CN106590459A - High temperature-resistant adhesive tape used for photovoltaic assembly battery piece positioning, and production method thereof - Google Patents
High temperature-resistant adhesive tape used for photovoltaic assembly battery piece positioning, and production method thereof Download PDFInfo
- Publication number
- CN106590459A CN106590459A CN201611205726.4A CN201611205726A CN106590459A CN 106590459 A CN106590459 A CN 106590459A CN 201611205726 A CN201611205726 A CN 201611205726A CN 106590459 A CN106590459 A CN 106590459A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- firming agent
- high temperature
- film
- coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 86
- 239000011347 resin Substances 0.000 claims abstract description 71
- 229920005989 resin Polymers 0.000 claims abstract description 71
- 239000010410 layer Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 32
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000011256 inorganic filler Substances 0.000 claims abstract description 28
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 28
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000012790 adhesive layer Substances 0.000 claims abstract description 19
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 12
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 229920002313 fluoropolymer Polymers 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 239000002250 absorbent Substances 0.000 claims abstract description 6
- 230000002745 absorbent Effects 0.000 claims abstract description 6
- 229920006267 polyester film Polymers 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims description 92
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 74
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 49
- 239000003292 glue Substances 0.000 claims description 41
- 239000011248 coating agent Substances 0.000 claims description 33
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 22
- 239000007787 solid Substances 0.000 claims description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000002360 preparation method Methods 0.000 claims description 16
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 15
- 150000001412 amines Chemical class 0.000 claims description 12
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 12
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 11
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 11
- 239000004408 titanium dioxide Substances 0.000 claims description 11
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 10
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 10
- 239000012948 isocyanate Substances 0.000 claims description 10
- 150000002513 isocyanates Chemical class 0.000 claims description 10
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 claims description 9
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 claims description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 238000006471 dimerization reaction Methods 0.000 claims description 9
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 9
- 230000008676 import Effects 0.000 claims description 9
- 238000010992 reflux Methods 0.000 claims description 9
- 230000005070 ripening Effects 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 claims description 7
- -1 polytrifluorochloroethylene Polymers 0.000 claims description 7
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229950000845 politef Drugs 0.000 claims description 6
- 239000008262 pumice Substances 0.000 claims description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 5
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 claims description 5
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 5
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 4
- 229920001774 Perfluoroether Polymers 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229940058401 polytetrafluoroethylene Drugs 0.000 claims description 4
- 229940117958 vinyl acetate Drugs 0.000 claims description 4
- 229920001038 ethylene copolymer Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical group O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 claims description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 2
- 238000010790 dilution Methods 0.000 claims description 2
- 239000012895 dilution Substances 0.000 claims description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 2
- 239000004848 polyfunctional curative Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 2
- 229910052731 fluorine Inorganic materials 0.000 claims 2
- 239000011737 fluorine Substances 0.000 claims 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 1
- 229920006266 Vinyl film Polymers 0.000 claims 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 229940074391 gallic acid Drugs 0.000 claims 1
- 235000004515 gallic acid Nutrition 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 239000011247 coating layer Substances 0.000 abstract 6
- 239000002313 adhesive film Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 25
- 238000012360 testing method Methods 0.000 description 22
- 239000012528 membrane Substances 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000004383 yellowing Methods 0.000 description 4
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 3
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 3
- ZHPNWZCWUUJAJC-UHFFFAOYSA-N fluorosilicon Chemical compound [Si]F ZHPNWZCWUUJAJC-UHFFFAOYSA-N 0.000 description 3
- 241000790917 Dioxys <bee> Species 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 229910003978 SiClx Inorganic materials 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000011087 paperboard Substances 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 244000147058 Derris elliptica Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 210000004247 hand Anatomy 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/203—Adhesives in the form of films or foils characterised by their carriers characterised by the structure of the release feature on the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/005—Presence of halogenated polymer in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high temperature-resistant adhesive tape used for photovoltaic assembly battery piece positioning. The adhesive tape sequentially comprises an adhesive layer, a substrate layer and an f coating layer from top to bottom, wherein the f coating layer comprises organic resin, a curing agent and an inorganic filler, and the substrate layer is a fluoroplastic film or a polyester film. The invention also provides a production method of the adhesive tape. An acrylic acid adhesive is specially modified, that is, an antioxidant and an ultraviolet absorbent are introduced to an adhesive system in order to greatly improve the yellow stain performance of the adhesive tape. The back side of the substrate layer is coated with the transparent f coating layer, so the substrate layer does not yellow, and makes the stability of the bonding force between the f coating layer surface and the adhesive film good; and the f coating layer has a certain release effect, so the unsmooth operating phenomenon caused by large bonding force between the adhesive surface and the f coating layer surface in the adhesive tape use process of a user is avoided.
Description
Technical field
The present invention relates to tape technology field, particularly relates to a kind of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape
And preparation method thereof.
Background technology
Core component cell piece in solar components, it is when hot pressing is carried out because glued membrane mobility sends out can cell piece
Movement is sent, therefore can use the fixation that cell piece is carried out to high temperature resistant locating adhesive tape.At present, the high temperature resistant for being used on the market is determined
Position adhesive tape is all the coated with acrylic pressure sensitive glue with PET as base material, but the hot pressing at high temperature of such product, typically results in adhesive tape change
Shape, xanthochromia and it is not enough with glued membrane bonding force the shortcomings of.It is additionally, since glue surface directly to wind with PET base material, between causing
Bonding force is big, and client uses the phenomenon for occurring tearing hardly possible during adhesive tape.
Therefore, the present inventor needs a kind of new technique of design badly to improve its problem.
The content of the invention
The present invention is intended to provide a kind of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape and preparation method thereof, it has excellent
Different weather-proof, high temperature resistant, anti-yellowing property, the two-sided cohesive force to glued membrane of adhesive tape is very strong.Meanwhile, can solve client makes
Adhesive tape tears the problem of hardly possible with during.
To solve above-mentioned technical problem, the technical scheme is that：
A kind of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape, includes successively from top to bottom adhesive layer, substrate layer, f
Coating, wherein the f coatings include organic resin, firming agent and inorganic filler, the substrate layer is fluoroplastics film or polyester
Film.
Preferably, in the f coatings organic resin selected from politef fluorocarbon resin, poly- difluoroethylene fluorocarbon resin,
One or more in perfluorinated resin, fluoroacrylic resin, fluorine silicon resin.
Preferably, the firming agent in the f coatings selected from isocyanates system firming agent, imidazole curing agent, hydrazides firming agent,
One or more in amine resin firming agent, amine curing agent and cyanamid dimerization system firming agent.
Preferably, inorganic filler is selected from titanium dioxide, the aluminum of titanium dioxide two, aluminium hydroxide, Pulvis Talci, dioxy in the f coatings
In SiClx, Calcium Carbonate, white carbon black, mica powder, barium sulfate, kieselguhr, pumice, bortz powder one or more.
Preferably, the adhesive layer is made up of modified acroleic acid esters adhesive.
Preferably, one or more of described fluoroplastics film in following film：Poly tetrafluoroethylene, perfluoroethylene third
Alkene copolymer film, poly- perfluoroalkoxy resin film, polytrifluorochloroethylene film, ethylene-chlorotrifluoro-ethylene copolymer film, ethylene-four
Fluoride copolymers film, polyvinylidene fluoride film, pvf film.
A kind of preparation method of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape as described above, including following step
Suddenly：
S1：The f coatings are coated on substrate layer of the thickness between 25-50 μm, coating thickness is between 5-20 μm；
S2：Take and step figure selected from acrylic acid methyl ester., acrylic acid -2- hydroxyl ethyl esters, acrylic acid, vinylacetate, the U.S.
One or more compounds in tertiary ethylene carbonate VEOVA10, the acrylic acid-2-ethyl caproite of Momentive are used as other
Compound, mixs homogeneously with butyl acrylate, adds into reaction vessel, adds EAC solvents, adds azodiisobutyronitrile to cause
Agent, under conditions of logical nitrogen, reacting by heating after reaction terminates, with reaction dissolvent dilution adjustment solid content, obtains synthetic glue；
S3：The synthetic glue that the mass fraction that step S2 prepares is 100 parts is taken, adds the mass fraction to be
Firming agent, antioxidant that mass fraction be 0.02-0.04 part of the tackifying resin, mass fraction of 20-50 parts for 0.1-1.5 parts
1010th, mass fraction is the UV absorbent of 0.03-0.07 parts, adjusts the solid back side for containing and coating the substrate layer with f coatings, so
After directly wound.
Preferably, one or more of described tackifying resin in Petropols, rosin resin；The firming agent choosing
One or more from epoxy hardener, isocyanates firming agent；Described UV absorbent are ultraviolet for BASF BASF's
Absorbent TINUVIN326.
Preferably, step S2 is specifically included：Possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit
Middle addition 90 parts of butyl acrylate BA, 7.5 parts of VEOVA10,2 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA is added
100 parts of ethyl acetate EAC, import nitrogen gas stirring half an hour, are slowly warmed up to 70 DEG C, add 0.2 part of AIBN, under nitrogen protection
Reaction 5 hours, is finally adjusted to solid content for 40% synthetic glue with ethyl acetate；
Step S3 is specifically included：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of oil trees are added
Fat FTR6100, adds 0.2 part of epoxiess firming agent NX-100E, adds 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber
TINUVIN326, with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is 25 μm, multiple respectively
Together on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
Preferably, the thickness of the substrate layer is 50 μm, and the thickness of the adhesive layer is 25 μm, the thickness of the f coatings
Spend for 5 μm.
Using above-mentioned technical proposal, the present invention at least includes following beneficial effect：
Photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape of the present invention and preparation method thereof, by acrylate glue
Glutinous agent carries out special modified, i.e., antioxidant and ultraviolet absorber are introduced in glue system, can greatly improve the property such as xanthochromia of adhesive tape
Energy.Meanwhile, in the transparent f coatings of the backsize of substrate layer, can cause base material non yellowing can also cause f coat sides and glued membrane it
Between bonding force good stability, while f coatings have certain release effect, client is not in during using adhesive tape
Glue surface and f coat side bonding forces be big to wait operation to have some setbacks phenomenon.
Specific embodiment
Embodiments of the present invention are illustrated below by way of specific instantiation, those skilled in the art can be by this specification
Disclosed content understands easily other advantages and effect of the present invention.The present invention can also pass through concrete realities different in addition
The mode of applying is carried out or applies, the every details in this specification can also based on different viewpoints with application, without departing from
Various modifications and changes are carried out under the spirit of the present invention.
A kind of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape, includes successively from top to bottom adhesive layer, substrate layer, f
Coating, wherein the f coatings include organic resin, firming agent and inorganic filler, the substrate layer is fluoroplastics film or polyester
Film.
The structure larger, the stripping Jing after burn-in test that enables to its bonding force between glued membrane in actual applications
The little, anti-yellowing property of power decay is excellent, simultaneously because the presence of f coatings so that adhesive layer interface and f coating interface bonding forces
Little, client is not in tear difficult operation phenomenon during using adhesive tape；The f coatings are relative on the another side of substrate layer
Adhesive layer is provided with, it enables to cell piece and unshifts in heat zone pressure, while bonding force is big after glue surface and glued membrane hot pressing,
Will not xanthochromia.
Preferably, in the f coatings organic resin selected from politef fluorocarbon resin, poly- difluoroethylene fluorocarbon resin,
One or more in perfluorinated resin, fluoroacrylic resin, fluorine silicon resin.
Preferably, the firming agent in the f coatings selected from isocyanates system firming agent, imidazole curing agent, hydrazides firming agent,
One or more in amine resin firming agent, amine curing agent and cyanamid dimerization system firming agent.
Preferably, inorganic filler is selected from titanium dioxide, the aluminum of titanium dioxide two, aluminium hydroxide, Pulvis Talci, dioxy in the f coatings
In SiClx, Calcium Carbonate, white carbon black, mica powder, barium sulfate, kieselguhr, pumice, bortz powder one or more.
Preferably, the adhesive layer is made up of modified acroleic acid esters adhesive.
Preferably, one or more of described fluoroplastics film in following film：Poly tetrafluoroethylene, perfluoroethylene third
Alkene copolymer film, poly- perfluoroalkoxy resin film, polytrifluorochloroethylene film, ethylene-chlorotrifluoro-ethylene copolymer film, ethylene-four
Fluoride copolymers film, polyvinylidene fluoride film, pvf film.
Embodiment 1
The preparation of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape in the present embodiment comprises the steps：
S1：The f coatings are coated on the substrate layer that thickness is 25 μm, coating thickness is 5 μm；
Wherein described f coatings include organic resin, firming agent and inorganic filler；Organic resin is accounted for
10%, firming agent accounts for 20%, and inorganic filler accounts for 70%.
Organic resin is the compositionss of politef fluorocarbon resin and poly- difluoroethylene fluorocarbon resin in the f coatings,
The two shared weight is 1:1.
Firming agent in the f coatings is the compositionss of isocyanates system firming agent and imidazole curing agent, shared by the two
Weight is 1:3.
In the f coatings inorganic filler for titanium dioxide, the aluminum of titanium dioxide two and aluminium hydroxide mixture, the weight shared by three
Amount is than being 1:2:3.
The substrate layer is fluoroplastics film.
S2：90 parts of butyl acrylate BA are added in possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit,
7.5 parts of VEOVA10 (stepping figure Momentive), 2 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA adds 100 parts of acetic acid
Ethyl ester EAC, imports nitrogen gas stirring half an hour, is slowly warmed up to 70 DEG C, adds 0.2 part of AIBN, and under nitrogen protection reaction 5 is little
When, finally solid content is adjusted to for 40% synthetic glue with ethyl acetate；
S3：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of Petropols FTR6100 (three wells) are added,
0.2 part of epoxiess firming agent NX-100E (Japan is comprehensive to grind) is added, 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber is added
TINUVIN326 (BASF BASF), with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is
25 μm, it is compound in respectively on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
Embodiment 2
The preparation of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape in the present embodiment comprises the steps：
S1：The f coatings are coated on the substrate layer that thickness is 30 μm, coating thickness is 10 μm；
Wherein described f coatings include organic resin, firming agent and inorganic filler；Organic resin is accounted for
5%, firming agent accounts for 25%, and inorganic filler accounts for 70%.
Organic resin is politef fluorocarbon resin in the f coatings.
Firming agent in the f coatings is hydrazides firming agent, amine resin firming agent, amine curing agent and cyanamid dimerization system
The compositionss of firming agent, the weight ratio shared by four is 1:2:3：1.
Preferably, inorganic filler is Pulvis Talci, silicon dioxide, the mixture of Calcium Carbonate in the f coatings, shared by three
Weight ratio is 2:2:5.
The substrate layer is polyester film.
S2：90 parts of butyl acrylate BA are added in possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit,
7.5 parts of VEOVA10 (stepping figure Momentive), 2 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA adds 100 parts of acetic acid
Ethyl ester EAC, imports nitrogen gas stirring half an hour, is slowly warmed up to 70 DEG C, adds 0.2 part of AIBN, and under nitrogen protection reaction 5 is little
When, finally solid content is adjusted to for 40% synthetic glue with ethyl acetate；
S3：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of hydrogenated rosin KS2100 (section's cyclopentadienyl) are added,
1 part of isocyanates firming agent TP-100 (Asahi Chemical Industry) is added, 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber is added
TINUVIN326 (BASF BASF), with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is
15 μm, it is compound in respectively on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
Embodiment 3
The preparation of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape in the present embodiment comprises the steps：
S1：The f coatings are coated on the substrate layer that thickness is 50 μm, coating thickness is 5 μm；
Wherein described f coatings include organic resin, firming agent and inorganic filler；Organic resin is accounted for
15%, firming agent accounts for 15%, and inorganic filler accounts for 70%.
Organic resin is poly- difluoroethylene fluorocarbon resin in the f coatings.
Firming agent in the f coatings is isocyanates system firming agent, hydrazides firming agent, amine resin firming agent and dimerization
Compositionss in cyanamide system firming agent, the weight ratio shared by four is 2:2:3：2.
Preferably, inorganic filler is white carbon black in the f coatings.
The substrate layer is poly tetrafluoroethylene.
S2：90 parts of butyl acrylate BA are added in possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit,
7.5 parts of vinylacetate VAC, 2 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA adds 100 parts of ethyl acetate, imports
Nitrogen gas stirring half an hour, 70 DEG C are slowly warmed up to, add 0.2 part of AIBN, reacted 5 hours under nitrogen protection, finally use acetic acid
Ethyl ester is adjusted to solid content for 40% synthetic glue；
S3：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of Petropols FTR6100 (three wells) are added,
1 part of isocyanates firming agent TP-100 (Asahi Chemical Industry) is added, 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber is added
TINUVIN326 (BASF BASF), with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is
20 μm, it is compound in respectively on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
Embodiment 4
The preparation of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape in the present embodiment comprises the steps：
S1：The f coatings are coated on the substrate layer that thickness is 40 μm, coating thickness is 20 μm；
Wherein described f coatings include organic resin, firming agent and inorganic filler；Organic resin is accounted for
20%, firming agent accounts for 20%, and inorganic filler accounts for 60%.
Organic resin is the compositionss in perfluorinated resin, fluoroacrylic resin and fluorine silicon resin, three in the f coatings
Shared weight ratio is 4:2:3.
Firming agent in the f coatings is the compositionss of amine curing agent and cyanamid dimerization system firming agent, shared by the two
Weight is 1:2.
Preferably, inorganic filler is selected from mica powder, barium sulfate, kieselguhr, pumice, bortz powder in the f coatings
Mixture, the weight ratio shared by five be 2:4:3：2：1.
The substrate layer is ethylene-tetrafluoroethylene copolymer film.
S2：90 parts of butyl acrylate BA are added in possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit,
7.5 parts of vinylacetate VAC, 2 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA adds 100 parts of ethyl acetate, imports
Nitrogen gas stirring half an hour, 70 DEG C are slowly warmed up to, add 0.2 part of AIBN, reacted 5 hours under nitrogen protection, finally use acetic acid
Ethyl ester is adjusted to solid content for 40% synthetic glue；
S3：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of hydrogenated rosin KS2100 (section's cyclopentadienyl) are added,
0.2 part of epoxiess firming agent NX-100E (Japan is comprehensive to grind) is added, 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber is added
TINUVIN326 (BASF BASF), with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is
22 μm, it is compound in respectively on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
Embodiment 5
The preparation of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape in the present embodiment comprises the steps：
S1：The f coatings are coated on the substrate layer that thickness is 45 μm, coating thickness is 25 μm；
Wherein described f coatings include organic resin, firming agent and inorganic filler；Organic resin is accounted for
15%, firming agent accounts for 30%, and inorganic filler accounts for 55%.
Organic resin is the compositionss of politef fluorocarbon resin and perfluorinated resin in the f coatings, shared by the two
Weight is 2:1.
Firming agent in the f coatings is isocyanates system firming agent, hydrazides firming agent, amine resin firming agent and dimerization
Compositionss in cyanamide system firming agent, the weight ratio shared by four is 4:2:3：2.
Preferably, inorganic filler is kieselguhr, pumice, the mixture of bortz powder in the f coatings, shared by three
Weight ratio is 3:2:3.
The substrate layer is poly- perfluoroalkoxy resin film.
S2：90 parts of butyl acrylate BA are added in possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit,
7.5 parts of VEOVA10 (stepping figure Momentive), 2 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA adds 100 parts of acetic acid
Ethyl ester, imports nitrogen gas stirring half an hour, is slowly warmed up to 70 DEG C, adds 0.2 part of AIBN, under nitrogen protection reaction 5 hours, most
Eventually solid content is adjusted to for 40% synthetic glue with ethyl acetate；
S3：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of Petropols FTR6100 (three wells) are added,
0.2 part of epoxiess firming agent NX-100E (Japan is comprehensive to grind) is added, 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber is added
TINUVIN326 (BASF BASF), with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is
18 μm, it is compound in respectively on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
Embodiment 6
The preparation of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape in the present embodiment comprises the steps：
S1：The f coatings are coated on the substrate layer that thickness is 35 μm, coating thickness is 8 μm；
Wherein described f coatings include organic resin, firming agent and inorganic filler；Organic resin is accounted for
18%, firming agent accounts for 22%, and inorganic filler accounts for 60%.
Organic resin is fluoroacrylic resin in the f coatings.
Firming agent in the f coatings is cyanamid dimerization system firming agent.
Preferably, inorganic filler is kieselguhr in the f coatings.
The substrate layer is fluorinated ethylene propylene copolymer film.
S2：90 parts of butyl acrylate BA are added in possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit,
7.5 parts of VEOVA10 (stepping figure Momentive), 2 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA adds 100 parts of acetic acid
Ethyl ester, imports nitrogen gas stirring half an hour, is slowly warmed up to 70 DEG C, adds 0.2 part of AIBN, under nitrogen protection reaction 5 hours, most
Eventually solid content is adjusted to for 40% synthetic glue with ethyl acetate；
S3：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of hydrogenated rosin KS2100 (section's cyclopentadienyl) are added,
0.2 part of epoxiess firming agent NX-100E (Japan is comprehensive to grind) is added, 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber is added
TINUVIN326 (BASF BASF), with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is
25 μm, it is compound in respectively on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
Embodiment 7
The preparation of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape in the present embodiment comprises the steps：
S1：The f coatings are coated on the substrate layer that thickness is 42 μm, coating thickness is 15 μm；
Wherein described f coatings include organic resin, firming agent and inorganic filler；Organic resin is accounted for
30%, firming agent accounts for 20%, and inorganic filler accounts for 50%.
Organic resin is the compositionss of poly- difluoroethylene fluorocarbon resin and perfluorinated resin in the f coatings, shared by the two
Weight is 3:1.
Firming agent in the f coatings is isocyanates system firming agent, imidazole curing agent, hydrazides firming agent, amine resin
Compositionss in firming agent, amine curing agent and cyanamid dimerization system firming agent, the weight ratio shared by six is 1:3:3:5:1:1.
Preferably, inorganic filler is titanium dioxide, the aluminum of titanium dioxide two, aluminium hydroxide, Pulvis Talci, titanium dioxide in the f coatings
Silicon, Calcium Carbonate, white carbon black, mica powder, barium sulfate, kieselguhr, pumice, the mixture of bortz powder, shared weight both ten
Than for 2:3:3:5:2:1：1:3:3:1:2:1.
The substrate layer is pvf film.
S2：70 parts of butyl acrylate BA are added in possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit,
24.5 parts of acrylic acid-2-ethyl caproite EHA, 5 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA adds 100 parts of acetic acid
Ethyl ester, imports nitrogen gas stirring half an hour, is slowly warmed up to 70 DEG C, adds 0.2 part of AIBN, under nitrogen protection reaction 5 hours, most
Eventually solid content is adjusted to for 40% synthetic glue with ethyl acetate；
S3：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of Petropols FTR6100 (three wells) are added,
0.2 part of epoxiess firming agent NX-100E (Japan is comprehensive to grind) is added, 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber is added
TINUVIN326 (BASF BASF), with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is
15 μm, it is compound in respectively on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
The present invention has the advantages that：
1.f coatings have the bonding force after lamination between glued membrane big, and the peeling force decay Jing after burn-in test is little, while
With color inhibition and having excellent weather resistance；
2.f coatings are due to certain release effect, solving the bonding force that client is occurred during using adhesive tape
The phenomenon that has some setbacks is operated greatly；
3. the position after locating adhesive tape hot pressing is used by estimating solar components, the compatibility that it surveys glued membranes with two is more
It is good；
4. bonding force after special modified acrylic acid adhesive face and glued membrane hot pressing is big and anti-yellowing property is excellent.
Effect of the present invention can be proved by following test：
The performance detection of test example photovoltaic module locating adhesive tape of the present invention
1st, sample
Make by oneself by embodiment 1-7.
2nd, method of testing
2.1 peel off 180 ° of peeling forces of force tester test sample
(1) web-like or sheet sample are taken, first product 25mm × 300mm size 3-5 bars is cut into into.
(2) mirror steel plate：150 ± 1mm of length, 50 ± 1mm of width, thickness 1.5mm-2mm
(3) one-faced tapes：The separated type material on adhesive tape is torn, glue surface can not contact handss or other articles, by glue surface and mirror
One end connection of face steel plate, with pressure roller (2Kg) in the case of external pressure is not applied, with the speed of 300mm/min 3 times back and forth so that
Glue surface is fully contacted with mirror steel plate, and sample is not allow for bubble generation with mirror steel plate bonding place.
(4) tested after parked 20min in the test environment of regulation after prepared by sample.
(5) by 180 ° of sample free end doubling, and the strip off binding face 25mm from test plate (panel), sample free end and sample board
It is clipped in respectively on upper and lower holder, release surface should be made to be consistent with the testing machine line of force, testing machine is with 300mm/min ± 10mm/
The min rates of climb are continuously peeled off, and have autographic apparatuss to draw stripping curve.
(6) test data and destruction interface location are recorded, is averaged.
2.2 percent thermal shrinkages are tested
(1) pressing plate is sampled with the square rustless steel of 100 × 100mm, along former cloth laterally (TD directions), left, center, right, respectively
Extract the square a piece of sample of 100 × 100mm.
(2) with electronic type slide gauge, longitudinal direction and the laterally length and width between mark are measured；It is labeled as MD directions or TD
Direction, and metric data marking pen is write on three samples.
(3) be layered on 5 layer paperboards in sample, above and 5 layer paperboards that pressurize, be positioned in 150 DEG C of circulated air baking ovens toast
30mins。
(4) sample is placed in 23 ± 2 DEG C after the completion of toasting, is cooled down 30 minutes under 65 ± 10%R.H. environment.
(5) longitudinal direction and the laterally length and width between mark are measured with electronic type slide gauge, again, and by metric data
Write on the test specimen with marking pen.
(6) calculate：" the heat shrink rate of former cloth thin film " is calculated according to following equation.
Heat shrink rate A%=(testing length after former testing length-baking)/original test data length × 100
(7) on test value record and test recording table, the arithmetic mean of instantaneous value for taking test value is final testing result.
(8) result judgement：It is qualified to be judged to heat shrink rate≤0.5%.
2.3 xanthochromia method of testings
(1) adhesive tape is cut into into 50mm*150mm samples, tests b values with color difference meter and be recorded as b1.
(2) sample is put into into QUV ultraviolet ageing testing machines, according to UV 90KWh, takes out sample and test b values with color difference meter again
And it is recorded as b2.
(3) Δ b=b2-b1 is calculated
3rd, result of the test
Result of the test is shown in Table 1, as a result shows.Photovoltaic module locating adhesive tape of the present invention has good adhesive property, resistance to
High temperature, color inhibition.
The photovoltaic module of the present invention locating adhesive tape the performance test results of table 1
| Group | Peeling force N/25mm | Xanthochromia Δ b | Contractility |
| Embodiment 1 | 10.2 | 0.2 | OK |
| Embodiment 2 | 9.8 | 0.3 | OK |
| Embodiment 3 | 10.0 | 0.2 | OK |
| Embodiment 4 | 9.9 | 0.2 | OK |
| Embodiment 5 | 10.6 | 0.3 | OK |
| Embodiment 6 | 10.1 | 0.3 | OK |
| Embodiment 7 | 11.0 | 0.3 | OK |
The explanation of above example is only intended to help and understands the method for the present invention and its core concept.It should be pointed out that right
For those skilled in the art, under the premise without departing from the principles of the invention, the present invention can also be carried out
Some improvement and modification, these are improved and modification also should be fallen in the protection domain of the claims in the present invention.
The foregoing description of the disclosed embodiments, enables those skilled in the art to realize or using the present invention.To this
Various modifications of a little embodiments will be apparent for those skilled in the art, as defined herein general
Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention will not
Can be intended to be limited to the embodiments shown herein, and be to fit to consistent with principles disclosed herein and features of novelty
Most wide scope.
Claims (10)
1. a kind of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape, it is characterised in that：From top to bottom successively include adhesive layer,
Substrate layer, f coatings, wherein the f coatings include organic resin, firming agent and inorganic filler, the substrate layer is fluoroplastics film
Or polyester film.
2. photovoltaic module cell piece as claimed in claim 1 positioning High temperature-resistanadhesive adhesive tape, it is characterized in that：In the f coatings
Organic resin is selected from politef fluorocarbon resin, poly- difluoroethylene fluorocarbon resin, perfluorinated resin, fluoroacrylic resin, fluorine
One or more in silicones.
3. photovoltaic module cell piece as claimed in claim 1 or 2 positioning High temperature-resistanadhesive adhesive tape, it is characterized in that：The f coatings
In firming agent be selected from isocyanates system firming agent, imidazole curing agent, hydrazides firming agent, amine resin firming agent, amine-type cure
One or more in agent and cyanamid dimerization system firming agent.
4. as described in claim 1-3 is arbitrary photovoltaic module cell piece positioning with High temperature-resistanadhesive adhesive tape, it is characterized in that：The f
Inorganic filler in coating is selected from titanium dioxide, the aluminum of titanium dioxide two, aluminium hydroxide, Pulvis Talci, silicon dioxide, Calcium Carbonate, white carbon black, Muscovitum
In powder, barium sulfate, kieselguhr, pumice, bortz powder one or more.
5. the photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape as described in claim 1-4 is arbitrary, it is characterised in that：The glue
Adhensive layer is made up of modified acroleic acid esters adhesive.
6. the photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape as described in claim 1-5 is arbitrary, it is characterised in that：Described
One or more of fluoroplastics film in following film：Poly tetrafluoroethylene, fluorinated ethylene propylene copolymer film, poly- perfluoroalkoxy
Base resin film, polytrifluorochloroethylene film, ethylene-chlorotrifluoro-ethylene copolymer film, ethylene-tetrafluoroethylene copolymer film, poly- inclined fluorine
Vinyl film, pvf film.
7. a kind of preparation method of the photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape as described in claim 1-6 is arbitrary, its
It is characterised by, comprises the steps：
S1：The f coatings are coated on substrate layer of the thickness between 25-50 μm, coating thickness is between 5-20 μm；
S2：Take and step figure Momentive selected from acrylic acid methyl ester., acrylic acid -2- hydroxyl ethyl esters, acrylic acid, vinylacetate, the U.S.
Tertiary ethylene carbonate VEOVA10, acrylic acid-2-ethyl caproite in one or more compounds as other compounds, with
Butyl acrylate mix homogeneously, adds into reaction vessel, adds EAC solvents, azodiisobutyronitrile initiator is added, in logical nitrogen
Under conditions of gas, reacting by heating after reaction terminates, with reaction dissolvent dilution adjustment solid content, obtains synthetic glue；
S3：The synthetic glue that the mass fraction that step S2 prepares is 100 parts is taken, addition mass fraction is 20-50
Firming agent, antioxidant 1010, matter that mass fraction be 0.02-0.04 part of the tackifying resin, mass fraction of part for 0.1-1.5 parts
Amount number is the UV absorbent of 0.03-0.07 parts, adjusts solid containing the back side for coating the substrate layer with f coatings, then carries out
Directly wind.
8. the preparation method of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape as claimed in claim 7, it is characterised in that：Institute
One or more of the tackifying resin stated in Petropols, rosin resin；The firming agent is selected from epoxy hardener, isocyanide
One or more in esters of gallic acid firming agent；Described UV absorbent are the ultraviolet absorber TINUVIN326 of BASF BASF.
9. the preparation method of photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape as claimed in claim 7 or 8, its feature exists
In：
Step S2 is specifically included：90 part third is added in possessing agitator, reflux condensing tube, nitrogen ingress pipe reaction unit
Olefin(e) acid butyl ester BA, 7.5 parts of VEOVA10,2 parts of acrylic acid AA, 0.5 part of acrylic acid -2- hydroxyl ethyl ester HEA adds 100 parts of ethyl acetate
EAC, imports nitrogen gas stirring half an hour, is slowly warmed up to 70 DEG C, adds 0.2 part of AIBN, under nitrogen protection reaction 5 hours, most
Eventually solid content is adjusted to for 40% synthetic glue with ethyl acetate；
Step S3 is specifically included：100 parts that step S2 is prepared of synthetic glue is taken, 30 parts of Petropols are added
FTR6100, adds 0.2 part of epoxiess firming agent NX-100E, adds 0.03 part of antioxidant 1010,0.05 part of ultraviolet absorber
TINUVIN326, with the solid content of diluted ethyl acetate to 20%, coats adhesive layer, and dry glue thickness is 25 μm, multiple respectively
Together on the back side with f coating material layers and on the back side without f coating material layers, 45 DEG C of ripenings 72 hours.
10. the preparation method of the photovoltaic module cell piece positioning High temperature-resistanadhesive adhesive tape as described in claim 7-9 is arbitrary, its feature
It is：The thickness of the substrate layer is 50 μm, and the thickness of the adhesive layer is 25 μm, and the thickness of the f coatings is 5 μm.
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|---|---|---|---|---|
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102911613A (en) * | 2011-08-02 | 2013-02-06 | 苏州中来光伏新材股份有限公司 | Coated-type high-adhesion solar cell back film and preparation method thereof |
| CN105754506A (en) * | 2016-03-11 | 2016-07-13 | 苏州赛伍应用技术有限公司 | Positioning adhesive tape for photovoltaic modules |
| CN205420264U (en) * | 2015-12-04 | 2016-08-03 | 深圳市金凯新瑞光电股份有限公司 | PET protection film |
| CN106221595A (en) * | 2016-07-21 | 2016-12-14 | 苏州泰仑电子材料有限公司 | Mould release membrance of ultralight off-type force and preparation method thereof |
-
2016
- 2016-12-23 CN CN201611205726.4A patent/CN106590459A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102911613A (en) * | 2011-08-02 | 2013-02-06 | 苏州中来光伏新材股份有限公司 | Coated-type high-adhesion solar cell back film and preparation method thereof |
| CN205420264U (en) * | 2015-12-04 | 2016-08-03 | 深圳市金凯新瑞光电股份有限公司 | PET protection film |
| CN105754506A (en) * | 2016-03-11 | 2016-07-13 | 苏州赛伍应用技术有限公司 | Positioning adhesive tape for photovoltaic modules |
| CN106221595A (en) * | 2016-07-21 | 2016-12-14 | 苏州泰仑电子材料有限公司 | Mould release membrance of ultralight off-type force and preparation method thereof |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019024166A1 (en) * | 2017-03-01 | 2019-02-07 | 苏州赛伍应用技术股份有限公司 | High-performance repair tape for backboard of photovoltaic module, and manufacturing method therefor |
| CN107057598A (en) * | 2017-04-28 | 2017-08-18 | 西安泰力松新材料股份有限公司 | Composite membrane for dereliction grid solar cell component and preparation method thereof |
| CN111788716A (en) * | 2018-02-28 | 2020-10-16 | 三洋电机株式会社 | Battery with a battery cell |
| CN109294475B (en) * | 2018-08-29 | 2021-11-12 | 苏州赛伍应用技术股份有限公司 | Water-blocking adhesive tape for photovoltaic module frame and preparation method and application thereof |
| CN109294475A (en) * | 2018-08-29 | 2019-02-01 | 苏州赛伍应用技术股份有限公司 | A kind of photovoltaic component frame adhesive tape and its preparation method and application that blocks water |
| CN109517534A (en) * | 2018-11-21 | 2019-03-26 | 苏州赛伍应用技术股份有限公司 | A kind of photovoltaic component back plate patching material and preparation method thereof and method for repairing and mending |
| CN110527464A (en) * | 2019-09-10 | 2019-12-03 | 皇冠（太仓）胶粘制品有限公司 | The viscous color inhibition rupture pressure disc glue of height, adhesive tape and preparation method thereof |
| CN111087950A (en) * | 2019-12-23 | 2020-05-01 | 崴思新材料泰州有限公司 | Adhesive, double-sided tape applying adhesive and preparation method of double-sided tape |
| CN114621696A (en) * | 2020-12-11 | 2022-06-14 | 苏州阿特斯阳光电力科技有限公司 | Fixing adhesive tape for photovoltaic module battery string and preparation method and application thereof |
| CN114621696B (en) * | 2020-12-11 | 2023-12-01 | 苏州阿特斯阳光电力科技有限公司 | Fixing adhesive tape for photovoltaic module battery string and preparation method and application thereof |
| CN112662336A (en) * | 2020-12-23 | 2021-04-16 | 苏州赛伍应用技术股份有限公司 | Adhesive tape for positioning solar power generation module cell and preparation method thereof |
| CN114958220A (en) * | 2021-02-24 | 2022-08-30 | 江苏伊诺尔新材料科技有限公司 | Packaging adhesive tape for resin lenses |
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Application publication date: 20170426 |