CN106601896B - 量子点封装结构及其制备方法、以及玻璃量子点扩散板 - Google Patents
量子点封装结构及其制备方法、以及玻璃量子点扩散板 Download PDFInfo
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- CN106601896B CN106601896B CN201611198096.2A CN201611198096A CN106601896B CN 106601896 B CN106601896 B CN 106601896B CN 201611198096 A CN201611198096 A CN 201611198096A CN 106601896 B CN106601896 B CN 106601896B
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- 238000000034 method Methods 0.000 claims description 24
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- 239000010410 layer Substances 0.000 description 214
- 230000000694 effects Effects 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 27
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 23
- 239000001301 oxygen Substances 0.000 description 23
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- 239000005020 polyethylene terephthalate Substances 0.000 description 20
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- 239000012528 membrane Substances 0.000 description 14
- 238000002844 melting Methods 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- 239000000843 powder Substances 0.000 description 11
- 238000005286 illumination Methods 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
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- 238000001764 infiltration Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- -1 Polyethylene Terephthalate Polymers 0.000 description 4
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- 230000002411 adverse Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 235000013399 edible fruits Nutrition 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000009738 saturating Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 229920002521 macromolecule Polymers 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910002971 CaTiO3 Inorganic materials 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 2
- 229910000673 Indium arsenide Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
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- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
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- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Natural products CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000005909 ethyl alcohol group Chemical group 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- 230000005476 size effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201611198096.2A CN106601896B (zh) | 2016-12-22 | 2016-12-22 | 量子点封装结构及其制备方法、以及玻璃量子点扩散板 |
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CN201611198096.2A CN106601896B (zh) | 2016-12-22 | 2016-12-22 | 量子点封装结构及其制备方法、以及玻璃量子点扩散板 |
Publications (2)
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CN106601896A CN106601896A (zh) | 2017-04-26 |
CN106601896B true CN106601896B (zh) | 2019-06-11 |
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CN110126257B (zh) * | 2019-05-15 | 2020-09-22 | 北京理工大学 | 一种强度可控半导体纳米晶柔性光电器件的3d打印方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US9159886B2 (en) * | 2011-04-19 | 2015-10-13 | Intellectual Discovery Co., Ltd. | Lighting apparatus with a carrier layer |
CN105470374A (zh) * | 2014-09-05 | 2016-04-06 | 鸿富锦精密工业(深圳)有限公司 | 量子点封装结构及其制备方法 |
CN104728779B (zh) * | 2015-04-21 | 2018-01-12 | 张家港康得新光电材料有限公司 | 发光膜层结构及背光模组 |
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Address after: 517000 No. 1 and No. 2 Xuanlang Industrial Park, Henan Road, Baipu, Linjiang Town, Jiangdong New Area, Heyuan City, Guangdong Province Patentee after: GUANGDONG XUAN LANG INDUSTRIAL Co.,Ltd. Address before: 523000 Building A, 352 Xiangyang Road, Shigu Management Zone, Tangxia Town, Dongguan City, Guangdong Province Patentee before: GUANGDONG XUAN LANG INDUSTRIAL Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Quantum dot packaging structure and preparation method, as well as glass quantum dot diffusion plate Effective date of registration: 20231027 Granted publication date: 20190611 Pledgee: Bank of China Limited by Share Ltd. Heyuan branch Pledgor: GUANGDONG XUAN LANG INDUSTRIAL Co.,Ltd. Registration number: Y2023980062963 |