CN106643716B - MEMS inertial measurement unit with redundant signal acquisition strategy - Google Patents
MEMS inertial measurement unit with redundant signal acquisition strategy Download PDFInfo
- Publication number
- CN106643716B CN106643716B CN201611096117.XA CN201611096117A CN106643716B CN 106643716 B CN106643716 B CN 106643716B CN 201611096117 A CN201611096117 A CN 201611096117A CN 106643716 B CN106643716 B CN 106643716B
- Authority
- CN
- China
- Prior art keywords
- module
- power supply
- mems sensor
- sensor module
- spi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The invention relates to a MEMS inertial measurement unit with a redundant signal acquisition strategy. The device adopts the quick-start MEMS sensor module and the high-precision MEMS sensor to work in a time-sharing manner, and when the microprocessor unit judges that the system power-on time is less than the start time of the high-precision MEMS sensor module, the data of the quick-start MEMS sensor module is acquired through the SPI bus; otherwise, acquiring data of the high-precision MEMS sensor module; and carrying out format conversion, filtering and calibration on the acquired data, and then outputting the data. Thus, the actual requirements of quick measurement and accurate measurement after stable operation are met.
Description
Technical Field
The invention belongs to the technical field of inertial measurement and control, and relates to an MEMS inertial measurement device with a redundant signal acquisition strategy.
Background
The MEMS sensor is a sensor manufactured by adopting a micro-electro-mechanical system technology, and the MEMS inertial sensor comprises a gyroscope and an accelerometer and can be used for measuring the motion state parameters of the carrier. The sensor has the characteristics of quick response, low power consumption, impact resistance, small size and the like. At present, the measurement precision of the MEMS gyroscope can reach 1 degree/h to the maximum, the measurement precision of the MEMS accelerometer can reach 0.01mg, and the starting time of the MEMS sensor can reach 0.1 s.
The MEMS inertial measurement technology has the main problem that the measurement precision is not high, and the MEMS inertial measurement technology can only be used for carriers with low precision requirement or short running time. In the design process of an inertial measurement system or an inertial navigation system scheme, the specification that the starting time and the measurement precision meet the requirements is often difficult to select when the sensor is selected.
Disclosure of Invention
The invention aims to provide an MEMS inertial measurement unit with a redundant signal acquisition strategy, so as to meet specific requirements on starting time and measurement accuracy in some use occasions requiring quick starting time and high measurement accuracy.
The purpose of the invention is realized as follows: the MEMS inertial measurement unit with redundant signal acquisition strategy is characterized by at least comprising: the device comprises a quick-start MEMS sensor module, a high-precision MEMS sensor module, a microprocessor unit, a power supply module, an SPI (serial peripheral interface) data acquisition module and a CAN (controller area network) communication isolation driving module which are arranged in a device base, wherein the microprocessor unit is the core of the device, the quick-start MEMS sensor module and the high-precision MEMS sensor module are electrically connected with the microprocessor unit through the SPI data acquisition module, the microprocessor unit is an SPI communication host, and the quick-start MEMS sensor module and the high-precision MEMS sensor module are SPI communication slave machines; the SPI data acquisition module comprises a quick start MEMS sensor module, a high-precision MEMS sensor module and an SPI interface of a microprocessor unit; the CAN communication isolation driving module is connected with a CAN interface of the microprocessor unit; the power module provides 3.3V direct current voltage for the microprocessor unit, the quick-start MEMS sensor module and the high-precision MEMS sensor module, and provides two groups of completely independent direct currents of 5V and CAN5V for the CAN communication isolation driving module.
The device base is a main body of an inertial measurement unit structure, the external dimension of the device base is 59x69x38mm, the material of the device base is A12, and a quick-start MEMS sensor module, a high-precision MEMS sensor module and a signal processing circuit board are arranged in the device base; the quick-start MEMS sensor module is arranged on the right side surface inside the device base, the high-precision MEMS sensor module is arranged at the bottom of the device base, the input and output connector is fixed on the left side surface outside the device base, the signal processing circuit board comprises a microprocessor unit, a power supply module, an SPI data acquisition module and a CAN communication isolation driving module, and the signal processing circuit board is arranged on the inner surface of the device cover plate through screws; the device cover plate with the signal processing circuit board is internally installed at the upper end of the device base through screws.
The power module comprises a 5V/5W stabilized power supply module, a 3.3V three-terminal regulator and a 5V/1W stabilized power supply module, wherein the 5V/5W stabilized power supply module selects 24S05-5W, the 3.3V three-terminal regulator selects 78D33, the 5V/1W stabilized power supply module selects B0505S-1W, an external direct-current power supply generates a 5V power supply through the 5V/5W stabilized power supply module, the 5V power supply generates a 3.3V power supply through the 3.3V three-terminal regulator, the 5V power supply also generates a 3.3V power supply through the 5V/1W stabilized power supply module, and the rated power of the power module is 3W.
The quick start MEMS sensor module selects ADIS16448 sensor combination of ADI, and the high accuracy MEMS sensor selects ADIS16485 sensor combination of ADI, and the microprocessor unit selects 32-bit microprocessor STM32F103 for use, and the module of making an uproar selects 120 ohm resistor for use in SPI communication.
The general IO port PB1 of the microprocessor unit is defined as a chip selection signal CS448 of an ADIS16448 sensor combination, PB0 is defined as a chip selection signal CS485 of an ADIS16485 sensor combination, PA5 is defined as a clock signal SCLK of an SPI bus, PA6 is defined as a data signal DIN of the SPI bus, and PA7 is defined as a data signal DOUT of the SPI bus; the SPI communication noise reduction module is a 120-ohm resistor which is connected with the ground in parallel on each signal line of CS448, CS485, SCLK, DIN and DOUT, and reduces the noise and the SPI communication error rate.
The CAN communication isolation driving module comprises a CAN interface of the microprocessor unit, a high-speed photoelectric coupler and a CAN driver, wherein the high-speed photoelectric coupler is HCPL-0661, and the CAN driver is TJA 1050; the CAN interfaces of the microprocessor unit are PA12(TXD) and PA11(RXD), signals of the TXD and the RXD are isolated by an optical coupler HCPL-0661 and then are connected with a CAN driver TJA1050, the connection end of the high-speed photoelectric coupler and the microprocessor unit adopts 5V power supply, and the connection end of the high-speed photoelectric coupler and the CAN driver adopts CAN5V power supply; two resistance-capacitance networks of 60 omega resistor +4700PF are matched between CANH and CANL of the CAN driver so as to improve the anti-interference and transmission capability of the bus.
When the microprocessor unit judges that the system power-on time is less than the starting time of the high-precision MEMS sensor module, data for quickly starting the MEMS sensor module are acquired through the SPI bus; otherwise, acquiring data of the high-precision MEMS sensor module; and carrying out format conversion, filtering and calibration on the acquired data, and then outputting the data.
The invention has the advantages that as the quick-start MEMS sensor module and the high-precision MEMS sensor are adopted to work in a time-sharing way, when the microprocessor unit judges that the system power-on time is less than the start time of the high-precision MEMS sensor module, the data of the quick-start MEMS sensor module is acquired through the SPI bus; otherwise, acquiring data of the high-precision MEMS sensor module; and carrying out format conversion, filtering and calibration on the acquired data, and then outputting the data. Thus, the actual requirements of quick measurement and accurate measurement after stable operation are met.
Drawings
FIG. 1 is a general functional block diagram of the present invention;
FIG. 2 is an overall layout of the present invention;
fig. 3 is a block diagram of a hardware implementation of the signal processing circuitry of the present invention.
In the figure: 1. rapidly starting the MEMS sensor module; 2. a high-precision MEMS sensor module; 3. a power supply module; 4. a microprocessor unit; 5. an SPI data acquisition module; 6. a CAN communication isolation driving module; 7. a 5V/5W voltage-stabilized power supply module; 8. 3.3V three-terminal regulator; 9. a 5V/1W voltage-stabilized power supply module; 10. a high-speed photocoupler; 11. a CAN driver; 12. an SPI communication noise reduction module; 13. a device input/output connector; 14. a device base; 15. a device cover plate; 16. and a signal processing circuit board.
Detailed Description
The invention will now be described in more detail by way of example with reference to the accompanying drawings in which:
with reference to fig. 1, a MEMS inertial measurement unit with a redundant signal acquisition strategy comprises at least: the device comprises a quick-start MEMS sensor module 1, a high-precision MEMS sensor module 2, a microprocessor unit 4, a power supply module 3, an SPI data acquisition module 5 and a CAN communication isolation driving module 6 which are arranged in a device base 14, wherein the microprocessor unit 4 is the core of the device, the quick-start MEMS sensor module 1 and the high-precision MEMS sensor module 2 are electrically connected with the microprocessor unit 4 through the SPI data acquisition module 5, the microprocessor unit 4 is an SPI communication host, and the quick-start MEMS sensor module 1 and the high-precision MEMS sensor module 2 are SPI communication slave machines; the SPI data acquisition module 5 comprises a quick start MEMS sensor module 1, a high-precision MEMS sensor module 2 and an SPI interface of a microprocessor unit 4; the CAN communication isolation driving module 6 is connected with a CAN interface of the microprocessor unit 4; the power module 3 provides 3.3V direct current voltage for the microprocessor unit 4, the quick-start MEMS sensor module 1 and the high-precision MEMS sensor module 2, and provides two groups of completely independent direct currents of 5V and CAN5V for the CAN communication isolation driving module 6.
Referring to FIG. 2, the device base 14 is the main body of the inertial measurement device structure, and has the external dimensions of 59x69x38mm and the material A12(GB/T3880-1997), and the fast-start MEMS sensor module 1, the high-precision MEMS sensor module 2 and the signal processing circuit board 16 are mounted inside the device base 14; the quick-start MEMS sensor module 1 is installed on the right side surface inside the device base 14, the high-precision MEMS sensor module 2 is installed at the bottom of the device base 14, the input and output connector 13 is fixed on the left side surface outside the device base 14, the signal processing circuit board 16 comprises a microprocessor unit 4, a power supply module 3, an SPI data acquisition module 5 and a CAN communication isolation driving module 6, and the signal processing circuit board 16 is installed on the inner surface of a device cover plate 15 through screws; the device cover plate 15 with the signal processing circuit board 16 is mounted on the upper end of the device base 14 by screws.
Referring to fig. 3, the power module 3 includes a 5V/5W regulated power supply module 7, a 3.3V three-terminal regulator 8 and a 5V/1W regulated power supply module 9, wherein the 5V/5W regulated power supply module 7 selects 24S05-5W, the 3.3V three-terminal regulator 8 selects 78D33, the 5V/1W regulated power supply module 9 selects B0505S-1W, an external dc power supply generates a 5V power supply by voltage stabilization of the 5V/5W regulated power supply module 7, the 5V power supply generates a Vcc (3.3V) power supply by the 3.3V three-terminal regulator 8, the 5V power supply also generates a Vcc (3.3V) power supply by the 5V/1W regulated power supply module 9, and the rated power of the power supply module 3 is 3W.
The quick start MEMS sensor module is a 6-freedom MEMS integrated sensor (ADIS16448) with a triaxial gyroscope and an accelerometer, and can work by being externally supplied with a 3.3V direct-current power supply. The module is provided with an internal integrated temperature sensor, the output of the module is an SPI serial interface, and the module works in an SPI slave mode. The angular rate measurement error is 0.5 DEG/S; the acceleration measurement error is 10 mg; the start-up time was 0.2 seconds. The high-precision MEMS sensor module is a 6-freedom MEMS integrated sensor (ADIS16485) with a triaxial gyroscope and an accelerometer, and can work by being externally supplied with a 3.3V direct-current power supply. The module is provided with an internal integrated temperature sensor, the output of the module is an SPI serial interface, and the module works in an SPI slave mode. The angular rate measurement error is 0.2 DEG/S; the measurement error of the accelerometer is 3 mg; the start-up time was 0.5 seconds. The SPI communication noise reduction module 12 uses a 120 ohm resistor.
The general IO port PB1 of the microprocessor unit 4 is defined as a chip select signal CS448 of the ADIS16448 sensor combination, PB0 is defined as a chip select signal CS485 of the ADIS16485 sensor combination, PA5 is defined as a clock signal SCLK of the SPI bus, PA6 is defined as a data signal DIN of the SPI bus, and PA7 is defined as a data signal DOUT of the SPI bus; the SPI communication noise reduction module 12 is a 120-ohm resistor connected to the ground in parallel on each signal line of CS448, CS485, SCLK, DIN and DOUT, and reduces the noise and the SPI communication error rate.
The SPI interface and the sensor SPI interface of microprocessor unit internal integration, microprocessor universal port define two sensors's CS chip selection signal control two sensors's operating condition, and SCLK, DIN and DOUT of SPI interface are two sensor commons. Because the data acquisition clock is in microsecond order of magnitude, the noise of SPI interface data line is great, has increased the noise reduction circuit on the interface circuit in order to reduce digital communication error rate. The microprocessor has a working voltage of 3.3V, requires the CPU clock frequency not lower than 72MHz, and is provided with an internal integrated universal timer, a CAN interface, an SPI interface and a JTAG debugging interface.
The CAN communication isolation driving module 6 comprises a CAN interface of the microprocessor unit 4, a high-speed photoelectric coupler 10 and a CAN driver 11, wherein the high-speed photoelectric coupler 10 is HCPL-0661, and the CAN driver 11 is TJA 1050; the CAN interfaces of the microprocessor unit 4 are PA12(TXD) and PA11(RXD), signals of the TXD and the RXD are isolated by an optocoupler HCPL-0661 and then are connected with a CAN driver TJA1050, the connection end of the high-speed optocoupler 10 and the microprocessor unit 4 adopts 5V for power supply, and the connection end of the high-speed optocoupler 10 and the CAN driver 11 adopts CAN5V for power supply; two resistance-capacitance networks of 60 Ω resistor +4700PF are matched between CANH and CANL of CAN driver 11 to improve the anti-interference and transmission capability of the bus.
Referring to fig. 1, 2 and 3, the input/output connector 13 includes an external power supply and CAN communication interface (CANH, CANL) lead terminals; after the device is powered on, when the microprocessor unit 4 judges that the system power-on time is less than the starting time of the high-precision MEMS sensor module 2, data for quickly starting the MEMS sensor module 1 are acquired through the SPI bus; otherwise, acquiring data of the high-precision MEMS sensor module 2; and carrying out format conversion, filtering and calibration on the acquired data, and then outputting the data. And when the sensor module is designed, the high-precision MEMS sensor module is gated and the sensor module is stopped from being started quickly after the sensor module is powered on for 0.5 second.
The invention can be used as a design scheme of an MEMS sensor inertia measuring device for data acquisition and processing by adopting a redundancy strategy, and meets the actual requirements of some carrier control systems on quick measurement after power-on and accurate measurement after stable operation. The components, structures and software methods of the present embodiment that are not described in detail are well known in the art, and need not be described in detail herein.
Claims (2)
1. The MEMS inertial measurement unit with the redundant signal acquisition strategy is characterized by comprising: the device comprises a quick-start MEMS sensor module, a high-precision MEMS sensor module, a microprocessor unit, a power supply module, an SPI (serial peripheral interface) data acquisition module and a CAN (controller area network) communication isolation driving module which are arranged in a device base, wherein the microprocessor unit is the core of the device, the quick-start MEMS sensor module and the high-precision MEMS sensor module are electrically connected with the microprocessor unit through the SPI data acquisition module, the microprocessor unit is an SPI communication host, and the quick-start MEMS sensor module and the high-precision MEMS sensor module are SPI communication slave machines; the SPI data acquisition module comprises a quick start MEMS sensor module, a high-precision MEMS sensor module and an SPI interface of a microprocessor unit; the CAN communication isolation driving module is connected with a CAN interface of the microprocessor unit; the power supply module provides 3.3V direct current voltage for the microprocessor unit, the quick-start MEMS sensor module and the high-precision MEMS sensor module, and provides two groups of completely independent direct currents of 5V and CAN5V for the CAN communication isolation driving module; the device base is a main body of an inertial measurement unit structure, the external dimension of the device base is 59x69x38mm, the material of the device base is A12, and a quick-start MEMS sensor module, a high-precision MEMS sensor module and a signal processing circuit board are arranged in the device base; the quick-start MEMS sensor module is arranged on the right side surface inside the device base, the high-precision MEMS sensor module is arranged at the bottom of the device base, the input and output connector is fixed on the left side surface outside the device base, the signal processing circuit board comprises a microprocessor unit, a power supply module, an SPI data acquisition module and a CAN communication isolation driving module, and the signal processing circuit board is arranged on the inner surface of the device cover plate through screws; the device cover plate with the signal processing circuit board is internally arranged at the upper end of the device base through screws; the power supply module comprises a 5V/5W stabilized power supply module, a 3.3V three-terminal regulator and a 5V/1W stabilized power supply module, wherein the 5V/5W stabilized power supply module selects 24S05-5W, the 3.3V three-terminal regulator selects 78D33, the 5V/1W stabilized power supply module selects B0505S-1W, an external direct current power supply generates a 5V power supply through the 5V/5W stabilized power supply module, the 5V power supply generates a 3.3V power supply through the 3.3V three-terminal regulator, the 5V power supply also generates a 3.3V power supply through the 5V/1W stabilized power supply module, and the rated power of the power supply module is 3W; the fast start MEMS sensor module adopts an ADIS16448 sensor combination of ADI, the high-precision MEMS sensor adopts an ADIS16485 sensor combination of ADI, the microprocessor unit adopts a 32-bit microprocessor STM32F103, and the SPI communication noise reduction module adopts a 120-ohm resistor; the general IO port PB1 of the microprocessor unit is defined as a chip selection signal CS448 of an ADIS16448 sensor combination, PB0 is defined as a chip selection signal CS485 of an ADIS16485 sensor combination, PA5 is defined as a clock signal SCLK of an SPI bus, PA6 is defined as a data signal DIN of the SPI bus, and PA7 is defined as a data signal DOUT of the SPI bus; the SPI communication noise reduction module is a 120-ohm resistor which is connected with the ground in parallel on each signal line of CS448, CS485, SCLK, DIN and DOUT, so that the noise and the SPI communication error rate are reduced; when the microprocessor unit judges that the system power-on time is less than the starting time of the high-precision MEMS sensor module, data for quickly starting the MEMS sensor module are acquired through the SPI bus; otherwise, acquiring data of the high-precision MEMS sensor module; and carrying out format conversion, filtering and calibration on the acquired data, and then outputting the data.
2. The MEMS inertial measurement unit with the redundant signal acquisition strategy according to claim 1, wherein the CAN communication isolation driving module comprises a CAN interface of a microprocessor unit, a high-speed photoelectric coupler and a CAN driver, wherein the high-speed photoelectric coupler is HCPL-0661, and the CAN driver is TJA 1050; the CAN interfaces of the microprocessor unit are PA12 and PA11, wherein PA12 is connected with TXD signals, PA11 is connected with RXD signals, the TXD and RXD signals are isolated by an optocoupler HCPL-0661 and then are connected to a CAN driver TJA1050, the connection end of the high-speed optocoupler and the microprocessor unit adopts 5V for power supply, and the connection end of the high-speed optocoupler and the CAN driver adopts CAN5V for power supply; the resistance-capacitance network of the matching resistor +4700PF between CANH and CANL of the CAN driver improves the anti-interference and transmission capability of the bus, wherein the resistance-capacitance network comprises two 60 omega resistors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611096117.XA CN106643716B (en) | 2016-12-02 | 2016-12-02 | MEMS inertial measurement unit with redundant signal acquisition strategy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611096117.XA CN106643716B (en) | 2016-12-02 | 2016-12-02 | MEMS inertial measurement unit with redundant signal acquisition strategy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106643716A CN106643716A (en) | 2017-05-10 |
| CN106643716B true CN106643716B (en) | 2020-03-17 |
Family
ID=58814806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611096117.XA Active CN106643716B (en) | 2016-12-02 | 2016-12-02 | MEMS inertial measurement unit with redundant signal acquisition strategy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106643716B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108507591A (en) * | 2018-03-22 | 2018-09-07 | 湖北三江航天万峰科技发展有限公司 | Multichannel MEMS gyroscope demarcates test data collection device and acquisition method |
| CN109353528B (en) * | 2018-09-11 | 2021-11-12 | 陕西千山航空电子有限责任公司 | Impact detection sensor realized based on impact safety discrimination method |
| CN109144091A (en) * | 2018-11-06 | 2019-01-04 | 广州极飞科技有限公司 | A kind of flight controller and unmanned vehicle |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1687707A (en) * | 2005-06-07 | 2005-10-26 | 中国航天时代电子公司 | Engineering implementation method for quick starting inertial measurement unit of optical fiber gyroscope and guaranteeing precision |
| CN103248364A (en) * | 2013-04-12 | 2013-08-14 | 东南大学 | Inertial sensor IMU signal analog-to-digital conversion module |
| CN205280091U (en) * | 2015-11-23 | 2016-06-01 | 中船重工西安东仪科工集团有限公司 | Combination measuring circuit is measured to MEMS inertia |
| CN105912008A (en) * | 2016-06-13 | 2016-08-31 | 合肥赛为智能有限公司 | Electric power iron tower inspection unmanned plane flight control system and flight control method thereof |
-
2016
- 2016-12-02 CN CN201611096117.XA patent/CN106643716B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1687707A (en) * | 2005-06-07 | 2005-10-26 | 中国航天时代电子公司 | Engineering implementation method for quick starting inertial measurement unit of optical fiber gyroscope and guaranteeing precision |
| CN103248364A (en) * | 2013-04-12 | 2013-08-14 | 东南大学 | Inertial sensor IMU signal analog-to-digital conversion module |
| CN205280091U (en) * | 2015-11-23 | 2016-06-01 | 中船重工西安东仪科工集团有限公司 | Combination measuring circuit is measured to MEMS inertia |
| CN105912008A (en) * | 2016-06-13 | 2016-08-31 | 合肥赛为智能有限公司 | Electric power iron tower inspection unmanned plane flight control system and flight control method thereof |
Non-Patent Citations (1)
| Title |
|---|
| "ADI推出MEMS IMU实现高度精确定位";ADI;《微型机与应用》;20121231;第31卷(第14期);正文第87页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106643716A (en) | 2017-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106643716B (en) | MEMS inertial measurement unit with redundant signal acquisition strategy | |
| EP1098787B1 (en) | Computerized automotive service equipment using multi-point serial link data transmission protocols | |
| CN107901044A (en) | The drive control integral system of joint of robot | |
| EP3336484A1 (en) | Touch probe for cmm including digital signal communication | |
| WO2003073725A2 (en) | Communications bridge between a vehicle information network and a remote system | |
| CN105867418A (en) | Universal small unmanned aerial vehicle dual-core flight control computer and control method | |
| CN111781624B (en) | Universal integrated navigation system and method | |
| CN103644912A (en) | Multi-list redundant strapdown inertial measuring device for laser gyroscope | |
| US20200080916A1 (en) | Condition monitoring device for monitoring the condition of a mechanical machine component | |
| CN103248364A (en) | Inertial sensor IMU signal analog-to-digital conversion module | |
| CN106289256A (en) | Signal calculated processing system based on two CSTR Yu FPGA architecture | |
| CN103196447A (en) | Batch MEMS (micro-electromechanical system) sensor based inertial measurement unit and gesture-position information acquisition method | |
| CN108693885A (en) | A kind of unmanned aerial vehicle control system and unmanned plane | |
| CN206877150U (en) | A kind of unmanned aerial vehicle control system and unmanned plane | |
| CN107450408A (en) | A kind of system and method for sensor plug and play | |
| JP2008535459A5 (en) | ||
| EP2600251B1 (en) | Debug system, electronic control unit, information processing unit, semiconductor package, and transceiver circuit | |
| TWI528161B (en) | Data transmitting system and data transmitting method | |
| CN107600417A (en) | A kind of flying robot's Hardware Design method for carrying redundancy mechanical arm | |
| CN202057801U (en) | Combined positioning device based on BD, GPS and DR | |
| CN103901886A (en) | Universal CAN node for distributed agricultural machine navigation control system | |
| CN208013787U (en) | A kind of winged control of SCM Based logistics | |
| CN207231496U (en) | A kind of outdoor mobile robot combined navigation device | |
| JP6511457B2 (en) | Multiple communication device | |
| CN207161256U (en) | A kind of wind electricity blade fatigue loading encourages isochronous controller |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |