CN106572617A - Heat dissipation device for electronic equipment - Google Patents
Heat dissipation device for electronic equipment Download PDFInfo
- Publication number
- CN106572617A CN106572617A CN201610927074.9A CN201610927074A CN106572617A CN 106572617 A CN106572617 A CN 106572617A CN 201610927074 A CN201610927074 A CN 201610927074A CN 106572617 A CN106572617 A CN 106572617A
- Authority
- CN
- China
- Prior art keywords
- heat
- housing
- electronic equipment
- gap
- memorial alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a heat dissipation device for electronic equipment, and the electronic equipment comprises a housing. The interior of the housing is provided with a heat source, and the heat dissipation device comprises a memory alloy sealing plate and a heat conducting part. A side wall of the housing is provided with a gap, and the memory alloy sealing plate seals the gap. The heat conducting part is connected between the heat source and the memory alloy sealing plate. After the heat source generates heat, the memory alloy sealing plate deforms, and forms a heat dissipation gap between the memory alloy sealing plate and the gap. After the heat source generates heat, the memory alloy sealing plate deforms, and forms the heat dissipation gap between the memory alloy sealing plate and the gap. The heat dissipation gap can enable the air inside and outside the housing to carry out heat exchange, thereby reducing the internal temperature of the housing. The device causes no noise, is good in heat dissipation effect, and does not need an additional circuit. When the temperature of the heat source is lower, the memory alloy sealing plate recovers to an initial state, and enables the housing to be closed, thereby preventing dust and gnats from entering, and reducing the impact on electrical performances.
Description
Technical field
The present invention relates to heat abstractor technical field, more particularly to the heat abstractor of a kind of electronic equipment.
Background technology
At present, the power of the household small-size electronic equipment such as router, Set Top Box is increasing, and this kind equipment is due to general
Used in the place higher to noise requirements such as bedroom or parlor, and its internal temperature can be very high when high capacity runs,
And then its service behaviour can be affected.
It is to the radiating mode of household small-size electronic equipment in prior art：One is to adopt active heat removal, i.e., using fan
Deng heat dissipation equipment, this mode has larger noise and needs to increase extra circuit；Two is this side in housing openings
Formula can cause a large amount of dusts or small insect to enter and cause bigger impact to heat dispersion even electric property.
The content of the invention
The present invention mainly solves the technical problem in the presence of prior art, there is provided a kind of noiselessness, do not need volume
External circuit, reduces the heat abstractor of the electronic equipments of entrance such as dust.
What the above-mentioned technical problem of the present invention was mainly addressed by following technical proposals：
The heat abstractor of the electronic equipment of the present invention, the electronic equipment includes housing, and the inside of the housing is provided with heat
Source, the heat abstractor includes memorial alloy shrouding and heat-conducting piece, and the side wall of the housing is provided with a breach, and the memory is closed
Golden shrouding is sealed on the breach, and the heat-conducting piece is connected between the thermal source and memorial alloy shrouding, when the thermal source
After heating, the memorial alloy shrouding produces deformation, and a radiating gap is formed between the breach.
Further, the heat-conducting piece is arranged on the upper surface of the thermal source, and the section of its sectional area and the thermal source
Product is adapted.
Further, the memorial alloy shrouding is shaped as L-type or V-type, and the heat-conducting piece seals with the memorial alloy
One of end of plate is connected, after the thermal source generates heat, the upper and lower of the memorial alloy shrouding respectively with institute
State and formed between breach the first gap and the second gap.
Further, the heat-conducting piece is made with the memorial alloy shrouding using same material, and the heat conduction
Part and the memorial alloy shrouding integral molding.
Further, the memorial alloy shrouding is arranged on the inner side of the breach, is additionally provided with the outside of the breach anti-
Dirt net.
Further, the Air Filter and the housing detachable connection.
The beneficial effects of the present invention is：After thermal source generates heat, memorial alloy shrouding produces deformation, and the shape between breach
Into a radiating gap, by this radiating gap the air inside and outside housing can be caused to produce heat exchange, so as to reduce housing
The purpose of internal temperature, its noiselessness, good heat dissipation effect, and do not need additional circuit, and heat source temperature it is relatively low when, memorial alloy
Shrouding returns to original state, makes housing be in closed state, it is to avoid the entrance of dust and small insect etc., reduces to electrical resistance
The impact of energy.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the heat abstractor of the electronic equipment of one embodiment of the invention；
Fig. 2 is the structural representation of the heat abstractor of the electronic equipment of another embodiment of the present invention；
Fig. 3 is the structural representation of the heat abstractor of the electronic equipment of another embodiment of the invention；
Specific embodiment
The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent clearly defines so as to make to protection scope of the present invention.
Refering to shown in Fig. 1, the heat abstractor of the electronic equipment of the present invention, the electronic equipment includes housing 1, housing 1 it is interior
Portion is provided with thermal source 2, and heat abstractor includes memorial alloy shrouding 3 and heat-conducting piece 4, and the side wall of housing 1 is provided with a breach 5, remembers
Alloy shrouding 3 is sealed on breach 5, and heat-conducting piece 4 is connected between thermal source 2 and memorial alloy shrouding 3, after thermal source 2 generates heat, note
Recall alloy shrouding 3 and produce deformation, and a radiating gap 6 is formed between breach 5.Thermal source 2 in the present invention be mainly circuit board,
Electric elements etc..
In the present invention, after thermal source 2 generates heat, memorial alloy shrouding 3 produces deformation, and a radiating is formed between breach 5
Gap 6, can cause the air inside and outside housing 1 to produce heat exchange, so as to reduce inside housing 1 by this radiating gap 6
The purpose of temperature, its noiselessness, good heat dissipation effect, and do not need additional circuit, and the temperature of thermal source 2 it is relatively low when, memorial alloy envelope
Plate 3 returns to original state, makes housing 1 be in closed state, it is to avoid the entrance of dust and small insect etc., reduces to electrical resistance
The impact of energy.
Refering to shown in Fig. 2, in another embodiment of the present invention, heat-conducting piece 4 is arranged on the upper surface of thermal source 2, and its
Sectional area is adapted with the sectional area of thermal source 2, and the heat that thermal source 2 is produced can so be transferred to efficiently, to greatest extent
On heat-conducting piece 4, so as to improve the temperature susceplibility of memorial alloy shrouding 3, and then radiating control ability is improved.Certainly, heat-conducting piece 4
May also be arranged on the other positions such as the lower surface of thermal source 2.
Memorial alloy shrouding 3 in the present invention is shaped as L-type or V-type, and heat-conducting piece 4 is with memorial alloy shrouding 3 wherein
One end is connected, and after thermal source 2 generates heat, the upper and lower of memorial alloy shrouding 3 forms first between breach 5 respectively
The gap 8 of gap 7 and second.By the interaction in the first gap 7 and the second gap 8, the inner air and outer air that can cause housing 1 is produced
Raw convection current, such that it is able to accelerate to reduce the internal temperature of housing 1, further improves radiating efficiency.
Preferably, in order to improve working (machining) efficiency, reducing processing cost, heat-conducting piece 4 adopts material of the same race with memorial alloy shrouding 3
Material is made, and heat-conducting piece 4 and the integral molding of memorial alloy shrouding 3.
Refering to shown in Fig. 3, in yet another embodiment of the present invention, memorial alloy shrouding 3 is arranged on the inner side of breach 5,
The outside of breach 5 is additionally provided with Air Filter 9.The process of deformation radiating can be produced in memorial alloy shrouding 3 by arranging Air Filter 9
In, to radiating, the outside of gap 6 applies proofing dust and protecting, further reduces the intrusion of dust.And change for convenience and clean dust-proof
Net 9, Air Filter 9 and the detachable connection of housing 1.
More than, specific embodiment only of the invention, but protection scope of the present invention is not limited thereto, it is any without
The change or replacement that creative work is expected are crossed, all should be included within the scope of the present invention.Therefore, protection of the invention
The protection domain that scope should be limited by claims is defined.
Claims (6)
1. the heat abstractor of a kind of electronic equipment, the electronic equipment includes housing, and the inside of the housing is provided with thermal source, and it is special
Levy and be, the heat abstractor includes memorial alloy shrouding and heat-conducting piece, the side wall of the housing is provided with a breach, the note
Recall alloy shrouding to seal on the breach, the heat-conducting piece is connected between the thermal source and memorial alloy shrouding, when described
After thermal source heating, the memorial alloy shrouding produces deformation, and a radiating gap is formed between the breach.
2. the heat abstractor of electronic equipment as claimed in claim 1, it is characterised in that the heat-conducting piece is arranged on the thermal source
Upper surface, and its sectional area is adapted with the sectional area of the thermal source.
3. the heat abstractor of electronic equipment as claimed in claim 1 or 2, it is characterised in that the shape of the memorial alloy shrouding
Shape is L-type or V-type, and the heat-conducting piece is connected with one of end of the memorial alloy shrouding, when thermal source heating
Afterwards, the upper and lower of the memorial alloy shrouding forms respectively the first gap and the second gap between the breach.
4. the heat abstractor of electronic equipment as claimed in claim 3, it is characterised in that the heat-conducting piece and the memorial alloy
Shrouding is made using same material, and the heat-conducting piece and the memorial alloy shrouding integral molding.
5. the heat abstractor of electronic equipment as claimed in claim 1, it is characterised in that the memorial alloy shrouding is arranged on institute
The inner side of breach is stated, on the outside of the breach Air Filter is additionally provided with.
6. the heat abstractor of electronic equipment as claimed in claim 5, it is characterised in that the Air Filter is removable with the housing
Unload formula connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610927074.9A CN106572617A (en) | 2016-10-31 | 2016-10-31 | Heat dissipation device for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610927074.9A CN106572617A (en) | 2016-10-31 | 2016-10-31 | Heat dissipation device for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106572617A true CN106572617A (en) | 2017-04-19 |
Family
ID=58533480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610927074.9A Pending CN106572617A (en) | 2016-10-31 | 2016-10-31 | Heat dissipation device for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106572617A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190200484A1 (en) * | 2017-12-26 | 2019-06-27 | Acer Incorporated | Electronic device |
| CN110096120A (en) * | 2018-01-30 | 2019-08-06 | 宏碁股份有限公司 | Electronic device |
| CN110611253A (en) * | 2019-09-20 | 2019-12-24 | 张家铭 | Power distribution network transmission automatic adjustment control cabinet |
| CN112860024A (en) * | 2021-01-19 | 2021-05-28 | 荣跃伟 | High heat dissipating's computer machine case shell based on expend with heat and contract with cold |
| CN113453483A (en) * | 2020-03-26 | 2021-09-28 | 中科寒武纪科技股份有限公司 | Device for heat dissipation and electronic device thereof |
| WO2022142848A1 (en) * | 2020-12-29 | 2022-07-07 | 华为技术有限公司 | Optical cage assembly, optical module connector, and fabrication method for optical cage assembly |
| CN115857122A (en) * | 2023-02-28 | 2023-03-28 | 上海安理创科技有限公司 | Embedded optical module and manufacturing method thereof |
| WO2023179120A1 (en) * | 2022-03-22 | 2023-09-28 | 荣耀终端有限公司 | Electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101130398A (en) * | 2006-08-25 | 2008-02-27 | 佛山市顺德区顺达电脑厂有限公司 | Device for automatically opening and closing dust-proof cover |
| CN203722990U (en) * | 2014-01-24 | 2014-07-16 | 加弘科技咨询(上海)有限公司 | Self-adjustable wind guiding cover |
| CN104597992A (en) * | 2014-12-22 | 2015-05-06 | 合肥联宝信息技术有限公司 | Method and device for dissipating heat of notebook computer |
| CN204856291U (en) * | 2015-05-05 | 2015-12-09 | 天津卿壹创想科技有限公司 | Computer display |
| CN105704983A (en) * | 2016-02-25 | 2016-06-22 | 上海斐讯数据通信技术有限公司 | Auxiliary heat radiation device and home electronic device |
-
2016
- 2016-10-31 CN CN201610927074.9A patent/CN106572617A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101130398A (en) * | 2006-08-25 | 2008-02-27 | 佛山市顺德区顺达电脑厂有限公司 | Device for automatically opening and closing dust-proof cover |
| CN203722990U (en) * | 2014-01-24 | 2014-07-16 | 加弘科技咨询(上海)有限公司 | Self-adjustable wind guiding cover |
| CN104597992A (en) * | 2014-12-22 | 2015-05-06 | 合肥联宝信息技术有限公司 | Method and device for dissipating heat of notebook computer |
| CN204856291U (en) * | 2015-05-05 | 2015-12-09 | 天津卿壹创想科技有限公司 | Computer display |
| CN105704983A (en) * | 2016-02-25 | 2016-06-22 | 上海斐讯数据通信技术有限公司 | Auxiliary heat radiation device and home electronic device |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190200484A1 (en) * | 2017-12-26 | 2019-06-27 | Acer Incorporated | Electronic device |
| CN110096120A (en) * | 2018-01-30 | 2019-08-06 | 宏碁股份有限公司 | Electronic device |
| CN110096120B (en) * | 2018-01-30 | 2022-05-03 | 宏碁股份有限公司 | Electronic device |
| CN110611253A (en) * | 2019-09-20 | 2019-12-24 | 张家铭 | Power distribution network transmission automatic adjustment control cabinet |
| CN110611253B (en) * | 2019-09-20 | 2021-01-29 | 深圳润世华研发科技有限公司 | Power distribution network transmission automatic adjustment control cabinet |
| CN113453483A (en) * | 2020-03-26 | 2021-09-28 | 中科寒武纪科技股份有限公司 | Device for heat dissipation and electronic device thereof |
| WO2022142848A1 (en) * | 2020-12-29 | 2022-07-07 | 华为技术有限公司 | Optical cage assembly, optical module connector, and fabrication method for optical cage assembly |
| CN112860024A (en) * | 2021-01-19 | 2021-05-28 | 荣跃伟 | High heat dissipating's computer machine case shell based on expend with heat and contract with cold |
| WO2023179120A1 (en) * | 2022-03-22 | 2023-09-28 | 荣耀终端有限公司 | Electronic device |
| CN115857122A (en) * | 2023-02-28 | 2023-03-28 | 上海安理创科技有限公司 | Embedded optical module and manufacturing method thereof |
| CN115857122B (en) * | 2023-02-28 | 2023-04-28 | 上海安理创科技有限公司 | Embedded optical module and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170419 |