CN106554621A - A kind of organosilicon resin composition and application thereof - Google Patents
A kind of organosilicon resin composition and application thereof Download PDFInfo
- Publication number
- CN106554621A CN106554621A CN201510471559.7A CN201510471559A CN106554621A CN 106554621 A CN106554621 A CN 106554621A CN 201510471559 A CN201510471559 A CN 201510471559A CN 106554621 A CN106554621 A CN 106554621A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- parts
- silicones
- organosilicon
- organosilicon resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The present invention relates to a kind of organosilicon resin composition and application thereof.The organosilicon resin composition includes following components by weight：0.1 10 parts of 100 parts of organic siliconresin, 3 20 parts of epoxy modified silicone polymer, 0.0001 2.0 parts of catalyst and auxiliary agent；The number-average molecular weight of the epoxy modified silicone polymer is 2200～50000.The present invention is used as plasticized modifier by adding epoxy modified silicone polymer, improves the toughness of silicon resin composition, the crackle produced after reducing and eliminating the solidification of silicone layer pressing plate.Epoxy modified silicone polymer, due to containing silica group in strand, ensure that the excellent compatibility with silicones, the internal stress of silicones can be reduced, the crackle produced after reducing and eliminating silicones solidification, and the peel strength of laminate and Copper Foil can be improved in strand simultaneously containing epoxide group, the performances such as silicon resin composition acid and alkali-resistance, chemically-resistant solvent are enhanced.
Description
Technical field
The invention belongs to copper-clad plate technical field, is related to a kind of organosilicon resin composition and application thereof, specifically
It is related to a kind of organosilicon resin composition and the prepreg containing it, laminate and copper-clad plate
Background technology
When preparing laminate or copper-clad plate using organic siliconresin, although organic siliconresin laminate has common
The advantage that epoxy laminate does not have：Excellent hydrophobicity, high and low temperature resistance, weather-resistant, electricity
Insulating properties and weatherability, and, halogen-free phosphorus-free inflaming retarding.But silicone layer pressing plate also has itself chemical composition
And some shortcomings for occurring：Hardening time length, solidification temperature is high, mechanical strength is low, and the stripping of Copper Foil it is strong
The adhesive strength of poor, each interlayer of degree is poor and the shortcomings of relatively low bending strength.Meanwhile, organic siliconresin tool
Have a tridimensional network, crosslinking points than comparatively dense, with the increase of crosslink density, after organic siliconresin solidification
It is easily cracking.
At present, general methyl silicon resin, methyl phenyl silicone resin or the phenyl silicon tree for passing through to mix difference R/Si
Fat adjusts the hardness and toughness of silicones.The methyl phenyl silicone resin or phenyl polysiloxane of high R/Si is silicones
Good toughener, but the silicones of high R/Si are hardening time long, and solidification temperature is high, and thermosetting is poor, heat-resisting
Property is low.By the silicones for mixing two or more different R/Si, although after resin solidification being reduced
Crosslink density, reduce cracking, but organic siliconresin is still relatively low with the peel strength of Copper Foil.It is additionally, since
The addition of high R/Si silicones causes its solvent resistant, chemical-resistance poor, while hardening time extends, Gu
Change temperature to increase, increase energy loss, reduce production efficiency.CN 101525467A disclose one kind
Epoxy/organosilicon hybrid material and preparation method thereof.The epoxy/organosilicon hybrid material is included：Asphalt mixtures modified by epoxy resin
Fat, organic siliconresin, acid curing agent, nonessential organic epoxy silane and nonessential auxiliary agent etc..But
It is that in the prior art, organic epoxy silane is low molecular coupling agent, and molecular weight is 100～2000, its master
Syllabus is the compatibility for improving epoxy resin and organic siliconresin, is not referred to organosilicon resin composition
Toughness improvement.
The content of the invention
For problem present in prior art, an object of the present invention is to provide a kind of organic siliconresin
Compositionss, by adding epoxy modified silicone polymer toughening agent so that the resin combination is keeping nothing
On the premise of the premium properties such as halogen phosphorus-free flame-retarding, heat-resisting and weather-proof, the crisp of resin combination can be reduced again
Property, improve the toughness and peel strength of resin combination.
To achieve these goals, present invention employs following technical scheme：
A kind of organosilicon resin composition, which includes following components by weight：
The number-average molecular weight of the epoxy modified silicone polymer be 2200～50000, such as 2500,
3000、4000、6000、8000、10000、12000、15000、18000、21000、24000、
27000th, 30000,33000,36000,39000,42000,45000 or 48000.
In the present invention, the content of the epoxy modified silicone polymer be, for example, 4 parts, 5 parts, 6 parts,
7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts,
18 parts or 19 parts.
The content of the catalyst be, for example, 0.0005 part, 0.001 part, 0.005 part, 0.1 part, 0.3 part,
0.5 part, 0.7 part, 0.9 part, 1.1 parts, 1.3 parts, 1.5 parts, 1.7 parts or 1.9 parts.
The content of the auxiliary agent be, for example, 0.5 part, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts,
4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts or
9.5 part.
The present invention is used as plasticized modifier by adding epoxy modified silicone polymer, improves silicones group
The toughness of compound, the crackle produced after reducing and eliminating the solidification of silicone layer pressing plate.Epoxy modified silicone gathers
Compound refers to and epoxide group is introduced on polysiloxane chain by chemical modification method, and becoming
There is the silica segment flexible molecule chain containing epoxide group again.Epoxy modified silicone polymer, due to molecule
Contain silica group in chain, it is ensured that the excellent compatibility with silicones, the planted agent that silicones can be reduced
Power, the crackle produced after reducing and eliminating silicones solidification, and contain epoxide group again simultaneously in strand
The peel strength of laminate and Copper Foil can be improved, silicon resin composition acid and alkali-resistance, chemically-resistant solvent etc. is enhanced
Performance.Thus, epoxy modified silicone polymer is the good toughener of organosilicon resin composition.
Preferably, the number-average molecular weight of epoxy modified silicone polymer is 2500～35000.
In the present invention, the epoxy modified silicone polymer be strand in containOrIn any one or two kinds combination andPolymer.
Preferably, the organic siliconresin is condensed type silicones, preferably methyl silicon resin or/and methyl
Phenyl polysiloxane.
In the present invention, the condensed type silicones are appointing in dehydrating condensation, dealcoholysis condensation or dehydrogenative condensation
One or more are anticipated, its reaction structure is as follows：
In the present invention, the condensed type silicones have the structure being expressed as below：
Wherein, R1、R2、R3And R4It is identical or different, it independently is-CH3、-Ph、-OCH3、
-OCH2CH3Or in-OH any one or at least two combination, n represents the degree of polymerization, and n>5,
Such as 6,8,10,12,15,20,25,30 or 35.
Preferably, the condensed type silicones be R/Si=1.0～1.7 (such as 1.1,1.2,1.3,1.4,
1.5th, 1.6 or 1.7) (mol ratio) and Ph/ (Me+Ph)=0～0.8 (such as 0.1,0.2,0.3,0.4,0.5,
0.6 or methyl silicon resin 0.7) or/and methyl phenyl silicone resin, wherein Ph represent phenyl group, Me generations
Table methyl group, R represent organo-functional group-CH3、-Ph、-OCH3、-OCH2CH3, in-H or-OH
Any one or at least two combination.In condensed type silicones, R/Si (mol ratio) is too small,
Ph/Si (mol ratio) is too low, and after silicones solidification, flexibility is poor, and paint film is hardened, and R/Si (mol ratio)
Excessive, Ph/Si (mol ratio) is too high, and laminate hardness is low, and slow curing, thermosetting are low, therefore the condensation
Type silicones are preferably the first of R/Si=1.2～1.7 (mol ratio) and Ph/ (Me+Ph)=0.2-0.6 (mol ratio)
Base phenyl polysiloxane.
Preferably, the catalyst is zinc naphthenate, aphthenic acids stannum, cobalt naphthenate, iron naphthenate, cycloalkanes
Sour cerium, zinc polycarboxylate, carboxylic acid stannum, carboxylic acid cobalt, ferric carboxylate, cerium carboxylate, perfluorinated sulfonic acid, phosphonitrilic chloride, amine
In class, quaternary ammonium base, titanate esters or guanidine compound any one or at least two mixture.
Preferably, the auxiliary agent is coupling agent or/and dispersant, and the coupling agent is silane coupler, titanium
In acid esters coupling agent or aluminate coupling agent any one or at least two mixture.
Preferably, the organosilicon resin composition also includes filler.
Preferably, described filler is aluminium oxide, aluminium hydroxide, silicon dioxide, Zinc Oxide, Muscovitum, Talcum
Powder, magnesium hydroxide, boehmite, titanium dioxide, silicon nitride, carborundum, boron nitride, Calcium Carbonate or kaolinite
In soil any one or at least two mixture.
Preferably, described filler content is 0-200 weight portions.
A kind of exemplary organosilicon resin composition includes by weight：
The second object of the present invention is to provide a kind of resin adhesive liquid, and which is by organic siliconresin as above
Compositionss are obtained in being dissolved or dispersed in solvent.
As the solvent in the present invention, it is not particularly limited, as concrete example, toluene, diformazan can be enumerated
Benzene, normal hexane, hexamethylene or isopropanol etc..
The third object of the present invention is to provide a kind of organic siliconresin prepreg, and which includes reinforcing material and leads to
Cross impregnation and be dried as above organosilicon resin composition of the postadhesion on reinforcing material.
The organic siliconresin prepreg of the present invention forms net using condensation reaction polymerization crosslinking by organic siliconresin
Shape structure.
The preparation method of exemplary prepreg is：
By organic siliconresin, epoxy modified silicone polymer, catalyst, auxiliary agent, filler, solvent and
The organic siliconresin glue that optionally other components are obtained impregnated in reinforcing material such as lamellar fiberglass fiber base material
In, then it is dried and obtains.
The fourth object of the present invention is to provide a kind of organic siliconresin laminate, and the laminate contains at least
One organic siliconresin prepreg as above, which passes through at least one prepreg heating as above
Extrusion forming is obtained.
The fifth object of the present invention is to provide a kind of organic siliconresin copper-clad laminate, described copper foil covered
Pressing plate includes the organic siliconresin prepreg as above of at least one overlapping and covers the preimpregnation after overlapping
The Copper Foil of the one or both sides of material.
The laminate made using the organosilicon resin composition of the present invention and copper-clad laminate, are ensureing have
Under machine silicone layer pressing plate and copper-clad laminate superperformance, while improve organic siliconresin laminate
And the bending strength and impact strength of copper-clad laminate, and improve and copper due to introducing epoxide group
The peel strength of paper tinsel, meets the use requirement in printed circuit board (PCB) is processed and assembled.
Compared with the prior art, the present invention has the advantages that：
The present invention is used as plasticized modifier by adding epoxy modified silicone polymer, improves silicones group
The toughness of compound, the crackle produced after reducing and eliminating the solidification of silicone layer pressing plate.Epoxy modified silicone gathers
Compound refers to and epoxide group is introduced on polysiloxane chain by chemical modification method, and becoming
There is the silica segment flexible molecule chain containing epoxide group again.Epoxy modified silicone polymer, due to molecule
Contain silica group in chain, it is ensured that the excellent compatibility with silicones, the planted agent that silicones can be reduced
Power, the crackle produced after reducing and eliminating silicones solidification, and contain epoxide group again simultaneously in strand
The peel strength of laminate and Copper Foil can be improved, silicon resin composition acid and alkali-resistance, chemically-resistant solvent etc. is enhanced
Performance.
Description of the drawings
Electron microscopes of the Fig. 1 for 1 copper-clad laminate of embodiment.
Electron microscopes of the Fig. 2 for 2 copper-clad laminate of embodiment
Electron microscopes of the Fig. 3 for 3 copper-clad laminate of embodiment
Electron microscopes of the Fig. 4 for 1 copper-clad laminate of comparative example
Electron microscopes of the Fig. 5 for 2 copper-clad laminate of comparative example
Electron microscopes of the Fig. 6 for 3 copper-clad laminate of comparative example.
Electron microscopes of the Fig. 7 for 4 copper-clad laminate of comparative example.
Electron microscopes of the Fig. 8 for 5 copper-clad laminate of comparative example.
Electron microscopes of the Fig. 9 for 6 copper-clad laminate of comparative example.
Specific embodiment
Technical scheme is further illustrated below by specific embodiment.
Embodiment 1
Weigh R/Si=1.6 (mol ratio), the methyl phenyl silicone resin of Ph/ (Me+Ph)=0.7 (mol ratio)
100 parts, be dissolved in 100 parts of toluene solvants, it is to be dissolved completely after, weigh the catalysis of 0.0001 zinc Isoocatanoate
Agent, 0.5 part of Z-6040 (U.S., DOW CORNING manufacture), 4.0 number average molecular weights are 2300 epoxide modified have
Organosilicon polymer, puts in silicon resin solution, after the 2h that stirs, obtains silicones glue.
It is 104g/cm with this silicon resin glue immersion stain weight2Glass fabric, be dried 10min at 110 DEG C
Obtain the prepreg that resin content is 58%.4 prepregs are overlapped, is configured in the duplexer upper and lower surface
The electrolytic copper foil of 35 μ, in 200 DEG C, surface pressing 30kgf/cm2, below 30mmHg vacuum under carry out
The extrusion forming of 120min, obtains doublesided copperclad laminate of the thickness for 0.5mm.
Embodiment 2
Weigh R/Si=1.3 (mol ratio), the methyl phenyl silicone resin of Ph/ (Me+Ph)=0.3 (mol ratio)
100 parts, be dissolved in 100 parts of toluene solvants, it is to be dissolved completely after, weigh 0.13g aluminium acetylacetonates, 1.0
Part KBM-503 (Japan, SHIN-ETSU HANTOTAI's chemistry manufacture), 0.5 part of BYK-903 (Germany, BYK manufacture),
10 number average molecular weights are 10000 epoxy modified silicone polymer, are put in silicon resin solution, are stirred
After uniform, add 30.0 parts of silicon dioxide, 2h, emulsifying 20min are stirred under room temperature, silicones glue is obtained.
In addition to using the resin adhesive liquid, carry out similarly to Example 1, obtain prepreg and thickness is
The doublesided copperclad laminate of 0.5mm.
Embodiment 3
Weigh R/Si=1.1 (mol ratio), 100 parts of the methyl silicon resin of Ph/ (Me+Ph)=0 (mol ratio),
Be dissolved in 100 parts of toluene solvants, it is to be dissolved completely after, (China, Hubei force have greatly to weigh 0.3g KH-550
Ji Gui new materials limited company), 2.0 parts of Z-6040 (U.S., DOW CORNING manufacture), 1.0 parts
BYK-903 (Germany, BYK manufactures), 20.0 number average molecular weights are poly- for 45000 epoxy modified silicones
Compound, puts in silicon resin solution, after stirring, adds 100 parts of melting silicon powders, 80.0 parts of oxygen
Change aluminum, 2h, emulsifying 20min are stirred under room temperature, silicones glue is obtained.
In addition to using the resin adhesive liquid, carry out similarly to Example 1, obtain prepreg and thickness is
The double-sided copper-clad laminate of 0.5mm.
Comparative example 1
Weigh R/Si=1.6 (mol ratio), the methyl phenyl silicone resin of Ph/ (Me+Ph)=0.7 (mol ratio)
100 parts, be dissolved in 100 parts of toluene solvants, it is to be dissolved completely after, weigh the catalysis of 0.0001 zinc Isoocatanoate
Agent, 0.5 part of Z-6040 (U.S., DOW CORNING manufacture), 4.0 number average molecular weights are 1500 epoxide modified have
Organosilicon polymer, puts in silicon resin solution, after the 2h that stirs, obtains silicones glue.
In addition to using the resin adhesive liquid, carry out similarly to Example 1, obtain prepreg and thickness is
The doublesided copperclad laminate of 0.5mm.
Comparative example 2
Weigh R/Si=1.6 (mol ratio), the methyl phenyl silicone resin of Ph/ (Me+Ph)=0.7 (mol ratio)
100 parts, be dissolved in 100 parts of toluene solvants, it is to be dissolved completely after, weigh the catalysis of 0.0001 zinc Isoocatanoate
Agent, 0.5 part of Z-6040 (U.S., DOW CORNING manufacture), 25.0 number average molecular weights are 2300 epoxide modified
Organosilicon polymer, puts in silicon resin solution, after the 2h that stirs, obtains silicones glue.
In addition to using the resin adhesive liquid, carry out similarly to Example 1, obtain prepreg and thickness is
The doublesided copperclad laminate of 0.5mm.
Comparative example 3
Weigh R/Si=1.1 (mol ratio), 100 parts of the methyl silicon resin of Ph/ (Me+Ph)=0 (mol ratio),
Be dissolved in 100 parts of toluene solvants, it is to be dissolved completely after, (China, Hubei force have greatly to weigh 0.3g KH-550
Ji Gui new materials limited company), 2.0 parts of Z-6040 (U.S., DOW CORNING manufacture), 1.0 parts
BYK-903 (Germany, BYK manufactures), 1.0 number average molecular weights are poly- for 45000 epoxy modified silicones
Compound, puts in silicon resin solution, after stirring, adds 100 parts of melting silicon powders, 80.0 parts of oxygen
Change aluminum, 2h, emulsifying 20min are stirred under room temperature, silicones glue is obtained.
In addition to using the resin adhesive liquid, carry out similarly to Example 1, obtain prepreg and thickness is
The doublesided copperclad laminate of 0.5mm.
Comparative example 4
Weigh R/Si=1.6 (mol ratio), the methyl phenyl silicone resin of Ph/ (Me+Ph)=0.7 (mol ratio)
100 parts, be dissolved in 100 parts of toluene solvants, it is to be dissolved completely after, weigh the catalysis of 0.0001 zinc Isoocatanoate
Agent, 0.5 part of Z-6040 (U.S., DOW CORNING manufacture), 4.0 parts of organosilan (Japanese SHIN-ETSU HANTOTAI's chemical industry
The KBM-303 of Co., Ltd.'s production), put in silicon resin solution, after the 2h that stirs, obtain silicon tree
Fat glue.
In addition to using the resin adhesive liquid, carry out similarly to Example 1, obtain prepreg and thickness is
The doublesided copperclad laminate of 0.5mm.
Comparative example 5
Epoxy/organosilicon hybrid material before the in-situ solidifying that CN 101525467A embodiments 1 are obtained as
Resin adhesive liquid, using method impregnated glass fiber cloth same as Example 1, obtains prepreg and thickness is
The doublesided copperclad laminate of 0.5mm.
Comparative example 6
R/Si=1.8 (mol ratio) is weighed, 100 parts of the methyl phenyl silicone resin of Ph/ (Me+Ph)=0.7 is molten
In 100 parts of toluene solvants, it is to be dissolved completely after, weigh 0.0001 zinc Isoocatanoate catalyst, 0.5 part
Z-6040 (U.S., DOW CORNING manufacture), 4.0 number average molecular weights are polymerized for 2300 epoxy modified silicones
Thing, puts in silicon resin solution, after the 2h that stirs, obtains silicones glue.
It is 104g/cm with this silicon resin glue immersion stain weight2Glass fabric, be dried 10min at 110 DEG C
Obtain the prepreg that resin content is 58%.4 prepregs are overlapped, is configured in the duplexer upper and lower surface
The electrolytic copper foil of 35 μ, in 200 DEG C, surface pressing 30kgf/cm2, below 30mmHg vacuum under carry out
The extrusion forming of 120min, obtains doublesided copperclad laminate of the thickness for 0.5mm.
The assay method of each test method and evaluation methodology are as described below.
Effect exact p-value：
Peel strength test：
Method of testing：Tested using IPC-TM-6502.4.8 methods.
Heat decomposition temperature tests (Td 5%)：
Method of testing：Thermogravimetric measure of the change instrument (TG-DTA) 10 DEG C/min of heat temperature raising under nitrogen atmosphere
The temperature for decomposing 5% is measured under velocity conditions.
Additionally, Fig. 1～9 are respectively the electron microscope of the copper-clad plate of embodiment 1～3 and comparative example 1～6.
Can draw from above test result analysis, embodiment 1-3 plate property is heat-resist, peel strength
It is higher, while not cracking in electric Microscopic observation laminate.And add in comparative example 1 it is epoxide modified
Silicones molecular weight is low, and toughening effect is poor, and laminate is cracking.The epoxy added in comparative example 2 changes
Property silicones contents it is excessive, cause the thermostability of laminate to decline.The epoxide modified silicon added in comparative example 3
Resin content is too low, causes the toughening effect of laminate to be short of, and laminate is cracking.Add in comparative example 4
Enter the epoxy silane with 1 equal parts of comparative example, but due to being small molecule, do not have toughening effect, make
The cracking phenomenon of laminate；Comparative example 5 is to be used to make layer using CN 101525467A embodiments 1
Pressing plate, compared with the present invention, due to the epoxy resin added in component it is more, therefore its thermostability, resistance to Huang
Change, weatherability are poor, and its decomposition temperature Td (5%) is substantially reduced.Comparative example 6 is compared with embodiment 1, is made
Silicones R/Si is 1.8, causes under identical condition of cure resin solidification not exclusively, Td (2%) temperature compared with
It is low, poor heat resistance.
Applicant states that the present invention illustrates the method detailed of the present invention, but the present invention by above-described embodiment
Above-mentioned method detailed is not limited to, that is, does not mean that the present invention has to rely on above-mentioned method detailed ability real
Apply.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention, to product of the present invention
The addition of the equivalence replacement and auxiliary element of each raw material, selection of concrete mode etc., all fall within the guarantor of the present invention
Within the scope of shield scope and disclosure.
Claims (10)
1. a kind of organosilicon resin composition, which includes following components by weight：
The number-average molecular weight of the epoxy modified silicone polymer is 2200～50000.
2. organosilicon resin composition as claimed in claim 1, it is characterised in that epoxide modified organic
The number-average molecular weight of silicon polymer is 2500～35000；
Preferably, the epoxy modified silicone polymer be strand in contain
In any one or two kinds combination andMacromolecule polyalcohol.
3. organosilicon resin composition as claimed in claim 1 or 2, it is characterised in that the organosilicon
Resin is condensed type silicones, preferably methyl silicon resin or/and methyl phenyl silicone resin；
Preferably, the condensed type silicones have the structure being expressed as below：
Wherein, R1、R2、R3And R4It is identical or different, it independently is-CH3、-Ph、-OCH3、
-OCH2CH3Or in-OH any one or at least two combination, n represents the degree of polymerization, and n>5；
Preferably, the condensed type silicones are R/Si=1.0～1.7 (mol ratio) and Ph/ (Me+Ph)=0～0.8
Methyl silicon resin or/and methyl phenyl silicone resin, wherein Ph represents phenyl group, and Me represents methyl base
Group, R represent organo-functional group-CH3、-Ph、-OCH3、-OCH2CH3, it is any one in-H or-OH
Kind or at least two combination；
Preferably, the condensed type silicones are R/Si=1.2～1.7 (mol ratio) and Ph/ (Me+Ph)=0.2-0.6
The methyl phenyl silicone resin of (mol ratio).
4. the organosilicon resin composition as described in one of claim 1-3, it is characterised in that the catalysis
Agent is zinc naphthenate, aphthenic acids stannum, cobalt naphthenate, iron naphthenate, cerium naphthenate, zinc polycarboxylate, carboxylic acid
Stannum, carboxylic acid cobalt, ferric carboxylate, cerium carboxylate, perfluorinated sulfonic acid, phosphonitrilic chloride, amine, quaternary ammonium base, titanate esters
Or in guanidine compound any one or at least two mixture；
Preferably, the auxiliary agent is coupling agent or/and dispersant, and the coupling agent is silane coupler, titanium
In acid esters coupling agent or aluminate coupling agent any one or at least two mixture.
5. the organosilicon resin composition as described in one of claim 1-4, it is characterised in that described organic
Silicon resin composition also includes filler；
Preferably, described filler is aluminium oxide, aluminium hydroxide, silicon dioxide, Zinc Oxide, Muscovitum, Talcum
Powder, magnesium hydroxide, boehmite, titanium dioxide, silicon nitride, carborundum, boron nitride, Calcium Carbonate or kaolinite
In soil any one or at least two mixture；
Preferably, described filler content is 0-200 weight portions.
6. the organosilicon resin composition as described in one of claim 1-5, it is characterised in that organosilicon tree
Oil/fat composition includes by weight：
7. a kind of resin adhesive liquid, which is will be the organosilicon resin composition as described in one of claim 1-6 molten
Solution or dispersion are obtained in a solvent.
8. a kind of organic siliconresin prepreg, which includes reinforcing material and is dried postadhesion by impregnation increasing
The organosilicon resin composition as described in one of claim 1-6 on strong material.
9. a kind of organic siliconresin laminate, the laminate contain at least one as claimed in claim 8
Organic siliconresin prepreg.
10. a kind of organic siliconresin copper-clad laminate, the copper-clad laminate include at least one overlapping
Organic siliconresin prepreg as claimed in claim 8 and cover the side or two of the prepreg after overlapping
The Copper Foil of side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510471559.7A CN106554621B (en) | 2015-09-29 | 2015-09-29 | Organic silicon resin composition and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510471559.7A CN106554621B (en) | 2015-09-29 | 2015-09-29 | Organic silicon resin composition and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106554621A true CN106554621A (en) | 2017-04-05 |
| CN106554621B CN106554621B (en) | 2020-03-13 |
Family
ID=58413309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510471559.7A Active CN106554621B (en) | 2015-09-29 | 2015-09-29 | Organic silicon resin composition and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106554621B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110128997A (en) * | 2019-05-17 | 2019-08-16 | 陈定方 | A kind of organic silicon potting adhesive effectively improving thermal coefficient and preparation method |
| CN111040168A (en) * | 2019-12-26 | 2020-04-21 | 广东盈骅新材料科技有限公司 | Epoxy modified organic silicon resin and preparation method thereof |
| CN111100463A (en) * | 2019-12-26 | 2020-05-05 | 广东盈骅新材料科技有限公司 | Epoxy modified silicone resin composition and application thereof |
| CN113736383A (en) * | 2021-08-26 | 2021-12-03 | 深圳市明粤科技有限公司 | Organic silicon heat-conducting adhesive film and preparation method and application thereof |
| CN114656771A (en) * | 2020-12-24 | 2022-06-24 | 广东生益科技股份有限公司 | Resin composition and application thereof |
| CN115181495A (en) * | 2022-07-07 | 2022-10-14 | 江苏苏博特新材料股份有限公司 | Super-amphiphobic super-weather-resistant organic silicon protective coating and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101186796A (en) * | 2007-12-06 | 2008-05-28 | 上海交通大学 | Method for preparing epoxy resin adhesive |
| CN101638517A (en) * | 2009-09-10 | 2010-02-03 | 苏州大学 | Organosilicon resin composition |
| CN103289409B (en) * | 2013-03-21 | 2015-07-29 | 杭州师范大学 | A kind of preparation method with the silicone resin matrix material of high bending property |
-
2015
- 2015-09-29 CN CN201510471559.7A patent/CN106554621B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101186796A (en) * | 2007-12-06 | 2008-05-28 | 上海交通大学 | Method for preparing epoxy resin adhesive |
| CN101638517A (en) * | 2009-09-10 | 2010-02-03 | 苏州大学 | Organosilicon resin composition |
| CN103289409B (en) * | 2013-03-21 | 2015-07-29 | 杭州师范大学 | A kind of preparation method with the silicone resin matrix material of high bending property |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110128997A (en) * | 2019-05-17 | 2019-08-16 | 陈定方 | A kind of organic silicon potting adhesive effectively improving thermal coefficient and preparation method |
| CN111040168A (en) * | 2019-12-26 | 2020-04-21 | 广东盈骅新材料科技有限公司 | Epoxy modified organic silicon resin and preparation method thereof |
| CN111100463A (en) * | 2019-12-26 | 2020-05-05 | 广东盈骅新材料科技有限公司 | Epoxy modified silicone resin composition and application thereof |
| CN114656771A (en) * | 2020-12-24 | 2022-06-24 | 广东生益科技股份有限公司 | Resin composition and application thereof |
| CN114656771B (en) * | 2020-12-24 | 2023-09-12 | 广东生益科技股份有限公司 | Resin composition and application thereof |
| CN113736383A (en) * | 2021-08-26 | 2021-12-03 | 深圳市明粤科技有限公司 | Organic silicon heat-conducting adhesive film and preparation method and application thereof |
| CN115181495A (en) * | 2022-07-07 | 2022-10-14 | 江苏苏博特新材料股份有限公司 | Super-amphiphobic super-weather-resistant organic silicon protective coating and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106554621B (en) | 2020-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106554621A (en) | A kind of organosilicon resin composition and application thereof | |
| EP2684904B1 (en) | Resin composition, and prepreg and laminated sheet containing same | |
| CN105936745A (en) | Resin composition | |
| CN107254144A (en) | Resin combination and use its prepreg and laminate | |
| CN103665863B (en) | Containing the compositions of thermosetting resin of double-tower type epoxy silsesquioxane | |
| CN106467668A (en) | A kind of organic siliconresin aluminum-based copper-clad plate and preparation method thereof | |
| KR20140027303A (en) | Resin composition, prepreg and laminate | |
| CN108219371A (en) | Composition epoxy resin, prepreg, laminate and printed circuit board | |
| KR101738291B1 (en) | Cyanate resin composition and application thereof | |
| CN102775614B (en) | Double-decker-shaped silsesquioxane-containing benzoxazine resin | |
| CN103347930A (en) | Curable resin composition and cured product thereof | |
| CN109988299B (en) | Epoxy-containing organic silicon modified polyphenyl ether resin and preparation method and application thereof | |
| JP2018507278A (en) | Non-halogen / non-phosphorus silicone resin composition, and prepreg, laminate, copper-clad laminate and printed circuit board using the same | |
| JP5672073B2 (en) | Curing agent for epoxy resin, curable resin composition, and cured product thereof | |
| CN103748140A (en) | Curable resin composition and process for producing cured products using same | |
| CN103724999A (en) | Cyanate resin composition and application thereof | |
| CN108250746A (en) | Bismaleimide amine composition and its prepreg, the laminate and printed circuit board of a kind of polysiloxanes-allyl compound modification | |
| WO2013056411A1 (en) | Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same | |
| CN106336662B (en) | A kind of compositions of thermosetting resin and prepreg and laminate using its making | |
| CN106349643B (en) | A kind of compositions of thermosetting resin and prepreg and laminate using its making | |
| CN109535390A (en) | The prepreg and laminate of its preparation of phosphorous epoxy resin composition and application | |
| CN109971175A (en) | Modified maleimide resin combination and its prepreg and laminate of preparation | |
| CN109749440A (en) | Cyanate resin composition and application thereof | |
| CN103724998A (en) | Cyanate resin composition and application thereof | |
| CN111748178A (en) | Epoxy resin composition and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |