CN106566301A - Cured type composition for flexible circuit board - Google Patents

Cured type composition for flexible circuit board Download PDF

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Publication number
CN106566301A
CN106566301A CN201610996510.8A CN201610996510A CN106566301A CN 106566301 A CN106566301 A CN 106566301A CN 201610996510 A CN201610996510 A CN 201610996510A CN 106566301 A CN106566301 A CN 106566301A
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CN
China
Prior art keywords
fpc
curing composition
circuit board
flexible circuit
beo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610996510.8A
Other languages
Chinese (zh)
Inventor
张富治
陈锦华
付建云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiang Science And Technology Circuit Board Co Ltd Of Daya Gulf Section Of Huizhou City
Original Assignee
Xiang Science And Technology Circuit Board Co Ltd Of Daya Gulf Section Of Huizhou City
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiang Science And Technology Circuit Board Co Ltd Of Daya Gulf Section Of Huizhou City filed Critical Xiang Science And Technology Circuit Board Co Ltd Of Daya Gulf Section Of Huizhou City
Priority to CN201610996510.8A priority Critical patent/CN106566301A/en
Publication of CN106566301A publication Critical patent/CN106566301A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular

Abstract

The invention provides a cured type composition for a flexible circuit board. The cured type composition for the flexible circuit board is provided, maintains the welding heat resisting performance and other various characters and combines closing performance and high hardness on a plastic base material and a conductor layer.

Description

A kind of FPC curing composition
Technical field
The invention belongs to PCB processing technique fields, and in particular to a kind of FPC curing composition.
Background technology
Method as etchant resist, soldering-resistance layer, sign flag etc. is formed on printed wiring board, it is known to use comprising solidification The ink of type composition, the method that ink solidification is made using the irradiation of active energy beam.
But be formed at the various FPC curing compositions such as the ink against corrosion on printed wiring board, mark ink and want The each characteristic for maintaining resistance to soldering heat performance etc. is sought, and requires adaptation and high rigidity on plastic basis material and conductor layer.So And, utilize as discussed above active energy beam irradiation and solidified curing composition, be particularly suitable for being printed just During the printed wiring board composition of method of ink solidification is made after brush, take into account adaptation on plastic basis material and conductor layer and High rigidity is difficult.
The content of the invention
In view of this, the present invention provides a kind of FPC curing composition, there is provided maintain resistance to soldering heat performance Etc. each characteristic and take into account the FPC of the adaptation on plastic basis material and conductor layer and high rigidity and combined with curing type Thing.
The technical scheme is that：A kind of FPC curing composition, it is characterised in that by following weight Number meter is into being grouped into：Acrylate polymer 9-13, silicone modified polyacrylate 11-14, polysiloxanes 1- 5th, rilanit special 2-6, polyvinyl butyral resin 2-6, PVP 14-19, the contracting second of dimethacrylate two Diol ester 1.5-3, acrylamide 2-4, dimethylamino ethyl acrylate 1-3, methylene blue 4-7, get Ke Sa porphyrin 10- 14th, BeO 2-4, Al2O3 3-7, tributyl phosphate 3-7, diethylene glycol diacetate 3-5, myristoyl both sexes guanidine-acetic acid sodium 1.5-3.5, lauroylamidopropyl betaine 1-4,5-ALA 1-4, m- tetrahydroxy phenyl chlorin 1-3.
Further, the FPC curing composition by following parts by weight meter into being grouped into：Acrylic acid Ester polymer 11, silicone modified polyacrylate 12.7, polysiloxanes 2.8, rilanit special 3.5, polyvinyl alcohol Butyral 4.5, PVP 17.4, dimethacrylate tirethylene glycol ester 2.7, acrylamide 3.1, third Olefin(e) acid dimethylamino ethyl ester 1.8, methylene blue 5.2, get Ke Sa porphyrins 12.4, BeO 2.9, Al2O3 4.2nd, tributyl phosphate 5.4th, diethylene glycol diacetate 3.5, myristoyl both sexes guanidine-acetic acid sodium 2.9, lauroylamidopropyl betaine 3.2,5- ammonia Base ketone valeric acid 2.3, m- tetrahydroxy phenyl chlorin 1.7.
Further, viscosity of the curing composition at 60 DEG C is 55-85mPas.
By the FPC curing composition of the present invention, can obtain to plastic base and conductor circuit gold Both category have excellent adaptation and the cured coating film with high rigidity.The curing composition of the present invention is for example as printing The ink against corrosion (anti-etching ink, welding resistance ink, plating resist ink) of wiring board, plays excellent substrate protective value, even if with low exposure Amount also plays excellent cured coating film characteristic.Contain heat curable component in the curing composition of the present invention, can further improve Adaptation, heat resistance are improved.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that retouched The embodiment stated is only a part of embodiment of the invention, rather than the embodiment of whole.
A kind of FPC curing composition, it is characterised in that by following parts by weight meter into being grouped into：Propylene It is acid ester polymer 9-13, silicone modified polyacrylate 11-14, polysiloxanes 1-5, rilanit special 2-6, poly- Vinyl butyral 2-6, PVP 14-19, dimethacrylate tirethylene glycol ester 1.5-3, acryloyl Amine 2-4, dimethylamino ethyl acrylate 1-3, methylene blue 4-7, get Ke Sa porphyrin 10-14, BeO 2-4, Al2O3 3-7、 Tributyl phosphate 3-7, diethylene glycol diacetate 3-5, myristoyl both sexes guanidine-acetic acid sodium 1.5-3.5, dodecanamide propyl Glycine betaine 1-4,5-ALA 1-4, m- tetrahydroxy phenyl chlorin 1-3.
Further, by following parts by weight meter into being grouped into：Acrylate polymer 11, organosilicon-modified acrylate Polymer 12.7, polysiloxanes 2.8, rilanit special 3.5, polyvinyl butyral resin 4.5, PVP 17.4th, dimethacrylate tirethylene glycol ester 2.7, acrylamide 3.1, dimethylamino ethyl acrylate 1.8, methylene Blue 5.2, get Ke Sa porphyrins 12.4, BeO 2.9, Al2O3 4.2nd, tributyl phosphate 5.4, diethylene glycol diacetate 3.5, Myristoyl both sexes guanidine-acetic acid sodium 2.9, lauroylamidopropyl betaine 3.2,5-ALA 2.3, m- tetrahydroxy benzene Base chlorin 1.7.
Further, viscosity of the curing composition at 60 DEG C is 55-85mPas.
By the FPC curing composition of the present invention, can obtain to plastic base and conductor circuit gold Both category have excellent adaptation and the cured coating film with high rigidity.The curing composition of the present invention is for example as printing The ink against corrosion (anti-etching ink, welding resistance ink, plating resist ink) of wiring board, plays excellent substrate protective value, even if with low exposure Amount also plays excellent cured coating film characteristic.Contain heat curable component in the curing composition of the present invention, can further improve Adaptation, heat resistance are improved.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie In the case of spirit or essential attributes without departing substantially from the present invention, the present invention can be in other specific forms realized.Therefore, no matter From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling Change is included in the present invention.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped Containing an independent technical scheme, this narrating mode of specification is only that for clarity those skilled in the art should Using specification as an entirety, the technical scheme in each embodiment can also Jing it is appropriately combined, form those skilled in the art Understandable other embodiment.The ins and outs not described in detail in the present invention, can pass through arbitrary in this area Prior art is realized.Particularly, all technical characterstics not described in detail can be realized by any prior art in the present invention.

Claims (3)

1. a kind of FPC curing composition, it is characterised in that by following parts by weight meter into being grouped into：Acrylic acid Ester polymer 9-13, silicone modified polyacrylate 11-14, polysiloxanes 1-5, rilanit special 2-6, poly- second Enol butyral 2-6, PVP 14-19, dimethacrylate tirethylene glycol ester 1.5-3, acrylamide 2-4, dimethylamino ethyl acrylate 1-3, methylene blue 4-7, get Ke Sa porphyrin 10-14, BeO 2-4, Al2O3 3-7, phosphorus Sour tributyl 3-7, diethylene glycol diacetate 3-5, myristoyl both sexes guanidine-acetic acid sodium 1.5-3.5, dodecanamide propyl are sweet Dish alkali 1-4,5-ALA 1-4, m- tetrahydroxy phenyl chlorin 1-3.
2. FPC curing composition according to claim 1, it is characterised in that by following parts by weight meter Into being grouped into：Acrylate polymer 11, silicone modified polyacrylate 12.7, polysiloxanes 2.8, hydrogenated castor Oil 3.5, polyvinyl butyral resin 4.5, PVP 17.4, dimethacrylate tirethylene glycol ester 2.7, Acrylamide 3.1, dimethylamino ethyl acrylate 1.8, methylene blue 5.2, get Ke Sa porphyrins 12.4, BeO 2.9, Al2O3 4.2nd, tributyl phosphate 5.4, diethylene glycol diacetate 3.5, myristoyl both sexes guanidine-acetic acid sodium 2.9, lauroyl Amine CAB 3.2,5-ALA 2.3, m- tetrahydroxy phenyl chlorin 1.7.
3. FPC curing composition according to claim 1 and 2, it is characterised in that the curing type group Viscosity of the compound at 60 DEG C is 55-85mPas.
CN201610996510.8A 2016-11-13 2016-11-13 Cured type composition for flexible circuit board Pending CN106566301A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610996510.8A CN106566301A (en) 2016-11-13 2016-11-13 Cured type composition for flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610996510.8A CN106566301A (en) 2016-11-13 2016-11-13 Cured type composition for flexible circuit board

Publications (1)

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CN106566301A true CN106566301A (en) 2017-04-19

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104031475A (en) * 2014-07-01 2014-09-10 珠海保税区天然宝杰数码科技材料有限公司 Ultraviolet light curing jetting ink for marking flexible circuit boards
CN104140717A (en) * 2013-05-06 2014-11-12 北京中科纳通电子技术有限公司 High-solid content jet-printing conductive ink
CN105073894A (en) * 2013-03-25 2015-11-18 积水富乐株式会社 Curable composition
CN105733361A (en) * 2016-04-29 2016-07-06 珠海保税区天然宝杰数码科技材料有限公司 Etching-resistant jet ink and application thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105073894A (en) * 2013-03-25 2015-11-18 积水富乐株式会社 Curable composition
CN104140717A (en) * 2013-05-06 2014-11-12 北京中科纳通电子技术有限公司 High-solid content jet-printing conductive ink
CN104031475A (en) * 2014-07-01 2014-09-10 珠海保税区天然宝杰数码科技材料有限公司 Ultraviolet light curing jetting ink for marking flexible circuit boards
CN105733361A (en) * 2016-04-29 2016-07-06 珠海保税区天然宝杰数码科技材料有限公司 Etching-resistant jet ink and application thereof

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Application publication date: 20170419