CN106548964A - Pollutant disposal system between a kind of conductor etching - Google Patents
Pollutant disposal system between a kind of conductor etching Download PDFInfo
- Publication number
- CN106548964A CN106548964A CN201611116002.2A CN201611116002A CN106548964A CN 106548964 A CN106548964 A CN 106548964A CN 201611116002 A CN201611116002 A CN 201611116002A CN 106548964 A CN106548964 A CN 106548964A
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- Prior art keywords
- etching
- disposal system
- conductor
- pollutant disposal
- pollutant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/14—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
- B01D53/18—Absorbing units; Liquid distributors therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/81—Solid phase processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Environmental & Geological Engineering (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Treating Waste Gases (AREA)
- Ventilation (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The invention discloses pollutant disposal system between a kind of conductor etching, including the new blower fan being arranged at outside between etching, by semiconductor cleaning machine, etching machine between etching between the isolation isolated, the exhaust hood being arranged above semiconductor cleaning machine, the inorganic waste gases processing system connected with the exhaust hood by pipeline, by between pipeline and described isolation bottom connection organic waste gas treatment system, and be arranged at etching between and isolation between top several blower fan filtering units.The molecular level pollutant that pollutant disposal system is produced in effectively eliminating semiconductor production process between the conductor etching that the present invention is provided, improves the cleanliness factor of semiconductor production.
Description
Technical field
The present invention relates to exhaust-gas treatment field, pollutant disposal system between more particularly to a kind of conductor etching.
Background technology
In production process of semiconductor, the process such as cleaning and etching of semiconductor produces substantial amounts of molecular level pollutant, in order to
Pollution is prevented, is provided in actual production between the etching of processing semiconductor, and the fresh air to outdoor introducing is carried out simple filtration
Process, therefore pollute effective pollutant for removing and producing because of semiconductor machining between etching, therefore it cannot be guaranteed that semiconductor production institute
The cleanliness factor for needing, the final quality for affecting finished semiconductor.
It can be seen that, prior art could be improved and improve.
The content of the invention
In view of in place of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide pollutant between a kind of conductor etching
Processing system, it is intended to the pollutant produced in effective process semiconductor production process the cleanliness factor for improving semiconductor production.
In order to achieve the above object, this invention takes technical scheme below：
Pollutant disposal system between a kind of conductor etching, including new blower fan outer between etching is arranged at, the new blower fan passes through
Pipeline and etching between side return air passageway connection, also include by semiconductor cleaning machine, etching machine between etching in isolated
Isolation between, the exhaust hood being arranged above semiconductor cleaning machine, by the inorganic waste gases that pipeline is connected with the exhaust hood
Reason system, by the organic waste gas treatment system of bottom connection between pipeline and described isolation, and is arranged between etching and isolates
Between top several blower fan filtering units.
Between described conductor etching in pollutant disposal system, the organic waste gas treatment system includes that zeolite runner is dense
Contracting equipment and incinerator.
Between described conductor etching in pollutant disposal system, the inorganic waste gases processing system includes that a rinsing type is washed
Wash tower.
Between described conductor etching in pollutant disposal system, the pipeline of the connection rinsing type scrubbing tower and exhaust hood
In be additionally provided with the first chemical filter.
Between described conductor etching in pollutant disposal system, the lower section between the etching is communicated with return air layer, described
Water spray equipment is provided between return air layer and return air passageway.
Between described conductor etching in pollutant disposal system, the second change between the etching, is provided between return air layer
Learn filter.
Between described conductor etching in pollutant disposal system, second chemical filter includes that upper and lower two-layer is stacked
Cylinder chemical filter, upper strata chemical filter is filled with the impregnated activated carbon of Jing potassium hydroxide, lower floor's chemical filter
It is filled with Jing copper sulphate and the impregnated activated carbon of sulfuric acid.
Between described conductor etching in pollutant disposal system, the entrance of each blower fan filtering unit is respectively provided with
There is the 3rd chemical filter.
Beneficial effect：
The invention provides pollutant disposal system between a kind of conductor etching, including new blower fan outer between etching is arranged at, will
Semiconductor cleaning machine, etching machine between etching between the isolation isolated, the exhaust hood being arranged above semiconductor cleaning machine,
The inorganic waste gases processing system connected with the exhaust hood by pipeline, by between pipeline and described isolation bottom connection it is organic
Exhaust treatment system, and be arranged at etching between and isolation between top several blower fan filtering units.The half of present invention offer
The molecular level pollutant that pollutant disposal system is produced in effectively eliminating semiconductor production process between conductor etch, improves half
The cleanliness factor of conductor production.
Description of the drawings
The structural representation of pollutant disposal system between the conductor etching that Fig. 1 is provided for the present invention.
Between the conductor etching that Fig. 2 is provided for the present invention in pollutant disposal system, the structure of the second chemical filter is shown
It is intended to.
Fig. 3 for in pollutant disposal system between the conductor etching that provides of the present invention, the 3rd chemical filter and blower fan
The structural representation of filter element.
Specific embodiment
The present invention provides pollutant disposal system between a kind of conductor etching, for make the purpose of the present invention, technical scheme and
Effect is clearer, clear and definite, and the present invention is described in more detail for the embodiment that develops simultaneously referring to the drawings.It should be appreciated that herein
Described specific embodiment only to explain the present invention, is not intended to limit the present invention.
Fig. 1 is referred to, the present invention provides pollutant disposal system between a kind of conductor etching.
Between described conductor etching, pollutant disposal system includes the new blower fan 10 being arranged at outside 901 between etching, described
The return air passageway 903 that new blower fan 10 passes through 901 sides between pipeline and etching connects, and also includes semiconductor cleaning machine 801, etching
Machine 802 901 between etching in 91 between the isolation isolated, the exhaust hood 401 being arranged above semiconductor cleaning machine 801 leads to
The inorganic waste gases processing system that piping is connected with the exhaust hood 401, is connected by 91 bottoms between pipeline and described isolation
Organic waste gas treatment system, and several blower fan filtering units 20 being arranged between etching between 901 and isolation above 91.
Specifically, the blower fan filtering unit suction circulated air for being arranged at top between etching sends into erosion after filtering vertically downward
Between quarter, the return air passageway of side between etching is traveled further into；The outer fresh air of the new blower fan suction chamber is conveyed after carrying out purified treatment
Mix to return air passageway with circulated air, mixed circulated air delivers to top between etching, is thusly-formed circulation, it is ensured that between etching
The cleaning of air.Additionally, semiconductor cleaning machine, etching machine（Generally also include other process equipments）Keep apart between being isolated,
Outside operating personnel are located between isolation, between etching, the blower fan filtering unit of top will circulation by the molecular level pollutant filtration of circulated air
Wind is vertically sent between isolation.Generally need to be cleaned before conductor etching, the molecular level pollutant produced in the technical process
Mainly acid, alkaline waste gas, is arranged at waste gas acid described in the exhaust hood mobile phone above semiconductor cleaning machine, alkaline and conveys
Processed to follow-up inorganic waste gases processing system, be then emitted into air.What is produced in conductor etching degumming process divides
Sub- level pollutant is mainly organic exhaust gas, sends into the inorganic waste gases processing system of lower section between connection etching by air-flow vertically downward
System, is emitted into air Jing after processing.As can be seen here, the present invention by arrange between isolation and with isolate between the inorganic waste gases that connect
Processing system and organic waste gas treatment system, the waste gas produced in effectively removes semiconductor fabrication processes, it is ensured that partly lead
The cleanliness factor of body production, therefore improve the quality of finished semiconductor.
Due to the molecular level pollutant that produces in semiconductor fabrication processes mainly between isolation in, it is preferable that between isolation
Top be covered with blower fan filtering unit, with improve isolation between air cleanliness factor;And the top between the etching beyond isolated area
The blower fan filtering unit quantity of setting relative can be reduced.
Further, between described conductor etching in pollutant disposal system, the organic waste gas treatment system includes
Zeolite runner concentrator 501 and incinerator 502.The zeolite runner concentrator 501 for will collect organic exhaust gas at
The waste gas for low air quantity, high concentration is managed, 502 burning disposal of incinerator is then sent to.
Further, between described conductor etching in pollutant disposal system, the inorganic waste gases processing system includes
One rinsing type scrubbing tower 403.403 pairs of acidity of the rinsing type scrubbing tower, alkaline waste gas are washed, the waste gas discharge after process
To air.Absorption efficiency height and low cost of the rinsing type scrubbing tower to acid, alkaline waste gas, therefore meeting inorganic waste gases process
Cost of manufacture is reduced while effect.
Further, between described conductor etching in pollutant disposal system, the connection rinsing type scrubbing tower 403 with
The first chemical filter 402 is additionally provided with the pipeline of exhaust hood 401.Specifically, first chemical filter 402 is cartridge type
Chemical filter, the first chemical filters of inorganic waste gases Jing that exhaust hood is collected are pre-processed, then Jing rinsing type scrubbing towers enter
Row absorbs, therefore improves the treatment effect of inorganic waste gases.
Further, between described conductor etching in pollutant disposal system, between the etching, 901 lower section is communicated with
Return air layer 902, is provided with Water spray equipment 30 between the return air layer 902 and return air passageway 903.The Water spray equipment 30 pairs
The circulated air of return air layer carries out purified treatment, further increases the cleanliness factor of circulated air.
Further, between described conductor etching in pollutant disposal system, between the etching between 901 and return air layer
902 are provided with the second chemical filter 60.Second chemical filter 60 is further to the molecular level pollutant in circulated air
Filter absorption of, improve the cleanliness factor of circulated air.In practical application, between etching 901 and return air layer 902 between pass through ventilative height
Frame floor connects, and the second chemical filter 60 is arranged under raised floor.In order to improve clean-up effect, generally by raised floor
Lower section is covered with the second chemical filter 60.
Fig. 2 shows the structure of second chemical filter, including the cylinder chemical filter that upper and lower two-layer is stacked, on
Layer cylinder chemical filter 601 is filled with the impregnated activated carbon of Jing potassium hydroxide, and lower floor cylinder chemical filter 602 is filled with
Jing copper sulphate and the impregnated activated carbon of sulfuric acid so that adsorption capacity of second chemical filter 60 to molecular level pollutant
Greatly improve, further increase etching between and isolation between air cleanliness factor.
Fig. 3 is referred to, further, pollutant disposal system kind between described conductor etching, each described blower fan mistake
The entrance of filter unit 20 is respectively arranged with the 3rd chemical filter 21.Specifically, the blower fan filtering unit 20 includes axle stream wind
Machine 201, the high efficiency particulate air filter 202 for being arranged at 201 outlet side of axial flow blower, and control fan operation controller 203.It is described
3rd chemical filter is plate chemical filter, is arranged at the inlet side of axial flow blower, and circulated air is through the 3rd chemical filtering
Blower fan filtering unit, therefore the cleanliness factor being further noted that between etching and between isolation are entered back into after device purified treatment.
In sum, the invention provides pollutant disposal system between a kind of conductor etching, including being arranged between etching
Outer new blower fan, by semiconductor cleaning machine, etching machine between etching between the isolation isolated, be arranged at semiconductor cleaning machine
The exhaust hood of top, the inorganic waste gases processing system connected with the exhaust hood by pipeline, by between pipeline and described isolation
Bottom connection organic waste gas treatment system, and be arranged at etching between and isolation between top several blower fan filtering units,
The molecular level pollutant produced in effectively eliminating semiconductor production process, and the cleanliness factor of circulated air is ensure that, therefore improve
The cleanliness factor of semiconductor production.By the second chemical filter is arranged between etching between return air layer, return air layer with return
Water spray system is set between wind passageway, and the 3rd chemical filter unit is set in blower fan filtering unit import, further carried
The high cleanliness factor of circulated air, that is, improve the cleanliness factor of semiconductor production.
It is understood that for those of ordinary skills, with technology according to the present invention scheme and its can send out
Bright design in addition equivalent or change, and all these changes or replace the guarantor that should all belong to appended claims of the invention
Shield scope.
Claims (8)
1. pollutant disposal system between a kind of conductor etching, including new blower fan outer between etching is arranged at, the new blower fan leads to
The return air passageway connection of side between piping and etching, it is characterised in that also include semiconductor cleaning machine, etching machine in etching
Between between the isolation isolated, the exhaust hood being arranged above semiconductor cleaning machine is connected with the exhaust hood by pipeline
Inorganic waste gases processing system, by the organic waste gas treatment system of bottom connection between pipeline and described isolation, and be arranged at
Between etching and isolation between top several blower fan filtering units.
2. pollutant disposal system between conductor etching according to claim 1, it is characterised in that at the organic exhaust gas
Reason system includes zeolite runner concentrator and incinerator.
3. pollutant disposal system between conductor etching according to claim 2, it is characterised in that at the inorganic waste gases
Reason system includes a rinsing type scrubbing tower.
4. pollutant disposal system between conductor etching according to claim 3, it is characterised in that the connection rinsing type
The first chemical filter is additionally provided with scrubbing tower and the pipeline of exhaust hood.
5. pollutant disposal system between the conductor etching according to claim 1 or 4, it is characterised in that between the etching
Lower section be communicated with return air layer, be provided with Water spray equipment between the return air layer and return air passageway.
6. pollutant disposal system between conductor etching according to claim 5, it is characterised in that between the etching with return
The second chemical filter is provided between stratification of wind.
7. pollutant disposal system between conductor etching according to claim 6, it is characterised in that the described second chemical mistake
Filter includes the stacked cylinder chemical filter of upper and lower two-layer, and upper strata chemical filter is filled with the impregnated work of Jing potassium hydroxide
Property charcoal, lower floor's chemical filter are filled with Jing copper sulphate and the impregnated activated carbon of sulfuric acid.
8. pollutant disposal system between conductor etching according to claim 7, it is characterised in that each described blower fan mistake
The entrance of filter unit is respectively arranged with the 3rd chemical filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611116002.2A CN106548964B (en) | 2016-12-07 | 2016-12-07 | Pollutant processing system between semiconductor etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611116002.2A CN106548964B (en) | 2016-12-07 | 2016-12-07 | Pollutant processing system between semiconductor etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106548964A true CN106548964A (en) | 2017-03-29 |
| CN106548964B CN106548964B (en) | 2023-08-22 |
Family
ID=58396333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611116002.2A Active CN106548964B (en) | 2016-12-07 | 2016-12-07 | Pollutant processing system between semiconductor etching |
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| Country | Link |
|---|---|
| CN (1) | CN106548964B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289236A (en) * | 2019-07-29 | 2019-09-27 | 德淮半导体有限公司 | Processing chamber |
| CN112604413A (en) * | 2020-12-09 | 2021-04-06 | 宜讯汽车装备(上海)有限公司 | Air draft device for welding process of semiconductor cleaning equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050180897A1 (en) * | 2002-05-31 | 2005-08-18 | Ri Kokun | Perfluoride processing apparatus |
| JP2009127981A (en) * | 2007-11-27 | 2009-06-11 | Semiconductor Energy Lab Co Ltd | Clean room, film forming method, and manufacturing method of semiconductor device |
| CN202730240U (en) * | 2012-08-16 | 2013-02-13 | 山东三新电子有限公司 | Etching machine |
| CN206412321U (en) * | 2016-12-07 | 2017-08-15 | 广东申菱环境系统股份有限公司 | Pollutant disposal system between a kind of conductor etching |
-
2016
- 2016-12-07 CN CN201611116002.2A patent/CN106548964B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050180897A1 (en) * | 2002-05-31 | 2005-08-18 | Ri Kokun | Perfluoride processing apparatus |
| JP2009127981A (en) * | 2007-11-27 | 2009-06-11 | Semiconductor Energy Lab Co Ltd | Clean room, film forming method, and manufacturing method of semiconductor device |
| CN202730240U (en) * | 2012-08-16 | 2013-02-13 | 山东三新电子有限公司 | Etching machine |
| CN206412321U (en) * | 2016-12-07 | 2017-08-15 | 广东申菱环境系统股份有限公司 | Pollutant disposal system between a kind of conductor etching |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289236A (en) * | 2019-07-29 | 2019-09-27 | 德淮半导体有限公司 | Processing chamber |
| CN112604413A (en) * | 2020-12-09 | 2021-04-06 | 宜讯汽车装备(上海)有限公司 | Air draft device for welding process of semiconductor cleaning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106548964B (en) | 2023-08-22 |
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