CN106637312A - Copper plating solution for plate roller and preparation method of copper plating solution - Google Patents

Copper plating solution for plate roller and preparation method of copper plating solution Download PDF

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Publication number
CN106637312A
CN106637312A CN201710132995.0A CN201710132995A CN106637312A CN 106637312 A CN106637312 A CN 106637312A CN 201710132995 A CN201710132995 A CN 201710132995A CN 106637312 A CN106637312 A CN 106637312A
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China
Prior art keywords
parts
acid
sodium
copper plating
sodium salt
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CN201710132995.0A
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Inventor
张尚义
蔡孟虎
弓小军
赵建合
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Longyou Yunshun Plate Making Co Ltd
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Longyou Yunshun Plate Making Co Ltd
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Priority to CN201710132995.0A priority Critical patent/CN106637312A/en
Publication of CN106637312A publication Critical patent/CN106637312A/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The invention discloses a copper plating solution for a plate roller. The copper plating solution is prepared from the following raw materials in parts by weight: copper sulfate pentahydrate, hydroxybutylidene diphosphonate, methylamino di methylene phosphonic acid, tripotassium citrate, trisodium citrate, polyethyleneimine, trimethyl borate, sodium hydroxide, glycerol, pyrophosphate, thiosulfate, sulfite, sodium dodecyl sulfate, 2-sodium ethyl-hexanol sulfate, sodium diethylhexyl sulfosuccinate, sodium phosphodiester and water. The copper plating solution for the plate roller is simple in preparation method, a prepared plating is high in brightness, hardness and wear resistance, no burr exists after the outer layer of the plate roller is combined with the plating, and the surface evenness and the weatherability are excellent.

Description

A kind of roller copper plating bath and preparation method thereof
Technical field
The present invention relates to a kind of roller copper plating bath and preparation method thereof.
Background technology
Used as one kind of typography, abundant with its printing product layer of ink, bright-colored, saturation degree is high, printing plate for intaglio printing The advantages of press resistance rate is high, print quality is stable, print speed printing speed is fast occupies of crucial importance in printing packaging and picture and text publishing area Status.And roller is the important accessory of plate-making processing industry, roller is that metal material processing is become into each using mask-making technology Plant and carry decorative pattern, word, the roller of image.
In recent years, the electronics engraving intaglio plate of modernization and the intaglio printing of laser engraving emerges rapidly, intaglio printing with The short outstanding person for becoming packages printing industry of its printing big, bright in luster, printing-flow of batch.The intaglio plate during making of gravure cylinder The important step of printing.In the production process of roller, copper facing is very important one technique, and copper facing process control must be non- Chang Yanmi, slightly carelessness will take a substantial amount of time, manpower and materials are correcting produced problem.How high accuracy, height are realized The copper plating bath of automaticity is that manufacturing enterprise has to last for increasing the direction of creativity.Roller is called does steel rider, its effect It is, for making a plate, in cylinder surface copper facing, through intaglio plate electronic engraving machine etc. good pattern to be carved, is then plated with one layer of chromium, carries out After pay printing house, be usually used in plastics packed printing.It is to ensure coating that roller processes the quality of work before copper facing and chromium plating The key link of quality, in oxidation corrosion or speckles with the good plating of smooth light adhesion cannot be obtained on the surface of greasy dirt Layer, it is therefore necessary to carry out treatment before plating, space of a whole page oil removal is not net, be to cause copper or fall one of principal element of chromium, in addition, The copper plating bath of high-quality is also one of principal element of decision roller copper facing effect, and existing copper plating bath is mostly common copper facing Liquid so that it is raised that roller easily produces jagged and particle after copper facing so that coating is not smooth enough, and coating and roller Adhesion it is bad, easily produce delamination.
Therefore, in sum, there is compound method complexity in the copper plating bath for being currently used for roller, and copper plating bath is in roller Obtained coating has that brightness is low, hardness is little and wearability is weak so that roller outer layer is combined rear easy generation burr with coating, And the problems such as surface uniformity difference and weatherability difference.
The content of the invention
In view of this, it is an object of the present invention to provide a kind of coating has, brightness is high, hardness is big and wearability is strong, can make Obtain roller outer layer and rear impulse- free robustness, and good and good weatherability the roller copper plating bath of surface uniformity are combined with coating.
In order to solve above-mentioned technical problem, the technical scheme is that:A kind of roller copper plating bath, by following weight portion Raw material is made:Including cupric sulfate pentahydrate 40-56 parts, hydroxyl fourth fork di 2 ethylhexyl phosphonic acid 30-50 parts, the methylenephosphonic acid 33-41 parts of first ammonia two, lemon Lemon acid tripotassium 26-38 parts, trisodium citrate 24-30 parts, polyethyleneimine alkane 12-18 parts, boric acid 40-60 parts, NaOH 11- 19 parts, glycerine 13-17 parts, pyrophosphate 10-14 parts, thiosulfate 11-15 parts, sulphite 11-17 parts, lauryl alcohol sulphur Vinegar sodium salt 10-16 parts, 2 one ethylhexanol sulfuric acid vinegar sodium 9-13 parts, dioctyl sodium sulfosuccinate 9-15 parts, phosphate diester sodium Salt 12-18 parts and water 100-160 parts.
Further, the roller copper plating bath is made up of the raw material of following weight portion:Including 56 parts of cupric sulfate pentahydrate, hydroxyl Fourth 30 parts of di 2 ethylhexyl phosphonic acid of fork, 33 parts of two methylenephosphonic acid of first ammonia, 26 parts of citric acid tri potassium, 24 parts of trisodium citrate, polyethyleneimine alkane 12 parts, 40 parts of boric acid, 11 parts of NaOH, 13 parts of glycerine, 10 parts of pyrophosphate, 11 parts of thiosulfate, sulphite 11 Part, 10 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 one 9 parts of ethylhexanol sulfuric acid vinegar sodium, 9 parts of dioctyl sodium sulfosuccinate, phosphate diester 100 parts of 12 parts of sodium salt and water.
Further, the roller copper plating bath is made up of the raw material of following weight portion:Including 40 parts of cupric sulfate pentahydrate, hydroxyl Fourth 50 parts of di 2 ethylhexyl phosphonic acid of fork, 41 parts of two methylenephosphonic acid of first ammonia, 38 parts of citric acid tri potassium, 30 parts of trisodium citrate, polyethyleneimine alkane 18 parts, 60 parts of boric acid, 19 parts of NaOH, 17 parts of glycerine, 14 parts of pyrophosphate, 15 parts of thiosulfate, sulphite 17 Part, 16 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 one 13 parts of ethylhexanol sulfuric acid vinegar sodium, 15 parts of dioctyl sodium sulfosuccinate, phosphoric acid are double 160 parts of 18 parts of ester sodium salt and water.
Further, the roller copper plating bath is made up of the raw material of following weight portion:Including 48 parts of cupric sulfate pentahydrate, hydroxyl Fourth 40 parts of di 2 ethylhexyl phosphonic acid of fork, 37 parts of two methylenephosphonic acid of first ammonia, 32 parts of citric acid tri potassium, 27 parts of trisodium citrate, polyethyleneimine alkane 15 parts, 50 parts of boric acid, 15 parts of NaOH, 15 parts of glycerine, 12 parts of pyrophosphate, 13 parts of thiosulfate, sulphite 14 Part, 13 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 one 11 parts of ethylhexanol sulfuric acid vinegar sodium, 12 parts of dioctyl sodium sulfosuccinate, phosphoric acid are double 130 parts of 15 parts of ester sodium salt and water.
The invention solves the problems that another technical problem be that a kind of preparation method of roller copper plating bath is provided, including following step Suddenly:
1) 100-160 parts of fetching water are poured into pot, and are heated to 50-60 DEG C, and warm water is obtained, standby;
2) step 1 is taken) warm water total amount after heating 40% is put into reaction container, then adds boric acid 40-60 parts, pass through Stirring rod stirs so that boric acid is dissolved in warm water, finally takes cupric sulfate pentahydrate 40-56 parts and is added to the warm water for being mixed with boric acid In, and continuing stirring so that cupric sulfate pentahydrate is well mixed with the warm water for being mixed with boric acid, obtained solution A, then stands and is cooled to Normal temperature, it is standby;
3) step 1 is taken) warm water total amount after heating 40% is put into reaction container, then by citric acid tri potassium 26-38 parts It is added in reaction container with trisodium citrate 24-30 parts, citric acid front three and trisodium citrate is dissolved in by warm water by stirring rod In, then obtained solution B stands and is cooled to normal temperature, standby;
4) by step 2) obtained in solution A and step 3) obtained in the mixed merga pass stirring rod of solution B stir, then Stand 3-5 hours so that the precipitate in mixed solution, reuse filter screen and filtered sediment and mixing liquid, The mixed mixed solution of prepared deposit-free, it is standby;
5) take hydroxyl fourth fork di 2 ethylhexyl phosphonic acid 30-50 parts, the methylenephosphonic acid 33-41 parts of first ammonia two, polyethyleneimine alkane 12-18 parts, NaOH 11-19 parts, glycerine 13-17 parts, pyrophosphate 10-14 parts, thiosulfate 11-15 parts, sulphite 11-17 Part, lauryl alcohol sulfuric acid vinegar sodium salt 10-16 parts, 2 one ethylhexanol sulfuric acid vinegar sodium 9-13 parts, dioctyl sodium sulfosuccinate 9-15 parts Be added to step 4 successively with phosphate diester sodium salt 12-18 parts) obtained in mixed solution, while will be added by stirring rod Material is stirred so as to be well mixed with mixed solution, and copper plating bath is obtained, standby;
6) take step 1) warm water total amount after heating 20% fills into step 5) obtained in copper plating bath so that copper plating bath Viscosity is reduced, and is conducive to carrying out copper facing.
The technology of the present invention effect major embodiment is in the following areas:Cupric sulfate pentahydrate and boric acid are carried out with the warm water after heating The obtained solution of stirring mixes with citric acid tri potassium and trisodium citrate with the obtained solution of warm water stirring after heating, Jing Guochen Form sediment and filter, then add hydroxyl fourth fork di 2 ethylhexyl phosphonic acid, the methylenephosphonic acid of first ammonia two, polyethyleneimine alkane, NaOH, glycerine, Pyrophosphate, thiosulfate, sulphite, lauryl alcohol sulfuric acid vinegar sodium salt, 2 one ethylhexanol sulfuric acid vinegar sodium, butanedioic acid two are pungent Ester sodium sulfonate and copper plating bath obtained in phosphate diester sodium salt, not only compound method is simple, and obtained coating has brightness High, hardness is big and wearability is strong, enables to roller outer layer and rear impulse- free robustness is combined with coating, and surface uniformity is good and weather-proof Property is good.
Specific embodiment
Embodiment 1
A kind of roller copper plating bath, is made up of the raw material of following weight portion:Including 56 parts of cupric sulfate pentahydrate, hydroxyl fourth fork diphosphine 30 parts of acid, 33 parts of two methylenephosphonic acid of first ammonia, 26 parts of citric acid tri potassium, 24 parts of trisodium citrate, 12 parts of polyethyleneimine alkane, boric acid 40 parts, 11 parts of NaOH, 13 parts of glycerine, 10 parts of pyrophosphate, 11 parts of thiosulfate, 11 parts of sulphite, lauryl alcohol 10 parts of sulfuric acid vinegar sodium salt, 2 one 9 parts of ethylhexanol sulfuric acid vinegar sodium, 9 parts of dioctyl sodium sulfosuccinate, 12 parts of phosphate diester sodium salt With 100 parts of water.
A kind of preparation method of roller copper plating bath, comprises the following steps:
1) fetch water 100 parts and pour into pot, and be heated to 50 DEG C, warm water is obtained, it is standby;
2) step 1 is taken) warm water total amount after heating 40% is put into reaction container, then adds 40 parts of boric acid, by stirring Mix rod to stir so that boric acid is dissolved in warm water, finally take 56 parts of cupric sulfate pentahydrate and be added in the warm water for being mixed with boric acid, and Continue to stir so that cupric sulfate pentahydrate is well mixed with the warm water for being mixed with boric acid, obtained solution A, then stand and be cooled to normal temperature, It is standby;
3) step 1 is taken) warm water total amount after heating 40% is put into reaction container, then by 26 parts of citric acid tri potassium and lemon 24 parts of trisodium of lemon acid is added in reaction container, and citric acid front three and trisodium citrate are dissolved in warm water by stirring rod, is obtained Solution B, then stands and is cooled to normal temperature, standby;
4) by step 2) obtained in solution A and step 3) obtained in the mixed merga pass stirring rod of solution B stir, then Stand 3 hours so that the precipitate in mixed solution, reuse filter screen and filtered sediment and mixing liquid, make The mixed mixed solution of deposit-free is obtained, it is standby;
5) hydroxyl fourth 30 parts of di 2 ethylhexyl phosphonic acid of fork, 33 parts of two methylenephosphonic acid of first ammonia, 12 parts of polyethyleneimine alkane, NaOH 11 are taken Part, 13 parts of glycerine, 10 parts of pyrophosphate, 11 parts of thiosulfate, 11 parts of sulphite, 10 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 12 parts of one 9 parts of ethylhexanol sulfuric acid vinegar sodium, 9 parts of dioctyl sodium sulfosuccinate and phosphate diester sodium salt are added to successively step 4) In obtained mixed solution, while the material for adding is stirred by stirring rod so as to be well mixed with mixed solution, plating is obtained Copper liquid, it is standby;
6) take step 1) warm water total amount after heating 20% fills into step 5) obtained in copper plating bath so that copper plating bath Viscosity is reduced, and is conducive to carrying out copper facing.
Embodiment 2
A kind of roller copper plating bath, is made up of the raw material of following weight portion:Including 40 parts of cupric sulfate pentahydrate, hydroxyl fourth fork diphosphine 50 parts of acid, 41 parts of two methylenephosphonic acid of first ammonia, 38 parts of citric acid tri potassium, 30 parts of trisodium citrate, 18 parts of polyethyleneimine alkane, boric acid 60 parts, 19 parts of NaOH, 17 parts of glycerine, 14 parts of pyrophosphate, 15 parts of thiosulfate, 17 parts of sulphite, lauryl alcohol 16 parts of sulfuric acid vinegar sodium salt, 2 one 13 parts of ethylhexanol sulfuric acid vinegar sodium, 15 parts of dioctyl sodium sulfosuccinate, phosphate diester sodium salt 18 160 parts of part and water.
A kind of preparation method of roller copper plating bath, comprises the following steps:
1) fetch water 160 parts and pour into pot, and be heated to 60 DEG C, warm water is obtained, it is standby;
2) step 1 is taken) warm water total amount after heating 40% is put into reaction container, then adds 60 parts of boric acid, by stirring Mix rod to stir so that boric acid is dissolved in warm water, finally take 40 parts of cupric sulfate pentahydrate and be added in the warm water for being mixed with boric acid, and Continue to stir so that cupric sulfate pentahydrate is well mixed with the warm water for being mixed with boric acid, obtained solution A, then stand and be cooled to normal temperature, It is standby;
3) step 1 is taken) warm water total amount after heating 40% is put into reaction container, then by 38 parts of citric acid tri potassium and lemon 30 parts of trisodium of lemon acid is added in reaction container, and citric acid front three and trisodium citrate are dissolved in warm water by stirring rod, is obtained Solution B, then stands and is cooled to normal temperature, standby;
4) by step 2) obtained in solution A and step 3) obtained in the mixed merga pass stirring rod of solution B stir, then Stand 5 hours so that the precipitate in mixed solution, reuse filter screen and filtered sediment and mixing liquid, make The mixed mixed solution of deposit-free is obtained, it is standby;
5) hydroxyl fourth 50 parts of di 2 ethylhexyl phosphonic acid of fork, 41 parts of two methylenephosphonic acid of first ammonia, 18 parts of polyethyleneimine alkane, NaOH 19 are taken Part, 17 parts of glycerine, 14 parts of pyrophosphate, 15 parts of thiosulfate, 17 parts of sulphite, 16 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 18 parts of one 13 parts of ethylhexanol sulfuric acid vinegar sodium, 15 parts of dioctyl sodium sulfosuccinate and phosphate diester sodium salt are added to successively step 4) in mixed solution obtained in, while the material for adding is stirred by stirring rod so as to be well mixed with mixed solution, be obtained Copper plating bath, it is standby;
6) take step 1) warm water total amount after heating 20% fills into step 5) obtained in copper plating bath so that copper plating bath Viscosity is reduced, and is conducive to carrying out copper facing.
Embodiment 3
A kind of roller copper plating bath, is made up of the raw material of following weight portion:Including 48 parts of cupric sulfate pentahydrate, hydroxyl fourth fork diphosphine 40 parts of acid, 37 parts of two methylenephosphonic acid of first ammonia, 32 parts of citric acid tri potassium, 27 parts of trisodium citrate, 15 parts of polyethyleneimine alkane, boric acid 50 parts, 15 parts of NaOH, 15 parts of glycerine, 12 parts of pyrophosphate, 13 parts of thiosulfate, 14 parts of sulphite, lauryl alcohol 13 parts of sulfuric acid vinegar sodium salt, 2 one 11 parts of ethylhexanol sulfuric acid vinegar sodium, 12 parts of dioctyl sodium sulfosuccinate, phosphate diester sodium salt 15 130 parts of part and water.
A kind of preparation method of roller copper plating bath, comprises the following steps:
1) fetch water 130 parts and pour into pot, and be heated to 55 DEG C, warm water is obtained, it is standby;
2) step 1 is taken) warm water total amount after heating 40% is put into reaction container, then adds 50 parts of boric acid, by stirring Mix rod to stir so that boric acid is dissolved in warm water, finally take 48 parts of cupric sulfate pentahydrate and be added in the warm water for being mixed with boric acid, and Continue to stir so that cupric sulfate pentahydrate is well mixed with the warm water for being mixed with boric acid, obtained solution A, then stand and be cooled to normal temperature, It is standby;
3) step 1 is taken) warm water total amount after heating 40% is put into reaction container, then by 32 parts of citric acid tri potassium and lemon 27 parts of trisodium of lemon acid is added in reaction container, and citric acid front three and trisodium citrate are dissolved in warm water by stirring rod, is obtained Solution B, then stands and is cooled to normal temperature, standby;
4) by step 2) obtained in solution A and step 3) obtained in the mixed merga pass stirring rod of solution B stir, then Stand 4 hours so that the precipitate in mixed solution, reuse filter screen and filtered sediment and mixing liquid, make The mixed mixed solution of deposit-free is obtained, it is standby;
5) hydroxyl fourth 40 parts of di 2 ethylhexyl phosphonic acid of fork, 37 parts of two methylenephosphonic acid of first ammonia, 16 parts of polyethyleneimine alkane, NaOH 15 are taken Part, 15 parts of glycerine, 12 parts of pyrophosphate, 13 parts of thiosulfate, 14 parts of sulphite, 13 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 15 parts of one 11 parts of ethylhexanol sulfuric acid vinegar sodium, 12 parts of dioctyl sodium sulfosuccinate and phosphate diester sodium salt are added to successively step 4) in mixed solution obtained in, while the material for adding is stirred by stirring rod so as to be well mixed with mixed solution, be obtained Copper plating bath, it is standby;
6) take step 1) warm water total amount after heating 20% fills into step 5) obtained in copper plating bath so that copper plating bath Viscosity is reduced, and is conducive to carrying out copper facing.
Experimental example
Experimental subjects:Using common copper plating bath as a control group, using special copper plating bath as a control group two, this The roller copper plating bath of application contrasts the etching situation of three groups of copper plating baths as experimental group, and draws best copper plating bath.
Following table is the correction data table of three groups of experimental subjects
With reference to upper table, three groups of different experimental subjects the data obtaineds are contrasted, as a result show the application roller copper plating bath to version The copper facing effect of roller is more preferable.
The technology of the present invention effect major embodiment is in the following areas:Cupric sulfate pentahydrate and boric acid are carried out with the warm water after heating The obtained solution of stirring mixes with citric acid tri potassium and trisodium citrate with the obtained solution of warm water stirring after heating, Jing Guochen Form sediment and filter, then add hydroxyl fourth fork di 2 ethylhexyl phosphonic acid, the methylenephosphonic acid of first ammonia two, polyethyleneimine alkane, NaOH, glycerine, Pyrophosphate, thiosulfate, sulphite, lauryl alcohol sulfuric acid vinegar sodium salt, 2 one ethylhexanol sulfuric acid vinegar sodium, butanedioic acid two are pungent Ester sodium sulfonate and copper plating bath obtained in phosphate diester sodium salt, not only compound method is simple, and obtained coating has brightness High, hardness is big and wearability is strong, enables to roller outer layer and rear impulse- free robustness is combined with coating, and surface uniformity is good and weather-proof Property is good.
Certainly, the above is the representative instance of the present invention, and in addition, the present invention can also have other various to be embodied as The technical scheme that mode, all employing equivalents or equivalent transformation are formed, all falls within the scope of protection of present invention.

Claims (4)

1. a kind of roller copper plating bath, it is characterised in that:It is made up of the raw material of following weight portion:Including cupric sulfate pentahydrate 40-56 parts, Hydroxyl fourth fork di 2 ethylhexyl phosphonic acid 30-50 parts, the methylenephosphonic acid 33-41 parts of first ammonia two, citric acid tri potassium 26-38 parts, trisodium citrate 24-30 Part, polyethyleneimine alkane 12-18 parts, boric acid 40-60 parts, NaOH 11-19 parts, glycerine 13-17 parts, pyrophosphate 10- 14 parts, thiosulfate 11-15 parts, sulphite 11-17 parts, lauryl alcohol sulfuric acid vinegar sodium salt 10-16 parts, 2 one ethylhexanol sulphur Vinegar sodium 9-13 parts, dioctyl sodium sulfosuccinate 9-15 parts, phosphate diester sodium salt 12-18 parts and water 100-160 parts.
2. a kind of roller copper plating bath as claimed in claim 1, it is characterised in that:It is made up of the raw material of following weight portion:Including 56 parts of cupric sulfate pentahydrate, hydroxyl fourth 30 parts of di 2 ethylhexyl phosphonic acid of fork, 33 parts of two methylenephosphonic acid of first ammonia, 26 parts of citric acid tri potassium, citric acid three 24 parts of sodium, 12 parts of polyethyleneimine alkane, 40 parts of boric acid, 11 parts of NaOH, 13 parts of glycerine, 10 parts of pyrophosphate, thio sulphur 11 parts of hydrochlorate, 11 parts of sulphite, 10 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 one 9 parts of ethylhexanol sulfuric acid vinegar sodium, butanedioic acid two are pungent 100 parts of 9 parts of ester sodium sulfonate, 12 parts of phosphate diester sodium salt and water.
3. a kind of roller copper plating bath as claimed in claim 1, it is characterised in that:It is made up of the raw material of following weight portion:Including 40 parts of cupric sulfate pentahydrate, hydroxyl fourth 50 parts of di 2 ethylhexyl phosphonic acid of fork, 41 parts of two methylenephosphonic acid of first ammonia, 38 parts of citric acid tri potassium, citric acid three 30 parts of sodium, 18 parts of polyethyleneimine alkane, 60 parts of boric acid, 19 parts of NaOH, 17 parts of glycerine, 14 parts of pyrophosphate, thio sulphur 15 parts of hydrochlorate, 17 parts of sulphite, 16 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 one 13 parts of ethylhexanol sulfuric acid vinegar sodium, butanedioic acid two are pungent 160 parts of 15 parts of ester sodium sulfonate, 18 parts of phosphate diester sodium salt and water.
4. a kind of roller copper plating bath as claimed in claim 1, it is characterised in that:It is made up of the raw material of following weight portion:Including 48 parts of cupric sulfate pentahydrate, hydroxyl fourth 40 parts of di 2 ethylhexyl phosphonic acid of fork, 37 parts of two methylenephosphonic acid of first ammonia, 32 parts of citric acid tri potassium, citric acid three 27 parts of sodium, 15 parts of polyethyleneimine alkane, 50 parts of boric acid, 15 parts of NaOH, 15 parts of glycerine, 12 parts of pyrophosphate, thio sulphur 13 parts of hydrochlorate, 14 parts of sulphite, 13 parts of lauryl alcohol sulfuric acid vinegar sodium salt, 2 one 11 parts of ethylhexanol sulfuric acid vinegar sodium, butanedioic acid two are pungent 130 parts of 12 parts of ester sodium sulfonate, 15 parts of phosphate diester sodium salt and water.
CN201710132995.0A 2017-03-07 2017-03-07 Copper plating solution for plate roller and preparation method of copper plating solution Pending CN106637312A (en)

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CN201710132995.0A CN106637312A (en) 2017-03-07 2017-03-07 Copper plating solution for plate roller and preparation method of copper plating solution

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107419306A (en) * 2017-07-14 2017-12-01 成都联利达五金制品有限公司 A kind of wear-resisting electroplate liquid
CN111501074A (en) * 2020-05-22 2020-08-07 李鑫 Copper-nickel-manganese alloy electroplating solution and electroplating method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0762587A (en) * 1993-08-27 1995-03-07 C Uyemura & Co Ltd Additive for copper electroplating and copper electroplating bath
US5417841A (en) * 1990-08-03 1995-05-23 Mcgean-Rohco, Inc. Copper plating of gravure rolls
CN1136880A (en) * 1994-08-24 1996-11-27 菲利浦电子有限公司 Circuit arrangement
CN101348927A (en) * 2008-09-05 2009-01-21 江南机器(集团)有限公司 Non-cyanide copper plating solution
CN102912388A (en) * 2012-10-11 2013-02-06 郑州市大有制版有限公司 Gravure hard copper additive
CN103160883A (en) * 2011-12-18 2013-06-19 李平 Environment-friendly copper plating solution
CN104332213A (en) * 2014-11-19 2015-02-04 印培东 Electroplating copper clad aluminum conductor
CN105200467A (en) * 2015-11-02 2015-12-30 江苏梦得电镀化学品有限公司 Intaglio hard copper additive and plating solution
CN105921706A (en) * 2016-05-19 2016-09-07 西峡龙成特种材料有限公司 On-line repair method for continuous casting crystallizer copper plate

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5417841A (en) * 1990-08-03 1995-05-23 Mcgean-Rohco, Inc. Copper plating of gravure rolls
JPH0762587A (en) * 1993-08-27 1995-03-07 C Uyemura & Co Ltd Additive for copper electroplating and copper electroplating bath
CN1136880A (en) * 1994-08-24 1996-11-27 菲利浦电子有限公司 Circuit arrangement
CN101348927A (en) * 2008-09-05 2009-01-21 江南机器(集团)有限公司 Non-cyanide copper plating solution
CN103160883A (en) * 2011-12-18 2013-06-19 李平 Environment-friendly copper plating solution
CN102912388A (en) * 2012-10-11 2013-02-06 郑州市大有制版有限公司 Gravure hard copper additive
CN104332213A (en) * 2014-11-19 2015-02-04 印培东 Electroplating copper clad aluminum conductor
CN105200467A (en) * 2015-11-02 2015-12-30 江苏梦得电镀化学品有限公司 Intaglio hard copper additive and plating solution
CN105921706A (en) * 2016-05-19 2016-09-07 西峡龙成特种材料有限公司 On-line repair method for continuous casting crystallizer copper plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107419306A (en) * 2017-07-14 2017-12-01 成都联利达五金制品有限公司 A kind of wear-resisting electroplate liquid
CN111501074A (en) * 2020-05-22 2020-08-07 李鑫 Copper-nickel-manganese alloy electroplating solution and electroplating method thereof
CN111501074B (en) * 2020-05-22 2021-07-16 佛山市诺诚科技有限公司 Electroplating method

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Application publication date: 20170510