CN106634626A - Preparation method for phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive - Google Patents
Preparation method for phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive Download PDFInfo
- Publication number
- CN106634626A CN106634626A CN201610944430.8A CN201610944430A CN106634626A CN 106634626 A CN106634626 A CN 106634626A CN 201610944430 A CN201610944430 A CN 201610944430A CN 106634626 A CN106634626 A CN 106634626A
- Authority
- CN
- China
- Prior art keywords
- parts
- phenolic resin
- preparation
- soluble type
- modified high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Abstract
The invention provides a preparation method for a phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive, and relates to the preparation method for a phosphate adhesive. The preparation method is to solve problems of a conventional phosphate adhesive. The method comprises the following steps: 1, preparing an alcohol-soluble chromium aluminum dihydrogen phosphate matrix; 2, preparing a phenolic resin solution; 3, mixing the alcohol-soluble chromium aluminum dihydrogen phosphate matrix and the phenolic resin solution so as to obtain composite alcohol-soluble phosphoric acid resin; 4, preparing a curing agent; and 5, uniformly mixing the composite alcohol-soluble phosphoric acid resin and the curing agent so as to obtain the phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive. The phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive provided by the invention has higher adhesion strength, higher water resistance and lower dielectric loss; meanwhile, raw materials needed for preparation have extensive sources, and are cheap and easily available; and the molding process is simple and facilitates industrial production.
Description
Technical field
The present invention relates to the preparation method of Phosphate adhesive.
Background technology
With the continuous progress of Aeronautics and Astronautics technology, the high-temperature Resistance Adhesives of excellent performance are into binding material field in recent years
Study hotspot.High-temperature Resistance Adhesives have the inorganic and class of Organic adhesive two.Organic adhesive, generally with all kinds of high polymers as base
Body, has excellent adhesive property under room temperature, but organic matrix is cracked in hot environment, loses can cementing structure
Effect., based on silicate and phosphate, with excellent heat resistance, but adhesion strength is low for inorganic adhesive.However, base
In two class adhesives, each advantage prepares inorganic/organic hybrid type adhesive, is expected to realize thering is good heat resistance energy and bonding
The adhesive of excellent performance.Phenolic resin（PF）It is that one kind finds earliest and obtain wide variety of synthetic resin, although its tool
There are good pliability, higher bond strength, relatively low solidification temperature, but its heat resistance is low.Therefore for changing
Property PF, has carried out both at home and abroad substantial amounts of research, and obtains necessarily to enter on PF curing performances, mechanical property and heat resistance
Exhibition.Inorganic phosphate salt adhesive can be used for numerous materials such as bonded metal, ceramics, composite and glass, can room temperature or liter
Temperature solidification, it is good with heat-resisting quantity, the advantages of cure shrinkage is little, but the inorganic glue used in >=1000 DEG C of environment long-times
Stick be it is water base, to containing hydrophobic coating material（Hydrophobic material surface-stable contact angle is more than 150 °, is in rolling contact angle and is less than
10°）During bonding, because water-based adhesive can not soak hydrophobic coating, thus adhesive can not play corresponding bonding effect,
The each several part of bonding easily comes off.The spy that organic resin can be shown when current inorganic phosphate adhesive is with resin compounded
Point, it is easy to resin compounded, today there is also many scholar and inorganic phosphate is studied with the compound of organic resin.
The content of the invention
The invention aims to solve the problems, such as above-mentioned Phosphate adhesive, and provide phenolic resin modified resistance to height
The preparation method of warm ethanol-soluble type Phosphate adhesive.
The preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive, realizes according to the following steps：
First, by mass fraction, by 100 parts of PHOSPHORIC ACID TECH.GRADE dihydro chromium aluminum solutions, vacuum rotary steam is removed at 80～100 DEG C
Aqueous solvent is removed, then adds 50～150 parts of absolute ethyl alcohol, fully dissolving to obtain alcohol after biphosphate chromium aluminium is fully crystallized
Molten type biphosphate chromium aluminum substrate；
2nd, by mass fraction, 100 parts of phenol, 80～150 parts of water are added in reactor, are added after stirring and dissolving
Enter 1～10 part of catalyst, be warmed up to 65～75 DEG C, then take 100～120 parts of formaldehyde and drip in 1～2h, then rise
Temperature to 75～80 DEG C of holding 4h, products therefrom warm water are washed till neutrality, remove moisture, phenolic resin are obtained, then by phenolic aldehyde tree
Fat is dissolved in ethyl acetate, obtains phenol resin solution；
3rd, by mass fraction, phenol resin solution of 100 parts of the ethanol-soluble type biphosphate chromium aluminum substrate with 30 parts is mixed
Close, obtain compound ethanol-soluble type phosphoric acid resin；
4th, by mass fraction, 10～40 parts of zirconium oxide, 10～40 parts of oxygen is added in 50～100 parts of aluminum oxide
Change copper and 10～50 parts of carborundum, curing agent is obtained after mixing；
5th, by mass fraction, 100～300 parts of curing agent is added in 100 parts of compound ethanol-soluble type phosphoric acid resin, is mixed
It is even, that is, complete the preparation of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive.
Phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive in the present invention, at 1200 DEG C, shear strength reaches most
Big value 14.05MPa.After boiling water water boils 8h, bonding effect is remained in that.Dielectric constant：1.8～4.3（10GHz）；Dielectric is damaged
Consumption angle tangent tg δ：0.01-0.05（10GHz）.It can be seen that phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive is with higher
Adhesion strength, higher water resistance, lower dielectric loss is cheap and easily-available while the raw material sources needed for preparing are extensively,
And moulding process is simple, is easy to industrialized production.
Description of the drawings
Fig. 1 is the block diagram of the shear strength that two groups of adhesives process at different temperatures SiC bonds in embodiment, its
Middle a represents the adhesive containing 0 part of phenolic resin, and b represents the adhesive containing 30 parts of phenolic resin.
Specific embodiment
Technical solution of the present invention is not limited to act specific embodiment set forth below, also including between each specific embodiment
Any combination.
Specific embodiment one：The preparation side of the phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive of present embodiment
Method, realizes according to the following steps：
First, by mass fraction, by 100 parts of PHOSPHORIC ACID TECH.GRADE dihydro chromium aluminum solutions, vacuum rotary steam is removed at 80～100 DEG C
Aqueous solvent is removed, then adds 50～150 parts of absolute ethyl alcohol, fully dissolving to obtain alcohol after biphosphate chromium aluminium is fully crystallized
Molten type biphosphate chromium aluminum substrate；
2nd, by mass fraction, 100 parts of phenol, 80～150 parts of water are added in reactor, are added after stirring and dissolving
Enter 1～10 part of catalyst, be warmed up to 65～75 DEG C, then take 100～120 parts of formaldehyde and drip in 1～2h, then rise
Temperature to 75～80 DEG C of holding 4h, products therefrom warm water are washed till neutrality, remove moisture, phenolic resin are obtained, then by phenolic aldehyde tree
Fat is dissolved in ethyl acetate, obtains phenol resin solution；
3rd, by mass fraction, phenol resin solution of 100 parts of the ethanol-soluble type biphosphate chromium aluminum substrate with 30 parts is mixed
Close, obtain compound ethanol-soluble type phosphoric acid resin；
4th, by mass fraction, 10～40 parts of zirconium oxide, 10～40 parts of oxygen is added in 50～100 parts of aluminum oxide
Change copper and 10～50 parts of carborundum, curing agent is obtained after mixing；
5th, by mass fraction, 100～300 parts of curing agent is added in 100 parts of compound ethanol-soluble type phosphoric acid resin, is mixed
It is even, that is, complete the preparation of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive.
Specific embodiment two：Present embodiment from unlike specific embodiment one, by 100 parts of work in step one
Industry level biphosphate chromium aluminum solutions vacuum rotary steam at 90 DEG C removes aqueous solvent.Other steps and parameter and specific embodiment one
It is identical.
Specific embodiment three：Present embodiment from unlike specific embodiment one, in biphosphate in step one
Chromium aluminium adds 100 parts of absolute ethyl alcohol after being fully crystallized.Other steps and parameter are identical with specific embodiment one.
Specific embodiment four：Present embodiment from unlike specific embodiment one, by 100 parts of benzene in step 2
Phenol, 100 parts of water are added in reactor, and 5 parts of catalyst is added after stirring and dissolving.Other steps and parameter be embodied as
Mode one is identical.
Specific embodiment five：From unlike specific embodiment one, catalyst is dense to present embodiment in step 2
Hydrochloric acid or mass concentration are 20%～40% sulfuric acid.Other steps and parameter are identical with specific embodiment one.
Specific embodiment six：Present embodiment is warmed up to 70 DEG C from unlike specific embodiment one in step 2,
Then take 110 parts of formaldehyde and drip in 1.5h, then be warming up to 78 DEG C of holding 4h.Other steps and parameter be embodied as
Mode one is identical.
Specific embodiment seven：Present embodiment from unlike specific embodiment one, in step 2 phenolic resin with
The mass ratio of ethyl acetate is 1:1.Other steps and parameter are identical with specific embodiment one.
Specific embodiment eight：Present embodiment from unlike specific embodiment one, in 60 parts of oxygen in step 4
Change zirconium oxide, 10 parts of cupric oxide and 20 parts of the carborundum that 10 parts are added in aluminium.Other steps and parameter and specific embodiment party
Formula one is identical.
Specific embodiment nine：Present embodiment from unlike specific embodiment one, the grain of aluminum oxide in step 4
Footpath is 80～150nm；Zirconic particle diameter is 60～120nm；The particle diameter of cupric oxide is 40～70nm；The particle diameter of carborundum is 90
～120nm.Other steps and parameter are identical with specific embodiment one.
Specific embodiment ten：Present embodiment is answered in step 5 from unlike specific embodiment one at 100 parts
Close the curing agent that 200 parts are added in ethanol-soluble type phosphoric acid resin.Other steps and parameter are identical with specific embodiment one.
Beneficial effects of the present invention are verified by following examples：
Embodiment
The preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive, realizes according to the following steps：
First, by mass fraction, by 100 parts of PHOSPHORIC ACID TECH.GRADE dihydro chromium aluminum solutions, vacuum rotary steam is removed at 80～100 DEG C
Aqueous solvent is removed, then adds 100 parts of absolute ethyl alcohol, fully dissolving to obtain ethanol-soluble type after biphosphate chromium aluminium is fully crystallized
Biphosphate chromium aluminum substrate；
2nd, by mass fraction, 100 parts of phenol, 100 parts of water are added in reactor, 5 parts is added after stirring and dissolving
Catalyst, be warmed up to 65～75 DEG C, then take 110 parts of formaldehyde and drip in 1.5h, then be warming up to 80 DEG C holding 4h,
Products therefrom warm water is washed till neutrality, removes moisture, obtains phenolic resin, and then phenolic resin is dissolved in ethyl acetate,
Obtain phenol resin solution；
3rd, by mass fraction, phenol resin solution of 100 parts of the ethanol-soluble type biphosphate chromium aluminum substrate with 30 parts is mixed
Close, obtain compound ethanol-soluble type phosphoric acid resin；
4th, by mass fraction, 15 parts of zirconium oxide, 15 parts of cupric oxide and 20 parts of carbon is added in 50 parts of aluminum oxide
SiClx, obtains curing agent after mixing；
5th, by mass fraction, 200 parts of curing agent is added in 100 parts of compound ethanol-soluble type phosphoric acid resin, is mixed, i.e.,
Complete the preparation of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive.
The phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive of gained is prepared in the present embodiment, performance test is carried out：
(1) mainly by bonding carborundum test piece, the shear strength surveyed under its different temperatures；
(2) its shear strength is surveyed after boiling test, the water resistance of adhesive is investigated；
(3) its dielectric coefficient and dielectric loss are surveyed by high-temperature dielectric measuring instrument.
Test result shows：
(1) bonding sample of the modified, high temperature resistant ethanol-soluble type Phosphate adhesive containing 0 part and containing 30 parts of phenolic resin
Shear strength Jing after 200～1500 DEG C of heat treatment, it can be seen from figure 1 that shear strength is first raised with the rising of temperature reducing again.
Phenolic resin is added to significantly improve the shear strength of adhesive, room temperature shear strength of the bonding sample Jing after 200 DEG C of solidifications is
8.41MPa, Jing after 800 DEG C and 1000 DEG C of Temperature Treatments, shear strength gradually increases, and at 1200 DEG C, shear strength reaches maximum
Value 14.05MPa, but temperature, when continuing to rise to 1500 DEG C, the shear strength of sample is substantially reduced, and this is because phosphate is three-dimensional
Structure destroy and tack coat sintering densification cause volume contraction and caused by bonding interface forms microfissure；But due to
More carborundum are generated, bonding effect is enhanced, shear strength still reaches 7.20MPa.Experiment is obtained at 1000～1200 DEG C
Result show higher adhesive strength.
(2) the shear strength such as table 1 of the phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive after boiling water 8h water is boiled
Shown, it can be seen that after boiling water water boils 8h, the mechanical strength of adhesive declines, and 0 part of test piece abutting edge is voluntarily ruptured, lost
Mechanical strength, the addition of phenolic resin serves certain bonding effect, improves the mechanical strength of adhesive.
Table 1
（3）Dielectric constant：4.3（10GHz）；
Dielectric loss angle tangent tg δ：0.01（10GHz）.
Claims (10)
1. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive, it is characterised in that it is real according to the following steps
It is existing：
First, by mass fraction, by 100 parts of PHOSPHORIC ACID TECH.GRADE dihydro chromium aluminum solutions, vacuum rotary steam removes water at 80～100 DEG C
Solvent, then adds 50～150 parts of absolute ethyl alcohol, fully dissolving to obtain ethanol-soluble type after biphosphate chromium aluminium is fully crystallized
Biphosphate chromium aluminum substrate；
2nd, by mass fraction, 100 parts of phenol, 80～150 parts of water are added in reactor, after stirring and dissolving add 1～
10 parts of catalyst, is warmed up to 65～75 DEG C, then takes 100～120 parts of formaldehyde and drips in 1～2h, then is warming up to
75～80 DEG C of holding 4h, products therefrom warm water is washed till neutrality, removes moisture, obtains phenolic resin, then that phenolic resin is molten
Solution obtains phenol resin solution in ethyl acetate；
3rd, by mass fraction, phenol resin solution of 100 parts of the ethanol-soluble type biphosphate chromium aluminum substrate with 30 parts is mixed, is obtained
To compound ethanol-soluble type phosphoric acid resin；
4th, by mass fraction, 10～40 parts of zirconium oxide, 10～40 parts of cupric oxide is added in 50～100 parts of aluminum oxide
Carborundum with 10～50 parts, obtains curing agent after mixing；
5th, by mass fraction, 100～300 parts of curing agent is added in 100 parts of compound ethanol-soluble type phosphoric acid resin, is mixed, i.e.,
Complete the preparation of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive.
2. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
Levy is that by 100 parts of PHOSPHORIC ACID TECH.GRADE dihydro chromium aluminum solutions, vacuum rotary steam removes aqueous solvent at 90 DEG C in step one.
3. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
Levy is that 100 parts of absolute ethyl alcohol is added after biphosphate chromium aluminium is fully crystallized in step one.
4. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
It is that 100 parts of phenol, 100 parts of water are added in reactor in step 2 to levy, and 5 parts of catalysis is added after stirring and dissolving
Agent.
5. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
Levy is that catalyst is concentrated hydrochloric acid or sulfuric acid that mass concentration is 20%～40% in step 2.
6. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
It is that 70 DEG C are warmed up in step 2 to levy, and then takes 110 parts of formaldehyde and drips in 1.5h, then is warming up to 78 DEG C of holdings
4h。
7. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
Levy is that phenolic resin and the mass ratio of ethyl acetate are 1 in step 2:1.
8. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
Levy is that 10 parts of zirconium oxide, 10 parts of cupric oxide and 20 parts of carborundum is added in 60 parts of aluminum oxide in step 4.
9. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
Levy be aluminum oxide in step 4 particle diameter be 80～150nm；Zirconic particle diameter is 60～120nm；The particle diameter of cupric oxide is
40～70nm；The particle diameter of carborundum is 90～120nm.
10. the preparation method of phenolic resin modified high temperature resistant ethanol-soluble type Phosphate adhesive according to claim 1, it is special
Levy is that 200 parts of curing agent is added in 100 parts of compound ethanol-soluble type phosphoric acid resin in step 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610944430.8A CN106634626B (en) | 2016-11-02 | 2016-11-02 | Preparation method of phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610944430.8A CN106634626B (en) | 2016-11-02 | 2016-11-02 | Preparation method of phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106634626A true CN106634626A (en) | 2017-05-10 |
| CN106634626B CN106634626B (en) | 2020-01-10 |
Family
ID=58820584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610944430.8A Active CN106634626B (en) | 2016-11-02 | 2016-11-02 | Preparation method of phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106634626B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108276916A (en) * | 2018-02-01 | 2018-07-13 | 黑龙江省科学院石油化学研究院 | A kind of preparation method of alcohol-soluble phosphate adhesive material |
| CN113185921A (en) * | 2021-06-03 | 2021-07-30 | 哈尔滨工程大学 | Preparation method of ceramic precursor modified phosphate adhesive |
| CN115505340A (en) * | 2022-10-09 | 2022-12-23 | 哈尔滨工程大学 | Preparation method of nickel-aluminum modified silica sol inorganic adhesive |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101875830A (en) * | 2009-11-23 | 2010-11-03 | 黑龙江省科学院石油化学研究院 | Phenolic resin/phosphate hybrid adhesive and preparation method thereof |
| CN102277089A (en) * | 2011-05-27 | 2011-12-14 | 湖北省烟叶公司 | High temperature binder for inorganic non-metallic materials used in bulk curing barn and preparation method thereof |
| CN102391791A (en) * | 2011-09-09 | 2012-03-28 | 黑龙江省科学院石油化学研究院 | Phenolic resin hybrid phosphate adhesive and preparation method thereof |
| CN105802516A (en) * | 2016-06-03 | 2016-07-27 | 黑龙江省科学院石油化学研究院 | Preparation method of alcohol-soluble high-temperature-resistant phosphate adhesive |
-
2016
- 2016-11-02 CN CN201610944430.8A patent/CN106634626B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101875830A (en) * | 2009-11-23 | 2010-11-03 | 黑龙江省科学院石油化学研究院 | Phenolic resin/phosphate hybrid adhesive and preparation method thereof |
| CN102277089A (en) * | 2011-05-27 | 2011-12-14 | 湖北省烟叶公司 | High temperature binder for inorganic non-metallic materials used in bulk curing barn and preparation method thereof |
| CN102391791A (en) * | 2011-09-09 | 2012-03-28 | 黑龙江省科学院石油化学研究院 | Phenolic resin hybrid phosphate adhesive and preparation method thereof |
| CN105802516A (en) * | 2016-06-03 | 2016-07-27 | 黑龙江省科学院石油化学研究院 | Preparation method of alcohol-soluble high-temperature-resistant phosphate adhesive |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108276916A (en) * | 2018-02-01 | 2018-07-13 | 黑龙江省科学院石油化学研究院 | A kind of preparation method of alcohol-soluble phosphate adhesive material |
| CN113185921A (en) * | 2021-06-03 | 2021-07-30 | 哈尔滨工程大学 | Preparation method of ceramic precursor modified phosphate adhesive |
| CN115505340A (en) * | 2022-10-09 | 2022-12-23 | 哈尔滨工程大学 | Preparation method of nickel-aluminum modified silica sol inorganic adhesive |
| CN115505340B (en) * | 2022-10-09 | 2023-06-27 | 哈尔滨工程大学 | Preparation method of nickel-aluminum modified silica sol inorganic adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106634626B (en) | 2020-01-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105802516B (en) | The preparation method of ethanol-soluble type high temperature resistant Phosphate adhesive | |
| CN103066186B (en) | The insulating barrier of ceramic chip composite structure, aluminium base and manufacture method thereof | |
| CN109354823B (en) | Preparation method of heat-insulation ceramizable phenolic resin-based gradient composite material | |
| CN106634626A (en) | Preparation method for phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive | |
| CN105198492A (en) | Oxidation-resistant coating and preparation method thereof | |
| CN103265331B (en) | C/SiC/Na2SiO3 antioxidative compound coating suitable for graphite material and preparation method thereof | |
| CN106187195A (en) | Use the method that selective laser sintering technique prepares silicon carbide ceramics | |
| CN103497718A (en) | Heat-conducting insulated adhesive | |
| CN105272369A (en) | Porous ceramic connecting method | |
| CN106047073B (en) | A kind of graphene oxide based high-temp-resistant bicomponent epoxy resin coating | |
| CN105384454A (en) | Rapid manufacturing method for complex-structure high-toughness SiC-based composite part | |
| CN104342079A (en) | Preparation method and application method of high-temperature bonding agent used for bonding carbon felts | |
| CN104591702A (en) | High thermal shock resistant aluminum oxide ceramic substrate for LED and manufacturing method of high thermal shock resistant aluminum oxide ceramic substrate | |
| CN106555093A (en) | A kind of CNT strengthens aluminum silicon carbide composite material and preparation method thereof | |
| CN108532293B (en) | Method for preparing carbon coating on surface of carbon fiber by adjusting pH of sugar solution | |
| CN114671690A (en) | Synchronous reaction connection-preparation of heterogeneous SiC-based ceramic material connecting piece and method | |
| Luan et al. | Effect of PSO and TiB2 content on the high temperature adhesion strength of SiBCNO ceramic | |
| CN111844962A (en) | Ceramic fiber reinforced aerogel felt and preparation method thereof | |
| CN109608235A (en) | Gel infiltration ceramic modification method for C/C composite material special-shaped part | |
| CN104817953A (en) | Insulating heat-dissipating coating and preparation method of same | |
| CN109306158B (en) | Preparation method and use method of release film | |
| CN104927754A (en) | Hydroxyl-modified polycarbosilane/phosphate-based adhesive and preparation method thereof | |
| CN100337982C (en) | Carbon/ceramic heat-resistant composite material and preparation process thereof | |
| CN103740306B (en) | Preparation method of wood preservation adhesive | |
| CN107417177A (en) | A kind of high-temperature Resistance Adhesives used in domestic ceramics manufacturing process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |