CN106605009A - Multiple use cryo cooler in vacuum processing systems - Google Patents
Multiple use cryo cooler in vacuum processing systems Download PDFInfo
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- CN106605009A CN106605009A CN201480081726.0A CN201480081726A CN106605009A CN 106605009 A CN106605009 A CN 106605009A CN 201480081726 A CN201480081726 A CN 201480081726A CN 106605009 A CN106605009 A CN 106605009A
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- China
- Prior art keywords
- chamber
- processing
- active pumping
- pumping surface
- vaccum case
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/06—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
- F04B37/08—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
Abstract
A processing apparatus for processing a substrate is described. The processing apparatus includes a processing chamber for depositing a material on a flexible substrate, a winding chamber for guiding the flexible substrate into and out of the processing chamber, a cryo chiller and a cryo surface connected to the cryo chiller, wherein the cryo surface comprises a first active pumping surface in the processing chamber and a second active pumping surface in the winding chamber. Moreover, the processing chamber and the winding chamber are provided in a vacuum housing, and wherein a roller arrangement for guiding the flexible substrate is insertable in and withdrawable out of the vacuum housing, particularly wherein the roller arrangement provided separates the processing chamber from the winding chamber. Furthermore, the first active pumping surface and the second active pumping surface are connected to the cryo chiller in series.
Description
Technical field
Embodiments of the present invention are related to film processing device, and in particular to depositing system, and relate more specifically to volume
To rolling up (roll-to-roll；R2R) depositing system and its operational approach.Embodiments of the present invention more particularly to volume to volume system
In vacuum system, more particularly relate to the equipment on flexible substrates by film coated, and in depositing device
The method that vacuum system is provided.Exactly, embodiment is related to processing equipment, coating apparatus, and for processing the side of substrate
Method.
Background technology
The process of flexible base board (such as plastic foil or paper tinsel) exist in Packaging Industry, semicon industry and other industry compared with
High demand.Process can be included using material requested (such as metal, specifically aluminum) coating flexible substrate.Perform this task is
System generally comprises the process cylinder (such as cylindrical roller) to transmission base plate for being couple to processing system, the institute on cylinder is processed
At least a portion for stating substrate is processed.The system that volume to volume coating system can provide high yield.
Generally, evaporation technology (such as thermal evaporation process) can be used for deposited metal thin layer, and the thin metal layer can metallize
To on flexible base board.
Due to producing the high cleanliness required for viable commercial part, therefore provide high performance vacuum system.Allusion quotation
Type ground, diffusion pump and mechanical pump are used for emptying system.Due to the requirement of cleannes, subcolling condenser is typically also needed to
(cryogenic chiller).Subcolling condenser is based upon gas with reference to going from processing chamber housing on colder surface
Except the principle of gas.Generally, gas in processing chamber housing is frozen or absorption is on colder surface, and therefore from processing chamber housing
Remaining atmosphere in remove, so as to reduce chamber pressure.Condensation at low temperature is the main mechanism of the operation for being related to subcolling condenser.
In condensation at low temperature, gas molecule is condensed on the cool surface.When colder surface of the molecule by cooler, colder surface drop
Low molecular kinetic energy, now, " sticking coefficient " becomes operable, and molecule can adhere to colder surface.Therefore, molecule is from gas
It is removed in state, and less molecule is retained in atmosphere.Which results in the reduced pressure in chamber.
Therefore, cryogenic system is considerably complicated, and consumes relatively great amount of electric energy to provide high efficient cryogenic system.
In view of the above circumstances, there is provided a kind of processing system is beneficial, and this processing system provides simplified cryogenic system,
And wherein efficient cryogenic system is still provided while consumed electric energy is reduced.
The content of the invention
In view of the above circumstances, there is provided processing equipment as claimed in independent claim 1, coating as claimed in claim 13
Equipment, and the method for being used to process substrate as claimed in claim 14.Further conceive, advantages and features will be from appurtenance
Become apparent in profit requirement, description and accompanying drawing.
According to an embodiment, there is provided a kind of processing equipment.Processing equipment includes：Processing chamber housing, the processing chamber housing
For deposition materials on flexible substrates；Winding chamber, the winding chamber are used to guide flexible base board to enter and leave process
Chamber；Subcolling condenser；And low-temperature surface, the low-temperature surface is connected to subcolling condenser, and wherein low-temperature surface includes position
In the first active pumping surface in processing chamber housing and the second active pumping surface in winding chamber.
According to another embodiment, there is provided a kind of coating apparatus.Coating apparatus include：Coating chamber, the coating chamber
For deposition materials on flexible substrates；Winding chamber, the winding chamber are used to guide flexible base board to enter and leave coating
Chamber；Vaccum case, wherein coating chamber and winding chamber are provided in vaccum case；Subcolling condenser；Low-temperature surface, institute
State low-temperature surface and be connected to subcolling condenser, wherein low-temperature surface includes the first active pumping surface in coating chamber
With the second active pumping surface in winding chamber；Roller arranges that the roller is arranged for guiding flexible base board, its central roll cloth
Can extract out in putting pluggable vaccum case and from vaccum case, specifically, wherein the roller arrangement being provided will be coated with chamber
Room is separated with winding chamber, and its central roll arrangement is arranged on movable support member；And it is arranged on movable support member
On wall, for containing vacuum housing in a vacuum tight manner.
According to further embodiment, there is provided a kind of method for processing substrate.Method includes：Processing chamber housing is emptied
To first pressure, the processing chamber housing is used for deposition materials on flexible substrates；Winding chamber is emptied to into second pressure, it is described
Winding chamber is used to guide flexible base board to enter and leave processing chamber housing, and the second pressure is higher than first pressure；With from low temperature
Cooler to the first active pumping surface in the processing chamber housing provide cooling fluid and from the first active pumping surface to
The second active pumping surface in winding chamber provides cooling fluid.
Description of the drawings
In order to the mode of the features described above of the present invention can be understood in detail, the present invention's for being summarized above is more specific
Description may be referred to embodiment to carry out.Accompanying drawing is related to embodiments of the present invention, and is described below：
Fig. 1 illustrates the schematic diagram of the processing equipment according to embodiment described herein；
Fig. 2 illustrates the profile of the processing equipment in operation according to embodiment described herein；
Fig. 3 is illustrated such as according to embodiment described herein for processing equipment or the evaporation element of coating apparatus；
Fig. 4 illustrates an example of the processing equipment according to embodiment described herein；
Fig. 5 illustrates another example of the processing equipment according to embodiment described herein.
Specific embodiment
With detailed reference to the various embodiments of the present invention, one or more examples of the embodiment are in the accompanying drawings
Illustrate.In the following description to accompanying drawing, identical component symbol refers to identical element.In general, only describe with regard to
The difference of individual embodiments.Each example is to provide by way of explanation of the invention, and is not intended to limit the present invention.Separately
Outward, the feature for illustrating as a part for an embodiment or describing can be used for other embodiment or be combined with them
Another embodiment for producing.It is contemplated that description includes such modifications and variations.
It should be noted that the flexible base board used in embodiment described herein or substrate can be typically featured in that substrate is
It is flexible.Term " substrate " can be with the synonymous use of term " flexible base board ".For example, the flexibility as described in embodiment herein
Substrate can be paper tinsel, film or other flexible base boards.However, as described in greater detail below, the benefit of embodiment described herein is also
The non-flexible substrate or processing equipment of other array deposition (inline-deposition) systems can be supplied to.However, should
Understand, particular benefits can be used for flexible base board and the application for manufacturing device on flexible substrates.
Subcolling condenser is used to improve vacuum technology efficiency.According to embodiment as herein described, there is provided a kind of process sets
It is standby.Processing equipment includes：Processing chamber housing, the processing chamber housing are used for deposition materials on flexible substrates；Winding chamber, the volume
It is used to guide flexible base board to enter and leave processing chamber housing around chamber；Subcolling condenser；And low-temperature surface, the low-temperature surface quilt
It is connected to subcolling condenser, wherein low-temperature surface includes the first active pumping surface in processing chamber housing and is located at coil cavity
The second active pumping surface in room.First active pumping surface and the second active pumping surface are configured to effectively reduce at place
The quantity of the subcolling condenser needed in reason equipment.According to some embodiments, processing chamber housing mentioned in this article can be coating
Chamber.According to some embodiments that can be combined with other embodiment described herein, the first active pumping surface and/or
Two active pumping surfaces additionally or alternatively can be described separately as the first low-temperature surface or the second low-temperature surface.However, root
According to the other adjunctively or alternatively embodiment that can produce other embodiment, active pumping surface or low-temperature surface are by structure
It is the pumping such as vapor in vacuum chamber (such as processing chamber housing and/or winding chamber) to make.For example, vapor can be vacuum
90 moles of % or more of the gas load in chamber and/or vacuum chamber.
According to embodiment described herein, processing chamber housing (being such as coated with chamber) and winding chamber are provided at vaccum case
In, and for guiding the roller of flexible base board arrangement to can be inserted in vaccum case and can extract out from vaccum case, specifically
Say, wherein processing chamber housing is separated by the roller arrangement being provided with winding chamber.Typically, roller arrangement is arranged on removable support
On part.
According to embodiment described herein, the first active pumping surface, the second active pumping surface and subcolling condenser quilt
It is arranged on movable support member, specifically, wherein the first active pumping surface and the second active pumping surface are arranged on
Extend on the region among vaccum case.According to other embodiment described herein, the first active pumping surface and the second master
Dynamic pumping surface can be fixedly installed in vaccum case.First active pumping surface and the second active pumping surface have been placed as
Effect reduces the quantity of the low-temperature cryoprobe for needing in processing and provides a conception to be considered.In addition, first
Active pumping surface and the second active pumping surface are connected in series to subcolling condenser.It is provided in series according to embodiment party described herein
The first active pumping surface and the second active pumping surface of formula, i.e. be connected in series the first active pumping surface and the second master
Dynamic pumping surface, it is allowed to simply use a subcolling condenser in processing.
Another conception of the invention, the first active pumping surface and the second active pumping surface can have different chis
It is very little.Typically, the size of the first active pumping surface in the processing chamber is for example provided, and chamber is being wound more than for example providing
In the second active pumping surface size.In operation, the pressure for needing in processing chamber housing is needed less than winding in chamber
The pressure wanted.The the second active pumping surface that therefore, it can in positioned at coil cavity room provides lower rate of pumping, and this causes
The electricity for consuming in processing is less.Therefore it provides there is smaller size of second active pumping surface to reduce being
The amount of the electric energy needed in system, while still providing effective emptying system in winding chamber neutralisation treatment chamber.
Another conception of the invention, there is provided reduced size of first active pumping surface and second actively pumps table
Face.Effective rate of pumping of subcolling condenser depends on the size of low-temperature surface, but this dependency is relatively low.Therefore,
Allowed using the reduced size of first active pumping surface according to embodiment described herein and the second active pumping surface
Lower cooling power used in subcolling condenser, while effectively pumping speed is still provided in winding chamber and processing chamber housing
Degree and effective emptying system.
Figures 1 and 2 show that the signal of the processing equipment 100 for depositing operation according to embodiment described herein
Figure.Processing equipment 100 includes processing chamber housing 101, winding chamber 102 and vaccum case 110, wherein processing chamber housing and winding chamber
It is provided in vaccum case 110.Typically, vaccum case 110 has section, and the section can for example be substantial rectangular
's.Processing equipment 100 is further comprises for guiding the roller of flexible base board 130 to arrange 120.Roller arrangement 120 can be inserted into vaccum case
Can extract out in 110 and from vaccum case 110, and by processing chamber housing 101 (such as being coated with chamber) and 102 points of chamber of winding
Open.
Typically, roller arrangement 120 is arranged on movable support member 121.According to some embodiments, motor is wound
122 and 123 are arranged on movable support member 121, and are configured to drive roller arrangement 120.In the exemplary implementation, may be used
Moveable support is directed by track 124.Typically, movable support member is further by pushing up from vaccum case 110
Portion extend crossbeam 125 on wheel and be directed.According to the different enforcements that can be combined from other embodiment described herein
Mode, movable support member 121 are moveable relative to housing 110 in one direction.Typically, movable support member
Section of the moving direction perpendicular to housing 110, as shown in the arrow 126 in Fig. 1, i.e. section is as shown in Figure 2.According to some realities
Apply mode, be movable support member 121 provide movement actuator can select from the group being made up of following items：It is electronic
Machine, pneumatic actuator (such as pneumatic linear actuator), Linear actuator and hydraulic actuator (such as hydraulic cylinder).For with vacuum-packed
The wall 127 of mode containing vacuum housing 110 is arranged on movable support member, and processing chamber housing is divided into and extending to by its mesospore 127
In region among vaccum case 110 and the region that is retained in outside vaccum case 110.Typically, wall 127 is located at and housing
In the parallel plane of 110 section (that is, the section shown in Fig. 2).
The embodiment described in Fig. 1 and Fig. 2 include being arranged on below vaccum case 110 for emptying process equipment
100 two diffusion pumps 111 and 112, and it is placed in one group of mechanical pump, 113,114,115 and at 110 back of vaccum case
113a, 114a and 115a.It will be appreciated, however, that according to can combine further with other embodiment described herein
Embodiment, can provide one or more diffusion pumps and one or more mechanical pumps.According to can with it is described herein further
The exemplary embodiment of embodiment combination, diffusion pump 111 and 112 are connected only to processing chamber housing 101 (being for example coated with chamber), together
When mechanical pump 113,114,115 and 113a, 114a, 115a be then configured to for emptying winding chamber 102 and processing chamber housing
101。
According to embodiment described herein, and such as it is more fully described with reference to Fig. 2, Fig. 4 and Fig. 5, processing equipment 100 is also
Include subcolling condenser 240 and be connected to the low-temperature surface of subcolling condenser 240, wherein cooling surface has positioned at processing chamber
The first active pumping surface 241 in room 101 and the second active pumping surface 242 in winding chamber 102.First actively
Pumping surface and the second active pumping surface are configured to the quantity for effectively reducing the subcolling condenser for needing in processing.
Fig. 2 illustrates the profile of processing equipment 100 in operation.Fig. 2 illustrated embodiments are similar to shown in Fig. 1
Embodiment.As shown in Fig. 2 and as mentioned in this article, equipment 100 is volume to volume depositing device, is directed so as to carry
With the flexible base board 130 for processing.However, according to some embodiments that can be combined with other embodiment described herein, this
A little conceptions, details and feature are also applicable in other depositing devices.Can be using various vacuum processing techniques (especially vacuum
Deposition technique) processing substrate or the deposition film on substrate.
Flexible base board 130 leads into processing chamber housing from winding chamber 102 by roller arrangement 120 before substrate 130 is processed
In 101, and lead in winding chamber 102 from processing chamber housing 101 after substrate 130 is processed.Typically, flexible base board
130 are directed to substrate support from the feed rolls 210 being arranged on unwinder 211 by these rollers, as by shown in the first arrow.
Substrate support is configured to for the supporting substrate in process and/or deposition process.As shown in Fig. 2 particularly with reel-to-reel
For formula depositing device, substrate support can be process cylinder 212.From processing at cylinder 212, as by shown in the second arrow, base
Plate 130 is directed into tightens up roller 213 on up- coiler 214.
According to other embodiment, movable support member 121 further comprises partition wall 220, and partition wall is by processing chamber housing
101 (being for example coated with chamber) are separated with winding chamber 102.Typically, when movable support member 121 is inserted into vaccum case 110
When middle, for example, in operation, vaccum case 110 can be divided into relatively large winding chamber 102 and base by partition wall 220
Less processing chamber housing 101 in sheet.Typically, partition wall 220 is configured to provide the essentially rectangular of processing chamber housing 101 and cuts open
Face.Partition wall 220 is in partition wall 220 and processes there is provided at least one gap 221 between cylinder 212 (i.e. substrate support),
Wherein flexible base board 130 is conducted through at least one gap 221 in process and/or deposition process.In order to prevent partition wall
220 partition wall (partition) is exposed to higher in the case of 113,114,115,116 failure of pump or any other interference
Pressure reduction, typically, relief valve 222 is arranged in partition wall 220, and is configured to relatively low to pressure in the case of pressure reduction is too high
Open that side.
Fig. 2 illustrated embodiments include a sedimentary origin being fixedly installed in processing chamber housing 101.It will be appreciated, however, that
According to the further embodiment that can be combined with other embodiment described herein, one or more depositions can be provided
Source.For example, two, three, four or or even more (such as 8,10 or 12) sedimentary origins can be provided.Typically,
Sedimentary origin can be vaporizer, such as chemical vapor deposition (chemical vapor deposition；CVD) source, plasma
Body strengthens chemical vapor deposition (plasma enhanced chemical vapor deposition；PECVD) source, physics gas
(physicalvapor deposition are deposited mutually；PVD) source etc..However, may also comprise other sources of such as sputtering target.
Typically, sedimentary origin includes evaporator unit 230.Therefore, evaporator unit is defined as material from wherein evaporating
Region.For example, evaporator unit can include the ceramic crucible or boat for being suitable to fusion sediment material (for example, metal)
(boat).Crucible can be made up of conductivity ceramics, and by directly make electric current from wherein by and heat.Another option is that sensing
Heating.Another selection is electron beam heating.Therefore, evaporation source is thermal source, and wherein material is evaporated because of heating.Sedimentary origin also includes
Coat window 231.Sedimentary origin is configured to evaporate coating material by coat window 231, and coat window 231 is against process rolling
The dispensing area 232 of the flexible base board 130 on cylinder 212.According to further embodiments, plasma system can be included in process
In chamber.
Fig. 3 illustrates the embodiment of the evaporation element 230 according to embodiment described herein.Evaporation element 230 includes two
Individual evaporation row 301,302.Often row 301,302 includes multiple vaporizers 321,322, and the plurality of vaporizer 321,322 is along line
305 open so that the distance of substantial constant is distanced from one another cross in every row 301 and 302, and line 305 is substantially perpendicular to (such as 85 °
To 95 °) moving direction of substrate 130 and arrange.Substrate not shown here 130.
Evaporation element 230 can include 10 to 20 vaporizers 321 and 322 for being for example arranged to two rows 301 and 302.So
And, it will be appreciated that according to the further embodiment that can be combined with other embodiment described herein, can provide and be more than
The vaporizer of 20.For example, 22,24,26 or or even more (such as 30,32 or 34) vaporizers can be provided.
Typically, row 301 and 302 is displaced relative to each other along line 305, to obtain the friendship of each vaporizer 321 and 322
Wrong arrangement.Additionally, when being observed along line 305, the vaporizer 321 and 322 of corresponding line 301 and 302 can partly each other
Overlap, line 305 is, for example, parallel to the rotation axiss for processing cylinder 212 (i.e. substrate support).
Evaporation element 230 is formed in herein by heated crucible, heated crucibles deposition material to be melted
Material.According to further embodiments, each vaporizer 321 and 322 (for example, each crucible) also can be delivered to melt gold with metal wire
Category.According to the embodiment that can be combined with other embodiment described herein, each 321,322 (for example, each earthenware of vaporizer
Crucible) section be circular.
Processing equipment 100 further comprises subcolling condenser 240 and be connected to the low-temperature surface of subcolling condenser 240, wherein
Low-temperature surface includes the first active pumping surface 241 in processing chamber housing 101 and the second master in winding chamber 102
Dynamic pumping surface 242.Typically, subcolling condenser is arranged on outside vaccum case 110.According to exemplary embodiment, the first master
Dynamic pumping surface 241 and the second active pumping surface 242 are rectangles.
According to embodiment described herein, it is explained in greater detail in such as Fig. 4, the first active pumping surface, the second active pump
Surface and subcolling condenser is sent to be arranged on movable support member, specifically, wherein the first active pumping surface and the second master
Dynamic pumping surface is arranged on the region extended among vaccum case.According to other embodiment described herein, in such as Fig. 5 more
Explained in detail, the first active pumping surface and the second active pumping surface can be fixedly installed in vaccum case.
Fig. 4 illustrates the schematic section of the movable support member of the processing equipment 100 according to embodiment described herein.Fig. 4
Shown in embodiment similar to the embodiment shown in Fig. 1 and Fig. 2.In this figure, diffusion pump 111,112 is not showed that
With mechanical pump 113,114,115 and 113a, 114a, 115a.First active pumping surface 241,242 and of the second active pumping surface
Subcolling condenser 240 is arranged on movable support member 121.First active pumping surface 241 and the second active pumping surface 242
It is arranged on the region for extending among vaccum case 110.According to embodiment described herein, the first active pumping surface 241
Partition wall 220 is attached to the second active pumping surface 242.Typically, the first active pumping surface 241 and the second active pump
The surface on surface 242 is sent to be arranged essentially parallel to partition wall 220.According to other embodiment described herein, first actively pumps table
Face 241 and the second active pumping surface 242 are attached to the wall 127 for containing vacuum housing in a vacuum tight manner.
First active pumping surface 241 and the second active pumping surface 242 are connected in series to subcolling condenser 240.First
Active pumping surface 241 and the second active pumping surface 242 are configured to from low temperature cold with being connected in series for subcolling condenser 240
But device 240 provides cooling fluid to the first active pumping surface 241 in processing chamber housing 101 and actively pumps from first
Surface 241 provides cooling fluid to the second active pumping surface 242 in winding chamber 102.Typically, the first active pump
241 to the second active pumping surface 242 of surface is sent closer to the coolant outlet of subcolling condenser 240.First active pumping surface
With the placement location of the second active pumping surface be configured to together with the first active pumping surface and the second active pumping surface with
Subcolling condenser is connected in series the reduction for providing the subcolling condenser needed for processing equipment 100 together for subcolling condenser.
Therefore, a subcolling condenser is only needed in processing, this simplifies system and cost, while still providing efficient
Emptying system.
Another conception of the invention, the first active pumping surface and the second active pumping surface can have different chis
It is very little.Typically, size of the size of the first active pumping surface 241 more than the second active pumping surface 242.In operating process
In, the pressure needed in processing chamber housing is less than the pressure needed in winding chamber.Therefore, it can in the in the coil cavity room
Lower rate of pumping is provided in two active pumping surfaces, the electricity for consuming in processing is which results in less.Therefore it provides
The amount of the electric energy needed in system is reduced with smaller size of second active pumping surface, while still in winding chamber
With in processing chamber housing provide effective emptying system.
Another conception of the invention, there is provided reduced size of first active pumping surface 241 and second is actively pumped
Surface 242.Effective rate of pumping in chamber depends on low-temperature surface size, but this dependency is relatively small.Therefore, make
Allowed low with the reduced size of first active pumping surface according to embodiment described herein and the second active pumping surface
Lower cooling power used in warm cooler, while effectively pumping speed is still provided in winding chamber neutralisation treatment chamber
Degree and effective emptying system.
According to the exemplary embodiment that can be combined with other embodiment described herein, in processing chamber housing 101
The size of the first active pumping surface 241 can be 1.3m2To 2.5m2, such as about 1.7m2；And in winding chamber 102
The size of the second active pumping surface 242 can be 0.8m2To 1.8m2, such as about 1.3m2.In view of being connected in series and second chamber
Demand in (that is, winding chamber) to reduction pressure, when using with for 2m2Cooling power subcolling condenser 240 when,
Even 3m2Aggregate surface be also possible.According to embodiment described herein, the active pumping table of subcolling condenser is connected to
The area sum in face is likely larger than the specified area of subcolling condenser.Certainly, it is possible to use larger subcolling condenser (for example, is used
In above example, with for 3m2Cooling power subcolling condenser).
Although as shown in figure 4, in processing equipment 100, the first active pumping surface 241, the second active pumping surface 242
It is arranged on movable support member with subcolling condenser 240, but the invention is not restricted to so.First active pumping surface
241 and second active pumping surface 242 can also be fixedly installed in vaccum case 110, be such as more fully described with reference to Fig. 5
's.
Fig. 5 illustrates another example of the processing equipment 100 according to some embodiments.Specifically, Fig. 5 is illustrated according to this
The schematic section of the vaccum case 110 of the processing equipment 100 of the text embodiment.In this figure, diffusion pump is not showed that
111st, 112 and mechanical pump 113,114,115 and 113a, 114a, 115a.Shown in Fig. 5, embodiment is similar in Fig. 1 and Fig. 2
Illustrated embodiment.The first active pumping surface 241 and the second active pumping surface 242 of processing equipment 100 is fixedly installed
In vaccum case 110.Typically, the first active pumping surface 241 and the second active pumping surface 242 are attached to very respectively
Side the wall 110a and 110b of empty capsid 110.According to exemplary embodiment, subcolling condenser 240 also consolidated by relative vacuum housing 110
It is fixed to arrange.
First active pumping surface 241 and the second active pumping surface 242 are also connected in series to subcolling condenser 240.Cause
This, also with regard to this embodiment, can provide emptying system, wherein a subcolling condenser 240 is only needed, while still
Effective emptying system is provided in winding chamber neutralisation treatment chamber.
Typically, control panel and control watch-dog can be provided.According to exemplary embodiment, control panel and control prison
Control device is arranged on outside vaccum case.
According to some embodiments, deposition materials can be carried out according to depositing operation and to the subsequent applications of coated substrates
Select.For example, the deposition materials in source can be from the group of following material composition to select material：Aluminum, molybdenum, titanium, silver, copper etc.
Metal, silicon, tin indium oxide, ZnS, and other such as SiO2, aluminium oxide Al2O3Deng transparent conductive oxide.
Although the above is directed to embodiments of the present invention, can be in the situation of the elemental range without departing from the present invention
Under, other and the further embodiment of the design present invention, and protection scope of the present invention determined by following claims.
Claims (15)
1. a kind of processing equipment, including：
Processing chamber housing, for processing flexible base board；
Winding chamber, for guiding the flexible base board to enter or leaving the processing chamber housing；
Subcolling condenser；With
Low-temperature surface, is connected with the subcolling condenser, wherein the low-temperature surface includes in the processing chamber housing
One active pumping surface and the second active pumping surface in the winding chamber.
2. processing equipment as claimed in claim 1, wherein the processing chamber housing and the winding chamber are provided at vacuum shell
In body, and wherein be used for guide the flexible base board roller arrange can be inserted into the vaccum case in and can be from the vacuum
Extract out in housing, specifically, wherein the processing chamber housing is separated by the roller arrangement being provided with the winding chamber.
3. processing equipment as claimed in claim 1 or 2, wherein the first active pumping surface and described second is actively pumped
Surface is connected in series to the subcolling condenser, and wherein described first active pumping surface actively pumps table than described second
Coolant outlet of the face closer to the subcolling condenser.
4. processing equipment as claimed in claim 2 or claim 3, wherein roller arrangement is arranged on movable support member.
5. processing equipment as claimed in claim 4, wherein the wall for closing the vaccum case in a vacuum tight manner
It is arranged on the movable support member.
6. processing equipment as claimed in claim 5, wherein the processing equipment is divided into by the wall extends to the vacuum
Region and the region being retained in outside the vaccum case among housing.
7. the processing equipment as described in any one of claim 2～6, wherein the subcolling condenser is arranged on the vaccum case
Outward.
8. the processing equipment as described in any one of claim 1～7, wherein the first active pumping surface and second master
Dynamic pumping surface has different size.
9. the processing equipment as described in any one of claim 4～8, wherein the movable support member includes at least one separation
The processing chamber housing is separated by wall, the partition wall with the winding chamber.
10. processing equipment as claimed in claim 9, wherein at least one partition wall the partition wall with process cylinder
Between at least one gap is provided.
11. processing equipments as described in any one of claim 4～10, wherein the first active pumping surface, described second
Active pumping surface and the subcolling condenser are arranged on the movable support member, specifically, wherein first He
Second active pumping surface is arranged on the region extended among the vaccum case.
12. processing equipments as described in any one of claim 2～10, wherein the first active pumping surface and described second
Active pumping surface is fixedly installed in the vaccum case.
A kind of 13. coating apparatus, including：
Coating chamber, for deposition materials on flexible substrates；
Winding chamber, for guiding the flexible base board to enter or leaving the coating chamber；
Vaccum case, wherein the coating chamber and the winding chamber are provided in the vaccum case；
Subcolling condenser；
Low-temperature surface, is connected with the subcolling condenser, wherein the low-temperature surface includes the in the coating chamber
One active pumping surface and the second active pumping surface in the winding chamber；
Roller arrange, for guiding the flexible base board, wherein the roller arrangement can be inserted into the vaccum case in and can be from institute
Extract out in stating vaccum case, specifically, wherein the roller arrangement being provided is coated with chamber and the winding chamber by described
Separate, and wherein described roller arrangement is arranged on movable support member；And
The wall being arranged on the movable support member, for closing the vaccum case in a vacuum tight manner.
A kind of 14. methods for processing substrate, including：
Processing chamber housing is emptied to into first pressure, the processing chamber housing is used for deposition materials on flexible substrates；
Winding chamber is emptied to into second pressure, the winding chamber is used to guide the flexible base board to pass in and out the processing chamber
Room, the second pressure are higher than the first pressure；And
Actively pump from subcolling condenser to the first active pumping surface in the processing chamber housing and from described first
Surface provides cooling fluid to the second active pumping surface in the winding chamber.
15. methods as claimed in claim 14, further include：
The mobile movable support member in vaccum case；
The processing chamber housing is separated with the winding chamber by partition wall, wherein the partition wall is included in described may move
On support member；And
The processing chamber housing and the winding chamber are exhausted, and the movable support member is removed into the vacuum shell
Body.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2014/068978 WO2016034250A1 (en) | 2014-09-05 | 2014-09-05 | Multiple use cryo cooler in vacuum processing systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106605009A true CN106605009A (en) | 2017-04-26 |
Family
ID=51535423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480081726.0A Pending CN106605009A (en) | 2014-09-05 | 2014-09-05 | Multiple use cryo cooler in vacuum processing systems |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106605009A (en) |
| WO (1) | WO2016034250A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3338063A (en) * | 1966-01-17 | 1967-08-29 | 500 Inc | Cryopanels for cryopumps and cryopumps incorporating them |
| CN1842614A (en) * | 2004-05-25 | 2006-10-04 | 应用薄膜有限责任与两合公司 | Strip processing device |
| CN201215426Y (en) * | 2008-05-13 | 2009-04-01 | 博源科技材料（烟台）有限公司 | Refrigerating system for coiling chamber of vacuum aluminum plating machine |
| WO2011046050A1 (en) * | 2009-10-16 | 2011-04-21 | 東洋紡績株式会社 | Manufacturing device and manufacturing method for transparent conductive film |
-
2014
- 2014-09-05 CN CN201480081726.0A patent/CN106605009A/en active Pending
- 2014-09-05 WO PCT/EP2014/068978 patent/WO2016034250A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3338063A (en) * | 1966-01-17 | 1967-08-29 | 500 Inc | Cryopanels for cryopumps and cryopumps incorporating them |
| CN1842614A (en) * | 2004-05-25 | 2006-10-04 | 应用薄膜有限责任与两合公司 | Strip processing device |
| CN201215426Y (en) * | 2008-05-13 | 2009-04-01 | 博源科技材料（烟台）有限公司 | Refrigerating system for coiling chamber of vacuum aluminum plating machine |
| WO2011046050A1 (en) * | 2009-10-16 | 2011-04-21 | 東洋紡績株式会社 | Manufacturing device and manufacturing method for transparent conductive film |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016034250A1 (en) | 2016-03-10 |
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