can include The step of not shown in following figure:
The management function of mainboard is realized by monitoring the sensor being connected with the mainboard by I2C.
Those skilled in the art are it should be appreciated that embodiments herein can be provided as method, system or computer program Product.Therefore, the application can be using complete hardware embodiment, complete software embodiment or with reference to the reality in terms of software and hardware Apply the form of example.And, the application can be adopted and wherein include the computer of computer usable program code at one or more The computer program implemented in usable storage medium (including but not limited to magnetic disc store, CD-ROM, optical memory etc.) is produced The form of product.
The application is the flow process with reference to method, equipment (system) and computer program according to the embodiment of the present application Figure and/or block diagram are describing.It should be understood that can be by computer program instructions flowchart and/or each stream in block diagram The combination of journey and/or square frame and flow chart and/or the flow process in block diagram and/or square frame.These computer programs can be provided The processor of all-purpose computer, special-purpose computer, Embedded Processor or other programmable data processing devices is instructed to produce A raw machine so that produced for reality by the instruction of computer or the computing device of other programmable data processing devices The device of the function of specifying in present one flow process of flow chart or one square frame of multiple flow processs and/or block diagram or multiple square frames.
These computer program instructions may be alternatively stored in can guide computer or other programmable data processing devices with spy In determining the computer-readable memory that mode works so that the instruction being stored in the computer-readable memory is produced to be included referring to Make the manufacture of device, the command device realize in one flow process of flow chart or one square frame of multiple flow processs and/or block diagram or The function of specifying in multiple square frames.
These computer program instructions also can be loaded in computer or other programmable data processing devices so that in meter Series of operation steps is performed on calculation machine or other programmable devices to produce computer implemented process, so as in computer or The instruction performed on other programmable devices is provided for realizing in one flow process of flow chart or multiple flow processs and/or block diagram one The step of function of specifying in individual square frame or multiple square frames.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality Body or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or deposit between operating In any this actual relation or order.And, term " including ", "comprising" or its any other variant are intended to Nonexcludability is included, so that a series of process, method, article or equipment including key elements not only will including those Element, but also including other key elements being not expressly set out, or also include for this process, method, article or equipment Intrinsic key element.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that Also there is other identical element in process, method, article or equipment including the key element.Term " on ", D score etc. refers to The orientation or position relationship for showing is, based on orientation shown in the drawings or position relationship, to be for only for ease of the description present invention and simplify Description, rather than indicate or imply that the device or element of indication must be with specific orientation, with specific azimuth configuration and behaviour Make, therefore be not considered as limiting the invention.Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or be integrally connected;Can be It is mechanically connected, or electrically connects;Can be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two The connection of element internal.For the ordinary skill in the art, can as the case may be understand above-mentioned term at this Concrete meaning in invention.
In the specification of the present invention, a large amount of details are illustrated.Although it is understood that, embodiments of the invention can To put into practice in the case of without these details.In some instances, known method, structure and skill is not been shown in detail Art, so as not to obscure the understanding of this description.Similarly, it will be appreciated that disclose and help understand each to simplify the present invention One or more in individual inventive aspect, above in the description of the exemplary embodiment of the present invention, each of the present invention is special Levy and be grouped together into sometimes in single embodiment, figure or descriptions thereof.However, should not be by the method solution of the disclosure Release in the following intention of reflection:The feature that i.e. the present invention for required protection requirement ratio is expressly recited in each claim is more Many features.More precisely, as the following claims reflect, inventive aspect is less than single reality disclosed above Apply all features of example.Therefore, it then follows thus claims of specific embodiment are expressly incorporated in the specific embodiment, Wherein each claim itself is used as separate embodiments of the invention.It should be noted that in the case where not conflicting, this The feature in embodiment and embodiment in application can be mutually combined.Any single aspect is the invention is not limited in, Any single embodiment is not limited to, any combination and/or the displacement of these aspects and/or embodiment is also not limited to.And And, can be used alone the present invention each aspect and/or embodiment or with it is one or more other aspect and/or its enforcement Example is used in combination.
Finally it should be noted that:Various embodiments above only to illustrate technical scheme, rather than a limitation;To the greatest extent Pipe has been described in detail with reference to foregoing embodiments to the present invention, it will be understood by those within the art that:Its according to So the technical scheme described in foregoing embodiments can be modified, either which part or all technical characteristic are entered Row equivalent;And these modifications or replacement, do not make the essence disengaging various embodiments of the present invention technology of appropriate technical solution The scope of scheme, it all should cover in the middle of the claim of the present invention and the scope of specification.

Claims (6)

1. a kind of mainboard, it is characterised in that the mainboard is included by electricity and management function in SOPC realizations, the SOPC:
Upper electric module and Nios II;Wherein,
The upper electric module, for controlling the upper electricity of the mainboard;
The Nios II, for managing the mainboard.
2. mainboard according to claim 1, it is characterised in that the upper electric logic of the upper electric module is compiled using verilog Write.
3. mainboard according to claim 1 and 2, it is characterised in that the sensing that the Nios II pass through I2C and the mainboard Device communicates, and the management function of the mainboard is realized by monitoring the sensor.
4. mainboard according to claim 3, it is characterised in that the sensor includes:
For monitoring the sensor and sensor for monitoring the board status of the mainboard temperature.
5. on a kind of mainboard electricity and management method, it is characterised in that include:
Using electricity in the upper electric module control mainboard of mainboard, and the Nios II using the mainboard realize that mainboard is managed, wherein, should Mainboard includes that SOPC, the SOPC include upper electric module and Nios II.
6. method according to claim 5, it is characterised in that the Nios II using the mainboard realize that mainboard is managed, Including:
The management function of mainboard is realized by monitoring the sensor being connected with the mainboard by I2C.
CN201611238929.3A 2016-12-28 2016-12-28 Mainboard and mainboard electrifying and managing method Pending CN106649193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611238929.3A CN106649193A (en) 2016-12-28 2016-12-28 Mainboard and mainboard electrifying and managing method

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Application Number Priority Date Filing Date Title
CN201611238929.3A CN106649193A (en) 2016-12-28 2016-12-28 Mainboard and mainboard electrifying and managing method

Publications (1)

Publication Number Publication Date
CN106649193A true CN106649193A (en) 2017-05-10

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Family Applications (1)

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Country Status (1)

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CN (1) CN106649193A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7237086B1 (en) * 2003-11-26 2007-06-26 American Megatrends, Inc. Configuring a management module through a graphical user interface for use in a computer system
CN102236398A (en) * 2011-07-21 2011-11-09 曙光信息产业(北京)有限公司 Godson blade main board cold start method
CN103634237A (en) * 2013-10-31 2014-03-12 中国船舶重工集团公司第七二二研究所 MCMC [MicroTCA (Micro Telecom Computing Architecture) Carrier Management Controller]
CN104360927A (en) * 2014-12-11 2015-02-18 浪潮电子信息产业股份有限公司 Method for acquiring monitoring information of computer system structure based on NUMA (Non Uniform Memory Access)
CN205450909U (en) * 2016-04-01 2016-08-10 浪潮电子信息产业股份有限公司 BMC based on FPGA realizes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7237086B1 (en) * 2003-11-26 2007-06-26 American Megatrends, Inc. Configuring a management module through a graphical user interface for use in a computer system
CN102236398A (en) * 2011-07-21 2011-11-09 曙光信息产业(北京)有限公司 Godson blade main board cold start method
CN103634237A (en) * 2013-10-31 2014-03-12 中国船舶重工集团公司第七二二研究所 MCMC [MicroTCA (Micro Telecom Computing Architecture) Carrier Management Controller]
CN104360927A (en) * 2014-12-11 2015-02-18 浪潮电子信息产业股份有限公司 Method for acquiring monitoring information of computer system structure based on NUMA (Non Uniform Memory Access)
CN205450909U (en) * 2016-04-01 2016-08-10 浪潮电子信息产业股份有限公司 BMC based on FPGA realizes

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Application publication date: 20170510

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