CN106589814A - Epoxy resin glass cloth composite printed circuit board material with good heat dispersion property and preparation method thereof - Google Patents
Epoxy resin glass cloth composite printed circuit board material with good heat dispersion property and preparation method thereof Download PDFInfo
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- CN106589814A CN106589814A CN201611096872.8A CN201611096872A CN106589814A CN 106589814 A CN106589814 A CN 106589814A CN 201611096872 A CN201611096872 A CN 201611096872A CN 106589814 A CN106589814 A CN 106589814A
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- glass
- fiber
- epoxy resin
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- circuit board
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses an epoxy resin glass cloth composite printed circuit board material with a good heat dispersion property and a preparation method thereof. The epoxy resin glass cloth composite printed circuit board material is prepared from, by weight, 32-34 parts of 1080 glass fiber cloth, 40-42 parts of E-51 epoxy resin, 29-30 parts of phenolic resin, 0.3-0.4 parts of 4-ethylimidazole, 20-22 parts of carbon nano tube, 2.3-2.6 parts of vinylidene fluoride-hexafluoropropylene copolymer, 25-30 parts of butadiene, a proper amount of hydrogenated gasoline, 0.01-0.02 part of nickel naphthenate, 0.4-0.5 part of triisobutyl aluminium, 0.7-0.8 part of boron trifluoride diethyl etherate, 2.3-2.6 parts of expanded graphite powder, 2.5-2.8 parts of aromatic polyurethane acrylate and 0.8-1 parts of diamond micro-powder. By using the expanded graphite powder and the diamond micro-powder, the abrasive resistance and heat dispersion property of the material are improved, aromatic polyurethane acrylate is used for sealing and forms a chemical bond with the epoxy resin, the strength of the material is improved and the dielectric property is not affected.
Description
Technical field
The present invention relates to printed circuit board (PCB) prepreg technical field, more particularly to a kind of good epoxy resin glass-fiber-fabric of thermal diffusivity
Complex printed-circuit board material and preparation method thereof.
Background technology
Printed circuit board (PCB) is the critical piece in electronic product, and its q＆r is heavy to closing for electronic product
Will.Epoxy prepreg (Epoxy Prepreg) is the main raw material(s) for producing printed circuit board (PCB) at present.Storage is aging will be to epoxy
The performance of prepreg produces significant impact, and then has influence on the quality of printed circuit board (PCB).And the wet-heat resisting of printed circuit board (PCB) is old
Change performance and directly influence the reliability of electronic product, characterize and improve its moisture-resisting heat aging performance electronics industry is had it is important
Meaning.Herein by with reference to various research meanses, have studied epoxy prepreg storage ageing process in chemical and physical features
Change, so as to establish the aging quality supervision system of storage of epoxy prepreg, and be successfully applied to electronics industry.
By comparing the methods such as differential scanning calorimetry (DSC), middle infrared spectrum (Mid-IR) and near infrared spectrum (NIR), NIR is found
Can be very good to characterize the functional group's change before and after epoxy prepreg solidification.NIR results show 4530cm-1The epoxy peak at place and
4620cm-1Phenyl ring peak there is good resolution and the overlap without other absworption peaks to disturb.Constant temperature at 100 DEG C of epoxy prepreg
The NIR tracking results of solidification show that keeping uniform in solidification process epoxide group and consuming, phenyl ring peak intensity is held essentially constant.
And then it is aging to have studied storage of the epoxy prepreg under different temperatures and humidity using NIR, find with storage temperature and aging
The increase of time, is accordingly increased to illustrate that NIR aging to the storage of epoxy prepreg can be carried out effectively with respect to curing degree
Monitoring.Corresponding with solidification conversion ratio increase, the processing viscosity of epoxy prepreg is with storage aging temperature and the increase of time
Significantly improve, gel time accordingly shortens.Epoxy prepreg after dynamic mechanical analysis (DMA) discovery storage is aging occurs in that two
Individual glass transition temperature, binding time differentiates light scattering (TRSL) and the means such as polarizing microscope (OM), it was demonstrated that storage is always
Epoxy prepreg there occurs phase separation during change.Further improved by introducing amphipathic oligomeric silane coupling agent herein
The interface performance of resin and glass in printed circuit board (PCB), so as to improve reliability of the printed circuit board (PCB) in hygrothermal environment.Adopt
Synthesize a kind of amphipathic oligomeric silane coupling agent with silane coupler and octyl phenyl polyglycol ether, by gel chromatography
(GPC), the test specification such as IR, gas chromatography mass spectrometry chromatograph (GC-MS) its epoxy prepreg processing characteristics is not affected substantially.
The result of contact angle test shows that amphipathic coupling agent can significantly reduce contact angle of the resin to glass in epoxy prepreg.
Water absorption test finds, although the equilibrium water absorption of epoxy prepreg slightly rises after solidification, due to the work of amphipathic coupling agent
With its interface water suction is substantially suppressed.Circuit malfunction test, the test result of scanning electron microscope/energy disperse spectroscopy (SEM/EDX) are said
Bright, amphipathic oligomeric silane coupling agent can suppress the generation that conductive anodic filament under hygrothermal environment (CAF) fails, and then improve electricity
The reliability of road plate.In addition, compared with circuit malfunction test, interface water suction analysis can easily and effectively evaluate printed circuit board (PCB)
Resistance to CAF performances.
《Aging and printed circuit board (PCB) the hydrothermal aging research of storage of epoxy prepreg》The printed circuit board (PCB) that one text is obtained
Resistance to water be improved, but epoxy resin property is more crisp, it is bad with the caking property of glass surface, by vibrations can peel off,
The stability in use of circuit board is affected, needs to improve, in addition it is also necessary to improve the thermal diffusivity of circuit board.
The content of the invention
The object of the invention is exactly to make up the defect of prior art, there is provided a kind of good epoxy resin glass-fiber-fabric of thermal diffusivity is answered
Close printed circuit board material and preparation method thereof.
The present invention is achieved by the following technical solutions：
A kind of good epoxy resin glass-fiber-fabric complex printed-circuit board material of thermal diffusivity, is prepared by the raw materials in：1080
Glass-fiber-fabric 32-34, E-51 epoxy resin 40-42, phenolic resin 29-30,4- ethyl imidazol(e) 0.3-0.4, CNT 20-22,
Vinylidene fluoride-hexafluoropropylene copolymer 2.3-2.6, butadiene 25-30, appropriate hydrogasoline, nickel naphthenate 0.01-0.02, three
Aluminium isobutyl 0.4-0.5, boron trifluoride diethyl etherate 0.7-0.8, expanded graphite powder 2.3-2.6, aromatic urethane acrylate
2.5-2.8, diadust 0.8-1.
The preparation method of the good epoxy resin glass-fiber-fabric complex printed-circuit board material of the thermal diffusivity, comprises the following steps：
（1）Butadiene is added in hydrogasoline, the solution of 100-105g/L is configured to, CNT is added, is stirred,
Be put into water bath with thermostatic control, be heated to 75-78 DEG C, add vinylidene fluoride-hexafluoropropylene copolymer, nickel naphthenate, triisobutyl aluminium,
Boron trifluoride diethyl etherate reacts 10-15 minutes, obtains glue；
（2）1080 glass-fiber-fabrics are immersed into above-mentioned glue and shakes stirring reaction 2-2.3 hour, take out 1080 glass-fiber-fabrics, be put into self-styled
Bag, carries out irradiation, and absorbed dose are 68-78kGy, obtains modified 1080 glass-fiber-fabrics；
（3）It is by expanded graphite powder, diadust mix homogeneously then uniform with aromatic urethane acrylate grinding, then with
E-51 epoxy resin, phenolic resin, mix homogeneously, add other residual componentss mix homogeneously, obtain resin glue and are coated with
On modified 1080 glass-fiber-fabrics, resin glue is 1.9-2 with the weight ratio of glass-fiber-fabric:1,4-5 minutes are processed at 168-170 DEG C, i.e.,
.
It is an advantage of the invention that：The present invention is changed using vinylidene fluoride-hexafluoropropylene copolymer, butadiene to glass-fiber-fabric
Property, waterproofing protection film, and good toughness are defined on glass-fiber-fabric surface, it is firmly bonded with glass-fiber-fabric, it is not easily stripped, improve ring
Oxygen tree fat and the interface fastness of glass-fiber-fabric, slow down the aqueous corrosion at interface, extend the service life of material, by using carbon nanometer
Pipe, on glass-fiber-fabric surface continuous thin film is formed, and compares the discontinuous partial dot contact for being directly added into CNT, is defined
Continuous passage of heat, improves the heat dispersion and intensity of material.It is equal by using expanded graphite powder, diadust mixing
Even diadust is embedded in expanded graphite space, improves wearability, the thermal diffusivity of material, then uses aromatic urethane acrylate
Closed, with epoxy resin chemical bonds are formed, improve the intensity of material is not affected dielectric properties.
Specific embodiment
The good epoxy resin glass-fiber-fabric complex printed-circuit board material of a kind of thermal diffusivity, by following weight portion（Kilogram）Raw material
Make：1080 glass-fiber-fabrics 32, E-51 epoxy resin 40, phenolic resin 29,4- ethyl imidazol(e)s 0.3, CNT 20, inclined fluorine second
It is alkene-hexafluoropropylene copolymer 2.3, butadiene 25, appropriate hydrogasoline, nickel naphthenate 0.01, triisobutyl aluminium 0.4, borontrifluoride
Borate ether 0.7, expanded graphite powder 2.3, aromatic urethane acrylate 2.5, diadust 0.8.
The preparation method of the good epoxy resin glass-fiber-fabric complex printed-circuit board material of the thermal diffusivity, comprises the following steps：
（1）Butadiene is added in hydrogasoline, the solution of 100g/L is configured to, CNT is added, is stirred, be put into
Water bath with thermostatic control, is heated to 75 DEG C, adds vinylidene fluoride-hexafluoropropylene copolymer, nickel naphthenate, triisobutyl aluminium, borontrifluoride
Borate ether reacts 10 minutes, obtains glue；
（2）1080 glass-fiber-fabrics are immersed into above-mentioned glue vibrations stirring reaction 2 hours, 1080 glass-fiber-fabrics are taken out, valve bag is put into, is entered
Row irradiation, absorbed dose are 68kGy, obtain modified 1080 glass-fiber-fabrics；
（3）It is by expanded graphite powder, diadust mix homogeneously then uniform with aromatic urethane acrylate grinding, then with
E-51 epoxy resin, phenolic resin, mix homogeneously, add other residual componentss mix homogeneously, obtain resin glue and are coated with
On modified 1080 glass-fiber-fabrics, resin glue is 1.9 with the weight ratio of glass-fiber-fabric:1, process 4 minutes at 168 DEG C, obtain final product.
The electrical insulating property out-of-service time of the embodiment circuit board is 2398h, and impact strength is, 17.1KJ/cm-2, bending is by force
Spend for 22.8MPa.
Claims (2)
1. the good epoxy resin glass-fiber-fabric complex printed-circuit board material of a kind of thermal diffusivity, it is characterised in that：By following weight portion
Raw material is made：1080 glass-fiber-fabric 32-34, E-51 epoxy resin 40-42, phenolic resin 29-30,4- ethyl imidazol(e) 0.3-0.4,
CNT 20-22, vinylidene fluoride-hexafluoropropylene copolymer 2.3-2.6, butadiene 25-30, appropriate hydrogasoline, aphthenic acids
Nickel 0.01-0.02, triisobutyl aluminium 0.4-0.5, boron trifluoride diethyl etherate 0.7-0.8, expanded graphite powder 2.3-2.6, fragrant adoption
Urethane acrylate 2.5-2.8, diadust 0.8-1.
2. the preparation method of the good epoxy resin glass-fiber-fabric complex printed-circuit board material of thermal diffusivity according to claim 1, its
It is characterised by comprising the following steps：
（1）Butadiene is added in hydrogasoline, the solution of 100-105g/L is configured to, CNT is added, is stirred,
Be put into water bath with thermostatic control, be heated to 75-78 DEG C, add vinylidene fluoride-hexafluoropropylene copolymer, nickel naphthenate, triisobutyl aluminium,
Boron trifluoride diethyl etherate reacts 10-15 minutes, obtains glue；
（2）1080 glass-fiber-fabrics are immersed into above-mentioned glue and shakes stirring reaction 2-2.3 hour, take out 1080 glass-fiber-fabrics, be put into self-styled
Bag, carries out irradiation, and absorbed dose are 68-78kGy, obtains modified 1080 glass-fiber-fabrics；
（3）It is by expanded graphite powder, diadust mix homogeneously then uniform with aromatic urethane acrylate grinding, then with
E-51 epoxy resin, phenolic resin, mix homogeneously, add other residual componentss mix homogeneously, obtain resin glue and are coated with
On modified 1080 glass-fiber-fabrics, resin glue is 1.9-2 with the weight ratio of glass-fiber-fabric:1,4-5 minutes are processed at 168-170 DEG C, i.e.,
.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611096872.8A CN106589814A (en) | 2016-12-02 | 2016-12-02 | Epoxy resin glass cloth composite printed circuit board material with good heat dispersion property and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611096872.8A CN106589814A (en) | 2016-12-02 | 2016-12-02 | Epoxy resin glass cloth composite printed circuit board material with good heat dispersion property and preparation method thereof |
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| CN106589814A true CN106589814A (en) | 2017-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611096872.8A Pending CN106589814A (en) | 2016-12-02 | 2016-12-02 | Epoxy resin glass cloth composite printed circuit board material with good heat dispersion property and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111393582A (en) * | 2020-04-29 | 2020-07-10 | 四川润英达电子科技有限公司 | Method for recycling and reusing waste thermosetting polyurethane |
| CN113004660A (en) * | 2021-03-22 | 2021-06-22 | 惠州市纵胜电子材料有限公司 | Processing technology of epoxy glass fiber board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101914265A (en) * | 2010-07-24 | 2010-12-15 | 广州美嘉伟华电子材料有限公司 | A kind of non-halogen phosphorus-containing flame retardant high-frequency epoxy resin based composition and the application in bonding sheet and copper-clad plate thereof |
| CN104327323A (en) * | 2014-09-30 | 2015-02-04 | 青岛东泰诚恩新材料科技发展有限公司 | Butadiene rubber |
-
2016
- 2016-12-02 CN CN201611096872.8A patent/CN106589814A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101914265A (en) * | 2010-07-24 | 2010-12-15 | 广州美嘉伟华电子材料有限公司 | A kind of non-halogen phosphorus-containing flame retardant high-frequency epoxy resin based composition and the application in bonding sheet and copper-clad plate thereof |
| CN104327323A (en) * | 2014-09-30 | 2015-02-04 | 青岛东泰诚恩新材料科技发展有限公司 | Butadiene rubber |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111393582A (en) * | 2020-04-29 | 2020-07-10 | 四川润英达电子科技有限公司 | Method for recycling and reusing waste thermosetting polyurethane |
| CN111393582B (en) * | 2020-04-29 | 2022-12-13 | 四川润英达电子科技有限公司 | Method for recycling and reusing waste thermosetting polyurethane |
| CN113004660A (en) * | 2021-03-22 | 2021-06-22 | 惠州市纵胜电子材料有限公司 | Processing technology of epoxy glass fiber board |
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Application publication date: 20170426 |