CN106585156A - Ultraviolet light curing post-processing method for printing electrode - Google Patents
Ultraviolet light curing post-processing method for printing electrode Download PDFInfo
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- CN106585156A CN106585156A CN201611008357.XA CN201611008357A CN106585156A CN 106585156 A CN106585156 A CN 106585156A CN 201611008357 A CN201611008357 A CN 201611008357A CN 106585156 A CN106585156 A CN 106585156A
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- ultraviolet light
- substrate
- printing
- curing
- light polymerization
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0081—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses an ultraviolet light curing post-processing method for a printing electrode. The method comprises the following steps that 1, a substrate is placed into an ultrasonic cleaner to be cleaned; 2, the cleaned substrate is placed into a drying box to be dried; 3, printing parameters are set, and the dried substrate is placed on a printer for printing of preset patterns; 4, the printed substrate is placed into a UV curing instrument, the distance between a UV lamp and a lifting table in the UV curing instrument is adjusted, curing time is set, and curing is carried out; and 5, the roughness and electrical resistivity of a Ag film obtained through printing are tested. By adjusting the UV curing time and curing power, the roughness and electrical resistivity of the cured ink-jet printing Ag film are controlled under the low curing power, and the Ag film with the low electrical resistivity and roughness is obtained. According to the ultraviolet light curing post-processing method, curing time is short, the technological process is extremely simple, precuring is not needed, and only one step of UV curing is needed in the curing process.
Description
Technical field
The present invention relates to printed electronic device preparation field, and in particular to a kind of ultraviolet light polymerization post processing printed electrode
Method.
Background technology
Prior art is mainly by the composition of change Ag inks（Such as type of Ag fillers, the content of Ag etc.）To adjust
The performances such as the resistivity of Ag thin film after UV solidifications, and after the UV solidifications of short time, can again carry out relatively long time
Heat treatment；Or after adjustment UV solidifications heat treatment temperature and time to adjust UV solidifications after Ag thin film the performance such as resistivity.
But prior art lacks the research to Ag roughness of film after solidification.
Screen Printable UV Curing Electronic Inks. Karen L. Hueston, Laurie
N. Kroupa and James S. Tonge print Ag inks with silk screen printing, and change the composition of Ag inks（Ag materials
Type etc.）To adjust the performance of Ag thin film.Main process：(1) silk screen printing figure（2）Set in UV with the speed of 50 ft/min
Inswept sample carries out twice UV solidifications under standby（3）Heat treatment at least 1 hour at 80 DEG C, the Ag inks for being used be author voluntarily
Prepare, the body resistivity of gained Ag thin film is about between 7.13 ~ 42.4 Ω cm.Ag thin film in the method after UV solidifications
Resistivity is larger, and the time of cured is long.Resistivity is big, main cause be probably Ag inks composition in contain
More difficult volatilization or the organic principle for decomposing, and the parameter of UV cured may not be optimal.The cured time is long, should
The time required for processing is reheated in document after UV solidifications more than 1 hour.
Curing process and conductive performance of UV curable conductive
Inkjet printing.Wang Xue, Wei Jie have probed into Ag film resiativity of the Ag contents to inkjet printing in Ag inks
Impact, and the impact of heat treatment temperature and heat treatment time to Ag thin film.Main process：（1）Inkjet printing（2）One timing
Between UV solidification（Be not given in document）（3）Heat treatment, the Ag inks for being used are that author voluntarily prepares, Ag in gained Ag thin film
When nano-particle content is 70%, and the available resistivity of heat treatment 5min is 5 μ Ω at 200 DEG C after UV cured
cm.The temperature of heat treatment is higher in the method, and this can cause the surface roughness of thin film larger.Because Organic substance during heat treatment
Volatilization can cause Ag film surface out-of-flatnesses.
Both the above method is required for carrying out heat treatment after UV solidifies so that hardening time is longer, and increased technique
Loaded down with trivial details degree, and lack the research to Ag Film roughness after solidification.
Existing technical scheme is mainly by the composition of change Ag inks（As the species of Ag fillers in Ag inks, Ag contain
Amount etc.）, and increase heat treatment after UV solidifications adjusting and reduce the resistivity of Ag thin film.
But existing technical scheme lacks grinds to UV hardening times and UV solidification power to property after Ag ink cureds
Study carefully, especially also lack the research to roughness.Additionally, add heat treatment to increase the fussy degree of technique, and it is thin to increase Ag
The roughness of film.
Although the characteristic of Ag thin film is heavily dependent on the property of Ag inks itself and constituent, solidify work
Impact of the skill to Ag property of thin film is also very big, and the final property of Ag thin film depends not only on Ag inks itself.With it is existing
Technical scheme compare, the present invention not only employs UV curing process and inkjet technology to prepare Ag thin film simultaneously, and
Propose and solidify power and UV hardening times to adjust printing Ag film resiativities and roughness using UV, in less solidification
Between and less processing step under obtained the Ag thin film of low resistivity and roughness.
Present invention employs the mode of UV solidifications to solidify inkjet printing Ag thin film, and by adjusting the solidification of UV solidifications
The UV solidification power that time and sample are subject to is controlled to the resistivity and roughness of the printing Ag thin film after solidification, its purpose
It is：（1）The parameter of Ag inks UV solidifications is optimized, in the case where only solidifying using UV there is the Ag thin film for obtaining
Relatively low resistivity and surface roughness；（2）It is subject to from technological angle unlike the prior art, i.e. UV hardening times and sample
UV solidification power, the resistivity and surface roughness of Ag thin film are adjusted and are optimized；（3）Attempt reducing heat treatment step
Relatively low resistivity is obtained under conditions of rapid, while avoiding the problem of the larger surface roughness that heat treatment brings, is obtained more
Smooth Ag thin film.
The content of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of ultraviolet light polymerization post processing side for printing electrode
Method.The UV radiant powers that the method is subject under low UV radiant powers using UV curing process by adjustment sample（In the present invention
Solidify the lifting platform height in instrument using UV, i.e. sample is represented with a distance from UV lamp）Realize to ink-jet with UV hardening times
The surface roughness of Ag thin film and the control of resistivity are printed, so as to the Ag for obtaining relatively low resistivity and surface roughness is thin
Film.
The purpose of the present invention is achieved through the following technical solutions.
A kind of ultraviolet light polymerization post-processing approach for printing electrode, comprises the following steps：
（1）Substrate is cleaned：Substrate is put in ultrasonic cleaner and is cleaned；
（2）Substrate is dried：The substrate cleaned is put in baking oven and is dried；
（3）Thin film is printed：Print parameters are set, the substrate of drying is put into print preset figure on a printer；
（4）UV solidifies：Printed substrate is put in UV solidification instrument, the distance of lifting platform and UV lamp in UV solidification instrument is adjusted,
Set hardening time, solidification；
（5）The roughness and resistivity of test printing gained Ag thin film.
Preferably, step（1）The substrate is sheet glass.
Preferably, step（1）It is described cleaning for successively with reclaim isopropanol, reclaim tetrahydrofuran, alkaline cleaning fluid,
Deionized water, deionized water, isopropanol difference ultrasonic vibration 5 ~ 10min of substrate.
Preferably, step（2）Temperature in the baking oven is 75 ~ 85 DEG C.
Preferably, step（3）Ink used by middle printing is ANP 40LT granular pattern silver inks.
Preferably, step（3）The print parameters are：Shower nozzle to object stage distance is 1000um, and printing curve is pros
Shape, drop centers spacing is 35um, drop speeds are 2m/s, object stage temperature is 30 DEG C, nozzle temperature is 30 ~ 60 DEG C.
Preferably, step（4）The power of UV lamp tool is 600W in the UV solidifications instrument.
Preferably, step（4）Lifting platform and the distance of UV lamp are 0-37cm in the UV solidifications instrument.
It is further preferred that lifting platform and the distance of UV lamp are 24 ~ 26cm in the UV solidifications instrument.
Preferably, step（4）The hardening time is 2min ~ 5min.
Compared with prior art, the invention has the advantages that and technique effect：
1）The hardening time of inkjet printing Ag thin film of the present invention is shorter, and technical process is extremely simple, without the need for precuring, solidifies
Journey only needs to UV and solidifies a step.
2）UV curing process of the present invention is that solidification is completed with uniform UV radiation exposures Ag ink, therefore is connect with non-
Tactile the characteristics of, damage will not be produced to thin film, and the Ag film surfaces of inkjet printing are more uniform, smooth（Roughness typically exists
Below 20nm）.And the radiation-induced temperature rises of UV promote the volatilization of solvent and other Organic substances, thus solidify the electricity of rear film
Resistance rate is relatively low, can reach the 10 u Ω * cm orders of magnitude, minimum to can reach 11u Ω * cm or so.
3）Hardening time and solidification power that the present invention is solidified by adjustment UV（Lifting platform highly carrys out table used in the present invention
Show）It is low solidification power under realize control solidification after inkjet printing Ag thin film roughness and resistivity, and obtained compared with
The Ag thin film of low-resistivity and roughness.
Description of the drawings
Fig. 1 is UV solidifications instrument used by the embodiment of the present invention（It is internal）Schematic diagram.
Specific embodiment
Below in conjunction with accompanying drawing and example to the present invention be embodied as be described further, but the enforcement and protection of the present invention
Not limited to this.
The parameter specification of the material and facility used in following examples is as follows：
（1）It is 30%～35% that experiment uses solid content, and viscosity is 10～17 cPs, and surface tension is 35～38 dyn/cm,
Solvent is tri ethylene glycol ethyl ether, the cleaning solvent that can be used be ethanol, isopropanol polar solvent, sintering temperature be 120 DEG C～
150 DEG C, reference resistance rate is the ANP 40LT granular pattern silver inks of 11 μ Ω cm～12 μ Ω cm.
（2）Substrate adopts length and width 1cm × 1cm, the sheet glass of thickness 0.7mm.
（3）Printing device uses Dimatix DMP-2800 printers.
（4）UV solidifies instrument:The IntelliRay Full-Featured UV of Uvitron International, Inc
Flood Curing System（Full-function protected type uv cure system）UV0832, its maximum power density is 175mW/
cm2, solidification area is 8 inches × 6 inches.The power of UV lamp tool is 600W, and main UV radiation wave bands are for 315nm ~ 400nm's
UVA wave bands, the schematic diagram inside UV curing apparatus as shown in figure 1, the Sample in figure be sample, UV Lamp be uviol lamp.
Embodiment 1
（1）Substrate is cleaned：Substrate is put in ultrasonic cleaner, successively with the isopropanol for reclaiming, tetrahydrofuran, the alkali of recovery
Property cleanout fluid, deionized water, deionized water, isopropanol difference ultrasonic vibration 10min.
（2）Substrate is dried：The substrate cleaned is put in baking oven, is dried at 80 DEG C.
（3）Experiment parameter is arranged：Arrange shower nozzle to object stage distance be 1000um, design printing curve for 8mm*8mm just
It is square, set drop centers spacing as 35um, drop speeds be 2m/s, object stage temperature be 30 DEG C, nozzle temperature be 30 DEG C.
（4）Thin film is printed：With printer in substrate print preset figure.
（5）UV solidifies：Printed substrate is put in UV solidification instrument, lifting platform height h=0cm in adjustment UV solidification instrument,
I.e. apart from UV lamp 37cm, and hardening time is set for 485s, then solidified.
（6）Experimental result：
Roughness：The roughness Ra for printing gained Ag thin film is about 4.53nm in 175 ~ 185s hardening time, during 295 ~ 305s
About 2.25nm, is about 2.3nm during 475 ~ 485s, it is seen that kept stable after 300s.
Resistivity：The resistivity for printing gained Ag thin film is about 11.536 μ Ω cm in 175 ~ 185s hardening time,
It is about 21.056 μ Ω cm during 295 ~ 305s, 19.227 μ Ω cm is about during 475 ~ 485s.
Embodiment 2
（1）Substrate is cleaned：Substrate is put in ultrasonic cleaner, successively with the isopropanol for reclaiming, tetrahydrofuran, the alkali of recovery
Property cleanout fluid, deionized water, deionized water, isopropanol difference ultrasonic vibration 10min.
（2）Substrate is dried：The substrate cleaned is put in baking oven, is dried at 80 DEG C.
（3）Experiment parameter is arranged：It is 1000um that shower nozzle is arranged to object stage distance, and printing curve is that 8mm*8mm is square,
Drop centers spacing is 35um, and drop speeds are 2m/s, 30 DEG C of object stage temperature, 60 DEG C of nozzle temperature.
（4）Thin film is printed：With printer in substrate print preset figure.
（5）UV solidifies：Printed substrate is put in UV solidification instrument, lifting platform height h is in adjustment UV solidification instrument
0cm, 8cm, 10cm, 12cm, 14cm, i.e., apart from UV lamp 37cm, 29cm, 27cm, 25cm, 23cm, UV is set to hardening time
180s, is then solidified.
（6）Experimental result：
Roughness：The roughness Ra of Ag thin film undulation between 1.3nm ~ 2.95nm obtained by printing, without evident regularity.
Resistivity：The resistivity for printing gained Ag thin film is about 53.8 μ Ω cm when apart from UV lamp about 37cm, apart from UV
Be about 37.8 μ Ω cm during 28 ~ 30cm of lamp, apart from 26 ~ 28cm of UV lamp when be about 27.8 μ Ω cm, apart from 24 ~ 26cm of UV lamp when
About 23.4 μ Ω cm, apart from 22 ~ 24cm of UV lamp when be about 33.1 μ Ω cm, i.e., in UV lamp 24 ~ 26cm environs
Reach minima.
Claims (10)
1. a kind of ultraviolet light polymerization post-processing approach for printing electrode, it is characterised in that comprise the following steps：
（1）Substrate is cleaned：Substrate is put in ultrasonic cleaner and is cleaned；
（2）Substrate is dried：The substrate cleaned is put in baking oven and is dried；
（3）Thin film is printed：Print parameters are set, the substrate of drying is put into print preset figure on a printer；
（4）UV solidifies：Printed substrate is put in UV solidification instrument, the distance of lifting platform and UV lamp in UV solidification instrument is adjusted,
Set hardening time, solidification；
（5）The roughness and resistivity of test printing gained Ag thin film.
2. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 1, it is characterised in that step
（1）The substrate is sheet glass.
3. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 1, it is characterised in that step
（1）It is described cleaning for successively with reclaim isopropanol, reclaim tetrahydrofuran, alkaline cleaning fluid, deionized water, deionized water,
Isopropanol distinguishes ultrasonic vibration 5 ~ 10min of substrate.
4. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 1, it is characterised in that step
（2）Temperature in the baking oven is 75 ~ 85 DEG C.
5. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 1, it is characterised in that step
（3）Ink used by middle printing is ANP 40LT granular pattern silver inks.
6. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 1, it is characterised in that step
（3）The print parameters are：Shower nozzle to object stage distance is 1000um, and printing curve is square, and drop centers spacing is
35um, drop speeds are 2m/s, object stage temperature is 30 DEG C, nozzle temperature is 30 ~ 60 DEG C.
7. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 1, it is characterised in that step
（4）The power of UV lamp tool is 600W in the UV solidifications instrument.
8. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 1, it is characterised in that step
（4）Lifting platform and the distance of UV lamp are 0-37cm in the UV solidifications instrument.
9. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 8, it is characterised in that the UV
Lifting platform and the distance of UV lamp are 24 ~ 26cm in solidification instrument.
10. a kind of ultraviolet light polymerization post-processing approach for printing electrode according to claim 1, it is characterised in that step
（4）The hardening time is 2min ~ 5min.
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| CN201611008357.XA CN106585156B (en) | 2016-11-16 | 2016-11-16 | A kind of ultraviolet light solidification post-processing approach to print electrode |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107323118A (en) * | 2017-07-06 | 2017-11-07 | 华南理工大学 | A kind of preparation method of the silver-colored conductive film of UV solidifications pretreatment |
| CN107344456A (en) * | 2017-06-29 | 2017-11-14 | 华南理工大学 | A kind of method of the ultraviolet light regulation and control spuious particle in inkjet printing metal wire edge |
| CN107379804A (en) * | 2017-07-31 | 2017-11-24 | 华南理工大学 | A kind of large area high uniformity film ink-jet Method of printing and print system |
| CN107611024A (en) * | 2017-07-17 | 2018-01-19 | 华南理工大学 | A kind of high-performance source-drain electrode printed form thin film transistor (TFT) and preparation method thereof |
| CN107672333A (en) * | 2017-09-29 | 2018-02-09 | 华南理工大学 | A kind of method that UV pretreatments improve solution-type silver inks water inkjet printing quality of forming film |
| CN108231277A (en) * | 2017-12-13 | 2018-06-29 | 华南理工大学 | A kind of method for reducing MOD type silver ink water film defects by adjusting ink droplet spacing |
| CN108535305A (en) * | 2018-03-30 | 2018-09-14 | 南京大学 | A method of the superconducting nano-wire analysis of Uniformity based on element imaging |
| CN108725008A (en) * | 2018-05-31 | 2018-11-02 | 华南理工大学 | A method of improving metal-organic decomposition type silver ink water bond strength |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100003021A1 (en) * | 2008-07-01 | 2010-01-07 | Weyerhaeuser Co. | Systems and methods for curing deposited material using feedback control |
| CN102311681A (en) * | 2011-08-25 | 2012-01-11 | 浙江科创新材料科技有限公司 | UV curing silver nanowire ink and its preparation method and application method |
| CN102529479A (en) * | 2011-12-23 | 2012-07-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Post-treatment method for improving printing evenness of electronic material |
| CN103627255A (en) * | 2013-05-06 | 2014-03-12 | 苏州冷石纳米材料科技有限公司 | Nano-silver conductive ink and conductive film prepared by employing same |
| CN104303267A (en) * | 2012-05-18 | 2015-01-21 | 尤尼皮克塞尔显示器有限公司 | Forming conductive patterns using ink comprising metal nanoparticles and nanowires |
| US20150189761A1 (en) * | 2013-12-20 | 2015-07-02 | Intrinsiq Materials, Inc. | Method for depositing and curing nanoparticle-based ink |
-
2016
- 2016-11-16 CN CN201611008357.XA patent/CN106585156B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100003021A1 (en) * | 2008-07-01 | 2010-01-07 | Weyerhaeuser Co. | Systems and methods for curing deposited material using feedback control |
| CN102311681A (en) * | 2011-08-25 | 2012-01-11 | 浙江科创新材料科技有限公司 | UV curing silver nanowire ink and its preparation method and application method |
| CN102529479A (en) * | 2011-12-23 | 2012-07-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Post-treatment method for improving printing evenness of electronic material |
| CN104303267A (en) * | 2012-05-18 | 2015-01-21 | 尤尼皮克塞尔显示器有限公司 | Forming conductive patterns using ink comprising metal nanoparticles and nanowires |
| CN103627255A (en) * | 2013-05-06 | 2014-03-12 | 苏州冷石纳米材料科技有限公司 | Nano-silver conductive ink and conductive film prepared by employing same |
| US20150189761A1 (en) * | 2013-12-20 | 2015-07-02 | Intrinsiq Materials, Inc. | Method for depositing and curing nanoparticle-based ink |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107344456A (en) * | 2017-06-29 | 2017-11-14 | 华南理工大学 | A kind of method of the ultraviolet light regulation and control spuious particle in inkjet printing metal wire edge |
| CN107323118A (en) * | 2017-07-06 | 2017-11-07 | 华南理工大学 | A kind of preparation method of the silver-colored conductive film of UV solidifications pretreatment |
| CN107611024A (en) * | 2017-07-17 | 2018-01-19 | 华南理工大学 | A kind of high-performance source-drain electrode printed form thin film transistor (TFT) and preparation method thereof |
| CN107379804A (en) * | 2017-07-31 | 2017-11-24 | 华南理工大学 | A kind of large area high uniformity film ink-jet Method of printing and print system |
| CN107379804B (en) * | 2017-07-31 | 2023-01-06 | 华南理工大学 | Large-area high-uniformity film ink-jet printing method and printing system |
| CN107672333A (en) * | 2017-09-29 | 2018-02-09 | 华南理工大学 | A kind of method that UV pretreatments improve solution-type silver inks water inkjet printing quality of forming film |
| CN108231277A (en) * | 2017-12-13 | 2018-06-29 | 华南理工大学 | A kind of method for reducing MOD type silver ink water film defects by adjusting ink droplet spacing |
| CN108535305A (en) * | 2018-03-30 | 2018-09-14 | 南京大学 | A method of the superconducting nano-wire analysis of Uniformity based on element imaging |
| CN108535305B (en) * | 2018-03-30 | 2020-10-02 | 南京大学 | Superconducting nanowire uniformity analysis method based on element imaging |
| CN108725008A (en) * | 2018-05-31 | 2018-11-02 | 华南理工大学 | A method of improving metal-organic decomposition type silver ink water bond strength |
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