CN106647174B - A kind of focusing leveling device and focusing and leveling method - Google Patents
A kind of focusing leveling device and focusing and leveling method Download PDFInfo
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- CN106647174B CN106647174B CN201510731070.9A CN201510731070A CN106647174B CN 106647174 B CN106647174 B CN 106647174B CN 201510731070 A CN201510731070 A CN 201510731070A CN 106647174 B CN106647174 B CN 106647174B
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Abstract
The invention discloses a kind of focusing leveling device and focusing and leveling methods, the focusing leveling device includes lighting unit, projecting cell, probe unit and the relay unit arranged according to light path, wherein lighting unit and projecting cell are set to projection objective side, probe unit and relay unit are set to the projection objective other side, projecting cell includes projection mark plate, several gratings are additionally provided on the projection mark plate, the raster grid quantity and width of several gratings are different.By the way that the different grating of several grating parameters is arranged on projection mark plate, make the emergent light of lighting unit that can generate the measuring beam with sub-light spot of different shapes after projection mark plate, different sub-light spots is detected by probe unit, finally different sub-light spots are imaged by relay unit, to obtain the elevation information of silicon chip surface, avoid factor hot spot beat in silicon chip groove lose when cause detection cannot carry out or error increase, substantially increase the stability and reliability of system.
Description
Technical field
The present invention relates to photoetching machine technique fields, and in particular to a kind of focusing leveling device and focusing and leveling method.
Background technology
Projection mask aligner is a kind of equipment that the pattern on mask projects to silicon chip surface by projection objective.In photoetching
In the exposure process of machine, have if silicon chip makes in exposure field some regions be in relative to the defocus of focal plane of lens or inclination
It imitates except depth of focus, photoetching quality will be seriously affected, it is therefore necessary to be accurately controlled using focusing and leveling system.Existing focusing
The general work principle of leveling system is：It obtains silicon chip surface height and inclination information in entire exposure field first, is sentenced with this
The whether correct focusing and leveling of disconnected automatic focusing leveling system, and make corresponding adjusting according to these information, to accurately control silicon chip position
It sets.
However the silicon chip used in litho machine is usually required by multiple tracks silicon hole (through silicon via, TSV)
Technical finesse, TSV technology refer to by between chip and chip, make vertical conducting between wafer and wafer, realize chip
Between the state-of-the-art technology that interconnects, have many advantages, such as that package dimension is small, signal transmission is fast, low in energy consumption.Standard silicon chip is passing through each road
After TSV techniques, silicon chip edge will appear problems, be mainly reflected in：It is bonded inconsistent/decentraction, there is abrasion at edge, there is ditch
Slot, silicon chip surface have splash-proofing sputtering metal or insulating cement, and silicon chip has warpage, especially when there are when groove for silicon chip surface, it will right
The measurement of its apparent height and inclination information brings very big influence.
Currently, most common focusing-levelling detection device and its focusing and leveling method, as shown in Figure 1, including being distributed in throwing
The optical path of shadow objective lens optical axis both sides, including according to the sequentially connected lighting unit 1 ' of light path, projecting cell 2 ', probe unit 3 '
And relay unit 4 '.The light source emergent light that lighting unit 1 ' provides is sent to projecting cell after lens group optically focused by optical fiber
2 ', provide lighting source for entire measuring device, then by projecting cell 2 ' after, in silicon chip surface current exposure region
It is formed and measures hot spot, then, probe unit 3 ' detects the measurement hot spot on silicon chip, eventually by the detector in relay unit 4 '
It receives, the light intensity signal with measured object apparent height information is formed, to obtain the elevation information of silicon chip surface.The triangulation
It is smooth that method, which requires the surface of measured object, and for surface there are the silicon chip of groove, measurement accuracy will substantially reduce.
In view of the above problems, having also been proposed a kind of method of focusing and leveling in the prior art, main technical solution is：Control
The numerical aperture (NA) of lighting sub loop optical fiber processed should be greater than the numerical aperture (NA) and its enlargement ratio that are equal to projection branch optical fibers
Product, be more than or equal to the numerical aperture (NA) and the sum of measured object tilt quantity of detection branch optical fibers, to reduce measured object surface
It is uneven to cause to be imaged shade, so as to cause measured deviation.Under normal conditions, the pattern on silicon chip face and wiring are to hand in length and breadth
Wrong, therefore reflection light can generate offset in all directions, a technology wherein embodiment is by projection aperture diaphragm 11 '
Cross shape is made, as shown in Fig. 2, to ensure the smooth reception of detection light beam 12 ', to reduce measurement error.Though the program
The measurement error generated when so can reduce measured object surface irregularity to a certain extent, however when encountering large groove,
May cause to measure can not carry out, and influence the reliability and stability of system.
Invention content
The present invention provides a kind of focusing and leveling effectively improving system stability and reliability to overcome the above deficiency
Device and focusing and leveling method.
In order to solve the above-mentioned technical problem, the technical scheme is that：A kind of focusing leveling device, including arranged according to light path
Lighting unit, projecting cell, probe unit and the relay unit of row, wherein the lighting unit and the projecting cell are set to and throw
Shadow object lens side, the probe unit and the relay unit are set to the projection objective other side, and the projecting cell includes
Projection mark plate, which is characterized in that several gratings, the raster grid quantity of several gratings are additionally provided on the projection mark plate
It is different with width.
Further, the quantity of the grating is at least 3.
Further, the raster grid width of each grating and spacing are all higher than the resolution of CCD in the relay unit
Rate.
Further, the lighting unit is broadband light source.
Further, the projecting cell further include group lens group before the collimator and extender mirror being arranged in order, projection, it is first anti-
Organize lens group after penetrating microscope group and projection, the projection mark plate be located at before the collimator and extender mirror and the projection organize lens group it
Between.
Further, the probe unit includes group lens group, the second speculum group and detection before the detection being arranged in order
After organize lens group.
Further, the relay unit includes the relay mirror being arranged in order, relay lens group, detector, operation
Unit and focusing controller.
The present invention also provides a kind of focusing and leveling methods, include the following steps：
S1：Lighting unit, projecting cell, probe unit and relay unit are set, and installed according to light path, the throwing
Shadow unit includes projection mark plate, several gratings is placed in the projection mark plate surface, and each grating is numbered；
S2：The emergent light that the lighting unit provides is set to form the survey with different sub-light spots after the projecting cell
Light beam is measured, the surface of silicon chip is projected；
S3：The probe unit carries out detection to the measuring beam with the different sub-light spots and is formed with different sub-lights
The detection hot spot beam of spot；
S4：Relay unit receives the detection hot spot beam with different sub-light spots, is imaged to different sub-light spots,
The light intensity signal of the elevation information on the surface with the silicon chip is formed, and the elevation information of silicon chip surface is calculated, finally
Focusing and leveling is carried out to the silicon chip according to the elevation information.
Further, in the step S2, the emergent light that the lighting unit provides is by after projection mark plate, forming
With sub-light spot of different shapes, each sub-light spot corresponds to the grating accordingly numbered.
Further, each described in the light intensity signal with silicon chip surface elevation information formed in the step S4
The height that the signal rising edge of sub-light spot corresponds to the silicon chip surface is different.
Focusing leveling device and focusing and leveling method provided by the invention, by the way that several gratings are arranged on projection mark plate
The different grating of parameter makes the emergent light of lighting unit that can be generated after projection mark plate with sub-light spot of different shapes
Measuring beam, different sub-light spots is detected by probe unit, finally different sub-light spots are carried out by relay unit
Imaging forms the light intensity signal with silicon chip surface elevation information, to obtain the elevation information of silicon chip surface, due to not similar shape
The corresponding silicon chip surface height of signal rising edge of shape sub-light spot is different, therefore according to the sub-light spot of acquisition accordingly numbered
Accurately to obtain the height of silicon chip surface, cause detection that cannot carry out or miss when factor hot spot being avoided to beat the loss in silicon chip groove
Difference increases, and substantially increases the stability and reliability of system.
Description of the drawings
Fig. 1 is the structural schematic diagram of focusing leveling device in the prior art；
Fig. 2 is the relative position of one embodiment projection aperture diaphragm of focusing and leveling method and detection light beam in the prior art
Figure；
Fig. 3 is the structural schematic diagram of focusing leveling device of the present invention；
Fig. 4 is the structural schematic diagram of focusing leveling device grating of the present invention；
Fig. 5 is the structural schematic diagram of sub-light spot on focusing leveling device silicon chip of the present invention；
Fig. 6 is that focusing leveling device of the present invention has measuring beam and detection light beam schematic diagram in fluted silicon chip；
Fig. 7 is the corresponding signal graph of focusing leveling device difference sub-light spot of the present invention；
Fig. 8 a-8c are the schematic diagrames that focusing leveling device of the present invention only detects a sub- hot spot；
Fig. 9 is focusing and leveling method flow diagram of the present invention.
Fig. 1-2：1 ', lighting unit；2 ', projecting cell；3 ', probe unit；4 ', relay unit；11 ', aperture diaphragm；
12 ', light beam is detected；
Shown in Fig. 3~9：1, lighting unit；101, measuring beam；102, light beam is detected；2, projecting cell；21, it collimates
Beam expanding lens；22, projection mark plate；23, grating；24, lens group is organized before projection；25, the first speculum group；26, it is organized after projecting saturating
Microscope group；3, probe unit；31, lens group is organized before detection；32, the second speculum group；33, lens group is organized after detecting；4, relaying is single
Member；41, relay mirror；42, relay lens group；43, detector；44, arithmetic element；45, focusing controller；5, object is projected
Mirror；6, silicon chip；P1~P3, sub-light spot.
Specific implementation mode
The present invention is described in detail below in conjunction with the accompanying drawings：
As shown in figure 3, the present invention provides a kind of focusing leveling device, includes the lighting unit 1 arranged according to light path, projects
Unit 2, probe unit 3 and relay unit 4, wherein lighting unit 1 and projecting cell 2 are set to 5 side of projection objective, probe unit
3 and relay unit 4 be set to 5 other side of projection objective, projecting cell 2 includes projection mark plate 22, is also set on projection mark plate 22
There are several gratings 23, the raster grid quantity and width of several gratings 23 different.
As shown in figure 4, the quantity of grating 23 is at least 3, in the present embodiment, it is 3 to select the quantity of grating 23, respectively
Number is 231,232,233, and the raster grid width and spacing of each grating 23 are all higher than the resolution of CCD in the relay unit 4
Rate, and on the different location of projection mark plate 22.
Please continue to refer to Fig. 3, lighting unit 1 is broadband light source, and wave-length coverage can cover ultraviolet, visible light and near-infrared
Wave band.Preferred broadband light source is LED light source, xenon lamp or halogen lamp, and illumination emergent light is provided for system.Projecting cell 2 is also
Including be arranged in order collimator and extender mirror 21, projection before group lens group 24, the first speculum group 25 and projection after organize lens group 26,
Projection mark plate 22 is located between collimator and extender mirror 21 and the preceding group lens group 24 of projection, and the emergent light of lighting unit 1 is by projection
After marking plate 22, being formed has sub-light spot P1, P2, P3 of different shapes, as shown in figure 5, each sub-light spot P1, P2, P3 couple
The grating 23 that should accordingly number, i.e. sub-light spot P1 correspond to grating 231, and sub-light spot P2 corresponds to grating 232, and sub-light spot P3 corresponds to grating
233；Sub-light spot P1, P2, P3 of different shapes pool measuring beam 101, anti-by group lens group 24, first before projection successively
After penetrating microscope group 25 and projecting 6 surface of silicon chip is projected after group lens group 26.
Preferably, probe unit 3 includes before the detection that is arranged in order after group lens group 31, the second speculum group 32 and detection
Group lens group 33, probe unit 3 detect sub-light spot P1, P2, P3 of different shapes on silicon chip 6, receive by 6 surface of silicon chip
Sub-light spot P1, P2, P3 of regular reflection or diffraction form detection light beam.Specifically, as shown in fig. 6, when 6 surface of silicon chip exists
When groove, cause sub-light spot P1, P2, P3 after reflection or diffraction that can not pass through since sub-light spot P1, P2, P3 are fallen into groove
Probe unit 3 reaches relay unit 4, by the way that sub-light spot P1, P2, P3 of different shapes are numbered, what probe unit 3 was formed
Also there is the number information of sub-light spot P1, P2, P3 for detecting in detection light beam 102.
Preferably, relay unit 4 includes the relay mirror 41 being arranged in order, relay lens group 42, detector 43, operation
Unit 44 and focusing controller 45, detector 43 are used for receiving the detection hot spot with different shape sub-light spot P1, P2, P3
Shu Jinhang be imaged, formed with silicon chip surface elevation information light intensity signal, as shown in fig. 7, then by arithmetic element 44 into
The elevation information on 6 surface of silicon chip is calculated in row, final to carry out focusing and leveling to silicon chip 6 using focusing controller 45.Specifically,
In the light intensity signal with silicon chip surface elevation information that detector 43 is formed, the signal of each sub-light spot P1, P2, P3 rise
Apparent height along corresponding silicon chip 6 is different, and the quantity of the present embodiment neutron hot spot is 3, when detector 43 obtain all 2 with
When upper sub-light spot, the surface height data of the corresponding silicon chip of this 2/3 sub- hot spots 6 is obtained first, then to this 2/3 height
Degrees of data is weighted or is averaging, and obtains the apparent height of silicon chip 6；When 43 acquisition one sub- hot spots of any of which of detector
When (other two sub- hot spots are both fallen in groove at this time), as shown by figures 8 a-8 c, as long as obtaining the sub-light spot P1, P2, P3 couple
The surface height data for the silicon chip 6 answered can obtain the height on 6 surface of silicon chip, therefore, avoid the factor hot spot P1, P2, P3
Beat in 6 groove of silicon chip lose when cause detection cannot carry out or error increase.
The present invention also provides a kind of focusing and leveling methods, as shown in figure 9, including the following steps：
S1：Lighting unit 1, projecting cell 2, probe unit 3 and relay unit 4 are set, and installed according to light path, institute
It includes projection mark plate 22 to state projecting cell 2, and several gratings 23 are placed in 22 surface of projection mark plate, and to each grating 23 into
Row number, specifically, the quantity of grating is 3, number is 231,232,233 respectively, and each grating 23 is placed in projection mark plate
On 22 different location.
S2：The emergent light that lighting unit 1 provides is set to be formed after projecting cell 2 with different sub-light spot P1, P2, P3
Measuring beam 101 projects the surface of silicon chip 6, specifically, the emergent light of lighting unit 1 passes through after projection mark plate 22, shape
The grating 23 accordingly numbered, i.e. sub-light are corresponded at sub-light spot P1, P2, P3 of different shapes, each sub-light spot P1, P2, P3
Spot P1 corresponds to grating 231, and sub-light spot P2 corresponds to grating 232, and sub-light spot P3 corresponds to grating 233；Sub-light spot P1 of different shapes,
P2, P3 pool measuring beam 101, organize lens after organizing lens group 24, the first speculum group 25 and projection before projection successively
6 surface of silicon chip is projected after group 26.
S3：Probe unit 3 carries out detection to the measuring beam 101 with different sub-light spot P1, P2, P3 and is formed with difference
The detection hot spot beam 102 of sub-light spot P1, P2, P3, when 6 surface of silicon chip is there are when groove, since sub-light spot P1, P2, P3 fall into ditch
Cause sub-light spot P1, P2, P3 after reflection or diffraction that can not reach relay unit 4 by probe unit 3 in slot, by not
Sub-light spot P1, P2, P3 of similar shape are numbered, and also have the sub-light detected in the detection light beam 102 that probe unit 3 is formed
The number information of spot P1, P2, P3.
S4：Relay unit 4 receive with different sub-light spot P1, P2, P3 detection hot spot beam, to different sub-light spot P1,
P2, P3 are imaged, and the light intensity signal of the elevation information on the surface with silicon chip 6 is formed, and the height on 6 surface of silicon chip is calculated
Information is spent, focusing and leveling is finally carried out to silicon chip 6 according to the elevation information of acquisition；Specifically, being carried what detector 43 was formed
In the light intensity signal of 6 apparent height information of silicon chip, the signal rising edge of each sub-light spot P1, P2, P3 correspond to the surface height of silicon chip 6
Degree is different, and the quantity of whole sub-light spots is 3 in the present embodiment, when detector 43 obtains all 2 or more sub-light spots, first
The surface height data for obtaining the corresponding silicon chip of this 2/3 sub- hot spots 6, is then weighted this 2/3 altitude informations
Or be averaging, obtain the apparent height of silicon chip 6；When detector 43 obtains one sub- hot spot of any of which (at this time other
Two sub- hot spots are both fallen in groove), as long as obtaining the surface height data of the corresponding silicon chip of the sub-light spot P1, P2, P3 6, just
The height on 6 surface of silicon chip can be obtained, therefore, avoiding when the factor hot spot P1, P2, P3 beat the loss in 6 groove of silicon chip causes
Detection cannot carry out or error increases.
In conclusion focusing leveling device provided by the invention and focusing and leveling method, by projection mark plate 22
The different grating 23 of several grating parameters is set, the emergent light of lighting unit 1 is allow 22 to generate tool after projection mark plate
The measuring beam 101 for having sub-light spot P1, P2, P3 of different shapes, by probe unit 3 to different sub-light spot P1, P2, P3 into
Row detection, is finally imaged different sub-light spot P1, P2, P3 by relay unit 4, is formed and carries 6 apparent height information of silicon chip
Light intensity signal, to obtain the elevation information on 6 surface of silicon chip, due to the signal rising edge of different shape sub-light spot P1, P2, P3
6 apparent height of corresponding silicon chip is different, therefore can accurately be obtained according to sub-light spot P1, P2, P3 for accordingly numbering of acquisition
The height on 6 surface of silicon chip causes detection that cannot carry out or miss when the factor hot spot P1, P2, P3 being avoided to beat the loss in 6 groove of silicon chip
Difference increases, and substantially increases the stability and reliability of system.
Although embodiments of the present invention are illustrated in specification, these embodiments are intended only as prompting,
It should not limit protection scope of the present invention.It is equal that various omission, substitution, and alteration are carried out without departing from the spirit and scope of the present invention
It should be included within the scope of the present invention.
Claims (10)
1. a kind of focusing leveling device includes lighting unit, projecting cell, probe unit and the relay unit arranged according to light path,
The wherein described lighting unit and the projecting cell are set to projection objective side, and the probe unit and the relay unit are set to
The projection objective other side, the projecting cell include projection mark plate, which is characterized in that are also set on the projection mark plate
There are several gratings, the raster grid quantity and width of several gratings different.
2. focusing leveling device according to claim 1, which is characterized in that the quantity of the grating is at least 3.
3. focusing leveling device according to claim 1, which is characterized in that the raster grid width of each grating and
Away from the resolution ratio for being all higher than CCD in the relay unit.
4. focusing leveling device according to claim 1, which is characterized in that the lighting unit is broadband light source.
5. focusing leveling device according to claim 1, which is characterized in that the projecting cell further includes being arranged in order
Lens group is organized after organizing lens group, the first speculum group and projection before collimator and extender mirror, projection, the projection mark plate is located at described
Before collimator and extender mirror and the projection between group lens group.
6. focusing leveling device according to claim 1, which is characterized in that the probe unit includes the spy being arranged in order
Before surveying lens group is organized after group lens group, the second speculum group and detection.
7. focusing leveling device according to claim 1, which is characterized in that the relay unit includes in being arranged in order
After speculum, relay lens group, detector, arithmetic element and focusing controller.
8. a kind of focusing and leveling method, which is characterized in that include the following steps：
S1：Setting such as claim 1-7 any one of them focusing leveling devices, the projecting cell includes projection mark plate,
Several gratings are placed in the projection mark plate surface, and each grating is numbered；
S2：The emergent light that the lighting unit provides is set to form the measurement light with different sub-light spots after the projecting cell
Beam projects the surface of silicon chip；
S3：The probe unit carries out detection to the measuring beam with different sub-light spots and is formed with different sub-light spots
Detect hot spot beam；
S4：The relay unit receives the detection hot spot beam with different sub-light spots, is imaged to different sub-light spots,
The light intensity signal of the elevation information on the surface with the silicon chip is formed, and the elevation information of silicon chip surface is calculated, finally
Focusing and leveling is carried out to the silicon chip according to the elevation information.
9. focusing and leveling method according to claim 8, which is characterized in that in the step S2, the lighting unit carries
The emergent light of confession passes through after the projection mark plate, and being formed has sub-light spot of different shapes, and each sub-light spot corresponds to
The grating accordingly numbered.
10. focusing and leveling method according to claim 8, which is characterized in that is formed in the step S4 carries silicon chip
In the light intensity signal of apparent height information, the height that each sub-light spot rising edge corresponds to the silicon chip surface is different.
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| CN201510731070.9A CN106647174B (en) | 2015-10-30 | 2015-10-30 | A kind of focusing leveling device and focusing and leveling method |
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| CN110057839A (en) * | 2019-04-18 | 2019-07-26 | 中国科学院微电子研究所 | Focusing control apparatus and method in a kind of Optical silicon wafer detection system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101169601A (en) * | 2007-11-21 | 2008-04-30 | 上海微电子装备有限公司 | Focusing leveling measuring system |
| CN102141738A (en) * | 2011-04-02 | 2011-08-03 | 中国科学院光电技术研究所 | Nanometer-level automatic focusing system for projection lithography |
| CN102207694A (en) * | 2010-03-31 | 2011-10-05 | 上海微电子装备有限公司 | Imaging adjustment unit and focusing and leveling control system using the unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7355675B2 (en) * | 2004-12-29 | 2008-04-08 | Asml Netherlands B.V. | Method for measuring information about a substrate, and a substrate for use in a lithographic apparatus |
| JP5104107B2 (en) * | 2007-08-02 | 2012-12-19 | ウシオ電機株式会社 | Strip-shaped workpiece exposure apparatus and focus adjustment method in strip-shaped workpiece exposure apparatus |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101169601A (en) * | 2007-11-21 | 2008-04-30 | 上海微电子装备有限公司 | Focusing leveling measuring system |
| CN102207694A (en) * | 2010-03-31 | 2011-10-05 | 上海微电子装备有限公司 | Imaging adjustment unit and focusing and leveling control system using the unit |
| CN102141738A (en) * | 2011-04-02 | 2011-08-03 | 中国科学院光电技术研究所 | Nanometer-level automatic focusing system for projection lithography |
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