CN106599980A - Radio IC device - Google Patents
Radio IC device Download PDFInfo
- Publication number
- CN106599980A CN106599980A CN201710080855.3A CN201710080855A CN106599980A CN 106599980 A CN106599980 A CN 106599980A CN 201710080855 A CN201710080855 A CN 201710080855A CN 106599980 A CN106599980 A CN 106599980A
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- Prior art keywords
- wireless
- power supply
- supply circuits
- substrate
- chip
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- 239000000758 substrate Substances 0.000 claims description 208
- 239000000463 material Substances 0.000 claims description 73
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- 230000008878 coupling Effects 0.000 claims description 57
- 230000033228 biological regulation Effects 0.000 claims description 34
- 230000005611 electricity Effects 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 230000001939 inductive effect Effects 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 abstract description 15
- 238000005096 rolling process Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 description 33
- 239000000919 ceramic Substances 0.000 description 21
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- 230000008901 benefit Effects 0.000 description 4
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- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
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- 230000003321 amplification Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
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- 230000009977 dual effect Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
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- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/22—Capacitive coupling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/77—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for interrogation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Details Of Aerials (AREA)
Abstract
A wireless IC device and a component for a wireless IC device having a stable frequency characteristic are provided. The wireless IC device includes a wireless IC chip (5), a power feeding circuit (16), where the power feeding circuit (16) includes a resonance circuit having a predetermined resonance frequency, and a radiating plate (20) bonded to a lower surface of the power feeding circuit board (10). The radiating plate (20) radiates a transmission signal supplied from the power feeding circuit (16). The radiating plate (20) further receives and propagates a reception signal to the power feeding circuit (16). The power feeding circuit has an inductance element composed of a coil-shaped electrode pattern. The rolling axis of the coil-shaped electrode pattern is formed in a direction vertical to the radiating plate. The power feeding circuit is magnetically coupled with the radiating plate.
Description
It is on January 12nd, 2007, Application No. " 200780001074.5 (PCT/JP2007/ the applying date that the application is
050308) ", the division Shen of the application for a patent for invention of entitled " Wireless IC device and radio IC device part "
Please.
Technical field
The present invention relates to power supply circuits, can more particularly to be suitably mounted in and be used in RFID (Radio
Frequency Identification, RF identification) system Wireless IC device on power supply circuits.
Background technology
In recent years, as the management system of article, investigated makes the read write line of generation induction field and is attached to article
On the IC tag (hereinafter referred to as Wireless IC device) of information of the regulation that is stored with communicated in a non contact fashion, so as to carry out
The RFID system of information transmission.As the Wireless IC device for being used in RFID system, it is known to described in such as patent document 1,2
Device.
I.e., as shown in figure 59, there is provided antenna pattern 301 is set on plastic sheeting 300, and in the antenna pattern 301
The device of wireless IC chip 310 is installed, as shown in figure 60, there is provided the He of antenna pattern 321 is set on plastic sheeting 320 on one end
The electrode 322 of radiation, and the device of wireless IC chip 310 is installed in the assigned position of antenna pattern 321.
But, because wireless IC chip 310 is connected with existing wireless IC with antenna pattern 301,321 with au bump
Wireless IC chip 310 is carried in device, it is therefore necessary to by small wireless IC chip 310 be positioned at large-area film 300,
On 320.But, it is extremely difficult to install small wireless IC chip 310 on large-area film 300,320, if installed
When produce position deviation, then there is the problem that the resonant frequency characteristic of antenna changes.And, the resonant frequency characteristic of antenna
Also can roll because of antenna pattern 301,321 or be clipped (for example, be clipped in the middle of books) and changed by dielectric.
Patent document 1：JP 2005-136528 publication
Patent document 2：JP 2005-244778 publication
The content of the invention
Therefore, it is an object of the present invention to provide the Wireless IC device with stable frequency characteristic and can be adapted to
Be used in the part of the Wireless IC device.
In order to realize the purpose of the present invention, the Wireless IC device of the 1st invention has following feature, i.e. possess：Wireless IC core
Piece；It is connected, is provided with the power supply of the power supply circuits of the resonance circuit comprising the resonant frequency with regulation with the wireless IC chip
Circuit substrate；And paste or transmit letter from what the power supply circuits were provided near configuring the power supply circuits substrate and giving off
Number and/or receive collection of letters signal and be supplied to the radiant panel of the power supply circuits.
In the Wireless IC device of the 1st invention, or wireless IC chip is arranged side-by-side in cloth with power supply circuits substrate
On line substrate, while by the conductor connection being arranged on the circuit board.
The Wireless IC device of the 2nd invention has following feature, i.e. possess：Wireless IC chip；Carry the wireless IC chip,
And be provided with comprising have regulation resonant frequency resonance circuit power supply circuits power supply circuits substrate；And paste or lean on
Closely configure the power supply circuits substrate and the sending signal provided from the power supply circuits is provided and/or collection of letters signal is received
It is supplied to the radiant panel of the power supply circuits.
In the Wireless IC device of the 1st and the 2nd invention, the frequency of the letter signal that radiant panel gives off and nothing is supplied to
The frequency of the collection of letters signal of line IC chip is substantially what is determined by the resonant frequency of the resonance circuit of power supply circuits substrate.It is so-called
Substantially determine, refer to the position relationship etc. due to power supply circuits substrate and radiant panel, frequency occurs a small amount of skew.Namely
Say, because what the frequency that letter signal is received in power supply circuits substrate was to determine, the shape and size, position with radiant panel
Configuration etc. is unrelated, even if for example clipping by Wireless IC device winding or with dielectric, frequency characteristic also will not change such that it is able to
Obtain stable frequency characteristic.
In the Wireless IC device of the 2nd invention, wireless IC chip carrying on power supply circuits substrate, by the power supply circuits
Substrate is arranged on radiant panel.Power supply circuits substrate is fairly small with radiant panel phase specific area, therefore, it is possible to be incited somebody to action with high precision
Wireless IC chip carrying is on power supply circuits substrate.
In the Wireless IC device of the 1st and the 2nd invention, it is also possible to which radiant panel is configured at into the positive and negative of power supply circuits substrate
On.By clipping power supply circuits substrate with two pieces of radiant panels, the energy given off from power supply circuits is set to be delivered separately to just
Face and the radiant panel of reverse side, so as to gain is improved.
Above-mentioned resonance circuit can also be distributed constant type resonance circuit, or can also be by capacitance pattern and inductance figure
The lumped constant type resonance circuit that case is constituted.Distributed constant type resonance circuit strip line etc. forms inductance, especially when transmitting-receiving letter
When signal is in the high frequency band of more than 5GHz, the design of resonance circuit is easy to, therefore is useful.
Lumped constant type resonance circuit can also be LC series resonant circuits or LC antiresonant circuits, or can also be shape
Into the structure comprising multiple LC series resonant circuits or multiple LC antiresonant circuits.If using can with capacitance pattern with electricity
Sense pattern forms the composition of the lumped constant type resonance circuit of resonance circuit, then especially when receipts letter signal is in the low of below 5GHz
When in frequency band, resonance circuit can be easily designed, and be not susceptible to the impact from other elements such as radiant panels.And such as
Fruit constitutes resonance circuit with multiple resonance circuits, then by the coupling of each resonance circuit, letter signal can be made broadband.
Also, the capacitance pattern is the rear class of the wireless IC chip, if be configured at wireless IC chip with it is described
Between inductive patterns, then the performance of tolerance surge (surge) can be improved.Because surge is the low-frequency current of below 200MHz,
Therefore can be blocked using capacitor, and be prevented from wireless IC chip and be destroyed by surge.
Also, the capacitance pattern and the inductive patterns can also be made abreast to configure relative to radiant panel.Configure
The capacitance pattern and the inductive patterns so that they are not arranged in a straight line relative to radiant panel, and cause by
The electric field produced in capacitance pattern, the magnetic field produced due to inductive patterns directly act on respectively radiant panel, by this
Sample, the magnetic field formed using inductive patterns will not be covered by capacitance pattern, and can improve the spoke from inductive patterns radiation
Penetrate efficiency.And reflector and/or director can also be configured in the part that magnetic field is formed by inductive patterns.So can be easy
Ground adjustment radiation characteristic and directive property of the power supply circuits to radiant panel, and can strongly discharge the shadow from outside electromagnetic field
Ring, to seek the stabilisation of resonance characteristic.
The power supply circuits substrate can also be laminated multi-layer dielectric layer or magnetic layer and the multilager base plate that formed,
In this case, capacitor pattern and inductive patterns are formed at the surface and/or inside of multilager base plate.By using multilager base plate structure
Into resonance circuit, not only substrate surface but also inside can also form the element (electrode pattern etc.) for constituting resonance circuit, and energy
Enough seek the miniaturization of substrate.And can seek to improve the configuration free degree of resonant circuit components, realize resonance circuit
High performance.Multilager base plate can also be the multi-layer resinous substrate for being laminated multiple resin beds and being formed, or be laminated multiple potteries
Enamel coating and the ceramic multi-layer baseplate that formed.Form the thin-film multilayer substrate of technology again, or using film.When being that ceramics are more
In the case of laminar substrate, what ceramic layer was preferably formed with low-temperature sintered ceramics material.Because can by the low silver of resistance value and
Copper is used as resonance circuit component.
On the other hand, the power supply circuits substrate can also be the single layer substrate of dielectric or magnetic, in such case
Under, capacitance pattern and/or inductive patterns are formed at the surface of single layer substrate.The material of single layer substrate can be that resin can also be
Ceramics.Due to capacitance obtained from capacitance pattern can also single layer substrate positive and negative formed flat shape electrode it
Between formed, or between the electrode that can also be arranged side-by-side on single layer substrate face formed.
Power supply circuits substrate is preferably rigid substrates.If substrate is rigid substrates, no matter Wireless IC device is pasted
On the object of what shape, the frequency of letter signal is all stable.And, wireless IC chip can stably be mounted in just
On property substrate.Relative to this point, what radiant panel was preferably formed with flexible metal film.If radiant panel is flexible, can
Wireless IC device is pasted onto on the object of any shape.
And, if flexible metal film is held on flexible resin film, the process of Wireless IC device itself becomes easy.
Especially, if covering wireless IC chip, power supply circuits substrate and whole radiant panel with film, can protect it from outer
The impact of portion's environment.
But, the electrical length of radiant panel is preferably the integral multiple of the half-wavelength of resonant frequency, and such gain can reach
It is maximum.But, because frequency is substantially what is determined by resonance circuit, therefore the length of radiant panel is not necessarily resonant frequency
Half-wavelength integral multiple.This point has very much compared with radiant panel is the antenna element with particular resonant frequency
Profit.
Also, wireless IC chip can adopt various forms with the connection of power supply circuits substrate.For example can be in nothing
Chip side electrode pattern is set in line IC chip, while the 1st substrate-side electrode pattern is set on power supply circuits substrate, so that
Chip side electrode pattern carries out DC and is connected with the 1st substrate-side electrode pattern.In such a case, it is possible to scolding tin, electric conductivity tree
Fat, au bump etc. are attached.
Or, it is also possible to using Capacitance Coupled or magnetic coupling connection chip side electrode pattern and the 1st substrate-side electrode pattern
Between.If the connection carried out using Capacitance Coupled or magnetic coupling, then scolding tin or electroconductive resin are required for, as long as making
Pasted with the bonding agent of resin etc..In this case, it is not necessary in the surface of wireless IC chip, the table of power supply circuits substrate
Face forms chip side electrode pattern and the 1st substrate-side electrode pattern.For example can also be formed on the surface of chip side electrode pattern
Resin film, or the 1st substrate-side electrode pattern is formed at into the internal layer of multilager base plate.
In the case where Capacitance Coupled is carried out, the area of the 1st substrate-side electrode pattern is most like chip side electrode pattern
Area is big.Even if positional precision during by wireless IC chip carrying on power supply circuits substrate have some deviations, but two
The capacitance deviation formed between electrode pattern also can be relaxed.And, although formed in less wireless IC chip
Large-area electrode pattern is difficult, but because power supply circuits substrate is than larger, so for the large-area electrode of formation
Pattern does not have any obstacle.
In the case where being magnetically coupled, compared with Capacitance Coupled, because electric in power supply for by wireless IC chip carrying
The carrying required precision of base board is less high, therefore is more prone to be carried.And, chip side electrode pattern and the 1st base
Plate lateral electrode pattern is preferably respectively coiled type pattern.If the line of spiral (spiral) or helical form (helical) etc.
Round electrode pattern, then designing easily is carried out.If frequency is uprised, using crawling, (ミ ア Application ダ) is effective.
On the other hand, power supply circuits substrate can also adopt various forms with the connection of radiant panel.For example, can be in power supply
2nd substrate-side electrode pattern is set on circuit substrate, is connected so as to carry out DC to the 2nd substrate-side electrode pattern and radiant panel.
In such a case, it is possible to be attached with scolding tin, electroconductive resin, au bump etc..
Or, can also be attached using Capacitance Coupled or magnetic coupling between the 2nd substrate-side electrode pattern and radiant panel.
If the connection carried out using Capacitance Coupled or magnetic coupling, then scolding tin or electroconductive resin are required for, only need to be with using
The bonding agent of resin etc. is pasted.In this case, the 2nd substrate-side electrode pattern is not necessarily forming in power supply circuits base
Plate surface.For example, the 2nd substrate-side electrode pattern can also be formed at the internal layer of multilager base plate.
In the case where being magnetically coupled, the 2nd substrate-side electrode pattern is preferably coiled type electrode pattern.Due to spiral
(spiral) or the coiled type electrode pattern of helical form (helical) etc. is easily controlled magnetic flux, so being easily designed.If
Frequency is uprised, then can also adopt and crawl (ミ ア Application ダ).Further, in the case where being magnetically coupled, it is preferably capable of making by
The change of the magnetic flux produced by 2 substrate-side electrode patterns (coiled type electrode pattern) is hindered, for example, be preferably in radiant panel
Upper formation opening portion.By means of this, it is possible to increase the transmission efficiency of signal energy, while can reduce due to power supply circuits substrate
The frequency shift (FS) caused with fitting for radiant panel.
In the case where the 2nd substrate-side electrode pattern is coiled type electrode pattern, the 2nd substrate-side electrode figure can be formed
Case is so that its wireline reel is parallel to radiant panel or vertical with radial shield.In the latter case, it is preferably formed as coiled type electrode figure
Case is so that its winding width slowly becomes big towards radiant panel direction.
In the Wireless IC device of the 1st and the 2nd invention, if radiant panel is adopted had：Receipts letter signal is carried out with outside
Exchange Department of Radiation and with power supply circuits (resonance circuit) carry out receive letter signal the power supply for exchanging two sides (two ends)
Style of opening, then can improve antenna gain, even less power supply circuits pattern can also obtain enough using Department of Radiation
Gain, Wireless IC device can be operated in the case where having enough distances with read write line, even and UHF band
Frequency band above also can make full use of.And can substantially determine resonant frequency, the shape of Department of Radiation with power supply circuits pattern
Can freely set, the adjust gains such as the size of Department of Radiation can be utilized, and can be with the adjustment such as shape of Department of Radiation center frequency
Rate.
Also, at least a portion of the power supply of configuration Department of Radiation is located in the perspective plane of power supply circuits pattern with the part,
And the area of power supply can be less than the area on the perspective plane of power supply circuits pattern.Here, so-called perspective plane means with confession
The face that the trim line of electric circuit pattern is surrounded, the area of so-called power supply means the area of the metal part of radiant panel.
In the case that the power supply of radiant panel is coupled with power supply circuits pattern by magnetic field, if the area of power supply is than power supply electricity
The area on the perspective plane of road pattern is little, then because the part for hindering the magnetic flux of power supply circuits pattern diminishes, therefore, it is possible to improve letter
Number transmission efficiency.
Also, the power supply can be formed as example linear, the electricity so that length spans on its length direction are powered
The perspective plane of road pattern.And, the Department of Radiation of radiant panel can be respectively arranged at two sides of power supply, or can also only set
It is placed in a side of power supply.If Department of Radiation is arranged at two sides of power supply, the Capacitance Coupled with power supply circuits pattern
Property become strong.It is just strong with the magnetic coupling of power supply circuits pattern if Department of Radiation is only arranged at a side of power supply, and gain
Become big.
Furthermore, it is also possible to form multiple power supply circuits patterns on power supply circuits substrate, in which case it is convenient to by spoke
The power supply for penetrating portion is configured on the position between each perspective plane of multiple power supply circuits patterns.Power supply can also be formed as
For example it is linear, so that between each perspective plane of the multiple power supply circuits patterns of length spans on its length direction.If power supply
Portion is configured between multiple power supply circuits patterns, then the power supply quantitative change between power supply and power supply circuits pattern is big.
Also, radiant panel can also be formed in x-y plane, and with the upwardly extending radiation in x-axis direction and y-axis side
Portion.Can reception of circular polarized, to improve the gain of antenna.On the other hand, it is also possible in y-x-z spaces, with x-axis side
Upwards, on y-axis direction, the upwardly extending Department of Radiation in z-axis side.If Department of Radiation dimensionally extends, can in either direction
It is enough expeditiously to carry out transmitting-receiving letter.
Also, the Department of Radiation of radiant panel can be vertical in the formation face relative to power supply circuits pattern side upwardly extend.
Power supply can be set in the face of the Department of Radiation in the front end of the Department of Radiation of needle-like, the power supply and power supply circuit
Case is connected by electric field or magnetic field.Wireless IC device can be installed on into article in the form of the Department of Radiation of needle-like insertion article
In.
Also, power supply and power supply circuits pattern can also be covered with magnetic.The Vent leakages of electromagnetic energy are so prevented from,
The degree of coupling of power supply and power supply circuits pattern can be strengthened, and antenna gain can be improved.
The radio IC device part of the 3rd invention has following feature, i.e. possess：Wireless IC chip；And it is wireless with this
IC chip connects and is provided with the power supply circuits substrate of the power supply circuits comprising the resonance circuit with the resonant frequency for specifying.
The radio IC device part of the 4th invention has following feature, i.e. possess：Wireless IC chip；And carry the nothing
Line IC chip and be provided with comprising have regulation resonant frequency resonance circuit power supply circuits power supply circuits substrate.
If using the 1st and the 2nd invention, can with high precision by wireless IC chip carrying in circuit board or confession
On electric circuit substrate, and because the frequency of letter signal and collection of letters signal is by the power supply circuits for being arranged at power supply circuits substrate
Determined, even therefore Wireless IC device is wound, or clipped with dielectric, frequency characteristic also will not change, so as to
Access stable frequency characteristic.
If using the 3rd and the 4th invention, can rightly constitute the Wireless IC device of the 1st and the 2nd invention.
Description of the drawings
Fig. 1 is the stereogram of the 1st embodiment of the Wireless IC device for representing the present invention.
Fig. 2 is the profile of above-mentioned 1st embodiment.
Fig. 3 is the equivalent circuit diagram of above-mentioned 1st embodiment.
Fig. 4 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 1st embodiment.
Fig. 5 (A), (B) are the stereograms of the connection form for representing wireless IC chip and power supply circuits substrate.
Fig. 6 is the stereogram of the variation 1 for representing radiant panel.
Fig. 7 is the stereogram of the variation 2 for representing radiant panel.
Fig. 8 is the top view of the 2nd embodiment of the Wireless IC device for representing the present invention.
Fig. 9 represents the 3rd embodiment of the Wireless IC device of the present invention, (A) is the top view of deployed condition, is (B) to use
When stereogram.
Figure 10 is the stereogram of the 4th embodiment of the Wireless IC device for representing the present invention.
Figure 11 is the stereogram of the 5th embodiment of the Wireless IC device for representing the present invention.
Figure 12 is the profile of the 6th embodiment of the Wireless IC device for representing the present invention.
Figure 13 is the equivalent circuit diagram of the 7th embodiment of the Wireless IC device for representing the present invention.
Figure 14 is the equivalent circuit diagram of the 8th embodiment of the Wireless IC device for representing the present invention.
Figure 15 is the equivalent circuit diagram of the 9th embodiment of the Wireless IC device for representing the present invention.
Figure 16 is the profile of the 10th embodiment of the Wireless IC device for representing the present invention.
Figure 17 is the equivalent circuit diagram of above-mentioned 10th embodiment.
Figure 18 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 10th embodiment.
Figure 19 is the equivalent circuit diagram of the 11st embodiment of the Wireless IC device for representing the present invention.
Figure 20 is the equivalent circuit diagram of the 12nd embodiment of the Wireless IC device for representing the present invention.
Figure 21 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 12nd embodiment.
Figure 22 is the stereogram of the 13rd embodiment of the Wireless IC device for representing the present invention.
Figure 23 is the profile of the 14th embodiment of the Wireless IC device for representing the present invention.
Figure 24 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 14th embodiment.
Figure 25 is the equivalent circuit diagram of the 15th embodiment of the Wireless IC device for representing the present invention.
Figure 26 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 15th embodiment.
Figure 27 is the equivalent circuit diagram of the 16th embodiment of the Wireless IC device for representing the present invention.
Figure 28 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 16th embodiment.
Figure 29 is the equivalent circuit diagram of the 17th embodiment of the Wireless IC device for representing the present invention.
Figure 30 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 17th embodiment.
Figure 31 is the curve map of the reflection characteristic for representing above-mentioned 17th embodiment.
Figure 32 is the equivalent circuit diagram of the 18th embodiment of the Wireless IC device for representing the present invention.
Figure 33 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 18th embodiment.
Figure 34 represents the Wireless IC device of above-mentioned 18th embodiment, (A) is upward view, (B) is amplification profile.
Figure 35 is the equivalent circuit diagram of the 19th embodiment of the Wireless IC device for representing the present invention.
Figure 36 is the exploded perspective view of the power supply circuits substrate for representing above-mentioned 19th embodiment.
Figure 37 is the exploded perspective view of the 20th embodiment of the Wireless IC device for representing the present invention.
Figure 38 is the upward view of the power supply circuits substrate that Wireless IC device is equipped with above-mentioned 20th embodiment.
Figure 39 is the side view of above-mentioned 20th embodiment.
Figure 40 is the side view of the variation of above-mentioned 20th embodiment.
Figure 41 is the stereogram for representing the 1st form in the variation shown in Figure 40.
Figure 42 is the stereogram for representing the 2nd form in the variation shown in Figure 40.
Figure 43 is the exploded perspective view of the 21st embodiment of the Wireless IC device for representing the present invention.
Figure 44 is the equivalent circuit diagram of the 22nd embodiment of the Wireless IC device for representing the present invention.
Figure 45 is the exploded perspective view for representing above-mentioned 22nd embodiment power supply circuits substrate.
Figure 46 is the exploded perspective view of the power supply circuits substrate of the 23rd embodiment of the Wireless IC device for representing the present invention.
Figure 47 is the equivalent circuit diagram of the 24th embodiment of the Wireless IC device for representing the present invention.
Figure 48 is the stereogram of the power supply circuits substrate for representing above-mentioned 24th embodiment.
Figure 49 is the equivalent circuit diagram for representing the 25th embodiment of the invention.
Figure 50 is the stereogram of the power supply circuits substrate for representing above-mentioned 25th embodiment.
Figure 51 is the equivalent circuit diagram of the 26th embodiment of the Wireless IC device for representing the present invention.
Figure 52 is the stereogram of the power supply circuits substrate for representing above-mentioned 26th embodiment.
Figure 53 is the equivalent circuit diagram of the 27th embodiment of the Wireless IC device for representing the present invention.
Figure 54 is the stereogram of the power supply circuits substrate for representing above-mentioned 27th embodiment.
Figure 55 is the profile of the 28th embodiment of the Wireless IC device for representing the present invention.
Figure 56 is the profile of the 29th embodiment of the Wireless IC device for representing the present invention.
Figure 57 is the stereogram of the 30th embodiment of the Wireless IC device for representing the present invention.
Figure 58 is the stereogram of the 31st embodiment of the Wireless IC device for representing the present invention.
Figure 59 is the top view of the 1st that represents existing Wireless IC device.
Figure 60 is the top view of the 2nd that represents existing Wireless IC device.
Specific embodiment
The embodiment of Wireless IC device of the present invention and radio IC device part is illustrated with reference to the accompanying drawings.Separately
Outward, in each embodiment of following explanation to public part, partly indicate identical label, and the repetitive description thereof will be omitted.
(the 1st embodiment is with reference to Fig. 1～Fig. 7)
It is monopole type as the Wireless IC device 1a of the 1st embodiment, as depicted in figs. 1 and 2, by：Wireless IC chip 5,
Upper surface is equipped with the power supply circuits substrate 10 of wireless IC chip 5 and pastes the structure of radiant panel 20 of the power supply circuits substrate 10
Into.Wireless IC chip includes：Clock circuit, logic circuit, storage circuit, store necessary information, and be installed on power supply
Power supply circuits 16 inside circuit substrate 10 directly carry out DC connections.
Power supply circuits 16 are the circuits that the letter signal with assigned frequency is supplied to radiant panel 20, and/or
Be from by the received signal of radiant panel 20 select with assigned frequency collection of letters signal and be supplied to wireless IC chip
Circuit, it possesses the resonance circuit that resonance occurs under the frequency for receiving letter signal.
In power supply circuits substrate 10, as shown in Figures 2 and 3, inside is provided with using by spiral inductor element L and electricity
Hold the power supply circuits 16 that the LC tandems resonance circuit of the lumped constant type that element C1, C2 are constituted is constituted.In detail, such as Fig. 4
Shown, power supply circuits substrate 10 is that the potsherd 11A～11G to being made up of dielectric is laminated, is crimped, is sintered and obtained
, including：The sheet material 11A for being formed with connecting electrode 12 and reach through hole conductor 13a is, the sheet material for being formed with capacitance electrode 14a
11B, the sheet material 11C for being formed with electrode for capacitors 14b and reach through hole conductor 13b, the sheet material 11D for being formed with reach through hole conductor 13c,
The sheet material 11E that is formed with conductive pattern 15a and reach through hole conductor 13d, the sheet material 11F for being formed with reach through hole conductor 13e (one piece or
Polylith), be formed with the sheet material 11G of conductive pattern 15b.In addition, each potsherd 11A～11G can also be by magnetic ceramics material
The sheet material that material is constituted, power supply circuits substrate 10 can be using multilager base plates such as sheet material layered manner, the thick film screen printing methods for using in the past
Production process and be readily derived.
By being laminated above-mentioned 11A～11G, the spiral wireline reel inductance component L parallel with radiant panel 20 is formed, and
Capacitance electrode 14b is connected with the inductance component L two ends and capacitance electrode 14a is by reach through hole conductor 13a and connecting electrode
Capacity cell C1, C2 of 12 connections.And, as the connecting electrode 12 of substrate-side electrode pattern, by scolding tin salient point 6 and nothing
The chip side electrode pattern (not shown) of line IC chip 5 carries out DC connections.
That is, in the element of composition power supply circuits 16, from the inductance component L as coiled type electrode pattern magnetic is passed through
Field to radiant panel 20 provides letter signal, in addition, the collection of letters signal from radiant panel 20 is supplied to inductance component L by magnetic field.
Therefore, preferably configured in power supply circuits substrate 10 so that constitute the inductance component L of resonance circuit, capacity cell C1,
The close radiant panel 20 of inductance component L in C2.
Radiant panel 20 is cuboid, the i.e. metallic object of both ends open type being made up of nonmagnetic materials such as aluminium foil or Copper Foils, and
And be formed on the flexible resin film 21 of the insulating properties such as PET.The lower surface of above-mentioned power supply circuits substrate 10 is by by bonding agent
The 18 insulating properties adhesive linkages for being formed are pasted onto on radiant panel 20.
The size of one example is as follows, and the thickness of wireless IC chip 5 is 50～100 μm, and the thickness of scolding tin salient point 6 is about 20
μm, the thickness of power supply circuits substrate 10 is 200～500 μm, and the thickness of bonding agent 18 is 0.1～10 μm, the thickness of radiant panel 20
For 1～50 μm, the thickness of film 21 is 10～100 μm.Also, the size (area) of wireless IC chip 5 be 0.4mm × 0.4mm,
0.9mm × 0.8mm etc. is various.The size (area) of power supply circuits substrate 10 can be and wireless IC chip identical size
To the size of 3mm × 3mm or so.
Fig. 5 represents the connection form of wireless IC chip 5 and power supply circuits substrate 10.Fig. 5 (A) is to represent Wireless IC device 5
Reverse side and the front of power supply circuits substrate 10 be respectively arranged with the situation of a pair of antennas (balance) terminal 7a, 17a.Fig. 5 (B) table
Show other connection forms, be except the front of the reverse side in wireless IC chip 5 and power supply circuits substrate 10 is respectively arranged with one
Outside to antenna (balance) terminal 7a, 17a, the situation of ground terminal 17b is additionally provided with.But, power supply circuits substrate 10 connects
Ground terminal 17b forms terminal, is not connected with other elements of power supply circuits substrate 10.
Also, as shown in Figure 6 and Figure 7, radiant panel 20 is preferably elongated shape, preferably makes stickup power supply circuits substrate 10
The area of position 20 ' is more than substrate 10.Positional precision during to pasting does not have strict requirements, and can obtain stable electricity
Learn characteristic.
Fig. 3 represents the equivalent circuit of Wireless IC device 1a.Wireless IC device 1a radiant panels 20 are received by (not shown)
The high-frequency signal (such as UHF band) that read write line gives off, make mainly to realize with radiant panel 20 magnetic-coupled power supply circuits 16 (by
The LC series resonant circuits that inductance component L is constituted with capacity cell C1, C2) there is resonance, and only by the collection of letters of allocated frequency band
Signal is supplied to wireless IC chip 5.On the other hand, the energy of regulation is extracted out from the collection of letters signal, will by driving source of the energy
The information power supply circuits 16 being stored in wireless IC chip 5 match into the frequency of regulation, then from the inductance of power supply circuits 16
Element L, radiant panel 20 is sent to by magnetic coupling by letter signal, and is sent from radiant panel 20 to read write line, transmitted.
In addition, though the coupling that power supply circuits 16 are mainly carried out with the coupling of radiant panel 20 by magnetic field, but
There may be the coupling (electromagnetic field couples) carried out by electric field.
In the Wireless IC device 1a as the 1st embodiment, wireless IC chip 5 is provided with the confession of power supply circuits 16 with inside
Electric circuit substrate 10 directly carries out DC connections, and the area of power supply circuits substrate 10 is almost identical with wireless IC chip 5, and is firm
Property, therefore, compared with situation about being equipped on large-area fexible film in the past, can be wireless with high precision positioning
IC chip 5 is simultaneously equipped on film.It is additionally, since power supply circuits substrate 10 to be made up of ceramic material, and with heat resistance, institute
So that wireless IC chip 5 can be welded on power supply circuits substrate 10.In a word, due to adopting ultrasonic bonding unlike the past
Method, therefore, it is possible to inexpensively be welded, and can also avoid being caused due to pressure applied during ultrasonic bonding
Wireless IC chip it is damaged, and self-alignment (self-alignment) can make obtained from due to reflow soldering
With.
Also, in power supply circuits 16, resonant frequency characteristic is humorous by what is constituted with inductance component L and capacity cell C1, C2
Shake circuit to determine.The resonant frequency of the signal given off from radiant panel 20 is substantially equivalent to the intrinsic humorous of resonance circuit 16
Vibration frequency, the maximum gain of signal is substantially dependent on the size of power supply circuits 16, shape, power supply circuits 16 with radiant panel 20
At least a certain item in distance and medium.Specifically, in this 1st embodiment, the electrical length of radiant panel 20 takes resonance
The 1/2 of frequency lambda.But, the electrical length of radiant panel 20 may not be the integral multiple of λ/2.That is, in the present invention,
The frequency of the signal given off from radiant panel 20 is substantially what is determined by the resonant frequency of resonance circuit (power supply circuits 16),
Therefore frequency characteristic is essentially not dependent on the electrical length of radiant panel 20.If the electrical length of radiant panel 20 is whole for λ/2
During several times, gain is maximum, therefore ideal.
As described above, because the resonant frequency characteristic of power supply circuits 16 depends on being installed on inside power supply circuits substrate 10
, the resonance circuit being made up of inductance component L and capacity cell C1, C2, even if therefore by Wireless IC device 1a be clipped in books it
Between, resonant frequency characteristic also will not change.And, even if winding Wireless IC device 1a is so that the shape of radiant panel 20 occurs
Change, or change the size of radiant panel 20, resonant frequency characteristic also will not change.Also, constituting inductance unit due to being formed
The coiled type electrode pattern of part L is so that its wireline reel is parallel with radiant panel 20, therefore has the advantages that centre frequency is constant.And
And, because the rear class in wireless IC chip 5 inserts capacity cell C1, C2, therefore the electricity of low frequency can be blocked with the element C1, C2
Gush such that it is able to protect wireless IC chip 5 not affected by surge.
It is rigid multilager base plate to be additionally, since power supply circuits substrate 10, so when being convenient for welding wireless IC chip
Process.Being additionally, since radiant panel 20 is formed using the flexible metal film being held on fexible film 21, therefore, it is possible to milli
It is affixed to without barrier on the soft sack of such as plastic sheeting or on cylinder as PET bottle.
In addition, in the present invention, resonance circuit can also be doubled as making the impedance of wireless IC chip and the resistance of radiant panel
The match circuit of anti-matching.Or, power supply circuits substrate can also possess it is being constituted with inductance element and capacity cell, in resonance
The match circuit separately arranged outside circuit.If it is intended to the function of additional matches circuit over the resonant circuit, then resonance circuit
Be designed with the tendency for complicating.If separately arranging match circuit outside resonance circuit, can independently design humorous
Shake circuit, match circuit.
(the 2nd embodiment is with reference to Fig. 8)
As the Wireless IC device 1b of the 2nd embodiment, as shown in figure 8, being the device for making 90 ° of 20 bifurcated of radiant panel.Also
It is to say, in x-y plane, with the Department of Radiation 20a for extending in the direction of the x axis and the Department of Radiation 20b structures for extending in the y-axis direction
Into radiant panel 20, using the extension line of Department of Radiation 20a as power supply 20d, and bonding is equipped with wirelessly on power supply 20d
The power supply circuits substrate 10 of IC chip 5.
Further, the internal structure of power supply circuits substrate 10 as above-mentioned 1st embodiment, imitate by the effect of this 2nd embodiment
Fruit is identical with the 1st embodiment.It is additionally, since Department of Radiation 20a, 20b to upwardly extend with y-axis side in the direction of the x axis, therefore, it is possible to connect
Circularly polarized wave is received, so as to improve the gain of antenna.
(the 3rd embodiment is with reference to Fig. 9)
As the Wireless IC device 1c of the 3rd embodiment, shown in such as Fig. 9 (A), (B), x-axis direction is used in x-y-z space
On upper, y-axis direction, z-axis side upwardly extending Department of Radiation 20a, 20b, 20c constitute radiant panel 20, with the extended line of Department of Radiation 20a
Used as power supply 20d, and bonding is equipped with the power supply circuits substrate 10 of wireless IC chip 5 on power supply 20d.
Wireless IC device 1c can be pasted onto on such as corner of box like object to use, due to Department of Radiation 20a, 20b,
20c extends in 3-dimensional space, therefore antenna does not have directionality, and transmitting-receiving letter can be expeditiously carried out in any direction.
And, other action effects of Wireless IC device 1c are identical with above-mentioned 1st embodiment.
(the 4th embodiment is with reference to Figure 10)
It is in the flexible with insulating properties of larger area as shown in Figure 10 as the Wireless IC device 1d of the 4th embodiment
Plastic sheeting 21 on be formed with device obtained from the larger radiant panel 20 of area with aluminium foil etc., and wireless IC will be equipped with
The power supply circuits substrate 10 of chip 5 is adhered to the optional position of radiant panel 20.
In addition, the other structures of Wireless IC device 1d, the i.e. internal structure of power supply circuits substrate 10 and above-mentioned 1st embodiment
It is identical.Therefore, the action effect of this 4th embodiment is substantially identical with the 1st embodiment, and with for power supply circuits substrate
10 bonding location does not have the advantage of high-precision requirement.
(the 5th embodiment is with reference to Figure 11)
It is by with the larger spoke of the area of the formation such as aluminium foil as shown in figure 11 as the Wireless IC device 1e of the 5th embodiment
Penetrate plate 20 make it is latticed obtained from device.Grid can be formed on the face of whole radiant panel 20, or can also be at it
Formed in a middle part.
Other structures are identical with above-mentioned 4th embodiment, except not high-precision for the bonding location of power supply circuits substrate 10
Outside the advantage that degree is required, because the magnetic flux of coiled type electrode pattern passes through mesh openings portion, therefore the institute of power supply circuits substrate 10
The change (reduction) of the magnetic flux of generation tails off such that it is able to make more magnetic fluxs pass through radiant panel 20.Therefore, it is possible to improve signal
The transmission efficiency of energy, while the frequency shift (FS) caused due to stickup can be reduced.
(the 6th embodiment is with reference to Figure 12)
As the Wireless IC device 1f of the 6th embodiment, as shown in figure 12, including glue with power supply circuits substrate 10 on film 21
The composition surface that connects and (herein refer to whole surface) on face in addition, bonding agent 18 is coated by radiant panel 20.Profit
Wireless IC device 1f can be pasted on the arbitrary portion of article with the bonding agent 18.
In addition, the other structures of Wireless IC device 1f, the i.e. internal structure of power supply circuits substrate 10 and above-mentioned 1st embodiment
It is identical.Therefore, the action effect of this 6th embodiment is substantially identical with the 1st embodiment.
(the 7th embodiment is with reference to Figure 13)
It is in power supply circuits substrate 10 as shown in the equivalent circuit of Figure 13 as the Wireless IC device 1g of the 7th embodiment
Portion is provided with device obtained from the inductance component L as power supply circuits 16 being made up of coiled type electrode pattern.Constitute LC simultaneously
The capacity cell C of connection resonance circuit is by parasitic capacitance (the distributed constant type electricity between the conductive pattern as inductance component L
Hold) come what is formed.
Even that is, a coiled type electrode pattern, if having natural resonance, with coiled type electrode pattern
Parasitic capacitance C composition works as LC antiresonant circuits between the L compositions of itself and line such that it is able to constitute power supply circuits
16.Therefore, Wireless IC device 1g can receive the high-frequency signal given off from read write line (not shown) with radiant panel 20 (for example
UHF band), make mainly to realize that magnetic-coupled power supply circuits 16 (are made up of inductance component L and capacity cell C with radiant panel 20
LC antiresonant circuits) there is resonance, and only the collection of letters signal of the frequency band of regulation is supplied to into wireless IC chip 5.The opposing party
Face, extracts the energy of regulation out from the collection of letters signal, will be stored in the information in wireless IC chip 5 as driving source using the energy
The frequency of regulation is matched into power supply circuits 16, then letter will be transmitted by magnetic coupling from the inductance component L of power supply circuits 16
Number send radiant panel 20 to, and send from radiant panel 20 to read write line, transmission.
(the 8th embodiment is with reference to Figure 14)
It is possess the power supply for having dipole-type as shown in the equivalent circuit of Figure 14 as the Wireless IC device 1h of the 8th embodiment
The device of circuit 16 and radiant panel 20, is provided with the power supply being made up of two LC antiresonant circuits inside power supply circuits substrate
Circuit 16.Inductance component L 1 and capacity cell C1 are connected with the 1st port side of wireless IC chip 5, and inductance component L 2 and electric capacity are electric
Source C2 is connected with the 2nd port side of wireless IC chip 5, and opposed with radiant panel 20,20 respectively.Inductance component L 1 and electric capacity unit
The end of part C1 becomes open end.In addition, the 1st port and the 2nd port constitute the I/O of differential circuit.
The action effect of this 8th embodiment is substantially identical with above-mentioned 1st embodiment.That is, the Wireless IC device
1h radiant panels 20 receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make mainly and radiant panel
20 realize (LC antiresonant circuits, the Yi Jiyou being made up of inductance component L 1 and capacity cell C1 of magnetic-coupled power supply circuits 16
The LC antiresonant circuits that inductance component L 2 is constituted with capacity cell C2) there is resonance, and only by the collection of letters letter of allocated frequency band
Number it is supplied to wireless IC chip 5.On the other hand, the energy of regulation is extracted out from the collection of letters signal, using the energy as driving source
The frequency that the information power supply circuits 16 in wireless IC chip 5 match into regulation is will be stored in, then from the electricity of power supply circuits 16
Letter signal is sent to radiant panel 20 by sensing unit L1, L2 by magnetic coupling, and is sent from radiant panel 20 to read write line, passed
It is defeated.
(the 9th embodiment is with reference to Figure 15)
It is possess the power supply for having dipole-type as shown in the equivalent circuit of Figure 15 as the Wireless IC device 1i of the 9th embodiment
The device of circuit 16 and radiant panel 20, is provided with the power supply being made up of two LC series resonant circuits inside power supply circuits substrate
Circuit 16.Each inductance component L 1, L2 is opposed with radiant panel 20,20, each capacity cell C1, C2 ground connection.
The action effect of this 9th embodiment is substantially identical with above-mentioned 1st embodiment.That is, the Wireless IC device
1i radiant panels 20 receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make mainly and radiant panel
20 realize (LC series resonant circuits, the Yi Jiyou being made up of inductance component L 1 and capacity cell C1 of magnetic-coupled power supply circuits 16
The LC series resonant circuits that inductance component L 2 is constituted with capacity cell C2) there is resonance, and only by the collection of letters letter of allocated frequency band
Number it is supplied to wireless IC chip 5.On the other hand, the energy of regulation is extracted out from the collection of letters signal, using the energy as driving source
The frequency that the information power supply circuits 16 in wireless IC chip 5 match into regulation is will be stored in, then from the electricity of power supply circuits 16
Letter signal is sent to radiant panel 20 by sensing unit L1, L2 by magnetic coupling, and is sent from radiant panel 20 to read write line, passed
It is defeated.
(the 10th embodiment is with reference to Figure 16～Figure 18)
It is monopole type device as shown in figure 16 as the Wireless IC device 1j of the 10th embodiment, is in power supply circuits substrate
The useful inductance component L of 10 Inner Constitutions and device obtained from capacity cell C-shaped into the power supply circuits 16 of LC series resonant circuits.
As shown in figure 17, the coiled type electrode pattern for constituting inductance component L is formed, so that its wireline reel is vertical with radiant panel 20, and
Power supply circuits 16 are made mainly to realize magnetic coupling with radiant panel 20.
Power supply circuits substrate is as shown in figure 18 in detail, be that the potsherd 31A～31F to being made up of dielectric is laminated,
Crimping, the substrate of sintering, including：It is formed with the sheet material 31A of connecting electrode 32 and reach through hole conductor 33a, is formed with electricity
Hold the sheet material 31B of electrode 34a and reach through hole conductor 33b, being formed with the sheet material of capacitance electrode 34b and reach through hole conductor 33c, 33b
31C, sheet material 31D (one or more) for being formed with conductive pattern 35a and reach through hole conductor 33d, 33b, it is formed with conductive pattern
Sheet material 31E (one or more) of 35b and reach through hole conductor 33e, 33b, the sheet material 31F for being formed with conductive pattern 35c.
By being laminated above-mentioned sheet material 31A～31F, obtain vertical with radiant panel 20 by the wireline reel of helical form (helical)
Inductance component L and capacity cell C be connected in series obtained from the power supply circuits 16 that constituted of LC series resonant circuits.Electric capacity electricity
Pole 34a is connected by reach through hole conductor 33a with connecting electrode 32, then is connected with wireless IC chip 5 by scolding tin salient point 6, electricity
One end of sensing unit L is connected by reach through hole conductor 33b with connecting electrode 32, then by scolding tin salient point 6 and wireless IC chip 5
Connection.
The action effect of this 10th embodiment is substantially identical with above-mentioned 1st embodiment.That is, the Wireless IC device
1j radiant panels 20 receive the high-frequency signal (such as UHG frequency bands) given off from read write line (not shown), make mainly and radiant panel
20 realize that magnetic-coupled power supply circuits 16 (the LC series resonant circuits being made up of inductance component L and capacity cell C) occur resonance,
And only the collection of letters signal of allocated frequency band is supplied to into wireless IC chip 5.On the other hand, regulation is extracted out from the collection of letters signal
Energy, regulation is matched into using the energy of the regulation as the information power supply circuits 16 that driving source will be stored in wireless IC chip 5
Frequency, then passes to radiant panel 20 by magnetic coupling from the inductance component L of power supply circuits 16 by letter signal, and from spoke
Penetrate plate 20 to send to read write line, transmit.
Especially in this 10th embodiment, because forming coiled type electrode pattern so that its wireline reel hangs down with radiant panel 20
Directly, therefore by the magnetic flux composition of radiant panel 20 increase, and improve the transmission efficiency of signal energy, become big with gain
Advantage.
(the 11st embodiment is with reference to Figure 19)
As the Wireless IC device 1k of the 11st embodiment, as shown in the equivalent circuit of Figure 19, above-mentioned 10th embodiment is formed
The coiled type electrode pattern of shown inductance component L so that its winding width (coil diameter) towards the direction of radiant panel 20 slowly
Become big.Other structures are identical with above-mentioned 10th embodiment.
This 11st embodiment can be obtained and above-mentioned 10th embodiment identical action effect, in addition, due to being formed
The coiled type electrode pattern of inductance component L so that its winding width (coil diameter) slowly becomes big towards the direction of radiant panel 20,
Therefore signal transmission efficiency is improved.
(the 12nd embodiment is with reference to Figure 20 and Figure 21)
Dipole-type device as shown in the equivalent circuit of Figure 20 as the Wireless IC device 1l of the 12nd embodiment, be
Device obtained from the power supply circuits 16 being made up of two LC series resonant circuits is installed inside power supply circuits substrate 10.
Power supply circuits substrate 10, is the ceramic sheet material 41A～41F to being made up of dielectric as shown in figure 21 in detail
The substrate for being laminated, crimping, sinter and formed, including：It is formed with the sheet material of connecting electrode 42 and reach through hole conductor 43a
41A, the sheet material 41B for being formed with capacitance electrode 44a, the sheet material 41C for being formed with capacitance electrode 44b and reach through hole conductor 43b, formation
There is sheet material 41D (one or more) of conductive pattern 45a and reach through hole conductor 43c, be formed with conductive pattern 45b and reach through hole is led
Sheet material 41E (one or more) of body 43d, the sheet material 41F for being formed with conductive pattern 45c.
By being laminated above-mentioned sheet material 41A～41F, obtain vertical with radiant panel 20 by the wireline reel of helical form (helical)
Inductance component L 1, L2 and capacity cell C1, C2 be connected in series obtained from the power supply that constituted of two LC series resonant circuits
Circuit 16.Capacitance electrode 44a is connected by reach through hole conductor 43a with connecting electrode 42, then by scolding tin salient point and wireless IC
Chip 5 connects.
The action effect of this 12nd embodiment is substantially identical with above-mentioned 1st embodiment.That is, the Wireless IC device
1l radiant panels 20 receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make mainly and radiant panel
20 realize (LC series resonant circuits, the Yi Jiyou being made up of inductance component L 1 and capacity cell C1 of magnetic-coupled power supply circuits 16
The LC series resonant circuits that inductance component L 2 is constituted with capacity cell C2) there is resonance, and only by the collection of letters letter of allocated frequency band
Number it is supplied to wireless IC chip 5.On the other hand, the energy of regulation is extracted out from the collection of letters signal, using the energy as driving source
The information power supply circuits 16 that will be stored in wireless IC chip 5 match into assigned frequency, then from the inductance unit of power supply circuits 16
Letter signal is passed to radiant panel 20 by part L1, L2 by magnetic coupling, and is sent from radiant panel 20 to read write line, transmitted.
Also, because capacity cell C1, C2 and are configured at wireless IC chip 5 and inductance as the rear class of wireless IC chip 5
Between element L1, L2, therefore resistance to surge is improved.Because surge is the low-frequency current of below 200MHz, therefore can be with profit
Stopped with capacity cell C1, C2, can be so as to preventing wireless IC chip 5 from being destroyed by surge.
In addition, in this 2nd embodiment, the resonance circuit that is made up of capacity cell C1 and inductance component L 1 and by electric capacity unit
The resonance circuit that part C2 is constituted with inductance component L 2 is not coupled each other.
(the 13rd embodiment is with reference to Figure 22)
As the Wireless IC device 1m of the 13rd embodiment, as shown in figure 22, it is being made up of ceramics or heat-resistant resin
The surface of rigid individual layer power supply circuits substrate 50 is arranged by the inductance element structure of coiled type electrode pattern, i.e. spiral type (spiral)
Into power supply circuits 56 obtained from device.The both ends of power supply circuits 56 are directly connected by scolding tin salient point with wireless IC chip 5
Connect, the bonding agent of power supply circuits substrate 50 is pasted on the film 21 for keeping radiant panel 20.In addition, using insulation (not shown)
Film, the cross one another conductive pattern 56a for making composition power supply circuits 56 is mutually isolated with conductive pattern 56b, 56c.
The power supply circuits 56 of this 13rd embodiment, constitute to be wound as institute's shape between the conductive pattern of spiral (spiral)
Into the LC antiresonant circuits that utilize as capacitive component of parasitic capacitance.In addition, power supply circuits substrate 50 is by dielectric
Or the single layer substrate that magnetic is constituted.
In the Wireless IC device 1m as the 13rd embodiment, power supply circuits 56 mainly realize magnetic coupling with radiant panel 20.
Therefore, it is identical with the various embodiments described above, the high-frequency signal given off from read write line is received with radiant panel 20, make power supply circuits 56
Raw resonance, and only the collection of letters signal of the frequency band of regulation is supplied to into wireless IC chip 5.On the other hand, from the collection of letters signal
Extract the energy of regulation out, the information power supply circuits 56 that will be stored in as driving source using the energy in wireless IC chip 5 are matched
Into the frequency of regulation, then radiant panel 20 to is sent letter signal by magnetic coupling from the inductance element of power supply circuits 56,
And send from radiant panel 20 to read write line, transmit.
And, it is and upper for wireless IC chip 5 is arranged at into this point on the little power supply circuits substrate 50 of rigidity and area
State the 1st embodiment the same, so as to positioning precision is good, and can be connected with power supply circuits substrate 50 using scolding tin.
(the 14th embodiment is with reference to Figure 23 and Figure 24)
It is by the coiled type electrode figure of power supply circuits 56 as shown in figure 23 as the Wireless IC device 1n of the 14th embodiment
Case is installed on device obtained from the inside of power supply circuits substrate 50.Power supply circuits substrate 50 is to by dielectric as shown in figure 24
The substrate that the ceramic sheet material 51A～51D of composition is laminated, is crimped, being sintered, including：It is formed with the He of connecting electrode 52
The sheet material 51A of reach through hole conductor 53a, the sheet material 51B for being formed with conductive pattern 54a and reach through hole conductor 53b, 53c, it is formed with and leads
The sheet material 51C of body pattern 54b, not patterned sheet material 51D (polylith).
By being laminated above-mentioned sheet material 51A～51D, in coiled type electrode pattern, obtain being installed on inside and including by rolling up
The electricity that parasitic capacitance between the wire of the inductance element for spiral (spiral) and spiral (spiral) conductor is formed
The power supply circuits substrate 50 of the power supply circuits 56 of the constituted resonance circuit of Rongcheng point.And, positioned at the two ends of power supply circuits 56
The electrode 52 of connection is connected by scolding tin salient point 6 with wireless IC chip 5.The action effect and the above-mentioned 13rd of this 14th embodiment
Embodiment is identical.
(the 15th embodiment is with reference to Figure 25 and Figure 26)
It is to make wireless IC chip 5 and supply as shown in the equivalent circuit of Figure 25 as the Wireless IC device 1o of the 15th embodiment
Electric circuit substrate 10 realizes device obtained from Capacitance Coupled, and power supply circuits substrate 10 is connected to carry out with radiant panel 20 using DC
Connection.The power supply circuits 16 being made up of two LC series resonant circuits are installed inside power supply circuits substrate 10.Inductance element
Each wireline reel of L1, L2 is located on the position vertical with radiant panel 20, the capacitance electrode of one end and composition capacity cell C1, C2
65a, 65b (with reference to Figure 26) connection, other end phase using the connecting electrode 62 being arranged in the sole side surface of substrate 10
Mutual direct-coupling.Also, capacitance electrode 66a, 66b (with reference to Figure 26) for constituting capacity cell C1, C2 are formed at wireless IC chip 5
Reverse side.
Power supply circuits substrate 10, is the ceramic sheet material 61A～61G to being made up of dielectric as shown in figure 26 in detail
The substrate for being laminated, crimping, sinter and formed, including：It is formed with the piece of connecting electrode 62 and reach through hole conductor 63a, 63b
Material 61A, the sheet material 61B～61F for being formed with conductive pattern 64a, 64b and reach through hole conductor 63c, 63d, it is formed with capacitance electrode
The sheet material 61G of 65a, 65b.
By being laminated above-mentioned sheet material 61A～61G, obtain by inductance component L 1, L2 and capacity cell C1, C2 company of series connection respectively
The power supply circuits 16 that the two LC series resonant circuits for connecing are constituted.
That is, capacity cell C1 is formed at as the electrode 66a of chip side electrode pattern and as substrate-side electrode pattern
Between the plane electrode pattern being parallel to each other of electrode 65a.Capacity cell C2 is formed at the electrode as chip side electrode pattern
Between 66b and the plane electrode pattern being parallel to each other as the electrode 65b of substrate-side electrode pattern.Wireless IC chip 5 is with absolutely
Edge adhesive linkage is pasted onto on power supply circuits substrate 10, and is engaged by the insulating properties adhesive linkage.Also, power supply circuits base
Plate 10 carries out DC and is connected by the connecting electrode 62 as the 2nd substrate-side electrode pattern and radiant panel 20.Here, with scolding tin,
The connecting electrode 62 and radiant panel 20 of the engagement power supply circuits such as conductive adhesive substrate 10.
The action effect of this 15th embodiment is substantially identical with above-mentioned 1st embodiment.That is Wireless IC device 1o spokes
Penetrate plate 20 and receive the high-frequency signal (such as UHF band) radiated from read write line (not shown), make to realize that DC is connected with radiant panel 20
Power supply circuits 16 (the LC series resonant circuits that are made up of inductance component L 1 and capacity cell C1 and by inductance component L 2 with
The LC series resonant circuits that capacity cell C2 is constituted) there is resonance, and be only supplied to the collection of letters signal of allocated frequency band wirelessly
IC chip 5.On the other hand, extract the energy of regulation out from the collection of letters signal, will be stored in wirelessly as driving source using the energy
The information power supply circuits 16 of IC chip 5 match into assigned frequency, then realize the radiant panel that DC is connected to power supply circuits 16
20 transmission letter signals, and send from radiant panel 20 to read write line, transmit.Power supply circuits 16 are with wireless IC chip 5 by electricity
Hold element C1, C2 and realize Capacitance Coupled, so as to delivering power, receive letter signal.
But, the area of capacitance electrode 65a, 65b of power supply circuits 10 is formed at than being formed at the electric capacity of wireless IC chip 5
The area of electrode 66a, 66b is big.Even if positional precision when wireless IC chip 5 is equipped on power supply circuits substrate 10 has one
A little deviations, the skew of the electric capacity formed between capacitance electrode 65a, 66a and 65b, 66b also can be relaxed.It is additionally, since
Capacity cell C1, C2 are inserted in the rear class of wireless IC chip 5, it is possible to improving resistance to surge performance.
(the 16th embodiment is with reference to Figure 27 and Figure 28)
It is to make power supply circuits substrate 10 as shown in the equivalent circuit of Figure 27 as the Wireless IC device 1p of the 16th embodiment
Device obtained from Capacitance Coupled is realized with radiant panel 20.It is provided with the inside of power supply circuits substrate 10 humorous by two LC series connection
The power supply circuits 16 that the circuit that shakes is constituted.One end of inductance component L 1, L2 is connected with wireless IC chip 5, the other end be arranged at
Capacitance electrode 72a, 72b (with reference to Figure 28) connection of composition capacity cell C1, the C2 on the surface of substrate 10.In addition, constituting electric capacity
A capacitance electrodes many again of element C1, C2 work as end 20a, 20b of radiant panel 20.
Power supply circuits substrate 10, is the ceramic sheet material 71A～71G to being made up of dielectric as shown in figure 28 in detail
The substrate for being laminated, crimping, sinter and formed, including：It is formed with capacitance electrode 72a, 72b and reach through hole conductor 73a, 73b
Sheet material 71A, be formed with the sheet material 71B～71E of conductive pattern 74a, 74b and reach through hole conductor 73c, 73d, shape on a surface
Into have conductive pattern 74a, 74b and be formed with another surface connecting electrode 75a, 75b and with reach through hole conductor 73e,
The sheet material 71F of 73f connections.
By being laminated above-mentioned sheet material 71A～71F, obtain by being connected in series inductance component L 1, L2 and capacity cell C1, C2
The power supply circuits 16 that two LC series resonant circuits are constituted.By the way that power supply circuits substrate 10 is pasted onto into radiant panel with bonding agent
On 20, so as to pass through the insulating properties adhesive linkage, the capacitance electrode as plane electrode pattern with the configured in parallel of radiant panel 20 is made
72a, 72b are opposed with end 20a, 20b of radiant panel 20, so as to form capacity cell C1, C2.In addition, convex by using scolding tin
Point couples together connecting electrode 75a, 75b and wireless IC chip 5, so that one end of inductance component L 1, L2 and wireless IC
Chip 5 connects, and wireless IC chip 5 realizes that DC is connected with power supply circuits substrate 10.
Further, if bonding agent includes such as dielectric medium powder, adhesive linkage has as dielectric property, Neng Goujia
The capacitance of bulky capacitor element C1, C2.In addition, as capacitance electrode 72a, 72b of the 2nd substrate-side electrode pattern, although at this
The reverse side side surface of power supply circuits substrate 10 is formed in 16th embodiment, but power supply circuits substrate 10 can also be formed at
Internal the side of close radiant panel 20 (but will).In addition, capacitance electrode 72a, 72b can also be arranged at the internal layer of substrate 10.
The action effect of this 16th embodiment is substantially identical with above-mentioned 1st embodiment.That is Wireless IC device 1p spokes
Penetrate plate 20 and receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make to realize electric capacity with radiant panel 20
(the LC series resonant circuits that are made up of inductance component L 1 and capacity cell C1 and by inductance element of power supply circuits 16 of coupling
The LC series resonant circuits that L2 and capacity cell C2 are constituted) there is resonance, and be only supplied to the collection of letters signal of allocated frequency band
Wireless IC chip 5.On the other hand, extract the energy of regulation out from the collection of letters signal, will be stored in as driving source using the energy
The information power supply circuits 16 of wireless IC chip 5 match into assigned frequency, then by the Capacitance Coupled of capacity cell C1, C2 to
Radiant panel 20 transmits letter signal, and sends from radiant panel 20 to read write line, transmits.
(the 17th embodiment is with reference to Figure 29～Figure 31)
Used as the Wireless IC device 1q of the 17th embodiment, as shown in the equivalent circuit of Figure 29, power supply circuits 16 possess mutually
Magnetic-coupled inductance component L 1, L2, inductance component L 1 is connected by capacity cell C1a, C1b with wireless IC chip 5, and, lead to
Cross capacity cell C2a, C2b and inductance component L 2 is connected in parallel.In other words, power supply circuits 16 are included by inductance component L 1 and electricity
Hold the LC series resonant circuits that element C1a, C1b are constituted and the LC strings being made up of inductance component L 2 and capacity cell C2a, C2b
Connection resonance circuit, each resonance circuit is attached using the magnetic coupling that the M in Figure 29 is represented.And inductance component L 1, L2 two
Person and the magnetic coupling of radiant panel 20.
Power supply circuits substrate 10 is the ceramic sheet material 81A～81H to being made up of dielectric as shown in figure 30 in detail
The substrate for being laminated, crimping, sinter and formed, including：Patternless sheet material 81A, it is formed with conductive pattern 82a, 82b and wears
The sheet material 81B of via conductors 83a, 83b, 84a, 84b, be formed with conductive pattern 82a, 82b and reach through hole conductor 83c, 84c,
The sheet material 81C of 83e, 84e, the sheet material 81D, the shape that are formed with conductive pattern 82a, 82b and reach through hole conductor 83d, 84d, 83e, 84e
Into the sheet material 81E for having capacitance electrode 85a, 85b and reach through hole conductor 83e, it is formed with sheet material 81F, the nothing of capacitance electrode 86a, 86b
The sheet material 81G of pattern, reverse side are formed with the sheet material 81H of capacitance electrode 87a, 87b.
By being laminated above-mentioned sheet material 81A～81H, conductive pattern 82a connects to form electricity by reach through hole conductor 83b, 83c
Sensing unit L1, conductive pattern 82b connect to form inductance component L 2 by reach through hole conductor 84b, 84c.With capacitance electrode 86a,
87a is formed capacity cell C1a, capacitance electrode 86a and is connected with one end of inductance component L 1 by reach through hole conductor 83e.Use electric capacity
Electrode 86b, 87b form capacity cell C1b, and capacitance electrode 86b is connected by reach through hole conductor 83d with the other end of inductance component L 1
Connect.And, capacity cell C2a is formed with capacitance electrode 85a, 86a, capacitance electrode 85a is by reach through hole conductor 84e and inductance unit
One end connection of part L2.Capacity cell C2b is formed with capacitance electrode 85b, 86b, capacitance electrode 85b passes through reach through hole conductor 84d
It is connected with the other end of inductance component L 2.
The action effect of this 17th embodiment is substantially identical with above-mentioned 1st embodiment.That is Wireless IC device 1q spokes
Penetrate plate 20 and receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make mainly to realize with radiant panel 20
(the LC series resonant circuits that are made up of inductance component L 1 and capacity cell C1a, C1b and by electricity of magnetic-coupled power supply circuits 16
The LC series resonant circuits that sensing unit L2 is constituted with capacity cell C2a, C2b) there is resonance, and only by the collection of letters of allocated frequency band
Signal is supplied to wireless IC chip 5.On the other hand, the energy of regulation is extracted out from the collection of letters signal, using the energy as driving
Source will be stored in the information power supply circuits 16 of wireless IC chip 5 and match into assigned frequency, then by magnetic coupling from power supply electricity
The inductance component L 1, L2 on road 16 to radiant panel 20 transmits letter signal, and sends from radiant panel 20 to read write line, transmits.
Especially, in this 17th embodiment, as shown in figure 31, realize that frequency bandwidth X (frequency bandwidth of -5dB) exists
The frequency band of the non-constant width of more than 150MHz.This is because power supply circuits 16 are with comprising with the high degree of coupling realizing magnetic coupling each other
What multiple LC resonance circuits of the inductance component L 1, L2 of conjunction were constituted.Further, since in the rear class insertion electricity of wireless IC chip 5
Hold element C1a, C2a, so improve resistance to surge performance.
(the 18th embodiment is with reference to Figure 32 and Figure 34)
Used as the Wireless IC device 1r of the 18th embodiment, as shown in the equivalent circuit of Figure 32, power supply circuits 16 possess and have phase
Mutually magnetic-coupled inductance component L 1, L2 is realized with the high degree of coupling.Inductance component L 1 and the inductance element for being arranged at wireless IC chip 5
5 realize magnetic coupling, and inductance component L 2 forms series resonant circuit with capacity cell C2.Also, capacity cell C1 is real with radiant panel 20
Existing Capacitance Coupled, inserts capacity cell C3 many again between capacity cell C1, C2.
Power supply circuits substrate 10, is the ceramic sheet material 91A～91E to being made up of dielectric as shown in figure 33 in detail
The substrate for being laminated, crimping, sinter and formed, including：Formed by conductive pattern 92a, 92b and reach through hole conductor 93a, 93b,
The sheet material 91A of 94a, 94b, the sheet material 91B for being formed with capacitance electrode 95 and reach through hole conductor 93c, 93d, 94c, it is formed with electric capacity
The sheet material 91C of electrode 96 and reach through hole conductor 93c, 93d, the sheet material 91D for being formed with capacitance electrode 97 and reach through hole conductor 93c,
It is formed with the sheet material 91E of capacitance electrode 98.
By being laminated above-mentioned sheet material 91A～91E, inductance component L 1 is formed with conductive pattern 92a, with conductive pattern 92b shapes
Into inductance component L 2.Capacity cell C1 is formed with capacitance electrode 97,98, and one end of inductance component L 1 passes through reach through hole conductor
93a, 93c and capacitance electrode 98 connect, and the other end is connected by reach through hole conductor 93b, 93d and capacitance electrode 97.With electric capacity electricity
Pole 95,96 forms capacity cell C2, and one end of inductance component L 2 is connected by reach through hole conductor 94a, 94c and capacitance electrode 96,
The other end is connected by reach through hole conductor 94b with capacitance electrode 95.And, form capacity cell C3 with capacitance electrode 96,97.
Also, as shown in figure 34, in the reverse side of wireless IC chip 5 the coiled type electrode of chip side electrode pattern is provided as
Pattern 99, and form inductance component L 5 with the coiled type electrode pattern 99.Further, arrange on the surface of coiled type electrode pattern 99
The diaphragm constituted using resin etc..By means of this, the coiled type electrode pattern institute shape as substrate-side electrode pattern is used
Into inductance component L 1, L2 and coiled type electrode pattern 99 realize magnetic coupling.
The action effect of this 18th embodiment is substantially identical with above-mentioned 1st embodiment.That is Wireless IC device 1r spokes
Penetrate plate 20 and receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make to realize electric capacity with radiant panel 20
Coupling and magnetic-coupled power supply circuits 16 (the LC series resonant circuits being made up of with capacity cell C2 inductance component L 2) occur humorous
Shake, and only the collection of letters signal of allocated frequency band is supplied to into wireless IC chip 5.On the other hand, rule are extracted out from the collection of letters signal
Fixed energy, regulation frequency is matched into using the energy as the information power supply circuits 16 that driving source will be stored in wireless IC chip 5
Rate, then transmits letter signal by Capacitance Coupled and magnetic coupling to radiant panel 20, and sends out from radiant panel 20 to read write line
Send, transmit.Power supply circuits 16 realize magnetic coupling with wireless IC chip 5 by inductance component L 1, L5, so as to realize power, transmitting-receiving
The transmission of letter signal.
(the 19th embodiment is with reference to Figure 35 and Figure 36)
Used as the Wireless IC device 1s of the 19th embodiment, as shown in the equivalent circuit of Figure 35, power supply circuits 16 possess and have phase
Mutually magnetic-coupled inductance component L 1, L2, L3 is realized with the high degree of coupling.Inductance component L 1 and the inductance for being arranged at wireless IC chip 5
Element L5 realizes magnetic coupling, and inductance component L 2 forms LC series resonant circuits, inductance component L 3 and electricity with capacity cell C1a, C1b
Hold element C2a, C2b and form LC series resonant circuits.Also, inductance component L 1, L2, L3 realizes magnetic coupling with radiant panel 20 respectively.
Power supply circuits substrate 10, in detail, as shown in figure 36, be ceramic sheet material 101A to being made up of dielectric～
The substrate that 101E is laminated, crimps, sinters and formed, including：Be formed with conductive pattern 102a and reach through hole conductor 103a,
The sheet material 101A of 103b, the sheet material 101B for being formed with capacitance electrode 104a, 104b, it is formed with capacitance electrode 105a, 105b and wears
The sheet material 101C of via conductors 103c, 103d, be formed with capacitance electrode 106a, 106b and reach through hole conductor 103c, 103d,
The sheet material 101D of 103e, 103f, the sheet material 102E for being formed with conductive pattern 102b, 102c.That is, in the electrode for constituting capacity cell
Retaining space between 104a, 105a, 106a and electrode 104b, 105b, 106b, so that using produced by inductance component L 1
Magnetic flux reaches inductance component L 2, L3, then reaches radiant panel 20.
By being laminated above-mentioned sheet material 101A～101E, inductance component L 1 is formed with conductive pattern 102a, use conductive pattern
102b forms inductance component L 2, and with conductive pattern 102c inductance component L 3 is formed.Electric capacity unit is formed with capacitance electrode 104a, 105a
Part C1a, with capacitance electrode 104b, 105b capacity cell C1b is formed.Also, forming capacity cell with capacitance electrode 105a, 106a
C2a, with capacitance electrode 105b, 106b capacity cell C2b is formed.
One end of inductance component L 1 is connected by reach through hole conductor 103a with capacitance electrode 104a, and the other end passes through reach through hole
Conductor 103b is connected with capacitance electrode 104b.One end of inductance component L 2 is connected by reach through hole conductor 103c and capacitance electrode 105a
Connect, the other end is connected by reach through hole conductor 103f with capacitance electrode 106b.One end of inductance component L 3 passes through reach through hole conductor
103e is connected with capacitance electrode 106a, and the other end is connected by reach through hole conductor 103d with capacitance electrode 105b.
Also, as shown in figure 34, in the reverse side of wireless IC chip 5 the coiled type electrode of chip side electrode pattern is provided as
Pattern 99, with the coiled type electrode pattern 99 inductance component L 5 is formed.Further, profit is set on the surface of coiled type electrode pattern 99
The diaphragm constituted with resin etc..By means of this, formed using the coiled type electrode pattern as substrate-side electrode pattern
Inductance component L 1 and coiled type electrode pattern 99 realize magnetic coupling.The action effect of this 19th embodiment is substantially with above-mentioned the
17 embodiments are identical.That is, Wireless IC device 1s radiant panels 20 receive the high-frequency signal given off from read write line (not shown)
(such as UHF band), make with radiant panel 20 realize magnetic-coupled power supply circuits 16 (by inductance component L 2 and capacity cell C1a,
The LC series resonant circuits of C1b compositions and the LC series resonances electricity being made up of inductance component L 3 and capacity cell C2a, C2b
Road) there is resonance, and only the collection of letters signal of allocated frequency band is supplied to into wireless IC chip 5.On the other hand, from the collection of letters signal
The middle energy for extracting regulation out, is matched using the energy as the information power supply circuits 16 that driving source will be stored in wireless IC chip 5
Into assigned frequency, then transmitted from the inductance component L 1, L2, L3 of power supply circuits 16 to radiant panel 20 by magnetic coupling and transmit letter
Number, and send from radiant panel 20 to read write line, transmit.Power supply circuits 16 pass through inductance component L 1, L5 realities with wireless IC chip 5
Existing magnetic coupling, so as to the transmission realized electric power, receive letter signal.
Particularly in this 19th embodiment, because humorous with the multiple LC comprising mutual magnetic-coupled inductance component L 2, L3
The circuit that shakes constitutes power supply circuits 16, therefore makes frequency band broaden as above-mentioned 17th embodiment.
(the 20th embodiment is with reference to Figure 37 and Figure 42)
As the Wireless IC device 1t of the 20th embodiment, constituted obtained from power supply circuits substrate 110 with single layer substrate
Device, its equivalent circuit is identical with Fig. 3.I.e. power supply circuits 16 be be connected by inductance component L and with its two ends capacity cell C1,
What the series resonant circuit of C2 compositions was constituted.Power supply circuits substrate 110 is the ceramic substrate being made up of dielectric, such as Figure 37 institutes
Show, front forms capacitance electrode 111a, 111b, reverse side forms capacitance electrode 112a, 112b and conductive pattern 113.With electric capacity electricity
Pole 111a, 112a form capacity cell C1, and with capacitance electrode 111b, 112b capacity cell C2 is formed.
The action effect of this 20th embodiment is substantially identical with above-mentioned 1st embodiment.That is, Wireless IC device 1t spokes
Penetrate plate 20 and receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make to realize magnetic coupling with radiant panel 20
Power supply circuits 16 (the LC series resonant circuits being made up of inductance component L and capacity cell C1, C2) the generation resonance of conjunction, and only
The collection of letters signal of allocated frequency band is supplied to into wireless IC chip 5.On the other hand, the energy of regulation is extracted out from the collection of letters signal,
Assigned frequency, Ran Houtong are matched into as the information power supply circuits 16 that driving source will be stored in wireless IC chip 5 using the energy
Cross magnetic coupling and letter signal is transmitted from the inductance component L of power supply circuits 16 to radiant panel 20, and from radiant panel 20 to read-write
Device sends, transmission.
Particularly in this 20th embodiment, as shown in Figure 38 and Figure 39, configuration inductance element is so that it is relative to wireless
IC chip 5 only overlaps in the case of vertical view.By so, nearly all not having with the magnetic flux produced by inductance component L
Covered by wireless IC chip, so that the rising of magnetic flux is good.
Also, in this 20th embodiment, as shown in figure 40, it is also possible to clipped between positive and negative with radiant panel 20,20 and taken
It is loaded with the power supply circuits substrate 110 of wireless IC chip.The magnetic coupling between power supply circuits 16 and radiant panel 20,20 can so be improved
Efficiency is closed, and improves gain.
As the form of the positive and negative that radiant panel 20,20 is configured at power supply circuits substrate 110, as shown in figure 41, also may be used
To be configured in x-axis in line, or can also be as shown in figure 42, it is configured in x-axis, y-axis.
(the 21st embodiment is with reference to Figure 43)
It is the device for using the line electrode pattern of (ミ ア Application ダ) that crawls to be formed as the Wireless IC device 1u of the 21st embodiment,
Equivalent circuit is identical with Fig. 3.That is, power supply circuits 16 are with inductance component L and are connected capacity cell C1, C2 with its two ends
What the LC series resonant circuits of composition were constituted.Power supply circuits substrate 110 is the ceramic layer substrate being made up of dielectric, is such as schemed
Shown in 43, front forms capacitance electrode 121a, 121b, and reverse side forms capacitance electrode 122a, 122b and the conductive pattern for crawling
123.Capacity cell C1 is formed with capacitance electrode 121a, 122a, with capacitance electrode 121b, 122b capacity cell C2 is formed.
The action effect of this 21st embodiment is substantially identical with above-mentioned 1st embodiment.That is, Wireless IC device 1u spokes
Penetrate plate 20 and receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make to realize magnetic coupling with radiant panel 20
Power supply circuits 16 (the LC series resonant circuits being made up of inductance component L and capacity cell C1, C2) the generation resonance of conjunction, and only
The collection of letters signal of allocated frequency band is supplied to into wireless IC chip 5.On the other hand, the energy of regulation is extracted out from the collection of letters signal,
Assigned frequency, Ran Houtong are matched into as the information power supply circuits 16 that driving source will be stored in wireless IC chip 5 using the energy
Cross magnetic coupling and letter signal is transmitted from the inductance component L of power supply circuits 16 to radiant panel 20, and from radiant panel 20 to read-write
Device sends, transmission.
Especially, in this 21st embodiment, due to constituting inductance component L, therefore energy with the conductive pattern 123 for crawling
Enough transmitting-receiving letters for effectively carrying out high-frequency signal.
In addition, in above-mentioned 20th embodiment and the embodiments of Ben 21, it is also possible to constitute power supply circuits with multilager base plate
Substrate 110.
(the 22nd embodiment is with reference to Figure 44 and Figure 45)
Used as the Wireless IC device 1v of the 22nd embodiment, as shown in the equivalent circuit of Figure 44, power supply circuits 16 possess and have phase
Used by capacity cell C1 and connection the inductance component L 1, L2 of mutual electromagnetic coupled (being represented with symbol M), one end of inductance component L 1
Electrode 131a is connected with wireless IC chip 5, while being connected with one end of inductance component L 2 by capacity cell C2.Also, inductance is first
The other end of part L1, L2 is connected respectively by connecting electrode 131b with wireless IC chip 5.In other words, power supply circuits 16 are wrapped
Include：The LC series resonant circuits that are made up of inductance component L 1 and capacity cell C1 and by inductance component L 2 and capacity cell
The LC series resonant circuits that C2 is constituted, and both inductance component Ls 1, L2 realizes magnetic coupling with radiant panel 20.
The structure of power supply circuits substrate 10 is as shown in figure 45.Connecting electrode 131a is by reach through hole conductor 132a and electric capacity
Electrode 133 connects, and capacitance electrode 133 is opposed with capacitance electrode 134 forming capacity cell C1.And, capacitance electrode 134 with electricity
Hold electrode 135 opposed to form capacity cell C2.Connecting electrode 131b is two strands by reach through hole conductor 132b and bifurcated
Conductive pattern 136a, 137a connect, and conductive pattern 136a is connected by reach through hole conductor 132c with conductive pattern 136b, and is led to
Cross reach through hole conductor 132d to be connected with conductive pattern 136c, and also connected by reach through hole conductor 132e and conductive pattern 136d
Connect, conductive pattern 136d is connected by reach through hole conductor 132f with capacitance electrode 134.
On the other hand, conductive pattern 137a is connected by reach through hole conductor 132g with conductive pattern 137b, and by wearing
Via conductors 132h is connected with conductive pattern 137c, and also is connected with capacitance electrode 135 by reach through hole conductor 132i.Conductor
Pattern 136a, 136b, 136c constitute inductance component L 1, and conductive pattern 137a, 137b, 137c constitute inductance component L 2.In addition,
In Figure 45, the diagram of the ceramic sheet material being made up of dielectric is omitted.
The action effect of this 22nd embodiment is substantially identical with above-mentioned 1st embodiment.That is, Wireless IC device 1v spokes
Penetrate plate 20 and receive the high-frequency signal (such as UHF band) given off from read write line (not shown), make mainly to realize with radiant panel 20
(the LC series resonant circuits that are made up of inductance component L 1 and capacity cell C1 and by inductance unit of magnetic-coupled power supply circuits 16
The LC series resonant circuits that part L2 and capacity cell C2 is constituted) there is resonance, and only by the collection of letters signal offer of allocated frequency band
To wireless IC chip 5.On the other hand, extract the energy of regulation out from the collection of letters signal, will be stored as driving source using the energy
Assigned frequency is matched in the information power supply circuits 16 of wireless IC chip 5, then by magnetic coupling from power supply circuits 16
Inductance component L 1, L2 to radiant panel 20 transmits letter signal, and sends from radiant panel 20 to read write line, transmits.
Especially, in this 22nd embodiment, configuration capacitance electrode 133,134,135 and inductor conductor pattern 136a～
136c, 137a～137c is so that it is parallel with radiant panel 20.Therefore, using inductor conductor pattern 136a～136c, 137a～
The magnetic field that 137c is formed will not be covered by capacitance electrode 133,134,135 such that it is able to be improved from inductor conductor pattern
The radiation characteristic of 136a～136c, 137a～137c.
(the 23rd embodiment is with reference to Figure 46)
It is to utilize to include the power supply circuits with the equivalent circuit shown in Figure 44 as the Wireless IC device of the 23rd embodiment
The situation that 16 power supply circuits substrate 10 is constituted.The power supply circuits substrate 10 as shown in figure 46, possesses and the confession shown in Figure 45
The substantially the same structure of electric circuit substrate 10, and be using inductor conductor pattern 136a～136c, 137a～137c shapes
Reflector (reflection graphic patterns) 138 and director (guided wave pattern) substrate obtained from 139 are set on the part in magnetic field.Reflector
138 and director 139 can be easily adjusted from power supply circuits 16 to the radiation characteristic of radiant panel 20 and directionality, and can
Strongly exclude affects to seek stablizing for resonance characteristic from outside magnetic field.The action effect of this 23rd embodiment is in above-mentioned the
22 embodiments are identical.
(the 24th embodiment is with reference to Figure 47 and Figure 48)
It is using the distributed constant type resonance formed by inverse-F antenna structure as the Wireless IC device 1w of the 24th embodiment
Circuit forms device obtained from power supply circuits 150, with the equivalent circuit shown in Figure 47.In detail, as shown in figure 48, by
The power supply circuits substrate 140 that ceramic multi-layer baseplate is constituted possesses：In being arranged at the high lateral electrode 151 of the 1st face 140a and being installed on
The capacitance electrode 152 in portion and it is arranged at the downside electrode 153 of the 2nd face 140b.High lateral electrode 151 is using magnetic coupling and electric capacity
Coupled electric is connected with radiant panel 20, while being connected with the high side terminal of wireless IC chip with energization pins 154.Downside terminal
153 are connected with the downside terminal of wireless IC chip 5, and are connected with high lateral electrode 151 by shorting pin 155.Capacitance electrode
152 is opposed with high lateral electrode 151 to form electric capacity, is connected with downside electrode 153 by shorting pin 156.
Wireless IC device 1w radiant panels 20 receive the high-frequency signal given off from read write line (not shown), make and radiation
Plate 20 realizes that magnetic coupling and capacity coupled power supply circuits 150 occur resonance, and only carries the collection of letters signal of allocated frequency band
Supply wireless IC chip 5.On the other hand, extract the energy of regulation out from the collection of letters signal, using the energy as driving source, will deposit
The information power supply circuits 150 for being stored in wireless IC chip 5 are matched as assigned frequency, then send out from radiant panel 20 to read write line
Send, transmit.
(the 25th embodiment is with reference to Figure 49 and Figure 50)
It is using the distributed constant type resonance formed by inverse-F antenna structure as the Wireless IC device 1x of the 25th embodiment
Circuit forms device obtained from power supply circuits 150, with the equivalent circuit shown in Figure 49.In detail, as shown in figure 50, by
The power supply circuits substrate 140 that ceramic multi-layer baseplate is constituted possesses to be arranged at and the high lateral electrode 161 of the 1st face 140a and is arranged at the 2nd
The downside electrode 162 of face 140b.High lateral electrode 161 is electrically connected using magnetic coupling and Capacitance Coupled with radiant panel 20, while
It is connected with the high side terminal of wireless IC chip 5 with energization pins 163.Downside terminal 162 connects with the downside terminal of wireless IC chip 5
Connect, and be connected with high lateral electrode 161 by shorting pin 164.
Wireless IC device 1x radiant panels 20 receive the high-frequency signal given off from read write line (not shown), make and radiation
Plate 20 realizes that magnetic coupling and capacity coupled power supply circuits 160 occur resonance, and only carries the collection of letters signal of allocated frequency band
Supply wireless IC chip 5.On the other hand, extract the energy of regulation out from the collection of letters signal, using the energy as driving source, will deposit
The information power supply circuits 160 for being stored in wireless IC chip 5 match into assigned frequency, then send from radiant panel 20 to read write line,
Transmission.
(the 26th embodiment is with reference to Figure 51 and Figure 52)
It is using the distributed constant type resonance formed by inverted l antenna structure as the Wireless IC device 1y of the 26th embodiment
Circuit forms device obtained from power supply circuits 170, with the equivalent circuit shown in Figure 51.In detail, as shown in figure 52, by
The power supply circuits substrate 140 that ceramic multi-layer baseplate is constituted possesses to be arranged at and the high lateral electrode 171 of the 1st face 140a and is arranged at the 2nd
The downside electrode 172 of face 140b.High lateral electrode 171 is electrically connected using magnetic coupling and Capacitance Coupled with radiant panel 20, while with
Energization pins 173 are connected with the high side terminal of wireless IC chip 5.Downside electrode 172 connects with the downside terminal of wireless IC chip 5
Connect.
Wireless IC device 1y radiant panels 20 receive the high-frequency signal given off from read write line (not shown), make and radiation
Plate 20 realizes that magnetic coupling and capacity coupled power supply circuits 170 occur resonance, and only carries the collection of letters signal of allocated frequency band
Supply wireless IC chip 5.On the other hand, extract the energy of regulation out from the collection of letters signal, using the energy as driving source, will deposit
The information power supply circuits 170 for being stored in wireless IC chip 5 match into assigned frequency, then send from radiant panel 20 to read write line,
Transmission.
(the 27th embodiment is with reference to Figure 53 and Figure 54)
It is using the distributed constant type resonance formed by inverted l antenna structure as the Wireless IC device 1z of the 27th embodiment
Circuit forms device obtained from power supply circuits 180, with the equivalent circuit shown in Figure 53.In detail, as shown in figure 54, by
The power supply circuits substrate 140 that ceramic multi-layer baseplate is constituted possesses to be arranged at and the high lateral electrode 181 of the 1st face 140a and is installed on inside
Capacitance electrode 182 and be arranged at the downside electrode 183 of the 2nd face 140b.High lateral electrode 181 is using magnetic coupling and electric capacity coupling
Conjunction is electrically connected with radiant panel 20.Capacitance electrode 182 is opposed with high lateral electrode 181 to form electric capacity, with energization pins 184 with it is wireless
The high side terminal connection of IC chip 5.Downside terminal 183 is connected with the downside terminal of wireless IC chip 5, and by shorting pin
185 are connected with high lateral electrode 181.
Wireless IC device 1z radiant panels 20 receive the high-frequency signal given off from read write line (not shown), make and radiation
Plate 20 realizes that magnetic coupling and capacity coupled power supply circuits 180 occur resonance, and only carries the collection of letters signal of allocated frequency band
Supply wireless IC chip 5.On the other hand, extract the energy of regulation out from the collection of letters signal, using the energy as driving source, will deposit
The information power supply circuits 180 for being stored in wireless IC chip 5 match into assigned frequency, then send from radiant panel 20 to read write line,
Transmission.
(the 28th embodiment is with reference to Figure 55)
It is by wireless IC chip 5 and power supply circuits substrate as shown in figure 55 as the Wireless IC device 2a of the 28th embodiment
10 are equipped on rigid circuit board 8 and are arranged side-by-side, and power supply circuits substrate 10 is adhered to into radiant panel with bonding agent 18
Device obtained from 20.For example, power supply circuits substrate 10 is the structure that inside is provided with the power supply circuits 16 shown in Fig. 2, and
And electrically connected with wireless IC chip 5 using the multiple conductors 9 being arranged on circuit board 8.
Even if on Wireless IC device 2a, power supply circuits 16 also mainly with radiant panel 20 realize magnetic coupling, with the above-mentioned 1st
Embodiment plays identical effect, and exchanges signal with read write line.Further, in this 28th embodiment, as power supply circuits base
Plate 10, in addition to the substrate shown in the 1st embodiment, it is also possible to using the substrate shown in the various embodiments described above.This point is under
29th embodiment of face explanation is also identical.
(the 29th embodiment is with reference to Figure 56)
It is in wiring relative to above-mentioned 28th embodiment as shown in figure 56 as the Wireless IC device 2b of the 29th embodiment
Paste a radiant panel 20 on substrate 8 again, and with a pair of radiant panels 20,20 clamp wireless IC chip 5, power supply circuits substrate 10,
And device obtained from circuit board 8.Its effect is identical with the 28th embodiment, can particularly improve power supply circuits 16 and spoke
Penetrate the magnetic coupling efficiency of plate 20,20.
(the 30th embodiment is with reference to Figure 57)
It is right with left and right on the surface of resin film 21 as shown in figure 57 as the Wireless IC device 2c of the 30th embodiment
Shape is claimed to be provided as the radiant panel 22 of dual closed-loop path shape, and the central portion in the inner loop of the radiant panel 22 is matched somebody with somebody
Put and be equipped with situation obtained from the power supply circuits substrate 10 of wireless IC chip 5.
In this 30th embodiment, power supply circuits substrate 10 is not pasted onto on radiant panel 22, and is arranged near radiation
The position of plate 22.It is additionally, since radiant panel 22 and is formed as loop shape, so the straight length of radiant panel 22 reduces.Even if
In this structure, it is also possible to make power supply circuits substrate 10 realize that electromagnetic induction is coupled with radiant panel 22, with the various embodiments described above one
Sample carries out giving and accepting for signal, and can exchange signal with read write line.In addition, power supply circuits substrate 10 can be configured at radiant panel
22 substantially central portion, and there is no high request to positional precision.
(the 31st embodiment is with reference to Figure 58)
It is right with left and right on the surface of resin film 21 as shown in figure 58 as the Wireless IC device 2d of the 31st embodiment
Claim to arrange combination and crawl shape, loop shape and Vorticose radiant panel 23, and in the inner side loop of the radiant panel 23
Central part configuration is equipped with device obtained from the power supply circuits substrate 10 of wireless IC chip 5.
Even if in this 31st embodiment, power supply circuits substrate 10 is not pasted onto on radiant panel 23, and is configured in radiant panel
Near 23.And, because radiant panel 23 is formed as combination and crawls shape, loop shape and swirl shape, radiant panel
23 straight length reduces.Even if in such a configuration, it is also possible to make power supply circuits substrate 10 realize electromagnetism with radiant panel 23
Inductively, giving and accepting for signal is carried out as the various embodiments described above, and exchanging for signal can be carried out with read write line.And
As above-mentioned 30th embodiment, for the configuration of power supply circuits substrate 10 is without so high position accuracy demand.
(other embodiment)
Further, Wireless IC device of the invention is not limited to above-described embodiment, can there is various changes in the range of its purport
More.
For example, the thin portion shape of the details of the internal structure of power supply circuits substrate, radiant panel and film is arbitrary.Separately
Outward, wireless IC chip and power supply circuits substrate connection can also be adopted the process beyond scolding tin salient point.And, power supply circuits base
Plate is also not necessarily rigid substrates, it is also possible to constitute conduct with organic resin material (such as polyimides or liquid crystal polymer)
Flexible base board.
Industrial practicality
As described above, the present invention is useful for power supply circuits, particularly with stable frequency characteristic and reality
It is now very prominent on this aspect of broadband.
Claims (30)
1. a kind of Wireless IC device of the frequency band for more than UHF band, it is characterised in that
Possess：
Wireless IC chip；
It is connected with the wireless IC chip, and be provided with the power supply circuits of the resonance circuit comprising the resonant frequency with regulation
Power supply circuits substrate；And
Bonding or the close configuration power supply circuits substrate, and the letter signal that transmitting is provided by the power supply circuits, and/
Or collection of letters signal is received to be supplied to the radiant panel of the power supply circuits,
The power supply circuits are included with the resonance circuit of the frequency resonance of receiving and transmitting signal, and are built in the power supply circuits substrate
It is interior,
The radiant panel is cuboid, the i.e. metallic object of both ends open type being made up of nonmagnetic material,
The frequency of the signal given off from the radiant panel is determined by the resonant frequency of the power supply circuits.
2. Wireless IC device as described in claim 1, it is characterised in that
The wireless IC chip is arranged side-by-side on circuit board with the power supply circuits substrate, while by being arranged at the wiring
Conductor on substrate is attached.
3. a kind of Wireless IC device of the frequency band for more than UHF band, it is characterised in that
Possess：
Wireless IC chip；
The wireless IC chip is carried, and is provided with the confession of the power supply circuits of the resonance circuit comprising the resonant frequency with regulation
Electric circuit substrate；And
Bonding or the close configuration power supply circuits substrate, and the letter signal that transmitting is provided by the power supply circuits, and/
Or collection of letters signal is received to be supplied to the radiant panel of the power supply circuits,
The power supply circuits are included with the resonance circuit of the frequency resonance of receiving and transmitting signal, and are built in the power supply circuits substrate
It is interior,
The radiant panel is cuboid, the i.e. metallic object of both ends open type being made up of nonmagnetic material,
The frequency of the signal given off from the radiant panel is determined by the resonant frequency of the power supply circuits.
4. the Wireless IC device as described in claim 1 or 3, it is characterised in that
The frequency of the frequency of the letter signal and the collection of letters signal is substantially by the resonance of the power supply circuits substrate
What the resonant frequency of circuit was determined.
5. the Wireless IC device as described in claim 1 or 3, it is characterised in that
The radiant panel is configured on the positive and negative of the power supply circuits substrate.
6. the Wireless IC device as described in claim 1 or 3, it is characterised in that
The resonance circuit is distributed constant type resonance circuit.
7. the Wireless IC device as described in claim 1 or 3, it is characterised in that
The resonance circuit is the lumped constant type resonance circuit being made up of capacitance pattern and inductive patterns.
8. Wireless IC device as described in claim 7, it is characterised in that
The lumped constant type resonance circuit is LC series resonant circuits or LC antiresonant circuits.
9. Wireless IC device as described in claim 8, it is characterised in that
The structure of the lumped constant type resonance circuit includes multiple LC series resonant circuits or multiple LC antiresonant circuits.
10. Wireless IC device as claimed in claim 7, it is characterised in that
The capacitor pattern is configured at the rear class of the wireless IC chip, and is configured at the wireless IC chip and the inductance
Between pattern.
11. Wireless IC devices as claimed in claim 7, it is characterised in that
The capacitor pattern and the inductive patterns are configured so that it is parallel with the radiant panel.
12. Wireless IC devices as described in claim 11, it is characterised in that
Reflector and/or director are configured in the part that magnetic field is formed by the inductive patterns.
13. Wireless IC devices as claimed in claim 7, it is characterised in that
The power supply circuits substrate is laminated multi-layer dielectric layer or magnetic layer and the multilager base plate that formed；The capacitor figure
Case and the inductive patterns are formed at the surface and/or inside of the multilager base plate.
14. Wireless IC devices as claimed in claim 7, it is characterised in that
The power supply circuits substrate is the single layer substrate of dielectric or magnetic；The capacitor pattern and/or the inductance figure
Case is formed at the surface of single multilager base plate.
15. Wireless IC devices as described in claim 1 or 3, it is characterised in that
The power supply circuits substrate is rigid substrates；What the flexible metal film that the radiant panel is was formed.
16. Wireless IC devices as described in claim 15, it is characterised in that
The flexible metal film is supported on pliability resin film.
17. Wireless IC devices as described in claim 1 or 3, it is characterised in that
The electrical length of the radiant panel is the integral multiple of the half-wavelength of the resonant frequency.
18. Wireless IC devices as described in claim 1 or 3, it is characterised in that
It is provided with the wireless IC chip on chip side electrode pattern, and power supply circuits substrate and is provided with the 1st substrate-side electricity
Pole figure case, the wireless IC chip is with the power supply circuits substrate using the chip side electrode pattern and the 1st substrate-side
Connection is realized in the DC connections of electrode pattern.
19. Wireless IC devices as described in claim 1 or 3, it is characterised in that
It is provided with the wireless IC chip on chip side electrode pattern, and power supply circuits substrate and is provided with the 1st substrate-side electricity
Pole figure case, the wireless IC chip is with the power supply circuits substrate using the chip side electrode pattern and the 1st substrate-side
Capacitance Coupled between electrode pattern realizes connection.
20. Wireless IC devices as described in claim 19, it is characterised in that
The chip side electrode pattern and the 1st substrate-side electrode pattern are respectively the plane electrode patterns being parallel to each other,
The wireless IC chip is realized engaging with the power supply circuits substrate by insulating properties adhesive linkage.
21. Wireless IC devices as described in claim 1 or 3, it is characterised in that
Arrange in the wireless IC chip due to chip side electrode pattern, and the 1st base is provided with the power supply circuits substrate
Plate lateral electrode pattern, the wireless IC chip utilizes the chip side electrode pattern and the described 1st with the power supply circuits substrate
Magnetic coupling between substrate-side electrode pattern realizes connection.
22. Wireless IC devices as described in claim 21, it is characterised in that
The chip side electrode pattern and the 1st substrate-side electrode pattern are respectively coiled type electrode patterns, described wireless
IC chip is realized engaging with the power supply circuits substrate by insulating properties adhesive linkage.
23. Wireless IC devices as described in claim 1 or 3, it is characterised in that
The 2nd substrate-side electrode pattern, the power supply circuits substrate and radiant panel profit are provided with the power supply circuits substrate
It is connected realization connection with the DC of the radiant panel with the 2nd substrate-side electrode pattern.
24. Wireless IC devices as described in claim 1 or 3, it is characterised in that
The 2nd substrate-side electrode pattern, the power supply circuits substrate and radiant panel profit are provided with the power supply circuits substrate
Connection is realized with the Capacitance Coupled between the 2nd substrate-side electrode pattern and the radiant panel.
25. Wireless IC devices as described in claim 24, it is characterised in that
The 2nd substrate-side electrode pattern is the plane electrode pattern abreast configured with the radiant panel, the power supply
Circuit substrate is realized engaging with the radiant panel by insulating properties adhesive linkage.
26. Wireless IC devices as described in claim 1 or 3, it is characterised in that
The 2nd substrate-side electrode pattern, the power supply circuits substrate and radiant panel profit are provided with the power supply circuits substrate
Connection is realized with the magnetic coupling between the 2nd substrate-side electrode pattern and the radiant panel.
27. Wireless IC devices as described in claim 26, it is characterised in that
The 2nd substrate-side electrode pattern is coiled type electrode pattern, and the power supply circuits substrate is with the radiant panel by exhausted
Edge adhesive linkage realizes engagement.
28. Wireless IC devices as described in claim 27, it is characterised in that
The coiled type electrode pattern is formed so that its wireline reel is parallel with the radiant panel.
29. Wireless IC devices as described in claim 27, it is characterised in that
The coiled type electrode pattern is formed so that its wireline reel is vertical with the radiant panel.
30. Wireless IC devices as described in claim 29, it is characterised in that
The coiled type electrode pattern is formed so that its winding width slowly becomes big towards the radiant panel direction.
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006011626 | 2006-01-19 | ||
| JP2006-011626 | 2006-01-19 | ||
| JP2006079099 | 2006-03-22 | ||
| JP2006-079099 | 2006-03-22 | ||
| JP2006146258 | 2006-05-26 | ||
| JP2006-146258 | 2006-05-26 | ||
| JP2006182685 | 2006-06-30 | ||
| JP2006-182685 | 2006-06-30 | ||
| JP2006236777 | 2006-08-31 | ||
| JP2006-236777 | 2006-08-31 | ||
| CNA2007800010745A CN101351924A (en) | 2006-01-19 | 2007-01-12 | Radio IC device and radio IC device part |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007800010745A Division CN101351924A (en) | 2006-01-19 | 2007-01-12 | Radio IC device and radio IC device part |
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| Publication Number | Publication Date |
|---|---|
| CN106599980A true CN106599980A (en) | 2017-04-26 |
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| CNA2007800010745A Pending CN101351924A (en) | 2006-01-19 | 2007-01-12 | Radio IC device and radio IC device part |
| CN201710080855.3A Pending CN106599980A (en) | 2006-01-19 | 2007-01-12 | Radio IC device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
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| CNA2007800010745A Pending CN101351924A (en) | 2006-01-19 | 2007-01-12 | Radio IC device and radio IC device part |
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| CN (2) | CN101351924A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112585820A (en) * | 2018-10-10 | 2021-03-30 | 欧姆龙株式会社 | Electronic device |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102204011B (en) * | 2009-01-16 | 2013-12-25 | 株式会社村田制作所 | High frequency device and wireless IC device |
| JP5267578B2 (en) * | 2009-01-30 | 2013-08-21 | 株式会社村田製作所 | Antenna and wireless IC device |
| WO2010113776A1 (en) * | 2009-03-31 | 2010-10-07 | 株式会社村田製作所 | Signal transmission communication unit and coupler |
| CN102474009B (en) * | 2009-07-03 | 2015-01-07 | 株式会社村田制作所 | Antenna and antenna module |
| JP5240215B2 (en) * | 2010-02-17 | 2013-07-17 | 日立電線株式会社 | Circuit board and power conversion device using the same |
| CN102111465A (en) * | 2011-01-25 | 2011-06-29 | 杭州电子科技大学 | Coupled radio frequency identification mobile phone based on double-interface SIM (Subscriber Identity Module) card |
| CN102169872B (en) * | 2011-01-26 | 2013-07-03 | 上海腾怡半导体有限公司 | Power module of integrated inductor |
| TWI463639B (en) | 2011-01-28 | 2014-12-01 | Xintec Inc | Capacitive coupler package structure |
| WO2012137717A1 (en) | 2011-04-05 | 2012-10-11 | 株式会社村田製作所 | Wireless communication device |
| CN108235792B (en) * | 2016-10-21 | 2021-01-26 | 京瓷株式会社 | Substrate for tag, RFID tag, and RFID system |
| JP6473210B1 (en) * | 2017-11-02 | 2019-02-20 | 株式会社エスケーエレクトロニクス | LC resonant antenna |
| WO2021044931A1 (en) * | 2019-09-05 | 2021-03-11 | 株式会社村田製作所 | Medical-purpose metal tool provided with wireless ic tag |
| JP6912024B1 (en) * | 2019-09-05 | 2021-07-28 | 株式会社村田製作所 | Medical metal device with wireless IC tag |
| CN113016045B (en) * | 2019-10-18 | 2023-03-10 | 株式会社村田制作所 | Metal medical instrument with wireless IC tag |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| CN1294727A (en) * | 1998-06-08 | 2001-05-09 | 美国3M公司 | Identification tag with enhanced security |
| JP2001168628A (en) * | 1999-12-06 | 2001-06-22 | Smart Card Technologies:Kk | Auxiliary antenna for ic card |
| CN1308386A (en) * | 2000-02-04 | 2001-08-15 | 株式会社村田制作所 | Surface mounted antenna and communication equipment with the said antenna |
| WO2002007084A1 (en) * | 2000-07-18 | 2002-01-24 | Marconi Corporation P.L.C. | Wireless pallet communication device and method |
| WO2002070859A1 (en) * | 2001-02-28 | 2002-09-12 | Kellogg Brown & Root, Inc. | Controlled wellhead buoy |
| CN1392631A (en) * | 2001-06-20 | 2003-01-22 | 株式会社村田制作所 | Surface mounted antenna and radio machine using surface mounted antenna |
| WO2003079305A1 (en) * | 2002-03-13 | 2003-09-25 | Celis Semiconductor Corporation | Integrated circuit with enhanced coupling |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0704928A3 (en) * | 1994-09-30 | 1998-08-05 | HID Corporation | RF transponder system with parallel resonant interrogation and series resonant response |
| US5955723A (en) * | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
| US6628237B1 (en) * | 2000-03-25 | 2003-09-30 | Marconi Communications Inc. | Remote communication using slot antenna |
| US6483473B1 (en) * | 2000-07-18 | 2002-11-19 | Marconi Communications Inc. | Wireless communication device and method |
| JP4348282B2 (en) * | 2004-06-11 | 2009-10-21 | 株式会社日立製作所 | Wireless IC tag and method of manufacturing wireless IC tag |
-
2007
- 2007-01-12 CN CNA2007800010745A patent/CN101351924A/en active Pending
- 2007-01-12 CN CN201710080855.3A patent/CN106599980A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1294727A (en) * | 1998-06-08 | 2001-05-09 | 美国3M公司 | Identification tag with enhanced security |
| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| JP2001168628A (en) * | 1999-12-06 | 2001-06-22 | Smart Card Technologies:Kk | Auxiliary antenna for ic card |
| CN1308386A (en) * | 2000-02-04 | 2001-08-15 | 株式会社村田制作所 | Surface mounted antenna and communication equipment with the said antenna |
| WO2002007084A1 (en) * | 2000-07-18 | 2002-01-24 | Marconi Corporation P.L.C. | Wireless pallet communication device and method |
| WO2002070859A1 (en) * | 2001-02-28 | 2002-09-12 | Kellogg Brown & Root, Inc. | Controlled wellhead buoy |
| CN1392631A (en) * | 2001-06-20 | 2003-01-22 | 株式会社村田制作所 | Surface mounted antenna and radio machine using surface mounted antenna |
| WO2003079305A1 (en) * | 2002-03-13 | 2003-09-25 | Celis Semiconductor Corporation | Integrated circuit with enhanced coupling |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112585820A (en) * | 2018-10-10 | 2021-03-30 | 欧姆龙株式会社 | Electronic device |
| CN112585820B (en) * | 2018-10-10 | 2024-04-09 | 欧姆龙株式会社 | Electronic equipment |
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|---|---|
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