CN106622924B - A kind of production method of piezo-electricity composite material - Google Patents
A kind of production method of piezo-electricity composite material Download PDFInfo
- Publication number
- CN106622924B CN106622924B CN201611246104.6A CN201611246104A CN106622924B CN 106622924 B CN106622924 B CN 106622924B CN 201611246104 A CN201611246104 A CN 201611246104A CN 106622924 B CN106622924 B CN 106622924B
- Authority
- CN
- China
- Prior art keywords
- piezo
- plate
- composite material
- piezoelectric material
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 171
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000009833 condensation Methods 0.000 claims abstract description 28
- 230000005494 condensation Effects 0.000 claims abstract description 28
- 238000000227 grinding Methods 0.000 claims abstract description 24
- 238000011049 filling Methods 0.000 claims abstract description 7
- 239000012188 paraffin wax Substances 0.000 claims description 25
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 230000010412 perfusion Effects 0.000 claims description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229960002415 trichloroethylene Drugs 0.000 claims description 3
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 239000000523 sample Substances 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 9
- 238000005452 bending Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005237 high-frequency sound signal Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/50—Application to a particular transducer type
- B06B2201/55—Piezoelectric transducer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
A kind of production method of piezo-electricity composite material includes: to bind piezoelectric material and plate；Piezoelectric material of the bonding on the plate is cut, the depth of the slot of the piezoelectric material is less than the thickness of the piezoelectric material；The filling decoupling condensation material in the slot of the piezoelectric material；On the basis of the plate, the upper surface for being filled with the cured piezoelectric material of decoupling condensation material institute is ground, piezoelectric material is then removed, to the grinding of the lower surface of piezoelectric material；Electrode is arranged in piezoelectric material surface after grinding, obtains piezo-electricity composite material.This method can prevent piezoelectric material from bending in process, and the systematicness of crystallite member being correctly ordered with shape is effectively guaranteed, and the consistency for face battle array probe provides reliable guarantee.
Description
Technical field
The invention belongs to two-dimensional surface ultrasonic transducer preparation field more particularly to a kind of production sides of piezo-electricity composite material
Method.
Background technique
In recent years, ultrasonic three-dimensional imaging and three-dimensional space Sound stimulat, sound manipulate, the demand of sound treatment increasingly increases, right
The performance requirement of two-dimensional array ultrasonic transducer is also higher and higher.The core component of two-dimensional array ultrasonic transducer is that face battle array is visited
The quality of head, face battle array probe is directly related to the quality level of entire two-dimensional array ultrasonic transducer.
One face battle array probe is usually made of one to thousands of individual piezoelectricity array element (or being piezoelectric unit).It is each
An important factor for consistency between piezoelectricity array element is influence face battle array probe quality.Face battle array probe in the production process, need by
It is first (single piezoelectric unit) that piezoelectric ceramics is divided into crystallite.In order to enable the vibration mode of crystallite member is consistent, improves face array and visit
The electromechanical coupling factor of head, piezoelectric ceramics can generally select to carry out complete parttion.And uncoupling is filled in slot after singulation
Material.
But during decoupling condensation material described in curing molding, may result in piezoceramic material bending deformation,
So that forming dislocation between crystallite member；Alternatively, being suppressed during curing molding using fixture, prevent in the curing process
Variation, but behind in in the grinding process of extra decoupling condensation material, after being removed due to fixture, due to multiple grinding,
It is influenced also piezoceramic material be made to deform by internal stress, the crystallite member after will lead to grinding cannot form a rule
Cube then seriously affects the consistency of face battle array probe.
Summary of the invention
The purpose of the present invention is to provide a kind of production methods of piezo-electricity composite material, multiple with the piezoelectricity for solving the prior art
In condensation material manufacturing process, be easy so that piezo-electricity composite material deform or crystallite member between misplace, seriously affect face battle array
The problem of arranging the consistency of probe.
In a first aspect, the embodiment of the invention provides a kind of production methods of piezo-electricity composite material, which comprises
Piezoelectric material and plate are binded；
Piezoelectric material of the bonding on the plate is cut, the depth of the slot of the piezoelectric material is less than described
The thickness of piezoelectric material；
The filling decoupling condensation material in the slot of the piezoelectric material；
On the basis of the plate, to be filled with decoupling condensation material institute cured piezoelectric material upper surface grinding, then
Piezoelectric material is removed, the lower surface of piezoelectric material is ground；
Electrode is arranged in piezoelectric material surface after grinding, obtains piezo-electricity composite material.
With reference to first aspect, in the first possible implementation of first aspect, piezoelectric material surface after grinding
After the step of electrode is set, piezo-electricity composite material is obtained, the method also includes:
The piezo-electricity composite material and the plate are binded；
Matching layer material is perfused on the piezo-electricity composite material surface；
After matching layer material solidification, grinding is covered on the matching layer on the piezo-electricity composite material surface on the basis of plate
Material.
The possible implementation of with reference to first aspect the first, in second of possible implementation of first aspect,
After matching layer material solidification, after the step of matching layer of the composite material surface is ground on the basis of plate, the method is also
Include:
The piezo-electricity composite material is removed from plate, and array elements are carried out to the lower surface of the piezo-electricity composite material and are drawn
Point, obtain the piezo-electricity composite material of predetermined size.
The possible implementation of with reference to first aspect the first, in the third possible implementation of first aspect, institute
It states and matching layer material step is perfused in the composite material surface specifically:
In the baffle that the surrounding setting of the composite material is fitted closely with plate, the baffle and the Piezoelectric anisotropy material
There are gaps between material；
The perfusion matching layer material in the baffle, the upper surface of the piezo-electricity composite material and surrounding covering described
With layer material.
With reference to first aspect, described to stick piezoelectric material and plate in the 4th kind of possible implementation of first aspect
The step of conjunction specifically:
Paraffin is set on the surface of the plate, heats the paraffin, makes described paraffin melting in the planar surface；
The piezoelectric material is binded in the planar surface for having melted the paraffin.
With reference to first aspect, the possible implementation of the first of first aspect, second of first aspect can the side of being able to achieve
Formula, first aspect the third can be able to achieve or the 4th kind of first aspect can be able to achieve, in the 5th kind of possibility of first aspect
In implementation, the plate is glass plate.
With reference to first aspect, the possible implementation of the first of first aspect, second of first aspect can the side of being able to achieve
Formula, first aspect the third can be able to achieve or the 4th kind of first aspect can be able to achieve, in the 6th kind of possibility of first aspect
In implementation, the decoupling condensation material is epoxy resin.
The 4th kind with reference to first aspect can be able to achieve, described to take in the 7th kind of possible implementation of first aspect
Lower piezoelectric material step specifically:
After cleaning by trichloro ethylene to the paraffin on plate, the piezoelectric material is removed.
With reference to first aspect, in the 8th kind of possible implementation of first aspect, the piezoelectric material be piezoelectric ceramics,
Piezoelectric monocrystal or piezopolymer.
With reference to first aspect, the possible implementation of the first of first aspect, second of first aspect can the side of being able to achieve
Formula, first aspect the third can be able to achieve or the 4th kind of possible implementation of first aspect, at the 9th kind of first aspect
In possible implementation, the flatness of the plate is less than or equal to 5 microns.
The present invention binds piezoelectric material on plate, cuts on plate to the piezoelectric material, and will not
To piezoelectric material complete parttion, it can prevent crystallite member from misplacing due to there is no support.The slot of piezoelectric material after dicing
Middle filling decouples condensation material, on the basis of plate, carries out grinding to the upper surface for the piezoelectric material for having cured decoupling condensation material and adds
Work can prevent piezoelectric material from bending in process, and being correctly ordered and shape for crystallite member is effectively guaranteed
Systematicness, the consistency for face battle array probe provide reliable guarantee.
Detailed description of the invention
Fig. 1 is the implementation flow chart of the production method of piezo-electricity composite material provided in an embodiment of the present invention；
Fig. 2 is piezo-electricity composite material production schematic diagram provided in an embodiment of the present invention；
Fig. 3 is the implementation flow chart that piezo-electricity composite material surface provided in an embodiment of the present invention forms matching layer；
Fig. 4 is that the surface of piezo-electricity composite material provided in an embodiment of the present invention forms the production schematic diagram of matching layer.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The production method for being designed to provide a kind of piezo-electricity composite material of the embodiment of the present invention, to solve in the prior art
Piezo-electricity composite material is made, during decoupling condensation material described in curing molding, piezoceramic material bending is may result in and becomes
Shape, so that forming dislocation between crystallite member；Alternatively, being suppressed during curing molding using fixture, prevent from solidifying
Change in journey, but behind in in the grinding process of extra decoupling condensation material, after being removed due to fixture, since multiple is ground
Mill, is influenced also piezoceramic material be made to deform by internal stress, and the crystallite member after will lead to grinding cannot form one
The cube of a rule, seriously affect face battle array probe consistency the problem of.
In addition, the problem of present invention also further solves in the prior art for matching layer.In the prior art, it matches
Layer is to be bonded by way of pasting with piezo-electricity composite material.When array element constitute piezo-electricity composite material it is smaller, either
When linear array, piezo-electricity composite material and matching layer make respectively, answer in piezo-electricity composite material surface coating glue, then by the piezoelectricity
Condensation material is pasted with matching layer, and extra glue can be pressed into except piezo-electricity composite material and matching layer, so that piezoelectricity
It can combine closely between composite material and matching layer.But glue is still suffered between piezo-electricity composite material and matching layer
Layer, although the very thin of glue layer compacting still can impact the performance of ultrasonic transducer.Large-scale face battle array
Probe, since its piezo-electricity composite material area is excessive, extra glue is difficult to be extruded between piezo-electricity composite material and matching layer,
Extra glue can seriously affect the performance of face battle array probe, simultaneously it is also possible to be formed between piezo-electricity composite material and matching layer
The influence of bubble, the consistency of opposite battle array probe is more serious.
With reference to the accompanying drawing, the present invention is further illustrated.
It is as shown in Figure 1 the implementation process of the production method of piezo-electricity composite material provided in an embodiment of the present invention, is described in detail such as
Under:
In step s101, piezoelectric material and plate are binded.
The piezoelectric material can be piezoceramic material, monocrystalline piezoelectric material or polymeric piezoelectric material.The piezoelectricity
The crystal symmetry of material is lower, and when by external force, deformation occurs, the relative displacement of negative ions makes positive and negative in structure cell
Charge-site is no longer overlapped, and causes crystal that macroscopic polarization occurs, and plane of crystal surface density of charge is equal to polarization intensity on surface
Projection in normal direction, so both ends of the surface will appear heterocharge when piezoelectric material compression power acts on deformation.Conversely, piezoelectric material exists
When polarizing in electric field, material can be caused to deform because of the displacement of charge-site.Therefore, transducing can be made according to piezoelectric material
Device or sensor etc., for example when high frequency electrical signal is added on piezoelectric ceramics, then generate high frequency sound signal (mechanical shock), i.e., it is ultrasonic
Wave signal.
The plate, preferred embodiment select the flatness of plate to be less than or equal to 5 microns.That is, flat
The most raised position of plate and the difference in height for the position being most recessed cannot be greater than 5 microns.The plate can select glass material
Plate, or the material that other planarizations can also be selected good.
Described the step of binding piezoelectric material and plate specifically:
Paraffin is set on the surface of the plate, heats the paraffin, makes described paraffin melting in the planar surface.
The piezoelectric material is binded in the planar surface for having melted the paraffin.
The paraffin can be ground to powder or the state of smaller particle is arranged on plate, by the heating paraffin
Afterwards, the paraffin after thawing can be more uniformly on the surface of plate, so as to obtain preferably binding effect.
The heating method of the paraffin can be heated by flame or plate is placed in the atmosphere of certain temperature,
Paraffin is enabled to be evenly distributed in the region for needing to bind piezoelectric material, as the A figure in Fig. 2 show piezoelectric material and puts down
Effect diagram after plate bonding.The plate can select heat-resist glass material.
In step s 102, piezoelectric material of the bonding on the plate is cut, the slot of the piezoelectric material
Depth be less than the piezoelectric material thickness.
On the basis of planar bottom surface, the cutting of crystallite member is carried out to piezoelectric material.The crystallite member cut is i.e. single
Piezoelectric unit.Under normal circumstances, the piezoelectric material will not be fully segmented, and prevent crystallite member from not supporting after complete parttion
And it is easy to happen dislocation.If the B figure in Fig. 2 show the schematic diagram after cutting to piezoelectric material, the piezoelectric material
Lower surface is not cut open completely, thus reliably can be connected and be fixed between each crystallite first (piezoelectric unit), is avoided micro-
Wafer misplaces.
The depth of the slot of the piezoelectric material can be slightly less than the thickness of the piezoelectric material.For example, the piezoresistive material
The depth of the slot of material, can be 2-10 microns smaller than the thickness of the piezoelectric material etc..
In step s 103, the filling decoupling condensation material in the slot of the piezoelectric material.
Specifically, the decoupling condensation material can cover described into the slot of piezoelectric material when filling decoupling condensation material
Piezoelectric material, and in step S104 by way of grinding, extra decoupling condensation material can be removed, as the C in Fig. 2 schemes institute
It is shown as eliminating the schematic diagram of the piezoelectric material after extra decoupling condensation material.Decoupling condensation material after solidification, can be to crystallite
Member plays a supportive role, and can obtain individual crystallite member one by one.By the decoupling condensation material, can effectively overcome micro-
Affecting between wafer couples and is electrically coupled, and reduces string acoustic jamming.Optionally, the decoupling condensation material can be epoxy resin.
In step S104, on the basis of the plate, to be filled with decoupling condensation material cured piezoelectric material it is upper
Then piezoelectric material is removed in surface grinding, grind to the lower surface of piezoelectric material.
On the basis of the plate, grinds the two-sided of the piezoelectric material and is specifically as follows:
For the upper surface of piezoelectric material: can be on the basis of the bottom surface of the plate, after grinding is filled with decoupling condensation material
Piezoelectric material, until the upper surface of piezoelectric material is visible.Due to by being ground on the basis of plate, so as to effective
A possibility that single piezoelectric unit deforms is reduced, the consistency of face array probe is improved.
For the lower surface of piezoelectric material: piezoelectric material can be removed from the plate, it can be anti-by piezoelectric material
Come over to be fixed on the plate, grinds the lower surface of the piezoelectric material.The thickness that the lower surface of the piezoelectric material is ground
Degree can accordingly be adjusted according to the depth of slot.When removing the piezoelectric material, if being sticked in step S101 using paraffin
It closes, then paraffin can be cleaned using trichloro ethylene, the piezoelectric material of bonding then be removed, as shown in the D figure in Fig. 2
The schematic diagram of piezo-electricity composite material after grinding.
In step s105, electrode is arranged in piezoelectric material surface after grinding, obtains piezo-electricity composite material.
After the piezo-electricity composite material after being ground, to the two-sided setting electrode of the crystallite member of piezoceramic material, i.e.,
The preferable piezo-electricity composite material of consistency can be obtained.
By the way that piezoelectric material bonding on plate, cuts the piezoelectric material on plate, and will not be right
Piezoelectric material complete parttion can prevent crystallite member from misplacing due to not having support.In the slot of piezoelectric material after dicing
Filling decoupling condensation material carries out attrition process to the upper surface for the piezoelectric material for having cured decoupling condensation material on the basis of plate,
It can prevent piezoelectric material from bending in process, the rule of crystallite member being correctly ordered with shape is effectively guaranteed
Property, the consistency for face battle array probe provides reliable guarantee.
In order to further increase the quality of face battle array probe, the method can also include that piezo-electricity composite material surface is arranged
The step of matching layer, can be not easy between matching layer and piezo-electricity composite material by the improvement to matching layer set-up mode
It falls off, it is not easy to foaming, and ultrasonic transducer can be effectively improved without glue layer between matching layer and piezo-electricity composite material
Performance, specifically described below:
Piezo-electricity composite material surface as shown in Figure 3 forms the implementation flow chart of matching layer, comprising:
In step S301, the piezo-electricity composite material and the plate are binded.
The mode binded with piezoelectric material and the plate in step S101 is essentially identical, described as shown in the E figure in Fig. 4
Piezo-electricity composite material is same as the bonding process of the plate can be by the way of heating paraffin, by paraffin melting described flat
On plate, the paraffin melting region then is arranged in the piezo-electricity composite material.Also, the paraffin can be powdered
Or granular, the region for being distributed in bonding that can be more uniform, effect is more preferably binded to reach.
The piezo-electricity composite material can be obtained, or the piezoelectricity obtained by other methods by the method in Fig. 1
Composite material.
In step s 302, matching layer material is perfused on the piezo-electricity composite material surface.
Matching layer material is perfused on the piezo-electricity composite material surface, specifically can will match layer material heating and melting, so
It is poured onto the surface of the piezo-electricity composite material and the surrounding of piezo-electricity composite material afterwards.
As a kind of preferred embodiment of the present invention, as shown in the F figure in Fig. 4, it is perfused in the composite material surface
Matching layer material step specifically:
In the baffle that the surrounding setting of the composite material is fitted closely with plate, the baffle and the Piezoelectric anisotropy material
There are gaps between material；
The perfusion matching layer material in the baffle, the upper surface of the piezo-electricity composite material and surrounding covering described
With layer material.
The baffle is fitted closely with plate, can be overflowed to avoid matching layer material from baffle or other positions, thus
Achieve the purpose that save matching layer material.
There are gaps between the baffle and plate passes through institute when the matching layer material is poured in the baffle
Matching layer protection can be formed in the side of the piezo-electricity composite material by stating gap, so as to wrap up Piezoelectric anisotropy by matching layer
The surrounding of material, the combination between matching layer and piezo-electricity composite material are more stable reliable.By way of perfusion, so that piezoelectricity
Do not allow between composite material and the matching layer it is easy to foaming, and do not need setting glue layer, be conducive to improve ultrasonic transducer
Performance.
In step S303, after matching layer material solidification, grinding is covered on the Piezoelectric anisotropy material on the basis of plate
Expect the matching layer material on surface.
It, can be by extra on the piezo-electricity composite material surface of the matching layer of generation after the matching layer material solidification
It is removed with layer material, obtains the piezo-electricity composite material with matching layer as shown in the G figure in Fig. 4.The mode of removal matching layer material
Can by way of cutting, or grinding mode.In such a way that matching layer wraps up, be conducive to further increase grinding plus
The reliability of work.
In addition, the embodiment of the present invention can further include:
In step s 304, the piezo-electricity composite material is removed from plate, to the lower surface of the piezo-electricity composite material
Array elements division is carried out, the piezo-electricity composite material of predetermined size is obtained.Enable adaptation to the demand of different face array transducers.
Therefore, the present invention passes through piezo-electricity composite material production method shown in FIG. 1, the available preferable piezoelectricity of consistency
Composite material can be used for the two-dimensional surface energy converter of extensive array element.And matching is formed by piezo-electricity composite material shown in Fig. 2
Layer method, without glue layer between matching layer and piezo-electricity composite material, is conducive to mention by that will match layer material direct form
The performance of high ultrasonic transducer.Also, matching layer can be wrapped in the surrounding of piezo-electricity composite material by this method, be conducive to improve
The reliability of piezo-electricity composite material, in use, not easily to fall off between matching layer and piezo-electricity composite material.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of production method of piezo-electricity composite material, which is characterized in that the described method includes:
Piezoelectric material and plate are binded；
Piezoelectric material of the bonding on the plate is cut, the depth of the slot of the piezoelectric material is less than the piezoelectricity
The thickness of material；
The filling decoupling condensation material in the slot of the piezoelectric material；
On the basis of the plate, to be filled with decoupling condensation material institute cured piezoelectric material upper surface grinding, then remove
Piezoelectric material grinds the lower surface of piezoelectric material；
Electrode is arranged in piezoelectric material surface after grinding, obtains piezo-electricity composite material.
2. the method according to claim 1, which is characterized in that electrode is arranged in piezoelectric material surface after grinding, obtains
After the step of piezo-electricity composite material, the method also includes:
The piezo-electricity composite material and the plate are binded；
Matching layer material is perfused on the piezo-electricity composite material surface；
After matching layer material solidification, grinding is covered on the matching layer material on the piezo-electricity composite material surface on the basis of plate
Material.
3. method according to claim 2, which is characterized in that after matching layer material solidification, institute is ground on the basis of plate
After the step of stating the matching layer of composite material surface, the method also includes:
The piezo-electricity composite material is removed from plate, and array elements division is carried out to the lower surface of the piezo-electricity composite material, is obtained
To the piezo-electricity composite material of predetermined size.
4. method according to claim 2, which is characterized in that described that matching layer material step is perfused in the composite material surface
Suddenly specifically:
In the baffle that the surrounding setting of the composite material is fitted closely with plate, the baffle and the piezo-electricity composite material it
Between there are gaps；
The perfusion matching layer material in the baffle covers the matching layer in the upper surface of the piezo-electricity composite material and surrounding
Material.
5. method according to claim 1, which is characterized in that described the step of binding piezoelectric material and plate specifically:
Paraffin is set on the surface of the plate, heats the paraffin, makes described paraffin melting in the planar surface；
The piezoelectric material is binded in the planar surface for having melted the paraffin.
6. any one of -5 the method according to claim 1, which is characterized in that the plate is glass plate.
7. any one of -5 the method according to claim 1, which is characterized in that the decoupling condensation material is epoxy resin.
8. method according to claim 5, which is characterized in that described to remove piezoelectric material step specifically:
After cleaning by trichloro ethylene to the paraffin on plate, the piezoelectric material is removed.
9. method according to claim 5, which is characterized in that the piezoelectric material is piezoelectric ceramics, piezoelectric monocrystal or piezoelectricity
Polymer.
10. any one of -5 the method according to claim 1, which is characterized in that it is micro- that the flatness of the plate is less than or equal to 5
Rice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611246104.6A CN106622924B (en) | 2016-12-29 | 2016-12-29 | A kind of production method of piezo-electricity composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611246104.6A CN106622924B (en) | 2016-12-29 | 2016-12-29 | A kind of production method of piezo-electricity composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106622924A CN106622924A (en) | 2017-05-10 |
| CN106622924B true CN106622924B (en) | 2019-03-01 |
Family
ID=58837235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611246104.6A Active CN106622924B (en) | 2016-12-29 | 2016-12-29 | A kind of production method of piezo-electricity composite material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106622924B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107263035B (en) * | 2017-07-12 | 2019-01-15 | 大连理工大学 | A kind of processing method of high flatness ultra-thin metal plates |
| WO2019119316A1 (en) * | 2017-12-20 | 2019-06-27 | 深圳先进技术研究院 | Composite physical focused transducer and manufacturing method therefor |
| CN109939914A (en) * | 2017-12-20 | 2019-06-28 | 深圳先进技术研究院 | A kind of composite material physics focused transducer and its manufacturing method |
| CN108793993B (en) * | 2018-06-01 | 2021-04-23 | 中国科学院深圳先进技术研究院 | Single-phase ceramic target material and preparation method and application thereof |
| TWM585905U (en) * | 2019-08-16 | 2019-11-01 | 詠業科技股份有限公司 | Ultrasonic transducer |
| CN113066925A (en) * | 2021-03-19 | 2021-07-02 | 广州多浦乐电子科技股份有限公司 | Processing method of piezoelectric composite material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0294826A1 (en) * | 1987-06-12 | 1988-12-14 | Fujitsu Limited | Ultrasonic transducer structure |
| CN103041978A (en) * | 2013-01-23 | 2013-04-17 | 中国科学院上海硅酸盐研究所 | Focusing ultrasonic transducer and producing method thereof |
| CN105584192A (en) * | 2014-11-12 | 2016-05-18 | 中国科学院深圳先进技术研究院 | Fixture and method for preparing 1-3-type piezoelectric ceramic/monocrystal ferroelectric composite material |
| CN106058040A (en) * | 2016-07-01 | 2016-10-26 | 河北奥索电子科技有限公司 | Preparation method for piezoelectric composite material |
-
2016
- 2016-12-29 CN CN201611246104.6A patent/CN106622924B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0294826A1 (en) * | 1987-06-12 | 1988-12-14 | Fujitsu Limited | Ultrasonic transducer structure |
| CN103041978A (en) * | 2013-01-23 | 2013-04-17 | 中国科学院上海硅酸盐研究所 | Focusing ultrasonic transducer and producing method thereof |
| CN105584192A (en) * | 2014-11-12 | 2016-05-18 | 中国科学院深圳先进技术研究院 | Fixture and method for preparing 1-3-type piezoelectric ceramic/monocrystal ferroelectric composite material |
| CN106058040A (en) * | 2016-07-01 | 2016-10-26 | 河北奥索电子科技有限公司 | Preparation method for piezoelectric composite material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106622924A (en) | 2017-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106622924B (en) | A kind of production method of piezo-electricity composite material | |
| JP5046311B2 (en) | Composite piezoelectric material, method of manufacturing the composite piezoelectric material, and composite piezoelectric element using the composite piezoelectric material | |
| KR101656722B1 (en) | Acoustic generator | |
| KR101766487B1 (en) | Composite substrate manufacturing method and composite substrate | |
| US10374573B2 (en) | Plate wave devices with wave confinement structures and fabrication methods | |
| JP5665765B2 (en) | Ultrasonic transducer for use in fluid media | |
| CN104393164B (en) | Manufacturing method of 1-1-3 piezoelectric composite material | |
| CN105164919A (en) | Composite substrate for elastic wave element and elastic wave element | |
| CN103703793A (en) | Electromechanical conversion element and manufacturing method therefor | |
| CN110191405B (en) | Double-frequency large-size piezoelectric composite material spherical transducer and preparation method thereof | |
| CN108492815A (en) | Beam-folding phonon crystal with wide cut low bandgap characteristic | |
| CN111403593B (en) | Sensitive element for manufacturing high-frequency broadband high-sensitivity underwater acoustic transducer and preparation method thereof | |
| CN102151150B (en) | Two-dimensional array and three-dimensional imaging transducer and manufacturing method thereof | |
| WO2014210063A1 (en) | Low-profile, low-frequency, and low-impedance broad-band ultrasound transducer and methods thereof | |
| KR20160013518A (en) | Method for manufacturing piezoelectric device, piezoelectric device, and piezoelectric free-standing substrate | |
| WO2021253579A1 (en) | Preparation method for piezoelectric composite material, and application thereof | |
| CN101499512B (en) | Piezoelectric composite material of wide-band transducer | |
| Wang et al. | Ultrasonic transducer array design for medical imaging based on MEMS technologies | |
| CN111403594A (en) | Sensitive element for manufacturing high-sensitivity underwater acoustic transducer and preparation method thereof | |
| US20050174016A1 (en) | Composite piezoelectric body | |
| CN206491817U (en) | Ultrasonic bone density probe and its casting mold are launched/received to a kind of multichannel | |
| JP3302068B2 (en) | Ultrasonic probe for medical ultrasonic diagnostic equipment | |
| CN109742228A (en) | A kind of preparation method of piezo-electricity composite material and driver | |
| CN113066925A (en) | Processing method of piezoelectric composite material | |
| JP2626241B2 (en) | Method for manufacturing composite piezoelectric body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |