CN106646958A - Method and device for detecting substrate scratch - Google Patents
Method and device for detecting substrate scratch Download PDFInfo
- Publication number
- CN106646958A CN106646958A CN201710174104.8A CN201710174104A CN106646958A CN 106646958 A CN106646958 A CN 106646958A CN 201710174104 A CN201710174104 A CN 201710174104A CN 106646958 A CN106646958 A CN 106646958A
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- China
- Prior art keywords
- capacitance
- substrate
- insulating layer
- out area
- distributed line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
- G01N27/24—Investigating the presence of flaws
Abstract
The invention provides a method and a device for detecting substrate scratch. The method comprises the following steps: forming distributed circuits on an insulating layer surface of a fan-out area of the substrate by using an oxide material; detecting a first capacitance value of each circuit in the distributed circuits; comparing the first capacitance value with a second capacitance value of a standard product; confirming the scratch on the insulating layer surface in the fan-out area of the substrate according to a comparison result, thereby solving the problem of the scratch on the insulating layer surface in the fan-out area of a liquid crystal substrate in the production circulation link of the substrate and realizing the process monitoring.
Description
Technical field
The present invention relates to technical field of liquid crystal display, more particularly to the method and apparatus that a kind of substrate scratches detection.
Background technology
With the development of Display Technique, liquid crystal indicator has become the main product in people's daily life.At present,
Liquid crystal display product (Liquid Crystal Display：Abbreviation LCD) after second cutting is carried out, the film crystal of substrate
Pipe is fanned out to TFT Fan Out regions and can come out (shown in Figure 1), substrate in subsequent production intermediate links, due to each
Plant reason, it is easy to the situation that the signal line overlying insulating layer in TFT Fan Out regions is scratched occur, the scuffing can cause absolutely
Edge layer is damaged, circuit corrosion after metal exposure, and making TFT Fan Out regions line defect occur causes viewing area Line
Defect, so that defective product carries out shipment.
The content of the invention
In view of this, the purpose of the present invention is for problems of the prior art, there is provided a kind of substrate scratches detection
Method and apparatus, to solve the problems, such as substrate production intermediate links in TFT Fan Out regions surface of insulating layer scratch.
The method that a kind of substrate that the present invention is provided scratches detection, including：Surface of insulating layer in substrate fan-out area makes
Distributed line is formed with oxide material；
Detect the first capacitance of every circuit in the distributed line；
First capacitance is compared with the second capacitance of standardized product；
Determine that the surface of insulating layer of substrate fan-out area is scratched according to comparative result.
Optionally, the surface of insulating layer in substrate fan-out area forms the step of distributed line using oxide material
Suddenly include：
Distributed line is formed according to the holding wire of the surface of insulating layer of substrate fan-out area；
Or, distributed line is formed according to the cost of integrated circuit.
Optionally, the holding wire of the surface of insulating layer according to substrate fan-out area forms distributed line and includes：
The width of distributed line is determined according to the scuffing length of holding wire, distributed line is generated according to the width.
Optionally, it is described to determine that the surface of insulating layer of substrate fan-out area includes the step of scuffing according to comparative result：
If first capacitance is not equal to second capacitance, it is determined that the surface of insulating layer of substrate fan-out area is drawn
Wound.
Optionally, it is described to include the step of determine substrate insulating layer surface tear according to comparative result：
If first capacitance exceedes given threshold with the ratio of second capacitance, it is determined that substrate fan-out area
Surface of insulating layer scratch；
Or, if second capacitance exceedes given threshold with the ratio of first capacitance, it is determined that substrate is fanned
The surface of insulating layer for going out region is scratched.
Optionally, the oxide material includes：Indium tin oxide material.
According to another aspect the invention also discloses a kind of substrate scratches the equipment for detecting, including：
Mask plate and test device, wherein, the test device includes：Test fixture and integrated circuit；
The mask plate is used for the surface of insulating layer in substrate fan-out area and forms distributed line using oxide material；
The test fixture is used to detecting the first electric of every circuit in the distributed line that the mask plate is formed
Capacitance；
The integrated circuit is used for the second capacitance of the first capacitance and standardized product for detecting test fixture
It is compared；
The integrated circuit includes comparing unit, and the comparing unit is used to determine substrate fan-out area according to comparative result
Surface of insulating layer scratch.
Optionally, the mask plate forms distributed line for the holding wire of the surface of insulating layer according to substrate fan-out area
Road；
Or, distributed line is formed according to the cost of integrated circuit.
Optionally, the mask plate is additionally operable to
The width of distributed line is determined according to the scuffing length of holding wire, distributed line is generated according to the width.
Optionally, the comparing unit specifically for：
If first capacitance is not equal to second capacitance, it is determined that the surface of insulating layer of substrate fan-out area is drawn
Wound.
Optionally, the comparing unit specifically for：
If first capacitance exceedes given threshold with the ratio of second capacitance, it is determined that substrate fan-out area
Surface of insulating layer scratch；
Or, if second capacitance exceedes given threshold with the ratio of first capacitance, it is determined that substrate is fanned
The surface of insulating layer for going out region is scratched.
Compared with prior art, the present invention at least includes advantages below：
Surface of insulating layer of the present invention in substrate TFT Fan Out regions forms distributed line using oxide material,
Mitigate insulating surface to scratch, then detect the first capacitance of every circuit, by the of first capacitance and standardized product
Two capacitances are compared, and according to comparative result substrate insulating layer surface tear is determined, so as to production the circulation stage can and
The surface of insulating layer in Shi Faxian TFT Fan Out regions is scratched, and so as to avoid defective product shipment, and then reduces client
The fraction defective of product.
Description of the drawings
In order to be illustrated more clearly that technical scheme, below will be to use needed for embodiment of the present invention description
Accompanying drawing be briefly described.It should be evident that drawings in the following description are only some embodiments of the present invention, for this
For the those of ordinary skill of field, on the premise of not paying creative work, can be with other according to these accompanying drawings acquisitions
Accompanying drawing.
Fig. 1 is the schematic diagram that the thin film transistor (TFT) of substrate of the present invention is fanned out to TFT Fan Out regions；
Fig. 2 is the flow chart that a kind of substrate described in the embodiment of the present invention one scratches detection method；
Fig. 3 is the flow chart that a kind of substrate described in the embodiment of the present invention two scratches detection method；
Fig. 3-a are the schematic diagrames of the distributed line of standard of the present invention；
Fig. 3-b are the schematic diagrames of the distributed line that the present invention is scratched；
Fig. 4 is the schematic diagram that the holding wire of the surface of insulating layer of substrate fan-out area of the present invention forms distributed line；
Fig. 5 is the schematic diagram that the holding wire of the surface of insulating layer of substrate fan-out area of the present invention forms distributed line；
Fig. 6-a are the distributed line schematic diagrames that surface of insulating layer of the present invention in substrate fan-out area is formed；
Fig. 6-b are the equivalent circuit schematic diagrames of the distributed line of Fig. 6-a of the present invention；
Fig. 7 is the distributed line schematic diagram that surface of insulating layer of the present invention in substrate fan-out area is formed；
Fig. 8 is the schematic diagram that the first capacitance of the invention is compared with the second capacitance of standardized product；
Fig. 9 is the schematic diagram that a kind of substrate according to embodiment three scratches testing equipment.
Specific embodiment
The preferred embodiment of the disclosure is more fully described below with reference to accompanying drawings.Although showing the disclosure in accompanying drawing
Preferred embodiment, however, it is to be appreciated that may be realized in various forms the disclosure and the embodiment party that should not be illustrated here
Formula is limited.Conversely, these embodiments are provided so that the disclosure is more thorough and complete, and can be by the disclosure
Scope intactly conveys to those skilled in the art.
Embodiment one
With reference to Fig. 2, the flow chart that a kind of substrate described in the embodiment of the present invention one scratches detection method, the method are it illustrates
Specifically include：
Step 201：Surface of insulating layer in substrate fan-out area forms distributed line using oxide material.
Distributed line figure is formed by exposing to photoresist by surface of insulating layer of the mask plate in substrate fan-out area
Shape, is then performed etching using acid, by the oxide etching without photoresist covering part, retains mask plate figure, is formed and is divided
Cloth circuit, so as to the surface of insulating layer for preventing substrate fan-out area is scratched.
Oxide material can be indium tin oxide ITO, and the indium tin oxide transparent and electrically conductive is good, or other
Metal oxide materials, are not particularly limited to this present invention.
Step 202：Detect the first capacitance of every circuit in the distributed line.
Using the first capacitance of every circuit in the test fixture detection distributed line in test device.
Step 203：First capacitance is compared with the second capacitance of standardized product.
Step 204：Determine that the surface of insulating layer of substrate fan-out area is scratched according to comparative result.
The schematic diagram of the distributed line of standard is shown referring to Fig. 3-a, referring to Fig. 3-b the distributed line of scuffing is shown
The schematic diagram on road.
Capacitance C of acquisition second in Fig. 3-a is obtained by test device1-1、C4-1……Cn-1。
The first capacitance C in Fig. 3-b is obtained by test device1-2、C4-2.......Cn-2, by C1-2With C1-1Relatively,
C4-2With C4-1Relatively ... .Cn-2With Cn-1Relatively, comparative result is obtained, if any one is unequal in comparative result, is sentenced
The surface of insulating layer of fixed basic fan-out area is scratched.
The embodiment of the present invention, is formed by the surface of insulating layer in substrate TFT Fan Out regions using oxide material
Distributed line, prevents insulating surface from scratching, and then detects the first capacitance of every circuit, by first capacitance and mark
Second capacitance of quasi- product is compared, and according to comparative result substrate insulating layer surface tear is determined, so as in production circulation
Stage can in time find that the surface of insulating layer in TFT Fan Out regions is scratched, and so as to avoid defective product shipment, and then drop
The low fraction defective of product.
Embodiment two
With reference to Fig. 3, the flow chart that a kind of substrate described in the embodiment of the present application two scratches detection method, the method are it illustrates
Specifically include：
Step 301：Surface of insulating layer in substrate fan-out area forms distributed line using oxide material.
Distributed line can be formed according to the holding wire of the surface of insulating layer of substrate fan-out area in actual applications, and
It is shown in Figure 4 and the distributed line for being formed needs all holding wires of the surface of insulating layer of covering fan-out area.
In Fig. 4, the region of black overstriking is the distribution by mask plate in the surface of insulating layer formation of substrate fan-out area
Formula circuit, by test fixture the first capacitance of every circuit in distributed line is measured, and first capacitance refers to Fig. 4
Capacitance between middle Tx and Rx.
Preferably, the holding wire of the surface of insulating layer according to substrate fan-out area forms distributed line and includes：Root
Determine the width of distributed line according to the scuffing length of holding wire, distributed line is generated according to the width.
Referring in Fig. 5, it is assumed that the length that information wire is scratched is 2 signal lines, it is determined that the width of distributed line is to cover
The signal line of lid two, then the distributed line figure for being generated according to the width.
Distributed line can with according to the cost of integrated circuit (IC) formed distributed line, if integrated circuit into
This is higher, then can form more complicated distributed line, if the low cost of integrated circuit, can be formed fairly simple
Distributed line.
IC high costs, then illustrate that the interface of distributed line is more, and IC low costs, then illustrate the interface of distributed line
Few, Fig. 6-a show the distributed line of IC low costs, by the equivalent circuit figure of Fig. 6-a as shown in Fig. 6-b, can from such as Fig. 6-b
Intuitively to find out very much, the interface of IC seldom, thus reduces the cost of manufacture of IC.
Distributed line figure can also adopt other modes, such as distributed line shown in Fig. 7 subsequently actually to make
The distributed line of different pattern can be adopted with middle those skilled in the art, as long as the distributed line for being formed covers all letters
Number line, the present invention is not particularly limited to the pattern of distributed line.
Step 302：Detect the first capacitance of every circuit in the distributed line.
Step 303：First capacitance is compared with the second capacitance of standardized product.
The schematic diagram that the first capacitance is compared with the second capacitance of standardized product, test clip are shown referring to Fig. 8
Tool detects the first capacitance C2 of every circuit in distributed line, by the first capacitance C2 respectively with the second of standardized product
Capacitance C1 is compared, if the first capacitance occur is not equal to the second capacitance, then it is assumed that the insulating barrier of substrate fan-out area
Surface tear.
Step 304：Determine that the surface of insulating layer of substrate fan-out area is scratched according to comparative result.
The surface of insulating layer that in the following manner, can determine substrate fan-out area is scratched：
A kind of mode：First capacitance of every circuit in distributed line is entered with the second capacitance of standardized product
Row compares, if the first capacitance is not equal to second capacitance, it is determined that the surface of insulating layer of substrate fan-out area is scratched.
Another way：If first capacitance exceedes given threshold with the ratio of second capacitance, it is determined that
The surface of insulating layer of substrate fan-out area is scratched.
Or, if second capacitance exceedes given threshold with the ratio of first capacitance, it is determined that substrate is fanned
The surface of insulating layer for going out region is scratched.
Wherein, the setting of threshold value can be set by those skilled in the art using any appropriate ways, such as can be adopted
Artificial experience given threshold is used, or for the difference value given threshold of historical data, other modes, the present invention can also be adopted
This is not restricted.
The embodiment of the present invention, because scratching occurs in the surface of insulating layer in substrate TFT Fan Out regions, then capacitance can be sent out
Changing, thus when the first capacitance is not equal to the second capacitance, it is determined that substrate insulating layer surface tear, so as in substrate
The production circulation stage is assured that the damage of substrate insulating layer, so as to avoid the shipment of defective product.
Embodiment three
With reference to Fig. 9, the schematic diagram that a kind of substrate described in the embodiment of the present application three scratches testing equipment, the equipment are it illustrates
Specifically include：
Mask plate 901 and test device 902, wherein, the test device includes：Test fixture 9021 and integrated circuit
9022.
The mask plate is used for the surface of insulating layer in substrate fan-out area and forms distributed line using oxide material.
Wherein, the oxide material that the mask plate is used includes：Indium tin oxide material, or other metal oxidations
Thing material, is not particularly limited to this application.
Preferably, the mask plate forms distributed line for the holding wire of the surface of insulating layer according to substrate fan-out area
Road.
Or, distributed line is formed according to the cost of integrated circuit.
Preferably, the mask plate is additionally operable to determine the width of distributed line according to the scuffing length of holding wire, according to
The width generates distributed line.
The test fixture is used to detecting the first electric of every circuit in the distributed line that the mask plate is formed
Capacitance.
The integrated circuit is used for the second capacitance of the first capacitance and standardized product for detecting test fixture
It is compared.
The integrated circuit includes comparing unit, and the comparing unit is used to determine substrate fan-out area according to comparative result
Surface of insulating layer scratch.
Preferably, the comparing unit specifically for：
If first capacitance is not equal to second capacitance, it is determined that the surface of insulating layer of substrate fan-out area is drawn
Wound.
Preferably, the comparing unit specifically for：
If first capacitance exceedes given threshold with the ratio of second capacitance, it is determined that substrate fan-out area
Surface of insulating layer scratch.
Or, if second capacitance exceedes given threshold with the ratio of first capacitance, it is determined that substrate is fanned
The surface of insulating layer for going out region is scratched.
The embodiment of the present invention, is formed by the surface of insulating layer in substrate TFT Fan Out regions using oxide material
Distributed line, prevents insulating surface from scratching, and then detects the first capacitance of every circuit, by first capacitance and mark
Second capacitance of quasi- product is compared, and according to comparative result substrate insulating layer surface tear is determined, so as in production circulation
Stage can in time find that the surface of insulating layer in TFT Fan Out regions is scratched, and so as to avoid defective product shipment, and then drop
The low fraction defective of product.
In sum, this specification content should not be construed as limiting the invention, in particular it is required that noting following several
Point：
First, each embodiment in this specification is described by the way of progressive, what each embodiment was stressed
All be the difference with other embodiment, between each embodiment same or analogous part mutually referring to.
Secondly, it should be noted that in describing the invention, unless otherwise stated, term " first ", " second ",
" interior ", " outward ", " on ", D score, the order of the instruction such as "left", "right", orientation or position relationship be artificially defined order or
Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention or becomes apparent from description, in order, and
Be not indicate or imply indication structure or part must have specific orientation, with specific azimuth configuration and operation, because
This is not considered as limiting the invention.
3rd, in specification mentioned herein, illustrate a large amount of details.It is to be appreciated, however, that the present invention
Embodiment can be put into practice in the case of without these details.In some instances, be not been shown in detail known method,
Structure and technology, so as not to obscure the understanding of this description.
4th, it will be appreciated that in order to simplify the disclosure and help understand one or more in each inventive aspect, upper
In the face of the present invention exemplary embodiment description in, the present invention each feature be grouped together into sometimes single embodiment,
In figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：It is i.e. claimed
The more features of feature that are expressly recited in each claim of application claims ratio.More precisely, as following
As claims reflect, inventive aspect is all features less than single embodiment disclosed above.Therefore, abide by
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim itself
As the separate embodiments of the present invention.
Finally it should be noted that above-described embodiment the present invention will be described rather than limits the invention, and
And those skilled in the art can design without departing from the scope of the appended claims alternative embodiment.Will in right
In asking, any reference symbol between bracket should not be configured to limitations on claims.
Claims (10)
1. a kind of method that substrate scratches detection, it is characterised in that include：
Surface of insulating layer in substrate fan-out area forms distributed line using oxide material；
Detect the first capacitance of every circuit in the distributed line；
First capacitance is compared with the second capacitance of standardized product；
Determine that the surface of insulating layer of substrate fan-out area is scratched according to comparative result.
2. method according to claim 1, it is characterised in that the surface of insulating layer in substrate fan-out area uses oxygen
The step of compound material forms distributed line includes：
Distributed line is formed according to the holding wire of the surface of insulating layer of substrate fan-out area；
Or, distributed line is formed according to the cost of integrated circuit.
3. method according to claim 2, it is characterised in that the letter of the surface of insulating layer according to substrate fan-out area
Number line forms distributed line to be included：
The width of distributed line is determined according to the scuffing length of holding wire, distributed line is generated according to the width.
4. method according to claim 1, it is characterised in that described that the exhausted of substrate fan-out area is determined according to comparative result
The step of edge layer surface tear, includes：
If first capacitance is not equal to second capacitance, it is determined that the surface of insulating layer of substrate fan-out area is scratched.
5. method according to claim 1, it is characterised in that described to determine that substrate insulating layer surface is drawn according to comparative result
The step of hindering includes：
If the ratio of first capacitance and second capacitance exceedes given threshold, it is determined that substrate fan-out area it is exhausted
Edge layer surface tear；
Or, if second capacitance exceedes given threshold with the ratio of first capacitance, it is determined that substrate fanout area
The surface of insulating layer in domain is scratched.
6. the equipment that a kind of substrate scratches detection, it is characterised in that include：
Mask plate and test device, wherein the test device includes：Test fixture and integrated circuit；
The mask plate is used for the surface of insulating layer in substrate fan-out area and forms distributed line using oxide material；
The test fixture is used for the first capacitance of every circuit in the distributed line for detect the mask plate formation；
The integrated circuit is used to carry out first capacitance that test fixture is detected with the second capacitance of standardized product
Relatively；
The integrated circuit includes comparing unit, and the comparing unit is used to determine the exhausted of substrate fan-out area according to comparative result
Edge layer surface tear.
7. equipment according to claim 6, it is characterised in that the mask plate is used for the insulation according to substrate fan-out area
The holding wire of layer surface forms distributed line；
Or, distributed line is formed according to the cost of integrated circuit.
8. equipment according to claim 7, it is characterised in that the mask plate is additionally operable to
The width of distributed line is determined according to the scuffing length of holding wire, distributed line is generated according to the width.
9. equipment according to claim 6, it is characterised in that the comparing unit specifically for：
If first capacitance is not equal to second capacitance, it is determined that the surface of insulating layer of substrate fan-out area is scratched.
10. equipment according to claim 6, it is characterised in that the comparing unit specifically for：
If the ratio of first capacitance and second capacitance exceedes given threshold, it is determined that substrate fan-out area it is exhausted
Edge layer surface tear；
Or, if second capacitance exceedes given threshold with the ratio of first capacitance, it is determined that substrate fanout area
The surface of insulating layer in domain is scratched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710174104.8A CN106646958B (en) | 2017-03-22 | 2017-03-22 | The method and apparatus that substrate scratches detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710174104.8A CN106646958B (en) | 2017-03-22 | 2017-03-22 | The method and apparatus that substrate scratches detection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106646958A true CN106646958A (en) | 2017-05-10 |
| CN106646958B CN106646958B (en) | 2019-08-23 |
Family
ID=58848466
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710174104.8A Expired - Fee Related CN106646958B (en) | 2017-03-22 | 2017-03-22 | The method and apparatus that substrate scratches detection |
Country Status (1)
| Country | Link |
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| CN113494676A (en) * | 2020-04-01 | 2021-10-12 | 上海汽车集团股份有限公司 | High-pressure gas cylinder and damage monitoring device thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106646958B (en) | 2019-08-23 |
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