CN106645971B - Method for testing package impedance of ultrahigh frequency RFID chip by using resonance method - Google Patents
Method for testing package impedance of ultrahigh frequency RFID chip by using resonance method Download PDFInfo
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- CN106645971B CN106645971B CN201710059811.2A CN201710059811A CN106645971B CN 106645971 B CN106645971 B CN 106645971B CN 201710059811 A CN201710059811 A CN 201710059811A CN 106645971 B CN106645971 B CN 106645971B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/04—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2688—Measuring quality factor or dielectric loss, e.g. loss angle, or power factor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses a method for testing the impedance of an ultrahigh frequency RFID chip by using a resonance method, which comprises the following steps: manufacturing a first coil and a second coil, wherein the two coils can be sequentially packaged with the same ultrahigh frequency RFID chip; manufacturing a third coil for the network analyzer; testing the resonance values of two coils with chips by using the mutual inductance of the coils; and (3) obtaining the real part and the imaginary part of the package impedance of the ultrahigh frequency RFID chip by utilizing data processing. Compared with a method adopting direct test, the method of the invention does not introduce contact error, and avoids the problem of inaccurate non-standard impedance test of the network analyzer, and the invention is widely applicable to a method for testing the package impedance of the ultra-high frequency RFID chip by using a resonance method.
Description
Technical Field
The invention belongs to the technical field of electronics, relates to a method for testing the impedance of an ultrahigh frequency RFID chip band package, and particularly relates to a method for testing the impedance of the ultrahigh frequency RFID chip band package by using a resonance method.
Background
The ultra-high frequency RFID technology can be applied to various industries such as logistics, traffic, anti-counterfeiting, clothing and the like. Compared with the traditional high-frequency technology, the ultrahigh-frequency RFID technology has the advantages of long reading distance and strong anti-collision function.
In order to take advantage of the long read distance of RFID technology, the impedance of the uhf antenna generally needs to be designed as the conjugate of the chip impedance. Although the chip manufacturer gives the impedance value of the chip, the package greatly affects the impedance value of the chip because of the characteristics of the ultra-high frequency. Various packaging forms, even different manufacturers of the same packaging form, can result in different impedances of the packaged chips, which are not equal to design reference values provided by the chip manufacturers. Therefore, there is a need to find a way to test the impedance of packaged chips.
In the prior art, impedance is typically tested in the form of a radio frequency port connected across the packaged chip, but doing so can lead to at least two problems. First, the package size of the chip is typically very small (within 1mm of area), and the bond wires are typically quite large (on the order of 1cm x 1 cm), which can result in the bond wires having a larger impact than the package parasitics, resulting in test failure. Second, devices that test ultra-high frequency impedance, such as network analyzers, are typically only suitable for testing 50 ohm impedance, and impedance tests that deviate from 50 ohm are inaccurate, whereas ultra-high frequency RFID chips typically have a complex impedance value of around 20+j200ohm, resulting in test failures.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for testing the package impedance of the ultrahigh frequency RFID chip by using a resonance method, which not only can solve the problems in the prior art, but also has other beneficial effects.
In order to achieve the above purpose, the invention adopts the following technical scheme that the method for testing the package impedance of the ultra-high frequency RFID chip by using the resonance method comprises the following steps:
the first step, a first coil and a second coil are manufactured, and the first coil and the second coil can be respectively packaged with the same ultrahigh frequency
An RFID chip;
step two, manufacturing a third coil, wherein the third coil is a coil with a high self-resonance value and is electrically connected with a network component
An analyzer;
third, the first coil, the second coil and the third coil which are respectively packaged with the same ultrahigh frequency RFID chip are used for mutual
Sensing, namely testing the resonance values of two coils with the ultrahigh frequency RFID chips;
and fourthly, obtaining the real part and the imaginary part of the package impedance of the ultrahigh frequency RFID chip by utilizing data processing.
The inductance value of the first coil is L 1 The inductance value of the second coil is L 2 And satisfies: l (L) 1 >L 2 。
The inductance value of the third coil is L 3 And satisfies the following: l (L) 1 *5>L 3 >L 2 /5。
The self-resonance value of the third coil is omega 3 ＝2πf 3 And satisfies: f (f) 3 >1.2GHz。
The third coil is connected with one port of the network analyzer, and the network analyzer is set into a mode for testing the absolute value of the s parameter; and when the first coil and the second coil of the same ultrahigh frequency RFID chip are packaged and are sequentially close to the third coil for mutual inductance, the absolute value of the s parameter of the network analyzer is changed.
The principle of the invention is described below:
two coils are made, namely a first coil L 1 And a second coil L 2 The inductance values of the two coils are L respectively 1 And L 2 Has L 1 >L 2 . The inductance values of the two coils can be obtained using test or simulation methods, since the coils are typically a few centimeters in diameter, it is easy to obtain the correct values, both for testing and for simulation. The same package is then used to package the ultra-high frequency RFID chip onto both coils. The chip impedance value is capacitive, so LC resonance is formed with the inductive coil.
As for the third coil L 3 The size of which is equal to that of the first coil L 1 Second coil L 2 Similar but go throughNormally empty, where a third coil L is defined 3 The self-resonance value of the third coil L is a frequency value with the imaginary part of the s parameter of 0 measured by a network analyzer 3 The network analyzer is connected with one port of the network analyzer, and the network analyzer is set into a mode for testing the absolute value of the s parameter. And then the first coil L 1 And a third coil L 3 Facing and bringing the first coil L 1 Near the third coil L 3 The absolute value curve of the s parameter can be observed on a network analyzer, and an obvious peak value appears, and the frequency of the peak value is the coil L 1 Is of resonance value omega 1 ＝2πf 1 The same operation mode can measure the second coil L 2 Is of resonance value omega 2 ＝2πf 2 。
And finally, the real part and the imaginary part of the ultrahigh frequency RFID chip can be obtained by utilizing data post-processing.
Specifically, the chip capacitance value C p
Chip resistance R p
The calculation process of the data processing is as follows:
let the parallel imaginary part of the chip be X p
Wherein C is p Is the equivalent capacitance of the parallel connection of the chip.
The serial imaginary part of the chip is X L
Wherein C is L Is a chip stringAnd connecting an equivalent capacitor.
According to the serial-parallel conversion relation
Obtaining:
four values that can be obtained for the test are: l (L) 1 ，L 2 ，ω 1 ，ω 2 Wherein X is L1 ＝ω 1 L 1 ，X L2 ＝ω 2 L 2
Then there is
There are two unknowns, two equations
Can be solved as follows:
due to the technical scheme, the invention has the beneficial effects that the test is a wireless test, and the coil L 1 And coil L 2 No other package is introduced, so wire disturbance caused by direct testing is avoided. In addition, only the frequency corresponding to the peak value of the s parameter of the network analyzer is used for the test, and the accurate value of the s parameter is not used, so that the inaccurate problem of the non-50 ohm test is avoided; in addition, four tests according to the inventionThe steps are simple and easy to use, and the practical testing difficulty is solved.
Due to the beneficial effects, the method is widely applied to a method for testing the package impedance of the ultrahigh frequency RFID chip by using a resonance method.
Drawings
FIG. 1 shows a third coil L of the present invention 3 And a first coil L 1 Schematic of the test;
FIG. 2 shows a third coil L of the invention 3 And a second coil L 2 Schematic of the test;
FIG. 3 is a third coil L in an embodiment of the invention 3 And a first coil L 1 Coupling the measured absolute value graph of the s parameter;
FIG. 4 is a third coil L in an embodiment of the invention 3 And a second coil L 2 And coupling the absolute value curve graph of the s parameter measured.
Identification description: 1-a first coil; 2-a second coil; 3-a third coil; 4-network analyzer.
Detailed Description
The invention will now be further illustrated by way of example with reference to the accompanying drawings.
Referring to fig. 1-4, taking one of the commercial chips representing the ultra-high frequency RFID as an Alien H3 chip as an example, the datesheet gives an impedance design reference value of 1500 ohms 0.85pF. The Alien H3 chip was packaged in a manufacturer and then tested for the chip impedance value with the package in four steps.
The first step: making coils of both size, i.e. coil L 1 And coil L 2 ，L 1 ＝45nH，L 2 =35 nH, both values can be obtained by testing, since coil L 1 And coil L 2 Is in the order of centimeters, so the test is accurate.
And a second step of: third coil L for manufacturing network analyzer 3 . Tested to obtain L 3 ＝50nH
This coil L 3 And its own parasitic capacitance, resulting in a value of the self-resonant frequency. This resonance value should be greater than 1.2GHz. Definition L herein 3 The self-resonance value of the coil isThe network analyzer measures a frequency value with an imaginary part of 0. Coil L for 900MHz ultra-high frequency RFID chip 3 Has a self-resonance value of ω 3 ＝2πf 3 ，f 3 Should be greater than 1.2GHz.
And a third step of: testing two coils L with chips by using mutual inductance of the coils 1 And L 2 Is a resonance value of (a).
Coil L 3 The network analyzer is connected with one port of the network analyzer, and the network analyzer is set into a mode for testing the absolute value of the s parameter. At this time, the first coil L 1 (or second coil L) 2 ) Near the third coil L 3 As shown in fig. 1 and 2. The ultrahigh-frequency RFID chips are respectively packaged in the coil coils L 1 (or coil L) 2 ) On the coil L 1 (or coil L) 2 ) Near the third coil L 3 At this time, on the network analyzer, the s-parameter absolute value curve change, i.e., the curves shown in fig. 3 and 4, can be observed.
In fig. 3, the horizontal axis shows the scanning frequency, from 0.7GHz to 1GHz, the vertical axis shows the absolute value of s parameter, and it can be seen that the absolute value of s parameter has a minimum d1, and the data of the minimum is 0.7498GHz. This is the measured coil L 1 Resonance value.
In fig. 4, the horizontal axis shows the scanning frequency, from 0.7GHz to 1GHz, the vertical axis shows the absolute value of s parameter, and it can be seen that the absolute value of s parameter has a minimum value e1, and the data of the minimum value is 0.8521GHz. This is the measured coil L 2 Resonance value.
Fourth step: and (3) obtaining the real part and the imaginary part of the package impedance of the ultrahigh frequency RFID chip by utilizing data processing.
Chip capacitance value
Chip resistance value
Wherein L is 1 ＝45nH，L 2 ＝35nH,ω 1 ＝2π*0.7498GHz,ω 1 ＝2π*0.8521GHz
Substituting the formula to obtain C p ＝0.981pF，R p ＝1521.52ohm
Comparing the Alien H3 chip, the impedance design reference value given by the datesheet is 1500 ohm|0.85 pF, and the packaged chip impedance is really different from the impedance design reference value given by the datesheet. The package introduced a 21.52ohm resistance and a 0.131pF capacitance.
In this embodiment, only a specific case is given, and those skilled in the art can easily understand that local modifications made to the embodiment, but the technical solution and the idea of the present invention are adopted, and the modifications are within the protection scope of the present invention. For example, the coil shape is changed from a round shape to a square shape, a triangle shape or other shapes, or a plurality of test coils are added to form a plurality of data average values, and the like, which are all within the protection scope of the invention.
Claims (5)
1. A method for testing the impedance of an ultra-high frequency RFID chip strap package using a resonance method, comprising the steps of:
the method comprises the steps of firstly, manufacturing a first coil and a second coil, wherein the first coil and the second coil are respectively packaged with the same ultrahigh frequency RFID chip;
step two, manufacturing a third coil, wherein the third coil is a coil with a high self-resonance value and is electrically connected with a network analyzer;
thirdly, testing the resonance values of the two coils with the ultrahigh frequency RFID chips by respectively utilizing mutual inductance of the first coil, the second coil and the third coil which are packaged with the same ultrahigh frequency RFID chip;
and fourthly, obtaining the real part and the imaginary part of the package impedance of the ultrahigh frequency RFID chip by utilizing data processing.
2. A method of testing ultra-high frequency RFID chip strap package impedance using resonance method according to claim 1, wherein: the inductance value of the first coil is L1, the inductance value of the second coil is L2, and the following conditions are satisfied: l1 > L2.
3. A method of testing ultra-high frequency RFID chip strap package impedance using resonance method according to claim 1, wherein: the inductance value of the third coil is L3, and the inductance value meets the following conditions: l1 x 5> L3> L2/5.
4. A method of testing the impedance of an ultra-high frequency RFID chip strap package using a resonance method according to claim 3, wherein: the self-resonance value of the third coil is
And satisfies: f3. F>1.2GHz。
5. A method of testing ultra-high frequency RFID chip strap package impedance using resonance method according to claim 1, wherein: the third coil is connected with one port of the network analyzer, and the network analyzer is set into a mode for testing the absolute value of the s parameter; and when the first coil and the second coil of the same ultrahigh frequency RFID chip are packaged and are sequentially close to the third coil for mutual inductance, the absolute value of the s parameter of the network analyzer is changed.
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