CN106544533A - A kind of preparation method of high-strength highly-conductive wire copper alloy - Google Patents
A kind of preparation method of high-strength highly-conductive wire copper alloy Download PDFInfo
- Publication number
- CN106544533A CN106544533A CN201610997787.2A CN201610997787A CN106544533A CN 106544533 A CN106544533 A CN 106544533A CN 201610997787 A CN201610997787 A CN 201610997787A CN 106544533 A CN106544533 A CN 106544533A
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- China
- Prior art keywords
- preparation
- copper
- conductive wire
- copper alloy
- strength highly
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
Abstract
The invention discloses a kind of preparation method of high-strength highly-conductive wire copper alloy, belongs to copper alloy preparing technical field.The wire Cu alloy material contain percentage by weight be containing percentage by weight be 0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.4～0.5% chromium and 0.55～0.70% zirconium, remaining is copper.Preparation method is mixed smelting, ingot casting, hot rolling, solid solution, cold rolling and pickling processes by each component of above-mentioned weight ratio.Performance requirement of the electronics industry wire to Cu alloy material can preferably be met, it can also be used to have high demands the Cu alloy material field for leading high-elongation.And there is process is simple, advantage with low cost.
Description
Present patent application is for Application No.：2014106299394 divisional application, the applying date of original application
For：2014-11-11, invention and created name is：A kind of high-strength highly-conductive wire copper alloy and preparation method thereof.
Technical field
The invention belongs to copper alloy preparing technical field, more particularly, it relates to a kind of high-strength highly-conductive wire copper alloy
Preparation method.
Background technology
Multi-element composite micro-alloying technology is the study hotspot of current high-performance copper alloy material.Copper conductor alloy material will
Ask with high conductivity, higher intensity requirement and good elongation percentage.The Chinese patent application of Application No. 02133772.1
A kind of copper alloy material for contact net wire is disclosed, is contained tellurium, lithium and magnesium in this kind of Cu alloy material, is made the intensity of copper alloy
Increase, but conductivity is low, only up to 76%IACS.The Chinese patent application of Application No. 02133772.1 is disclosed
A kind of copper alloy material for contact net wire, not only contains tellurium in this kind of Cu alloy material, also containing lithium and magnesium, the addition of magnesium,
Make the intensity of kuttern increase, but conductivity is low, only up to 76%IACS.In Application No. 03135189.1
State's patent application discloses a kind of high electric material of copper, tellurium rare earth without containing silver, and which has the disadvantage to be difficult to high intensity and high connductivity
The matching of rate, especially when conductivity reaches 94.5%IACS, intensity is substantially not enough, only 330MPa or so.Therefore develop
A kind of alloy material of the high-strength highly-conductive of copper conductor is the problem solved required for inventor.
The content of the invention
, problem to be solved
For the above-mentioned problems in the prior art, the present invention provides a kind of preparation side of high-strength highly-conductive wire copper alloy
Method, is 0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.4～0.5% chromium and 0.55～0.70% zirconium containing percentage by weight, and remaining is
Copper, and the excellent wire Cu alloy material of conductivity and elongation percentage is obtained with reference to special Technology for Heating Processing.
, technical scheme
In order to solve the above problems, it is an object of the invention to provide a kind of high-strength highly-conductive wire copper alloy and preparation method thereof
Material.
It is to provide a kind of high-strength highly-conductive wire copper alloy and preparation method thereof material that another object of the present invention is
Preparation method.
In order to realize first technical purpose of the present invention, its technical scheme is：A kind of high-strength highly-conductive wire copper alloy
Material, it is characterised in that containing percentage by weight be 0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.4～0.5% chromium and 0.55～
0.70% zirconium, remaining is copper.
A kind of optimization component of the technical scheme is, is 0.05% lead, 0.7% ferrum, 0.04% magnesium containing percentage by weight,
0.4% chromium and 0.55% zirconium, remaining is copper.
A kind of optimization component of the technical scheme is, containing percentage by weight be 0.05% lead, 0.7% ferrum, 0.04% magnesium,
0.45% chromium and 0.62% zirconium, remaining is copper.
A kind of optimization component of the technical scheme is, containing percentage by weight be 0.05% lead, 0.7% ferrum, 0.04% magnesium,
0.5% chromium and 0.70% zirconium, remaining is copper.
In order to realize another technical purpose of the present invention, its technical scheme is：A kind of high-strength highly-conductive wire copper alloy
Preparation method, it is characterised in that：Comprise the steps：
（1）Each component is weighed according to above-mentioned weight ratio, crystallizing wheel is injected in the melting at 1200～1350 DEG C after mixing after melting,
Form slab ingot；
（2）To slab ingot hot rolling, its temperature is 800～950 DEG C, carries out the hot rolling of 12 passages, and reduction ratio is 75%, obtains hot rolling
Material；
（3）Solution treatment is carried out to hot rolling material, its temperature is 850～950 DEG C, and temperature retention time is 1～2h, and then water quenching obtains
To cold material；
（4）20～40% cold-rolling treatment is carried out to the cold material, pickling is finally carried out, the oxide on surface is removed.
Can be had both using the electric conductivity and elongation percentage of the wire Cu alloy material obtained by preparation method of the present invention, tissue is equal
Even, precipitated phase small and dispersed, alloy are cheap, and its conductivity reaches 91～95%IACS, and elongation percentage is 12～20%, and tension is strong
Spend for 620～655MPa, can preferably meet performance requirement of the copper conductor to copper alloy in electronics industry.
, beneficial effect
Compared to prior art, beneficial effects of the present invention are：
（1）What the present invention was bold adds micro and cheap Element Lead in molten copper so as to the alloy material after melting
Material conductivity is greatly improved.
（2）Present invention adds elemental iron, because of its obvious solution strengthening effect and dispersion-strengthened effect, makes alloy material
Obtain electric conductivity to be recovered, and elongation percentage is improved.
（3）The present invention is also added into element magnesium, and the alloy material specific strength which forms is high, damping good, thermal fatigue property
It is good, non-aging, there are good heat conductivity and good extrusion process performance again.
（4）Add in the present invention, Cr and Zr acts primarily as Precipitation reinforcing and hinders the effect of recrystallization.Add in copper
Enter the alloying element that solubility with temperature is reduced and is obviously reduced（Such as Cr, Zr）Saturation solid solution is formed by higher temperature solid solution
Body, then by timeliness, decomposes supersaturated solid solution, and alloying element diffusion-precipitation in the form of precipitated phase is distributed in matrix
In.Precipitated phase can effectively prevent the movement of crystal boundary and dislocation, greatly improve alloy strength.
（5）The present invention has also combined water quenching and solution treatment so that the performance of alloy has obtained further raising, and this
Invented technology is simple, with low cost.
Specific embodiment
The present invention is further described below with reference to specific embodiment.
Embodiment 1：0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.4% chromium and 0.55% zirconium are weighed according to percentage by weight, remaining
For copper.
Each component be blended in 1200-1350 DEG C at melting, inject casting ladle after melting, then by casting ladle injection crystallizing wheel crystallization,
Slab ingot is formed, to slab ingot forge hot, it is 800～950 DEG C that its temperature is its temperature, carries out the hot rolling of 12 passages, and reduction ratio is
75%, obtain hot rolling material；Solution treatment is carried out to hot rolling material, its temperature is 850～950 DEG C, temperature retention time is 1～2h, so
Water quenching afterwards, obtains cold material；Then 20～40% cold-rolling treatment is carried out to the cold material, pickling is finally carried out, surface is removed
Oxide.Wire Cu alloy material is obtained, its conductivity reaches 91%IACS, elongation percentage is 12%, and tensile strength is
630MPa。
Embodiment 2：0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.45% chromium and 0.62% zirconium are weighed according to percentage by weight, its
Yu Weitong, each component be blended in 1200-1350 DEG C at melting, inject casting ladle after melting, then by casting ladle injection crystallizing wheel crystallization, shape
Into slab ingot, to slab ingot forge hot, it is 800～950 DEG C that its temperature is its temperature, carries out the hot rolling of 12 passages, and reduction ratio is 75%,
Obtain hot rolling material；Solution treatment is carried out to hot rolling material, its temperature is 850～950 DEG C, temperature retention time is 1～2h, Ran Houshui
Quench, obtain cold material；Then 20～40% cold-rolling treatment is carried out to the cold material, pickling is finally carried out, the oxidation on surface is removed
Thing.Wire Cu alloy material is obtained, its conductivity reaches 93%IACS, elongation percentage is 17%, and tensile strength is 655MPa.
Embodiment 3：0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.5% chromium and 0.70% zirconium are weighed according to percentage by weight, remaining
For copper, each component be blended in 1200-1350 DEG C at melting, casting ladle is injected after melting, then by casting ladle injection crystallizing wheel crystallization, is formed
Slab ingot, to slab ingot forge hot, it is 800～950 DEG C that its temperature is its temperature, carries out the hot rolling of 12 passages, and reduction ratio is 75%, is obtained
To hot rolling material；Solution treatment is carried out to hot rolling material, its temperature is 850～950 DEG C, temperature retention time is 1～2h, Ran Houshui
Quench, obtain cold material；Then 20～40% cold-rolling treatment is carried out to the cold material, pickling is finally carried out, the oxidation on surface is removed
Thing.Wire Cu alloy material is obtained, its conductivity reaches 95%IACS, elongation percentage is 20%, and tensile strength is 620MPa.
The process is simple of the Cu alloy material of the present invention, with low cost, performance meets wire material property demand.But
Protection scope of the present invention is not limited to and is applied to copper alloy wire field, it can also be used to have high demands the copper alloy for leading high-elongation
Material Field.
Claims (5)
1. a kind of preparation method of high-strength highly-conductive wire copper alloy, it is characterised in that：Comprise the steps：
（1）Each component is weighed according to weight ratio, crystallizing wheel is injected in the melting at 1300～1350 DEG C after mixing after melting, formed
Slab ingot；
（2）To slab ingot hot rolling, its temperature is 800～950 DEG C, carries out the hot rolling of 12 passages, and reduction ratio is 75%, obtains hot rolling
Material；
（3）Solution treatment is carried out to hot rolling material, its temperature is 850～950 DEG C, and temperature retention time is 1～2h, and then water quenching obtains
To cold material；
（4）20～40% cold-rolling treatment is carried out to the cold material, pickling is finally carried out, the oxide on surface etc. is removed.
2. the preparation method of a kind of high-strength highly-conductive wire copper alloy according to claim 1 and 2, it is characterised in that：Institute
State high-strength highly-conductive wire Cu alloy material and contain percentage by weight for 0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.4～0.5% chromium
With 0.55～0.70% zirconium, remaining is copper.
3. the preparation method of a kind of high-strength highly-conductive wire copper alloy according to claim 2, it is characterised in that：The height
Strong height wire Cu alloy material contains percentage by weight for 0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.4% chromium and 0.55% zirconium,
Remaining is copper.
4. the preparation method of a kind of high-strength highly-conductive wire copper alloy according to claim 2, it is characterised in that：The height
Strong height wire Cu alloy material contains percentage by weight for 0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.45% chromium and 0.62%
Zirconium, remaining is copper.
5. the preparation method of a kind of high-strength highly-conductive wire copper alloy according to claim 2, it is characterised in that：The height
Strong height wire Cu alloy material contains percentage by weight for 0.05% lead, 0.7% ferrum, 0.04% magnesium, 0.5% chromium and 0.70% zirconium,
Remaining is copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610997787.2A CN106544533B (en) | 2014-11-11 | 2014-11-11 | A kind of preparation method of high-strength highly-conductive conducting wire copper alloy |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610997787.2A CN106544533B (en) | 2014-11-11 | 2014-11-11 | A kind of preparation method of high-strength highly-conductive conducting wire copper alloy |
| CN201410629939.4A CN104328304B (en) | 2014-11-11 | 2014-11-11 | Copper alloy for high-strength and high-conductivity lead and preparation method of copper alloy |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410629939.4A Division CN104328304B (en) | 2014-11-11 | 2014-11-11 | Copper alloy for high-strength and high-conductivity lead and preparation method of copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106544533A true CN106544533A (en) | 2017-03-29 |
| CN106544533B CN106544533B (en) | 2018-09-04 |
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| CN201410629939.4A Active CN104328304B (en) | 2014-11-11 | 2014-11-11 | Copper alloy for high-strength and high-conductivity lead and preparation method of copper alloy |
| CN201610997787.2A Expired - Fee Related CN106544533B (en) | 2014-11-11 | 2014-11-11 | A kind of preparation method of high-strength highly-conductive conducting wire copper alloy |
| CN201610997786.8A Active CN106498227B (en) | 2014-11-11 | 2014-11-11 | The preparation method of one Albatra metal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018214758A1 (en) * | 2017-05-25 | 2018-11-29 | 京东方科技集团股份有限公司 | Metal wire, thin-film transistor and manufacturing method therefor, array substrate and display device |
| CN114606414A (en) * | 2022-03-11 | 2022-06-10 | 北京理工大学 | High-conductivity regenerated aluminum alloy conductor and preparation method thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222484A (en) * | 2016-07-20 | 2016-12-14 | 合肥恒研智能科技有限公司 | A kind of built-in industrial control machine housing high-strength alloy |
| JP2020133000A (en) * | 2019-02-20 | 2020-08-31 | 三菱マテリアル株式会社 | Copper alloy material, commutator segment, and electrode material |
| CN114990376B (en) * | 2022-06-02 | 2023-08-22 | 浙江大学 | Ternary high-strength high-conductivity copper alloy and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152332A (en) * | 1984-08-21 | 1986-03-15 | Toshiba Corp | Bonding wire |
| CN101629254A (en) * | 2009-06-25 | 2010-01-20 | 中南大学 | Multi-element composite micro-alloying copper alloy with high strength and high conductivity and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265536A (en) * | 2007-03-12 | 2008-09-17 | 北京有色金属研究总院 | High-strength high-conductivity copper alloy and preparation method thereof |
| CN104004939A (en) * | 2014-06-13 | 2014-08-27 | 甘肃大鑫铜业有限责任公司 | High-strength and high-conductivity copper alloy and preparation method thereof |
-
2014
- 2014-11-11 CN CN201410629939.4A patent/CN104328304B/en active Active
- 2014-11-11 CN CN201610997787.2A patent/CN106544533B/en not_active Expired - Fee Related
- 2014-11-11 CN CN201610997786.8A patent/CN106498227B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152332A (en) * | 1984-08-21 | 1986-03-15 | Toshiba Corp | Bonding wire |
| CN101629254A (en) * | 2009-06-25 | 2010-01-20 | 中南大学 | Multi-element composite micro-alloying copper alloy with high strength and high conductivity and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018214758A1 (en) * | 2017-05-25 | 2018-11-29 | 京东方科技集团股份有限公司 | Metal wire, thin-film transistor and manufacturing method therefor, array substrate and display device |
| CN114606414A (en) * | 2022-03-11 | 2022-06-10 | 北京理工大学 | High-conductivity regenerated aluminum alloy conductor and preparation method thereof |
| CN114606414B (en) * | 2022-03-11 | 2022-12-02 | 北京理工大学 | High-conductivity regenerated aluminum alloy conductor and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104328304A (en) | 2015-02-04 |
| CN106498227A (en) | 2017-03-15 |
| CN106544533B (en) | 2018-09-04 |
| CN106498227B (en) | 2018-01-30 |
| CN104328304B (en) | 2017-01-11 |
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