CN106583958B - A kind of welding method of mask plate - Google Patents
A kind of welding method of mask plate Download PDFInfo
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- CN106583958B CN106583958B CN201611194102.7A CN201611194102A CN106583958B CN 106583958 B CN106583958 B CN 106583958B CN 201611194102 A CN201611194102 A CN 201611194102A CN 106583958 B CN106583958 B CN 106583958B
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- Prior art keywords
- mask plate
- solder joint
- fold
- spot pitch
- welding method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of welding methods of mask plate, determine spot pitch according to mask plate thickness, that described includes: the thickness T of S1 measurement mask plate the step of determining welding spacing；Height H, H=T+ △, the △ 15um-20um of S2 calculating solder joint；S3 calculates spot pitch D, D=λ H, λ 35-50.The present invention, which passes through, determines that the spacing of solder joint controls crimp height, reduces a large amount of testing time；Avoid the waste of mask plate caused by testing in the prior art；Method is simply easily achieved；The control precision of crimp height is high, improves the production yield of product.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of welding method of mask plate.
Background technique
It is deposited mask plate (Evaporation mask), also referred to as mask, when being a kind of vapor deposition organic material, shielding portion
Divide organic material, to form the geometric figure of needs, there is shaded portions organic material when for vapor deposition organic material thereon
Afterwards, at least one geometric figure is formed, it can be achieved that selectively blocking on organic material to glass substrate, and finally in glass base
Corresponding pattern is formed on plate.
In solder mask version, due to the height and range of mask plate fold caused by welding, it will affect mask plate and steam
Fitting between glass plating substrate, and then influence the yield of product.At present in the actual production process, it is looked for by largely testing
The distributing order of required suitably throw the net power, welding energy, solder joint height, spot pitch and solder joint into welding process,
By parameters more than determination, so that it is determined that suitable mask plate welding method, controls crimp height.But this method institute
The testing time needed is long, and test quantity is more, and a large amount of test also results in the waste of material.
Summary of the invention
Based on problems of the prior art, the present invention provide it is a kind of by determine solder joint spacing so that it is determined that solder joint
Distributing order, reduce the testing time, save material, control mask plate crimp height mask plate welding method.
To achieve the above object, the present invention provides a kind of welding method of mask plate, first scheme are as follows: including determining solder joint
Spacing, the step of the welding spacing that determine include:
The thickness T of S1 measurement mask plate；
Height H, H=T+ △, the △ 15um-20um of S2 calculating solder joint；
S3 calculates spot pitch D, D=λ H, λ 35-50；Calculate the development length L of fold caused by welding, L≤130/
3*H, when maximum extension length or so of the spot pitch in fold, fold is just extended in spacing.
When mask plate welds, it will appear fold around solder joint and extend around, when the spot pitch of mask plate is arranged
When obtaining close, the fold that two solder joints generate can be superimposed, so that the thickness of mask plate increases, lead to the mask plate surface welded
Unevenly；When spot pitch setting is too far, it will appear the clear band of not fold between two solder joints, also result in and welded
Mask plate surface it is uneven；When fold extends completion just in spot pitch, the welding spacing effect achieved
Fruit is best, and the uniformity on entire mask plate surface is also most suitable.
As the preferred embodiment of first scheme, λ is 35-44 or λ is 43-50.
As the preferred embodiment of first scheme, λ 43-44.
As the preferred embodiment of first scheme, λ 130/3, when mask plate thickness T is identical as △, λ takes the value, welding
When generated fold development length it is maximum, spot pitch is chosen to the maximum extension length or so of fold, produced by solder joint
Fold can just extend in spot pitch completion, be not superimposed, the flatness of mask plate is good.
As the preferred embodiment of above scheme, putting in order for solder joint is determined according to spot pitch.
It as the preferred embodiment of first scheme, is welded from mask plate center toward mask plate edge, if first welding edge
Solder joint, the fluctuating of wave may concentrate to centre, cause the height of intermediate solder joint higher, eventually lead to intermediate fold compared with
It is high.If first welding is intermediate, wave can extend toward edge, because edge does not hinder, fold can discharge at edge, final edge
Fold will not be too high.
The beneficial effect that the present invention realizes mainly has the following:
1. reducing a large amount of testing time；
2. avoiding the waste of mask plate caused by testing in the prior art；
3. method is simply easily achieved by determining that the spacing of solder joint controls crimp height；
4. the control precision of crimp height is high, the production yield of product is improved.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, further being retouched in detail below in conjunction with embodiment to the present invention
It states.
Embodiment 1
The mask plate welding method of the present embodiment is as follows: choosing suitable mask plate, measures the thickness T of mask platea, this reality
Apply the thickness T in examplea=30um, △a=20um, λa=130/3。
Solder joint height Ha=Ta+△a=50um, spot pitch Da=λa*Ha≈2.166mm；The maximum extension length L of folda=
130/3*Ha≈2.166mm。
According to spot pitch DaThe arrangement of solder joint is carried out on mask plate, the spacing of each solder joint all around is both needed to meet
Da≈ 2.166mm, then mask plate is placed on fusing soldering welder, suitable welding energy and spot size are selected, from mask plate
It is welded to mask plate surrounding at center.
Maximum extension similar length due to selected spot pitch just with the fold generated in welding process, so
It can be extended in spacing just, will not generate the Imbricate pattern between solder joint, to ensure that the pleat of entire mask plate
The relatively uniform degree of wrinkle.
Embodiment 2
The mask plate welding method of the present embodiment is as follows: choosing suitable mask plate, measures the thickness T of mask plateb, this reality
Apply the thickness T in exampleb=30um, △b=20um, λb=35。
Solder joint height Hb=Tb+△b=50um, spot pitch Db=λb*Hb=1.75mm, the maximum extension length L of foldb=
130/3*H ≈ 2.166mm, Db<Lb。
According to spot pitch DbThe arrangement of solder joint is carried out on mask plate, the spacing of each solder joint all around is both needed to meet
Db=1.75mm, then mask plate is placed on fusing soldering welder, suitable welding energy and spot size are selected, from mask plate
The heart is welded to mask plate surrounding.
Since selected spot pitch is less than the maximum extension length of the fold generated in welding process, so it is on side
The superposition of fold can be generated at edge, but its superposition is generated in edge, and the fold for feeding through to solder joint center will not be extended,
By controlling the size of overlap-add region, to ensure that the relatively uniform degree of the fold of entire mask plate.
Embodiment 3
The mask plate welding method of the present embodiment is as follows: choosing suitable mask plate, measures the thickness T of mask plateb, this reality
Apply the thickness T in examplec=30um, △c=20um, λc=50。
Solder joint height Hc=Tc+△c=50um, spot pitch Dc=λc*Hc=2.5mm, the maximum extension length L of foldc=130/
3*H ≈ 2.166mm, Dc>Lc。
According to spot pitch DcThe arrangement of solder joint is carried out on mask plate, the spacing of each solder joint all around is both needed to meet
Dc=2.5mm, then mask plate is placed on fusing soldering welder, suitable welding energy and spot size are selected, from the center of mask plate
It is welded to mask plate surrounding.
Since selected spot pitch is greater than the maximum extension length of the fold generated in welding process, so it is on side
It will appear one section of region not influenced by solder joint at edge, control the size in its region to control the phase of the fold of entire mask plate
To the uniformity.
Embodiment 4
The mask plate welding method of the present embodiment is as follows: choosing suitable mask plate, measures the thickness T of mask plateb, this reality
Apply the thickness T in exampleb=30um, △d=15um, λd=40。
Solder joint height Hd=Tb+△d=45um, spot pitch Dd=λd*Hd=1.8mm, the maximum extension length L of foldd=130/
3*H ≈ 1.95mm, Dd<Ld。
According to spot pitch DdThe arrangement of solder joint is carried out on mask plate, the spacing of each solder joint all around is both needed to meet
Dd=1.95mm, then mask plate is placed on fusing soldering welder, suitable welding energy and spot size are selected, from mask plate
The heart is welded to mask plate surrounding.
Since selected spot pitch is less than the maximum extension length of the fold generated in welding process, so it is on side
The superposition of fold can be generated at edge, but its superposition is generated in edge, and the fold for feeding through to solder joint center will not be extended,
By controlling the size of overlap-add region, to ensure that the relatively uniform degree of the fold of entire mask plate.
Embodiment 5
The mask plate welding method of the present embodiment is as follows: choosing suitable mask plate, measures the thickness T of mask plateb, this reality
Apply the thickness T in examplee=30um, △e=15um, λe=43。
Solder joint height He=Te+△e=45um, spot pitch De=λe*He=1.935mm, the maximum extension length L of folde=
130/3*He≈ 1.95mm, De<Le。
According to spot pitch DeThe arrangement of solder joint is carried out on mask plate, the spacing of each solder joint all around is both needed to meet
De=1.935mm, then mask plate is placed on fusing soldering welder, suitable welding energy and spot size are selected, from mask plate
The heart is welded to mask plate surrounding.
Since selected spot pitch is less than the maximum extension length of the fold generated in welding process, so it is on side
The superposition of fold can be generated at edge, but its superposition is generated in edge, and the fold for feeding through to solder joint center will not be extended,
By controlling the size of overlap-add region, to ensure that the relatively uniform degree of the fold of entire mask plate.
Embodiment 6
The mask plate welding method of the present embodiment is as follows: choosing suitable mask plate, measures the thickness T of mask plateb, this reality
Apply the thickness T in examplef=30um, △f=20um, λf=44。
Solder joint height Hf=Tf+△f=50um, spot pitch Df=λf*Hf=2.2mm, the maximum extension length L of foldf=
130/3*Hf≈ 2.166mm, Df>Lf。
According to spot pitch DfThe arrangement of solder joint is carried out on mask plate, the spacing of each solder joint all around is both needed to meet
Df=2.2 mm, then mask plate is placed on fusing soldering welder, suitable welding energy and spot size are selected, from mask plate
The heart is welded to mask plate surrounding.
Since selected spot pitch is greater than the maximum extension length of the fold generated in welding process, so it is on side
It will appear one section of region not influenced by solder joint at edge, control the size in its region to control the phase of the fold of entire mask plate
To the uniformity.
Embodiment 7
The mask plate welding method of the present embodiment is as follows: choosing suitable mask plate, measures the thickness T of mask plateb, this reality
Apply the thickness T in exampleg=30um, △g=20um, λg=45。
Solder joint height Hg=Tg+△g=50um, spot pitch Dg=λg*Hg=2.25mm, the maximum extension length L of foldg=
130/3*Hg≈ 2.166mm, Dg>Lg。
According to spot pitch DgThe arrangement of solder joint is carried out on mask plate, the spacing of each solder joint all around is both needed to meet
Dg=2.2 mm, then mask plate is placed on fusing soldering welder, suitable welding energy and spot size are selected, from mask plate
The heart is welded to mask plate surrounding.
Since selected spot pitch is greater than the maximum extension length of the fold generated in welding process, so it is on side
It will appear one section of region not influenced by solder joint at edge, control the size in its region to control the phase of the fold of entire mask plate
To the uniformity.
The above are wherein specific implementations of the invention, and the description thereof is more specific and detailed, but can not therefore manage
Solution is limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art, not departing from
Under the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection scope.
Claims (6)
1. a kind of welding method of mask plate, it is characterised in that: determine spot pitch according to mask plate thickness, described determines weldering
The step of connecing spacing include:
The thickness T of S1 measurement mask plate；
Height H, H=T+ △, the △ 15um-20um of S2 calculating solder joint；
S3 calculates spot pitch D, D=λ H, λ 35-50.
2. the welding method of mask plate as described in claim 1, it is characterised in that: λ is 35-44 or λ is 43-50.
3. the welding method of mask plate as described in claim 1, it is characterised in that: λ 43-44.
4. the welding method of mask plate as described in claim 1, it is characterised in that: λ 130/3.
5. the welding method of mask plate according to any one of claims 1-4, it is characterised in that: determined and welded according to spot pitch
Point puts in order.
6. the welding method of mask plate as described in claim 1, it is characterised in that: from mask plate center toward mask plate edge into
Row welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611194102.7A CN106583958B (en) | 2016-12-21 | 2016-12-21 | A kind of welding method of mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611194102.7A CN106583958B (en) | 2016-12-21 | 2016-12-21 | A kind of welding method of mask plate |
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| Publication Number | Publication Date |
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| CN106583958A CN106583958A (en) | 2017-04-26 |
| CN106583958B true CN106583958B (en) | 2019-01-15 |
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| CN201611194102.7A Active CN106583958B (en) | 2016-12-21 | 2016-12-21 | A kind of welding method of mask plate |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101898612B1 (en) * | 2017-11-30 | 2018-09-13 | 주식회사 한송네오텍 | Dual tension type welding apparatus for manufacturing AMOLED mobile mask frame assembly and manufacturing method of AMOLED mobile mask frame assembly using thereof |
| CN111074205B (en) | 2020-01-22 | 2022-04-08 | 京东方科技集团股份有限公司 | Mask plate assembly and manufacturing method thereof |
| CN111952485B (en) * | 2020-08-20 | 2023-12-19 | 京东方科技集团股份有限公司 | Mask plate net tensioning assembly, net tensioning device and net tensioning method |
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| CN1824824A (en) * | 2005-01-05 | 2006-08-30 | 三星Sdi株式会社 | Mask frame and method of fixing mask on the mask frame |
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| JP4173722B2 (en) * | 2002-11-29 | 2008-10-29 | 三星エスディアイ株式会社 | Vapor deposition mask, organic EL element manufacturing method using the same, and organic EL element |
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| CN1824824A (en) * | 2005-01-05 | 2006-08-30 | 三星Sdi株式会社 | Mask frame and method of fixing mask on the mask frame |
| CN104096970A (en) * | 2013-04-10 | 2014-10-15 | 昆山思拓机器有限公司 | OLED (organic light emitting diode) metal mask plate welding system and method |
| CN104372291A (en) * | 2013-08-15 | 2015-02-25 | 昆山允升吉光电科技有限公司 | Mask assembly |
| CN204676141U (en) * | 2014-12-22 | 2015-09-30 | 信利（惠州）智能显示有限公司 | A kind of OLED evaporation mask plate framework |
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| CN106583958A (en) | 2017-04-26 |
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Inventor after: Wang Hongying Inventor after: Ran Yinggang Inventor after: Wu Junxiong Inventor after: Ke Xianjun Inventor after: Su Junhai Inventor after: Li Jianhua Inventor before: Wang Hongying |
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