CN106585111A - Printing apparatus, printing material container and chip thereof, electrical connection structure of printing apparatus and printing material container - Google Patents
Printing apparatus, printing material container and chip thereof, electrical connection structure of printing apparatus and printing material container Download PDFInfo
- Publication number
- CN106585111A CN106585111A CN201611140786.2A CN201611140786A CN106585111A CN 106585111 A CN106585111 A CN 106585111A CN 201611140786 A CN201611140786 A CN 201611140786A CN 106585111 A CN106585111 A CN 106585111A
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- printed material
- contact
- material container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
- B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Electrophotography Configuration And Component (AREA)
Abstract
The invention relates to the field of imaging consumable chip reproduction, and more particularly to a printing apparatus, a printing material container and a chip thereof, an electrical connection structure of the printing apparatus and the printing material container. The printing material container is mounted on the printing apparatus, and the second contact member of the chip is deformed by the acting force of a retraction portion in contact with the second contact member so as not to be in the same plane of a first contact member disposed on a fixing portion. When there is a droplet of the print material container splashed onto the circuit board, the probability of covering both the first contact member and the second contact member is reduced. Thus, the risk of chip short circuit is reduced.
Description
Technical field
The present invention relates to consumable chip regeneration field is imaged, more particularly to printing device, printed material container and its chip,
The electric connection structure of printing device and printed material container.
Background technology
Cartridge memory in ink-jet printer or other printing devices contains the printed material used for printing device, beats
Shower nozzle for spraying printed material is installed on printed material material container and is set from printing with receiving for electrically connecting with printing device
Standby control command and the chip of feedback information to printer apparatus.During the work of printing device, spray via shower nozzle
The drop of printed material be possible to be dropped on the contact of chip electrical connection printing device and cause short circuit, cause the damage of chip
It is bad.
The content of the invention
The present invention is solution above-mentioned technical problem, there is provided a kind of printing for reducing printed material container chip short-circuit risks
The electric connection structure of equipment, printed material container and its chip, printing device and printed material container.Technical scheme
It is as follows：
A kind of chip for being installed on printed material container, including circuit board, located at the circuit board be used for make electrical contact with printing device
Multiple contacts；It is characterized in that：The contact includes the first contact of the movable part located at circuit board and is located at
Second contact of the fixed part of circuit board, the movable part can be sent out in the presence of the power perpendicular to circuit board surface direction
Raw deformation so that second contact being provided thereon is in different planes from first contact；The circuit board
Surface refers to and the chip is attached to after printing device, circuit board towards or the portion that dorsad electrically connects with the chip on printing device
The surface of part.When there is drop to splash on the circuit board of chip on printed material container, drop is reduced while being covered in first
Probability on contact and the second contact, so as to reduce the risk of chip short circuit.
Preferably, the movable part and the fixed part are partially separated so that the movable part with the fixed part
Detached part, deforms upon in the presence of the power perpendicular to circuit board surface direction.The movable part and the fixed part
It is partially separated, the gap of the separate section when the movable part produces deformation and between the fixed part can become big so that institute
State the distance between the first contact and second contact and become big, reduce the risk of chip short circuit.
Preferably, the thickness of the movable part of circuit board is less than 0.5mm.By adopting the PCB thinner than common PCB
Plate so that the pcb board can under force produce flexural deformation.
Preferably, the circuit board be thickness less than 0.5mm whole plate, the whole plate be divided into the fixed part and
The movable part.Board structure of circuit is simple, and easy to make, cost is substantially reduced.
Preferably, multiple contacts are in parallel distribution.
Preferably, multiple contacts are distributed in a row.
Preferably, multiple contacts are distributed in two row or multi-row.
Preferably, the movable part has two, two movable parts are respectively positioned at the both sides of the fixed part.Activity
Portion, in the edge of circuit board, makes more convenient also so that the structure of chip is more stable compared to fixed position.
Preferably, only arranging second contact on a movable part.
The present invention also provides the electric connection structure of a kind of printed material container and printing device, including being installed on printed material
The chip of container, the connector for being installed on printing device；The chip includes circuit board, is used to make electrical contact with located at the circuit board
Multiple contacts of printing device, the connector includes pedestal and the multiple conductors located at the pedestal, multiple contacts
Part is corresponded with multiple conductors；It is characterized in that：The contact includes that first of the movable part located at circuit board connects
Second contact of contact element and the fixed part located at circuit board, the movable part can be perpendicular to circuit board surface direction
Deform upon in the presence of power so that second contact being provided thereon is put down from first contact in different
Face；The conductor includes docking portion, and the docking portion can be in the relatively described base on the direction of the circuit board surface
Seat is mobile, and maximum moving displacement is 3mm；The circuit board surface refers to and the chip is attached to after printing device, circuit plate face
To or the dorsad surface of the connector.The docking portion can be moved relative to the pedestal so that be not in same plane
The first contact and the second contact can be corresponding conductor electrical contact.
Preferably, the movable part and the fixed part are partially separated so that the movable part with the fixed part
Detached part, deforms upon in the presence of the power perpendicular to circuit board surface direction.
Preferably, the thickness of the movable part of circuit board is less than 0.5mm.
Preferably, the circuit board be thickness less than 0.5mm whole plate, the whole plate be divided into the fixed part and
The movable part.
Preferably, the movable part has two, two movable parts are respectively positioned at the both sides of the fixed part.
Preferably, only arranging second contact on a movable part.
The present invention also provides a kind of printed material container, including container, the chip that is installed on the container, and its feature exists
In：The chip as it was previously stated, the container includes the chip installation portion for installing the chip, the chip installation portion with
There is activity space, the activity space causes the movable part perpendicular to circuit board front between the movable part of the chip
Power in the presence of deform upon so that the second contact being provided thereon is near the chip installation portion；The circuit board is just
Face refers to and the chip is attached to after printing device, the table of the part that circuit board is electrically connected towards on printing device with the chip
Face.
The present invention also provides a kind of printing device including said chip.
The present invention also provides a kind of printing device including above-mentioned printed material container.
The present invention also provides a kind of printing device including above-mentioned printed material container and printing device attachment structure.
In technical scheme, the connection of the chip by its contact and printer of printed material container is installed on
Part makes electrical contact with, and realizes the communication of printed material container and printing device.Printed material container is installed on printing device, chip
Second contact is subject to the active force of the docking portion being in contact with it and produces deformation, and contacts with first be arranged on fixed part
Part is not in a plane.When printed material container has drop to splash on circuit board, reduce while being covered in the first contact
With the probability on the second contact.So as to reduce the risk of chip short circuit.
Description of the drawings
The printed material container and printing device connecting-piece structure schematic side view of Fig. 1 present invention.
The printing device connecting-piece structure schematic side view of Fig. 2 present invention.
The chip structure schematic diagram one of the printed material container of the embodiment of the present invention one of Figure 30 1.
The chip structure schematic diagram two of the printed material container of the embodiment of the present invention one of Figure 30 2.
The chip structure schematic diagram three of the printed material container of the embodiment of the present invention one of Figure 30 3.
The chip structure schematic diagram four of the printed material container of the embodiment of the present invention one of Figure 30 4.
The chip structure schematic diagram five of the printed material container of the embodiment of the present invention one of Figure 30 5.
The chip structure schematic diagram six of the printed material container of the embodiment of the present invention one of Figure 30 6.
The chip structure schematic diagram seven of the printed material container of the embodiment of the present invention one of Figure 30 7.
The scheme of installation of printed material container and printing device in the Figure 30 1 of Figure 40 1.
The scheme of installation of printed material container and printing device in the Figure 30 2 of Figure 40 2.
The scheme of installation of printed material container and printing device in the Figure 30 3 of Figure 40 3.
The scheme of installation of printed material container and printing device in the Figure 30 4 of Figure 40 4.
The scheme of installation of printed material container and printing device in the Figure 30 5 of Figure 40 5.
The scheme of installation of printed material container and printing device in the Figure 30 6 of Figure 40 6.
The scheme of installation of printed material container and printing device in the Figure 30 7 of Figure 40 7.
The chip structure schematic diagram one of the printed material container of the embodiment of the present invention two of Figure 50 1.
The chip structure schematic diagram two of the printed material container of the embodiment of the present invention two of Figure 50 2.
The chip structure schematic diagram three of the printed material container of the embodiment of the present invention two of Figure 50 3.
The chip structure schematic diagram four of the printed material container of the embodiment of the present invention two of Figure 50 4.
The chip structure schematic diagram five of the printed material container of the embodiment of the present invention two of Figure 50 5.
The chip structure schematic diagram six of the printed material container of the embodiment of the present invention two of Figure 50 6.
The chip structure schematic diagram seven of the printed material container of the embodiment of the present invention two of Figure 50 7.
The scheme of installation of printed material container and printing device in the Figure 50 1 of Figure 60 1.
The scheme of installation of printed material container and printing device in the Figure 50 2 of Figure 60 2.
The scheme of installation of printed material container and printing device in the Figure 50 3 of Figure 60 3.
The scheme of installation of printed material container and printing device in the Figure 50 4 of Figure 60 4.
The scheme of installation of printed material container and printing device in the Figure 50 5 of Figure 60 5.
The scheme of installation of printed material container and printing device in the Figure 50 6 of Figure 60 6.
The scheme of installation of printed material container and printing device in the Figure 50 7 of Figure 60 7.
Specific embodiment
Embodiments of the present invention are described in detail below in conjunction with accompanying drawing.
This specific embodiment is only explanation of the invention, its be not to invent restriction, those skilled in the art
The modification without creative contribution can be made to the present embodiment as needed after this specification is read, but as long as at this
The protection of Patent Law is all received in bright right.
Embodiment one
A kind of such as Fig. 1, printer system includes printing device and printed material container.Chip 1 is installed on printed material container,
Printing device includes connector 2.Chip 1 includes circuit board, is used to make electrical contact with many of printing device located at the circuit board surface
Individual contact 12.Connector 2 includes pedestal 21 and the multiple conductors 22 located at pedestal 21, multiple contacts 12 and multiple conductors 22
Correspond.
Circuit board adopts thickness for the pcb board of 0.2mm, and this kind of pcb board can under force be deformed upon and bent.
Such as Fig. 3, multiple contacts are distributed in circuit board surface in two rows, in order to prevent each contact while the drop for being spilt covers
Cover and short circuit, the best plug hole of two rows contact is intervally arranged.Contact 12b in Fig. 3 has two, connects positioned at two rows respectively
In contact element at the end positions of second row.
Circuit board is cut using laser, Figure 30 1- Figure 30 7 describes the various modes cut to circuit board,
Line of cut a shows the cutting path cut to circuit board.This sentences and is described as a example by Figure 30 1：Will be close to circuit board
Two contact 12b in that row's contact at edge in two ends are separated with the contact 12a of mid portion.Circuit board quilt
It is cut into the movable part 111 and remaining fixed part 112 for being loaded with contact 12b.The area of movable part 111 is significantly smaller than fixed part
112 area, tilts so that located at movable part receiving in the presence of the power in circuit board surface direction and along Z axis
Contact on 111 is in different planes from the contact on fixed part 112.Now, movable part 111 and fixed part
The gap of the location of cut between 113 becomes big so that the distance of two parts is more remote.
The chip installation portion 3 of printed material container is used for chip 1, fixed part 112 and the chip installation portion 3 of chip 1
Mounting surface 31 fix.The caving in partially towards the direction away from chip below mounting surface 31 of chip installation portion 3 so that install
The activity space deformed upon for movable part 111 is formed between the back side of the chip circuit plate on container and chip installation portion 3
32.（Circuit board front refers to and the chip is attached to after printing device that circuit board is electrically connected towards on printing device with the chip
Part surface, back of circuit board refers to and the chip is attached to after printing device, circuit board dorsad on printing device with should
The surface of the part of chip electrical connection）When the movable part 111 of chip is being subject in the presence of the positive power of circuit board, court
Tilt in activity space 32 so that the contact on movable part 111 is near the chip installation portion 3.
As Fig. 2, conductor 22 include docking portion 221, docking portion 221 can be on the direction of the circuit board surface
（Z-direction in Fig. 2）Opposite base 21 is moved, and maximum moving displacement is 3mm.
Fig. 4 is after printed material container is installed on printing device shown in Fig. 3, printed material container chip with print
The attachment structure schematic diagram of the connector of equipment.The contact 12 of chip is corresponded with the conductor 22 of connector and contacted, and is installed
Gap between face 31 and connector 2 is less than length of the conductor 22 on the direction perpendicular to the surface of circuit board 11.With contact
Part 12 contact conductor 22 docking portion, chip circuit plate extruding force effect under towards Z axis opposite direction, it is partially retracted extremely
In the pedestal 21 of connector.It is constant that the fixed part 112 of chip circuit plate fixes its position with the mounting surface 31 of printed material container.
There is activity space 32 between the back side of the movable part 111 of chip circuit plate and the chip installation portion 3 of printed material container, be located at
The conductor that the contact of movable part 111 is corresponding contacts the active force perpendicular to circuit board direction being subject to later from conductor
And tilt towards in activity space 32.Contact on movable part 111 is with the contact on fixed part 112 in not
Same plane.Simultaneously as movable part 111 is tilted towards in activity space 32, cutting between movable part 111 and fixed part 113
Cut the gap at position and become big so that the distance of two parts is more remote.
The pcb board of general thickness can also be adopted in the present embodiment as the fixed part 112 of circuit board 11, only circuit board
The part of 11 movable part 111 adopts thickness and makes for the pcb board of 0.2mm.Now, preferably in the front of circuit board（It is provided with
Contact, the chip is attached to the table of the part that circuit board is electrically connected towards on printing device with the chip after printing device
Face）Movable part 111 and fixed part 112 at grade, to meet the excellent electric contact of the corresponding conductor of contact.
Can be using one or several any combination in Figure 30 1-307, Ren Heneng to the cutting mode of circuit board
Enough so that circuit board be divided into the movable part and fixed part being partially separated separation scheme should protection scope of the present invention it
It is interior.
The quantity of movable part and position can be according to the application scenarios of chip and demand in the purport without prejudice to the present invention
On the premise of arbitrarily adjust.
The quantity of the contact being distributed on movable part can also be according to the application scenario of chip and demand without prejudice to this
Arbitrarily adjust on the premise of the purport of invention.
Embodiment two
As a kind of printer systems of Fig. 1 include printing device and printed material container.Chip 1 is installed on printed material container,
Printing device includes connector 2.Chip 1 includes circuit board 11, is used to make electrical contact with printing device located at the circuit board surface
Multiple contacts 12.Connector 2 includes pedestal 21 and the multiple conductors 22 located at pedestal 21, multiple contacts 12 and multiple conductors
22 correspond.
Circuit board adopts thickness for the pcb board of 0.2mm, and this kind of pcb board can under force be deformed upon and bent.
As shown in figure 5, multiple contacts 12 are arranged in a row in circuit board surface.
Circuit board is cut using laser, Figure 50 1- Figure 50 7 describes the various modes cut to circuit board,
Line of cut a shows the cutting path cut to circuit board.This sentences and is described as a example by Figure 50 1：Will be close to circuit board
Two contact 12b in the contact at edge in two ends are separated with the contact 12a of mid portion.Circuit board is cut into
It is loaded with the movable part 111 and remaining fixed part 112 of contact 12b.The area of movable part 111 is significantly smaller than fixed part 112
Area, tilts so that on movable part 111 receiving in the presence of the power in circuit board surface direction and along Z axis
Contact be in different planes from the contact on the fixed part 112.Now, between movable part 111 and fixed part 113
The gap of location of cut become big so that the distance of two parts is more remote.
The chip installation portion 3 of printed material container is used for chip 1, fixed part 112 and the chip installation portion 3 of chip 1
Mounting surface 31 fix.The caving in partially towards the direction away from chip below mounting surface 31 of chip installation portion 3 so that install
The activity space deformed upon for movable part 111 is formed between the back side of the chip circuit plate on container and chip installation portion 3
32.（Circuit board front refers to and the chip is attached to after printing device that circuit board is electrically connected towards on printing device with the chip
Part surface, back of circuit board refers to and the chip is attached to after printing device, circuit board dorsad on printing device with should
The surface of the part of chip electrical connection）When the movable part 111 of chip is being subject in the presence of the positive power of circuit board, court
Tilt in activity space 32 so that the contact on movable part 111 is near the chip installation portion 3.
As Fig. 2, conductor 22 include docking portion 221, docking portion 221 can be on the direction of the circuit board surface
（Z-direction in Fig. 2）Opposite base 21 is moved, and maximum moving displacement is 3mm.
Fig. 6 is after printed material container is installed on printing device shown in Fig. 5, printed material container chip with print
The attachment structure schematic diagram of the connector of equipment.The contact 12 of chip is corresponded with the conductor 22 of connector and contacted, and is installed
Gap between face 31 and connector 2 is less than length of the conductor 22 on the direction perpendicular to the surface of circuit board 11.With contact
Part 12 contact conductor 22 docking portion, chip circuit plate extruding force effect under towards Z axis opposite direction, it is partially retracted extremely
In the pedestal 21 of connector.It is constant that the fixed part 112 of chip circuit plate fixes its position with the mounting surface 31 of printed material container.
There is activity space 32 between the back side of the movable part 111 of chip circuit plate and the chip installation portion 3 of printed material container, be located at
The conductor that the contact of movable part 111 is corresponding contacts the active force perpendicular to circuit board direction being subject to later from conductor
And tilt towards in activity space 32.Contact on movable part 111 is with the contact on fixed part 112 in not
Same plane.Simultaneously as movable part 111 is tilted towards in activity space 32, cutting between movable part 111 and fixed part 113
Cut the gap at position and become big so that the distance of two parts is more remote.
The pcb board of general thickness can also be adopted in the present embodiment as the fixed part 112 of circuit board 11, only circuit board
The part of 11 movable part 111 adopts thickness and makes for the pcb board of 0.2mm.Now, preferably in the front of circuit board（It is provided with
Contact, the chip is attached to the table of the part that circuit board is electrically connected towards on printing device with the chip after printing device
Face）Movable part 111 and fixed part 112 at grade, to meet the excellent electric contact of the corresponding conductor of contact.
Can be using one or several any combination in Figure 50 1-507, Ren Heneng to the cutting mode of circuit board
Enough so that circuit board be divided into the movable part and fixed part being partially separated separation scheme should protection scope of the present invention it
It is interior.
The quantity of movable part and position can be according to the application scenarios of chip and demand in the purport without prejudice to the present invention
On the premise of arbitrarily adjust.
The quantity of the contact being distributed on movable part can also be according to the application scenario of chip and demand without prejudice to this
Arbitrarily adjust on the premise of the purport of invention.
Although being described in conjunction with the accompanying embodiments of the present invention, those of ordinary skill in the art can be in appended power
Profit makes various modifications or modification in the range of requiring.
Claims (19)
1. a kind of chip for being installed on printed material container, including circuit board, it is used to make electrical contact with printing and set located at the circuit board
Standby multiple contacts；It is characterized in that：The contact includes the first contact of the movable part located at circuit board and sets
In the second contact of the fixed part of circuit board, the movable part can be in the presence of the power perpendicular to circuit board surface direction
Deform upon so that second contact being provided thereon is in different planes from first contact；The circuit
Plate surface refers to and the chip is attached to after printing device, circuit board towards or dorsad electrically connect with the chip on printing device
The surface of part.
2. a kind of chip for being installed on printed material container according to claim 1, it is characterised in that：The movable part and
The fixed part is partially separated so that the part detached with the fixed part of the movable part, perpendicular to circuit board surface
Deform upon in the presence of the power in direction.
3. a kind of chip for being installed on printed material container according to claim 2, it is characterised in that：Circuit board it is described
The thickness of movable part is less than 0.5mm.
4. a kind of chip for being installed on printed material container according to claim 2, it is characterised in that：The circuit board is
Whole plate of the thickness less than 0.5mm, the whole plate is divided into the fixed part and the movable part.
5. a kind of chip for being installed on printed material container according to claim 1, it is characterised in that：Multiple contacts
Part is in parallel distribution.
6. a kind of chip for being installed on printed material container according to claim 1, it is characterised in that：Multiple contacts
Part is distributed in a row.
7. a kind of installation according to claim 1 and the chip of printed material container, it is characterised in that：Multiple contacts
Part is distributed in two row or multi-row.
8. a kind of chip for being installed on printed material container according to claim 1, it is characterised in that：The movable part has
Two, two movable parts are respectively positioned at the both sides of the fixed part.
9. a kind of installation according to claim 8 and the chip of printed material container, it is characterised in that：One activity
One second contact is only set in portion.
10. the electric connection structure of a kind of printed material container and printing device, including the chip, the peace that are installed on printed material container
Connector loaded on printing device；The chip includes circuit board, is used to make electrical contact with many of printing device located at the circuit board
Individual contact, the connector includes pedestal and the multiple conductors located at the pedestal, and multiple contacts are described with multiple
Conductor is corresponded；It is characterized in that：The contact includes the first contact of the movable part located at circuit board and is located at
Second contact of the fixed part of circuit board, the movable part can be sent out in the presence of the power perpendicular to circuit board surface direction
Raw deformation so that second contact being provided thereon is in different planes from first contact；
The conductor includes docking portion, and the docking portion can be in the relatively described base on the direction of the circuit board surface
Seat is mobile, and maximum moving displacement is 3mm；The circuit board surface refers to and the chip is attached to after printing device, circuit plate face
To or the dorsad surface of the connector.
The electric connection structure of a kind of 11. printed material containers according to claim 10 and printing device, it is characterised in that：
The movable part and the fixed part are partially separated so that the part detached with the fixed part of the movable part, vertical
Deform upon in the presence of the power in circuit board surface direction.
The electric connection structure of a kind of 12. printed material containers according to claim 11 and printing device, it is characterised in that：
The thickness of the movable part of circuit board is less than 0.5mm.
The electric connection structure of a kind of 13. printed material containers according to claim 11 and printing device, it is characterised in that：
The circuit board is whole plate of the thickness less than 0.5mm, and the whole plate is divided into the fixed part and the movable part.
The electric connection structure of a kind of 14. printed material containers according to claim 10 and printing device, it is characterised in that：
The movable part has two, and two movable parts are respectively positioned at the both sides of the fixed part.
The electric connection structure of a kind of 15. printed material containers according to claim 14 and printing device, it is characterised in that：
One second contact is only set on one movable part.
A kind of 16. printed material containers, including container, the chip that is installed on the container, it is characterised in that：The chip is such as
Any one of claim 1-9, the container includes the chip installation portion for installing the chip, and the chip is installed
There is activity space, the activity space causes the movable part perpendicular to circuit board between the movable part of portion and the chip
Deform upon in the presence of positive power so that the second contact being provided thereon is near the chip installation portion；The circuit
Plate front refers to and the chip is attached to after printing device, the part that circuit board is electrically connected towards on printing device with the chip
Surface.
A kind of 17. printing devices, it is characterised in that：Including chip as claimed in any one of claims 1-9 wherein.
A kind of 18. printing devices, it is characterised in that：Including printed material container as claimed in claim 16.
A kind of 19. printing devices, it is characterised in that：Including the printed material container as any one of claim 10-15
With the electric connection structure of printing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611140786.2A CN106585111B (en) | 2016-12-12 | 2016-12-12 | The electric connection structure of printing device, printed material container and its chip, printing device and printed material container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611140786.2A CN106585111B (en) | 2016-12-12 | 2016-12-12 | The electric connection structure of printing device, printed material container and its chip, printing device and printed material container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106585111A true CN106585111A (en) | 2017-04-26 |
| CN106585111B CN106585111B (en) | 2018-11-16 |
Family
ID=58597575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611140786.2A Active CN106585111B (en) | 2016-12-12 | 2016-12-12 | The electric connection structure of printing device, printed material container and its chip, printing device and printed material container |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106585111B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201092146Y (en) * | 2007-10-15 | 2008-07-30 | 珠海天威飞马打印耗材有限公司 | Cartridge having chip fender bracket |
| DE202007018986U1 (en) * | 2006-11-22 | 2009-12-24 | Samuel, Martin | Ink cartridge with double chip |
| CN203282859U (en) * | 2013-05-23 | 2013-11-13 | 珠海艾派克微电子有限公司 | Circuit substrate, storage chip and imaging box |
| CN204955733U (en) * | 2015-09-18 | 2016-01-13 | 珠海艾派克微电子有限公司 | Chip and ink cartridge |
| CN206456101U (en) * | 2016-12-12 | 2017-09-01 | 杭州旗捷科技有限公司 | The electric connection structure of printing device, printed material container and its chip, printing device and printed material container |
-
2016
- 2016-12-12 CN CN201611140786.2A patent/CN106585111B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202007018986U1 (en) * | 2006-11-22 | 2009-12-24 | Samuel, Martin | Ink cartridge with double chip |
| CN201092146Y (en) * | 2007-10-15 | 2008-07-30 | 珠海天威飞马打印耗材有限公司 | Cartridge having chip fender bracket |
| CN203282859U (en) * | 2013-05-23 | 2013-11-13 | 珠海艾派克微电子有限公司 | Circuit substrate, storage chip and imaging box |
| CN204955733U (en) * | 2015-09-18 | 2016-01-13 | 珠海艾派克微电子有限公司 | Chip and ink cartridge |
| CN206456101U (en) * | 2016-12-12 | 2017-09-01 | 杭州旗捷科技有限公司 | The electric connection structure of printing device, printed material container and its chip, printing device and printed material container |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106585111B (en) | 2018-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206893832U (en) | Electronic building brick, electronic equipment and electronic system | |
| EP2285195B1 (en) | Socket, circuit board assembly, and apparatus having the same | |
| US9318820B2 (en) | Connector for multi-layered board | |
| US9166309B1 (en) | Bus bar with connector shroud | |
| CN1964142A (en) | Electrical device for interconnecting and assembly thereof | |
| RU2691643C2 (en) | Low-cost, non-connection, optical fiber subassembly (osa) and high-strength and small form factor and single-container data bus (bib) | |
| EP4106501A1 (en) | Cable assembly, signal transmission structure, and electronic device | |
| US6137508A (en) | Printhead de-multiplexing and interconnect on carriage mounted flex circuit | |
| CN105516407A (en) | Mobile terminal and circuit board assembly thereof | |
| US20200280145A1 (en) | Data communication system | |
| US7168988B1 (en) | Power connector with integrated decoupling | |
| JP6496711B2 (en) | Electronic devices | |
| CA3148768A1 (en) | 8 + 2 way xlr pcb female connector | |
| CN107613689A (en) | Connection component, printed circuit-board assembly and terminal | |
| US8083550B2 (en) | Electrical connector with cover | |
| US20030035033A1 (en) | Asymmetrical tape automated bonding device for a printhead cartridge | |
| CN206456101U (en) | The electric connection structure of printing device, printed material container and its chip, printing device and printed material container | |
| CN106585111A (en) | Printing apparatus, printing material container and chip thereof, electrical connection structure of printing apparatus and printing material container | |
| CN108604755B (en) | Electronic equipment | |
| CN206456100U (en) | Printing device, printed material container and its chip and their electric connection structure | |
| CN103151474B (en) | Structural improvement of upper cover of intelligent storage battery | |
| CN106494090B (en) | Printing device, printed material container and its chip and their electric connection structure | |
| CN202917689U (en) | Electric connector and electric connector assembly | |
| CN215933079U (en) | Display module assembly and display device | |
| CN216134658U (en) | PCB circuit board capable of being connected in series through lines |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |