CN106631048A - Mobile terminal ceramic backplane, preparation method thereof and mobile terminal - Google Patents
Mobile terminal ceramic backplane, preparation method thereof and mobile terminal Download PDFInfo
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- CN106631048A CN106631048A CN201610834438.9A CN201610834438A CN106631048A CN 106631048 A CN106631048 A CN 106631048A CN 201610834438 A CN201610834438 A CN 201610834438A CN 106631048 A CN106631048 A CN 106631048A
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/612—Machining
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/94—Products characterised by their shape
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Abstract
The invention discloses a mobile terminal ceramic backplane, a preparation method thereof and a mobile terminal. The preparation method of the mobile terminal ceramic backplane comprises following steps: S1, a flat ceramic green body is prepared; S2, the ceramic green body is arranged on a convex support body, support blocks are arranged on the periphery of the convex support body, a concave surface of a concave body faces downwards, and the concave body is arranged on the support body; a melting point of the support body is higher than glue discharge temperature of the ceramic green body and lower than sintering temperature of the ceramic green body; a convex surface profile of the convex support body, a concave surface of the concave plate are matched with the shape of a curved structure of the ceramic backplane required to be prepared; S3, the ceramic green body is sintered at the temperature of 1300-1470 DEG C, the support body is softened, and the concave body descends and then drives the ceramic green body to bend; the sintered ceramic green body is subjected to heat preservation for 1-2 h and then is naturally cooled; S4, the convex support body and the concave body after cooling are separated, and the ceramic backplane with the curved structure is prepared. The preparation method has the advantages that the yield is high and the processing cost is low.
Description
【Technical field】
The present invention relates to mobile terminal pottery backboard process technology, more particularly to a kind of mobile terminal pottery backboard and its
Preparation method, mobile terminal.
【Background technology】
With developing rapidly for consumer electronics market, mobile phone productses remove hardware high capacity, vdiverse in function outside the pale of civilization, its outward appearance
Structure material is also frequently weeded out the old and bring forth the new, and it experienced the evolution of plastics, glass, metal.For handset sheathing material
Requirement is that intensity is high, wearability is good, indeformable, signal is by the characteristic such as property is good.Will promotion and application 5G networks, it is desirable to hand
Machine structure material in addition to possessing above feature, also with low dielectric constant, to ensure stable signal transmission.And zirconium oxide is made pottery
Ceramic material has fracture toughness height (>=8MPam1/2), and case hardness is high (8.0), and good brightness and human body skin are suitable after polishing
Answering property waits well Comprehensive Characteristics, it is considered to be following optimal phone structural material.At present existing many mobile phone brands are in flagship
Ceramic version is released on type, but because technological requirement is high, manufacturing procedure is more, and process technology difficulty is big, the low feature of yields, causes
The cost for making ceramic mobile phone backboard remains high, it is difficult to large-scale promotion and application.
Tri- kinds of flat board, 2.5D, 3D is generally divided in the moulding industry of mobile phone backboard, tabular can pass through curtain coating, isostatic pressed,
The moulding process such as injection realize that after-processing technology is relatively ripe, easily realize.But it is beautiful to increase when mobile phone productses are designed
Sense, pursues 2.5D, 3D structures such as curve, curved surface, is that the rear processing of ceramic product brings at a relatively high difficulty.So-called 2.5D reality
It is a kind of transitional form between flat board and 3D, is that plate morphology is obtained again by edge chamfer.Most difficult is then 3D forms,
Its generally cambered surface or plane adds cambered surface, more complicated in structure, and also relatively difficult in technique realization, production capacity is not high.At present, make
Standby pottery backboard, usually first injection molded is similar structures, the technique such as Jing degreasings, sintering, CNC, polishing complete or
Machined using thick plate-like Jing copy grinding wheel.Rear trimming is re-sintered as being first cast or being molded into ceramic flat tabular, due to pottery
The hardness of porcelain products itself is high, can only remove to form curved surface and curvilinear structures using diamond grinding, and this causes processing difficulties, and
Polishing removal amount is little, easy to crack, and buckling deformation easily occurs when below 0.5mm is worked into, cause yields to decline and into
This rising.These are all difficult point of the whole ceramic product of puzzlement in mobile phone backboard large-scale application.
【The content of the invention】
The technical problem to be solved is：Above-mentioned the deficiencies in the prior art are made up, a kind of mobile terminal pottery is proposed
Porcelain backing and preparation method thereof, mobile terminal, yields is high when preparing curved-surface structure backboard, and processing cost is low.
The technical problem of the present invention is solved by following technical scheme：
A kind of preparation method of mobile terminal pottery backboard, comprises the following steps：S1, makes flat ceramic body；
S2, the ceramic body is placed on a convex support body, support block is arranged around the convex support body, by a spill
The concave surface of body down, the concave body is placed in the support block；The fusing point of the support block is higher than the ceramic body
Dump temperature, less than the sintering temperature of the ceramic body；The convex support body, concave body adopt exotic material system
Into, and the convex profile of the convex support body, the concave profile of the concave body tie with the curved surface of the pottery backboard that need to be prepared
The mating shapes of structure；S3, is sintered at a temperature of 1300～1470 DEG C to the ceramic body, and the support block is soft
Change, the concave body drives the ceramic body to bend after declining；1～2h, natural cooling are incubated after the completion of sintering；S4, will be cold
But the convex support body and concave body after separates, and the pottery backboard with curved-surface structure is obtained.
The technical problem of the present invention is solved by technical scheme further below：
One kind mobile terminal pottery backboard according to obtained in preparation method as above.
A kind of mobile terminal, including mobile terminal pottery backboard as above.
The beneficial effect that the present invention is compared with the prior art is：
The preparation method of the mobile terminal pottery backboard of the present invention, using matching somebody with somebody for convex support body, support block and concave body
Collaboration is closed, sintering and hot bending process are realized to flat ceramic blank while completing.In sintering process, support block softens, spill
Body drives ceramic body bending after declining, form curved-surface structure.The pottery for being formed with curved-surface structure is after taking out from sintering furnace
Porcelain backing.The present invention preparation method, without the need for first sintering as prior art after again by diamond grinding formed curved surface knot
Structure, can effectively reduce the processing cost and difficulty of processing of product, and preparation process yields is high, processing cost is low, be easy to mobile whole
The large-scale processing application of end pottery backboard.
【Description of the drawings】
Fig. 1 is the flow chart of the preparation method of the mobile terminal pottery backboard of the specific embodiment of the invention；
Fig. 2 be the specific embodiment of the invention preparation method in the state that is placed in profiling tool of ceramic body illustrate
Figure；
Fig. 3 a be the specific embodiment of the invention preparation method in position of the ceramic body initial placement on profiling tool
Put schematic diagram；
Fig. 3 b be the specific embodiment of the invention preparation method in ceramic body in contraction process be located at profiling tool
On position view；
Fig. 3 c be the specific embodiment of the invention preparation method in ceramic body after the completion of contraction be located at profiling tool
On position view；
Fig. 4 be the specific embodiment of the invention preparation method in ceramic body sintering hot bending after view.
【Specific embodiment】
With reference to specific embodiment and compare accompanying drawing the present invention is described in further details.
As shown in figure 1, the preparation process of the mobile terminal pottery backboard for this specific embodiment, comprises the following steps：
Batch mixing ball milling：It is placed in ball mill after the organic additives such as zirconia ceramics powder and binding agent are mixed
Row mixing and levigate Zirconium oxide powder particle.
De-bubble：Material after batch mixing ball milling will be carried out into bubble removing by way of vacuum drawn, in preventing follow-up ceramics
There is pore.
Curtain coating：Liquid pulp flow is overlayed on soft diaphragm is dried on flat surface.
Section：The diaphragm being cast is cut into into writing board shape, ceramic body is obtained standby.Cut in this specific embodiment
Long 150mm, the rectangle base substrate of wide 60mm, thick 0.5mm are made after piece.The surface configuration of base substrate is alternatively other shapes, such as side
Shape, circle, annular etc., concrete surface configuration according to plus man-hour need select suitable shape.
Degreasing sintered, profiling：The flat board diaphragm of shape will be cut by high temperature sintering organics removal, dense sintering is reached
Ultra hard ceramic material afterwards.Flat board diaphragm is simply placed in direct sintering on plane load bearing board by existing sintering, and this is concrete
Profiling tool and support block have been used during degreasing sintered in embodiment.By profiling tool and the phase interworking of support block
Close, simultaneously act on flat ceramic base substrate by the pressure that top concave body applies at a high temperature of realizing in sintering process imitative
By hot bending into 3D shapes in shape tool.
Specifically, as shown in Fig. 2 profiling tool includes concave body 1, support block 2 and convex support body 3.Wherein, convex
Support body 3 is that, for supporting flat ceramic base substrate 5, and concave body 1 is for dropping to the surface of ceramic body 5 at high temperature to pottery
Porcelain base substrate 5 carries out profiling.The song of the convex profile of convex support body 3, the concave profile of concave body 1 and the pottery backboard that need to be prepared
The mating shapes of face structure.For example, the convex profile of convex support body 3, the concave profile of concave body 1 are：Two ends are arc
Structure, centre is linear structure.Or, the convex profile of convex support body 3, the concave profile of concave body 1 are：One section of arc knot
Structure.Concave body 1 and convex support body 3 are made up of exotic material, specially can tolerate the material of 1600 DEG C of temperatures above, and it melts
Point is higher than the sintering temperature of ceramic body, can be corundum, sapphire, mullite, ceramics or zirconium oxide.
Support block 2 is arranged on around convex support body 3, for supporting concave body 1, and soften in sintering process so as to
Decline in concave body 1.In this specific embodiment, four support blocks, and four supports are provided with around convex support body 3
The height of block 2 is consistent, and to guarantee that the concave body 1 for supporting thereon is that flatly ceramic body is suppressed, reduces ceramics
Size distortion error after compacting hot bending.The softening point (fusing point) of support block 2 is higher than the dump temperature of ceramic body, less than ceramics
The sintering temperature of base substrate, its material can be normal silicate ceramics.Because the softening point (fusing point) of support block 2 is in above range.
Therefore, before this dumping of ceramic body 5 produces contraction, and then support block 2 softens, and concave body 1 drives ceramic body bending after declining.
Support block 2 can be considered disposable consumption product, can be any kind of fusing point suitable material, such as shraff, its material
Material wide material sources.
Preferably, the fusing point of support block is at 1350～1450 DEG C.So, can be with the sintering process of ceramic material preferably
Match somebody with somebody, to be supported piece completely soften subside concave body 1 decline after just correspond to ceramic material has shunk, start solidify, while hot
It is curved.It is further preferred that support block includes：In parts by weight, 60～85% silica, 10～30% aluminum oxide, 5～
10% alkali metal oxide.Wherein, alkali metal oxide is one or more in calcium oxide, potassium oxide, sodium oxide molybdena
Mixing.By said components proportioning, fusing point can more easily be debugged out by materials such as addition silica, aluminum oxide and be slightly less than
The support block of material of zirconia ceramics material.Need to heighten fusing point during as adjusted, can accordingly increase the content of aluminum oxide, otherwise
Reduce.The Base Material of support block can be common mullite ceramic, feldspar porcelain, and aluminum oxide, alkali metal oxygen are added on its basis
Compound.After proportioning is good can by it is dry-pressing formed re-sinter it is prepared, can a large amount of support blocks of disposal molding it is standby.
In the step, ceramic body 5 is placed on convex support body 3, support block 2 is set around convex support body 3.
In this specific embodiment convex support body 3 for bulk, around its four corners arrange four support blocks 2.By concave body 1
Concave surface down, be placed in support block 2.A whole set of profiling tool can be placed on load bearing board 4, is easy to put sintering furnace into and is burnt
Knot.Sintering furnace can be batch-type furnace, alternatively continuous oven.The sintering curre of sintering furnace, including time and temperature are set, and this is concrete real
It is sintering oxidation zircon ceramic to apply in mode, and it is 1450 DEG C to arrange maximum sintering temperature, and temperature retention time is 2 hours.Include after setting
Intensification temperature fall time, 50 hours altogether.
In sintering process, ceramic body 5 can slowly volatilize with the organic matter sintered inside when in-furnace temperature gradually rises
(dumping), the volume of ceramic body 5 can be gradually reduced.Specific ceramics have fixed shrinkage factor, need in advance estimate shrinkage ratio
The change of example and contraction front and back position.As shown in Fig. 3 a～3c, when ceramic body is placed on convex support body 3, positioned at mark
Position shown in line S1.Position generation after it shrinks is moved at dotted line S2, is shunk at the sintering highest temperature and is stopped, and position is in mark
At note line S3, no longer change.For ceramic body, the particularly after-contraction of zirconia ceramics blank sintering than regular meeting according to different
Formula slightly difference, but it is general all between 20%-30%, therefore the position that mark line S3 is illustrated is sintering shrinkage 20%-
Position after 30%.
After the completion of contraction, because the temperature in now sintering furnace is more than the softening temperature of support block, support BOB(beginning of block) soft
Change is subsided, and the decline of concave body 1 thereon is pressed on the ceramic body after dumping 5.The ceramic body 5 of the condition of high temperature is clipped in concave body
Between 1 and convex support body 3.Concave body 1 produces pressure to the ceramic body on convex support body 3, drives ceramic body 5 curved
It is bent.Because the profile of concave body 1 and convex support body 3 is the curved surface 3D shapes that design, therefore can be by ceramic body 5 in high temperature
Lower hot bending into 3D shapes, shown in the ceramic wafer 8 of curved-surface structure as shown in Figure 4.After hot bending, concave body 1 is pressed on ceramic wafer 8
Heat-insulation pressure keeping 2 hours.Afterwards, profiling tool is arrived with the ceramic wafer 8 after hot bending according to the sintering temperature curve along with the furnace cooling for arranging
Room temperature, can separate afterwards concave body 1 and convex support body 3, take out the good ceramic wafer 8 of hot bending.
It should be noted that, the shape and size design of the concave body 1 of this specific embodiment and the profile of convex support body 3
It is based on the ceramic board size after sintering.The design of profiling tool need to consider two sizes before ceramic wafer sintering and after sintering, both
Green state softer before sintering can be supported, also the effect of support can be reached after high temperature sintering shrinks and concave-convex mold can be made proper
The good matched purpose for reaching hot bending.When sintering is started, concave body 1 is not simultaneously pressed against on ceramic body softer before sintering,
Ceramic body 5 is located on convex support body 3, and the superjacent air space of ceramic body 5 is the concave surface of concave body 1, and ceramic body 5 with it is recessed
There is gap between the concave surface of body 1, the deformation that was under pressure before ceramic body sintering curing can be avoided.If direct during sintering
Force up, ceramic body can be to carry out under stress and cause cracking due to volatile organic compounds and contraction in sintering process, therefore only
Its organic matter volatilization can waited complete, spill pushes drive deformation bending when shrinking complete after just declining.
The preparation method of this specific embodiment, is acted on using the hot mastication of support block and spill is declined to pottery automatically
Porcelain base substrate is suppressed, and realizes that sintering and hot bending compacting are integrally completed, and to be may replace and pass through diamond again after first high temperature sintering cooling
Grinding, or the technique of high temperature hot bending is repeated, can effectively reduce the processing cost and difficulty of processing of product, preparation process non-defective unit
Rate is high, and with higher production efficiency, processing cost is relatively low.Preparation process realizes flat-type ceramic body quick Fabrication 3D
Class ceramic product, makes full use of the production of flat-type ceramic body ready availability, is adapted to scale of mass production.
Direct sintering hot bending integration in this specific embodiment.The first cutting different from the past of this mode or processing
The technique sintered into after special-shaped product.Special-shaped product is easily deformed in high temperature sintering, nearly 1500 DEG C of usual sintering temperature,
The ceramic block of complicated shape under this high temperature, particularly deforms with occurring softening to subside where cambered surface, and general flat board
The form of class is then because the support for having whole plane is not in this problem.This specific embodiment is sintered also different from first, then
The technique of hot bending.Hot bending again is first sintered, pyroprocess twice can be experienced.And setting by profiling tool in this specific embodiment
Meter, realizes the directly hot bending in high-temperature sintering process, only experiences a pyroprocess, therefore energy resource consumption is little, low cost.And
Due to sintering hot bending integration, it is to avoid in easily occurring when ceramic product experiences second high temperature during high temperature hot bending after first sintering
Portion's abnormal grain growth, has a strong impact on the problem of the strength of materials.
Ceramic body in this specific embodiment can be with rectangular flat board, circular flat board or erose flat
Plate, THICKNESS CONTROL is in below 1mm.Because the pressure that the ceramic body for different-thickness needs is different, thickness is moderate, only utilizes
The weight compacting of concave body 1 itself, constant weight can be placed above if the thickness thickness partially of ceramic body in concave body 1
Weight increases.Jing is tested, within the weight 2KG of the ceramic body placement of below 0.4mm thickness；0.4～0.6mm thick ceramic blank
Body places 2～3KG of weight；0.6mm～0.8mm thick ceramic body places 3～5KG of weight, and remaining thickness rule can add according to this
The weight of the material that playback is put.Weight material is high-melting-point high temperature resistant material, such as zirconium oxide, corundum, mullite, ceramics etc..
Additionally, concave body 1 or load bearing board 4 that support block is contacted because emollescence is possible to be stained with it, can be
The two ends of support block are coated every viscous powder, prevent adhesion, every viscous powder material can be zirconia powder or alumina powder.
A kind of mobile terminal is also provided in this specific embodiment, it is included obtained in preparation process as described above
Mobile terminal pottery backboard with curved-surface structure.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to assert
The present invention be embodied as be confined to these explanations.For general technical staff of the technical field of the invention,
Some replacements or substantially modification are made on the premise of without departing from present inventive concept, and performance or purposes are identical, all should be considered as
Belong to protection scope of the present invention.
Claims (10)
1. a kind of preparation method of mobile terminal pottery backboard, it is characterised in that：Comprise the following steps：S1, makes flat
Ceramic body；S2, the ceramic body is placed on a convex support body, is arranged around the convex support body and is supported
Block, the concave body is placed in the support block by the concave surface of a concave body down；The fusing point of the support block is higher than described
The dump temperature of ceramic body, less than the sintering temperature of the ceramic body；The convex support body, concave body adopt resistance to height
Adiabator is made, and the convex profile of the convex support body, the concave profile of the notch plate and the pottery backboard that need to be prepared
Curved-surface structure mating shapes；S3, is sintered at a temperature of 1300～1470 DEG C to the ceramic body, described
Bracer softens, and the concave body drives the ceramic body to bend after declining；1～2h, natural cooling are incubated after the completion of sintering；
S4, by cooling after the convex support body and concave body separate, be obtained with curved-surface structure pottery backboard.
2. the preparation method of mobile terminal pottery backboard according to claim 1, it is characterised in that：It is described in step S2
The fusing point of support block is at 1350～1450 DEG C.
3. the preparation method of mobile terminal pottery backboard according to claim 1, it is characterised in that：The support block bag
Include：In parts by weight, 60～85% silica, 10～30% aluminum oxide, 5～10% alkali metal oxide.
4. the preparation method of mobile terminal pottery backboard according to claim 3, it is characterised in that：The alkali metal oxidation
Thing is one or more the mixing in calcium oxide, potassium oxide, sodium oxide molybdena.
5. the preparation method of mobile terminal pottery backboard according to claim 1, it is characterised in that：It is described in step S2
Exotic material is the material for tolerating 1600 DEG C of temperatures above.
6. the preparation method of mobile terminal pottery backboard according to claim 1, it is characterised in that：In step S2, also wrap
Include the placement high temperature resistant object in the concave body.
7. the preparation method of mobile terminal pottery backboard according to claim 1, it is characterised in that：In step S2, also wrap
Include the position contacted with the concave body in support block to arrange every viscous powder.
8. the preparation method of mobile terminal pottery backboard according to claim 1, it is characterised in that：In step S2, by institute
State convex support body, support block to be placed on a load bearing board；In step S3, the load bearing board is moved in sintering furnace, 1300
The ceramic body is sintered at a temperature of～1470 DEG C.
9. mobile terminal pottery backboard obtained in a kind of preparation method according to claims 1 to 8.
10. a kind of mobile terminal, it is characterised in that：Including mobile terminal pottery backboard as claimed in claim 9.
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| CN109961690A (en) * | 2017-12-14 | 2019-07-02 | 三星显示有限公司 | Cover glass and its manufacturing method |
| CN110395981A (en) * | 2019-08-13 | 2019-11-01 | Oppo广东移动通信有限公司 | 2.5D or 3D ceramic shell and preparation method thereof and electronic equipment |
| CN110549461A (en) * | 2018-06-04 | 2019-12-10 | 香港城市大学 | Method of constructing printed ceramic objects and ceramic objects constructed thereby |
| CN110757630A (en) * | 2019-10-11 | 2020-02-07 | Oppo广东移动通信有限公司 | Preparation method of ceramic structural member, ceramic structural member and electronic equipment |
| CN112768822A (en) * | 2020-12-30 | 2021-05-07 | Oppo广东移动通信有限公司 | Shell assembly, preparation method and electronic equipment |
| CN113916002A (en) * | 2021-11-22 | 2022-01-11 | 中国建筑材料科学研究总院有限公司 | Sheet ceramic pressing and sintering device and using method thereof |
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| CN107433672A (en) * | 2017-06-22 | 2017-12-05 | 瑞声科技(新加坡)有限公司 | The preparation method of mobile communication equipment shell |
| CN109961690A (en) * | 2017-12-14 | 2019-07-02 | 三星显示有限公司 | Cover glass and its manufacturing method |
| CN109961690B (en) * | 2017-12-14 | 2023-03-21 | 三星显示有限公司 | Cover glass and method for manufacturing same |
| CN110549461A (en) * | 2018-06-04 | 2019-12-10 | 香港城市大学 | Method of constructing printed ceramic objects and ceramic objects constructed thereby |
| CN110549461B (en) * | 2018-06-04 | 2022-05-24 | 香港城市大学 | Method of constructing printed ceramic objects and ceramic objects constructed thereby |
| CN110395981A (en) * | 2019-08-13 | 2019-11-01 | Oppo广东移动通信有限公司 | 2.5D or 3D ceramic shell and preparation method thereof and electronic equipment |
| CN110395981B (en) * | 2019-08-13 | 2022-03-22 | Oppo广东移动通信有限公司 | 2.5D or 3D ceramic shell, preparation method thereof and electronic equipment |
| CN110757630A (en) * | 2019-10-11 | 2020-02-07 | Oppo广东移动通信有限公司 | Preparation method of ceramic structural member, ceramic structural member and electronic equipment |
| WO2021068722A1 (en) * | 2019-10-11 | 2021-04-15 | Oppo广东移动通信有限公司 | Preparation method for ceramic structure, ceramic structure and electronic device |
| CN112768822A (en) * | 2020-12-30 | 2021-05-07 | Oppo广东移动通信有限公司 | Shell assembly, preparation method and electronic equipment |
| CN113916002A (en) * | 2021-11-22 | 2022-01-11 | 中国建筑材料科学研究总院有限公司 | Sheet ceramic pressing and sintering device and using method thereof |
| CN113916002B (en) * | 2021-11-22 | 2023-03-10 | 中国建筑材料科学研究总院有限公司 | Sheet ceramic pressing and sintering device and using method thereof |
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