CN106538073A - Method for producing electronic component, and electronic assembly, heating device being provided in the substrate of the assembly - Google Patents
Method for producing electronic component, and electronic assembly, heating device being provided in the substrate of the assembly Download PDFInfo
- Publication number
- CN106538073A CN106538073A CN201580037882.1A CN201580037882A CN106538073A CN 106538073 A CN106538073 A CN 106538073A CN 201580037882 A CN201580037882 A CN 201580037882A CN 106538073 A CN106538073 A CN 106538073A
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- China
- Prior art keywords
- heater
- substrate
- building brick
- electronic building
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/165—Stabilizing, e.g. temperature stabilization
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
The invention relates to a method for producing an electronic assembly or for disassembling same. The invention additionally relates to the electronic assembly. The assembly has a heating device (16) which is integrated into a substrate (11). The heating device can be heated via an external power supply (19) during the assembly process so that for example solder connections (25) of an electric component (23) can be melted. According to the invention, the heating device (16) can also be used when operating the electronic assembly, said heating device then being directly actuated by the component (23). For this purpose, an electric connection must then be established between the component (23) and the heating device (16), said connection not yet being provided during the thermal assembly process in order to protect the electronic components (23) of the circuit from being damaged.
Description
Technical field
The present invention relates to a kind of method for manufacturing electronic building brick.In the method, there is provided substrate, in a substrate, exist
Form the embedded electric heater unit of lower face of the installation side of part.The installation side of substrate is equipped with part, and by heating
Device heats the substrate to uniform temperature, to support installation process.Here, alternatively, heater can provide hot installation
Whole heat energy needed for process.Alternatively, heater can also only support hot installation process, wherein, other heat energy can be by
External heating device is provided.By this way, the heater in substrate can for example support the hot installation process in soldering furnace.
The invention further relates to a kind of at least one of method for dismantling electronic building brick, wherein, the component has base
Plate, in a substrate, in the embedded electric heater unit of the lower face of the installation side for forming part.The electronic building brick is also equipped with portion
Part.
All installation processes of electronic building brick should be understood as the hot installation process in meaning of the present invention, wherein,
Product is by thermal energy to its end-state.Typical installation process is welded to by bonding operation, for example by the contact of part
Constitute on substrate.Alternatively, it is also possible to carry out bonding, wherein, in hot installation process, using heat adhesive, i.e., in temperature
The binding agent of the lower hardening of effect.However, hot installation process should also be understood that the so-called special operational for installation, for example, apply auxiliary
Material is helped, such as by the hot coating of thermmohardening.
The invention further relates to a kind of electronic building brick, which has substrate, in a substrate, on the surface of the installation side for forming part
The embedded electric heater unit in lower section.In the installation side installing component, the unit construction is at least one electronic circuit.
Background technology
It is known that heater is embedded in substrate component.According to 6,396,706 B1 of US, can for example in printing electricity
Heating element heater independent of each other is embedded in the plate of road.According to US 5,539,186, which can be by layer resistance or by curved shape figure
The heater strip of case builds.According to prior art, heater not only can be during installation process for entering to printed circuit board (PCB)
Row heating, can be hot to be used for purposefully importing in the operation of the electronic building brick of installation.
The content of the invention
The technical problem to be solved in the present invention is to propose a kind of method for manufacturing electronic building brick and can utilize
The electronic building brick of this method manufacture, wherein, enabling hot installation process is carried out, and harm is not produced to electronic building brick, and
And electronic building brick can be reliably run by integrated heater in a substrate.
According to the present invention, method of the above-mentioned technical problem by proposition is started, by solution of such as getting off, i.e. heater exists
Operate independently from the circuit electrical formed by electronic building brick during hot installation process.Thus, it is possible to advantageously ensure that in electronics group
There is electric isolution between heater in the circuit and substrate of part.As a result, heater must during hot installation process
Must be run by external control and contact.Contact on substrate for example can be used for this, wherein, further retouched in detail below
State how which is made electrical contact with.The power absorption of heater can be advantageously without causing in manufacture due to electric isolution
Electronic building brick damage, the power absorption for example when being welded be significantly greater than when electronic building brick is run after a while.
After hot installation process, at least one of heater and circuit of electronic building brick circuit is electrically connected, wherein,
Heater can be run using the circuit.In other words, by the temperature treatment to heater in electronic building brick run duration
It is integrated in electronic building brick.For this reason, it may be necessary to the component being located in substrate is made electrical contact with interlock circuit, so which can be to adding
Thermal is actual to be controlled.Power for needed for this can be applied by circuit itself, wherein, it is also necessary to electric energy is supplied to which
For its other function.However, as already mentioned, the heating power of the heater of needs is during hot installation process
It is substantially high, wherein, it is that this can use outside electric energy, as long as heater is not already connected to control circuit.
General installation process is advantageously made up of welding, bonding or coating.As already mentioned, coating is to install
So-called special operational, wherein, for example can apply protective coating on the electronic building brick for completing, to produce electric insulation.Also may be used
With in the pre-assembly, to substrate (such as printed circuit board (PCB) or also surface to be used as the housing parts of the substrate of electronic circuit)
Applying portion coating.Welding is conventionally used to set up reliable electrical connection, wherein, particularly lead-free solder is generated and is carried in recent years
The needs of high junction temperature.Bonding can make the different part of electronic circuit reliably with substrate connection.Here can also
Using so-called electroconductive binder, which is suitable for setting up electrical connection simultaneously.
A kind of construction of the invention is set to, during hot installation process via joint, especially by probe or
Person's terminal supplies electric energy to heater.Here, joint is provided by installation system, run in the installation system for manufacturing
Method.According to the present invention, installation system is modified, enabling perform installation method.In order to start hot installation process,
By the suitable contact surface of connector guide to substrate such that it is able to supply electric power to heater, to begin to warm up process.
This can advantageously use the energy source provided by installation system.Installation system can for example be assembling automaton, wherein,
The installation of electronic building brick can be advantageously accomplished in assembling automaton, because hot installation process can add by electric energy is introduced
Soldering furnace is not used () in thermal and terminate.Alternatively, can so that joint is provided in reflow soldering furnace, wherein, heating dress
Is provided and the energy that heat installs needs only partially provide, to support the heat input of reflow soldering furnace).Here, it is possible to use from plus
The heat energy of thermal is supported carrying out reflow soldering intermittent fever installation needs more for example compared with the remainder of electronic building brick
The region of the electronic building brick of energy feeding.This causes the thermic load of the electronic building brick during heat is installed less on the whole.
Another kind of construction of the invention is set to, electric heater unit via Plug contact or be welded to connect with it is described
Electronic circuit connects.The electronic circuit is operation and the electronic circuit that heater is guaranteed after hot installation process terminates
The parallel circuit of operation.If for electrical connection is provided with Plug contact, advantageously can be contacted with pin connector,
Wherein, the grafting of pin connector is the simple installation operation that can be performed after hot installation process.But also may be used for this
With using being welded to connect.Although only can also be produced by hot installation process and be welded to connect itself, this is welded to connect can be with
Manually produce and only need to carry out local heating to substrate in the position being welded to connect.The position can be advantageously selected,
So that the thermic load of follow-up welding process is not crucial for remaining electronic building brick.When such as electronic building brick undergoes to collide or shakes
When dynamic, the formation being welded to connect is advantageously especially reliable.
Another kind of construction of the invention could be arranged to, and electric heater unit is connected with the electronic circuit via contact
Connect, wherein, contact is integrated in the housing parts for electronic building brick and by housing member is arranged on electronic building brick
Above electrically connect.This has the advantages that following big：Integrated heater controls heating dress with electronic building brick run duration
The establishment of connection of the circuit put is set up by installation operation after all to be carried out in installation process.The installation operation is by shell
Placement of the body component on electronic building brick (such as in order to protect electronic building brick from environmental effect) is constituted.This solution
Another advantage is that electrical connection is interrupted again by removing housing member.When will for example carry out helpdesk to electronic building brick
When managing and need for this to dismantle part, this is favourable.
A kind of special construction of the invention is set to, electric heater unit via switch, particularly mechanical switch, two
Pole pipe, transistor or relay are connected with the electronic circuit.Switch can be just set when substrate is assembled, thus, it is possible to have
Keep additional installation expense little sharply.After heat installation terminates, then no longer need other installation steps, and only need by
The switching process that switch having installed, contacting with electronic circuit can be carried out.Manually operation machinery can switch, its
In, it has to be noted that will switch off when being assembled or afterwards, to there is electric isolution in installing in subsequent heat.Favorably
Ground is installed by diode and transistor so that blocking effect is produced during powering to heater during hot installation process, its
Electronic circuit of the protection in manufacture avoids damaging.The characteristic of selection transistor and diode so that run in electronic circuit
When, heater can be controlled by interlock circuit, that is, occur without blocking effect.If using relay, by which
It is connected with electronic circuit so that can switch it on to run heater in electronic circuit run duration.
Another kind of construction of the present invention is set to, and partly substrate is carried out with different intensity during hot installation process
Heating.It is possible thereby to while perform different hot installation processes.For example the subregion of electronic circuit can be connect with heat adhesive
Close, while the other positions formation in electronic circuit is welded to connect.It is further envisioned that coming by heating is differently carried out to substrate
The stress that compensation is produced due to the inhomogeneities of electronic building brick.
Particularly advantageously, temperature sensor is provided with substrate, which is electrically connected with the electronic circuit.The temperature is passed
Sensor can be used for the heat management of electronic building brick in electronic building brick run duration.The temperature of electronic building brick can be for example adjusted, is made
Obtain in the case where the deposition of dampness produces threat (condensation) to electronic building brick, activate heater, so that dampness is not deposited on
On electronic building brick.For this purpose, in addition to temperature sensor, can also advantageously use humidity sensor, to determine air humidity
It is whether actually so high so as to there is the danger of condensation.Temperature sensor can also be advantageously used in during heat is installed
The temperature control of monitoring substrate.For this purpose, be set to according to a kind of favourable construction of methods described, during hot installation process,
Temperature sensor is contacted with the control device of outside.Here, control device is provided by installation system, run in the installation system
For the method for manufacture.Control the energy to heater to feed using control device.
Advantageously, temperature sensor during hot installation process electrically independently with the electronic circuit formed by electronic building brick
Operation.Thus, it is possible to the measurement error for avoiding being likely to occur during the heat of electronic building brick is installed, so as to be provided by installation system
Control device reliably the temperature signal of temperature sensor can be processed.Then, temperature sensor is advantageously in peace
It is connected with least one of the electronic circuit of electronic building brick electronic circuit after dress process, wherein, while the electricity can be utilized
Electronic circuit runs heater.Thus, after the installation method terminates, temperature sensor can be used to carry out heat to electronic building brick
Management.
As already mentioned, the method according to the invention can be also used for being dismantled.Here, arranged according to the present invention
To heat the substrate to uniform temperature by heater, to support hot unloading process.Heater is in the hot unloading process phase
Between electrically operate independently from the electronic circuit formed by electronic building brick, so as to not produce harm to the electronic circuit.If should
Method for dismounting is only used for the maintenance of electronic building brick, then thus advantageously ensure that the electronic circuit not keeped in repair is without prejudice.Can be
Part to be replaced is removed after disconnecting by the connection that heat is installed from substrate.Thermally coupled can for example be to be welded to connect.Tearing open
After unloading process or after the installation process for assembling new part that then unloading process is carried out, heater is pressed
Electrically connected according at least one of the method having been described above and the electronic circuit of electronic building brick electronic circuit again, wherein, also just
It is to run heater using the circuit.
Additionally, the technical problem for being proposed is solved also using the electronic building brick that refers to of beginning, which is configured to, heater
Electrically connect with least one of the electronic circuit of electronic building brick electronic circuit, wherein, can be run using the electronic circuit
Heater.Additionally, contact structure that can be accessible from the outside is arranged between heater and the electronic circuit.Can be from outside
It is close to, means and make it possible to from the outside (at least when which does not have housing) of electronic building brick be made electrical contact with.This is the present invention's
It is needs in meaning, so as to utilize the external electrical contact execution installation process (as has been described) of heater and tear open
Unload process.
It is set to according to a kind of favorable structure of electronic building brick, contact structure is connected with switch.By switch and the electricity
Electronic circuit sets up electrical connection, and switch makes it possible to be adjusted the temperature of electronic building brick in run duration.For dismounting is processed
Then the electrical connection can be disconnected by (for example repairing welding) again.
Furthermore, it is possible to be advantageously arranged to, heater has the multiple fragments that individually can be controlled.By this way, no
Only during heat is installed, and certain temperature curve can be produced in electronic building brick run duration.As already mentioned
, all parts connection and the respective requirement of each electronic unit can be considered in heat is installed.Run in electronic building brick
When, this is equally possible.The temperature of the part that must avoid condensing of electronic building brick can be only adjusted for example.Can also think
Arrive, particular elements must be run at a certain temperature, the temperature then merely has to keep in the relevant portion of electronic building brick.When
When only heating to the part of the needs of electronic building brick, energy expenditure can be advantageously reduced.
Fragment in substrate advantageously can also be in another lower section with regard to the installation side one of substrate, and not only
It is to be arranged side by side.This has the advantage that：When it is contemplated that when higher heating is needed in the specific region of substrate,
These regions can more strongly be heated compared with other regions of substrate.Here, it is possible to use standardized heating unit
Part, wherein, heat is not the different capacity by heating element heater, but is realized by the structure of its stack.
Description of the drawings
Below, other details of the present invention are described with reference to the accompanying drawings.Identical or corresponding figure elements are correspondingly provided with
Identical reference, and it is only distinct between each accompanying drawing in the case of, illustrate repeatedly.Wherein：
Fig. 1 and 2 schematically partially shows the different step of the embodiment of installation method of the invention,
Fig. 3 shows the fragment using housing as the embodiment of the electronic building brick of the invention of substrate,
Figure 4 and 5 illustrate the embodiment of the substrate of the heater with segmentation as top view and as side-looking,
And
Fig. 6 illustrates another embodiment of electronic building brick of the invention as overlooking.
Specific embodiment
In the method according to Fig. 1, using the substrate 11 of printed circuit board (PCB) form.Intermediate layer is provided with the substrate 11
12, its own is filled with the thermosetting plastics matrix of dopant.Dopant is responsible for the electric conductivity of this layer.At the concentration of dopant
More than percolation threshold (Perkolationsschwelle), so as to intermediate layer 12 can be conductive.As dopant, for example can be with
Using CNT (CNT) or other carbonizable substances, such as carbon black or graphite granule.Can also use metal or ceramic particle or
The mixture of all dopant types for referring to of person is setting up electric conductivity.Intermediate layer 12 is via penetrating contact site 13 and substrate 11
The engagement pad 14 of installation side 15 connects, and is consequently formed heater 16.
Substrate 11 is maintained in the receiving portion 17 of the installation system not being shown specifically.Installation system also provides controller 18,
The supply electric power of probe 19 in engagement pad 14 can be dropped downwardly to by controller 18.The electric power causes to produce in heater 16
Heat, which can be monitored via temperature sensor 20.Temperature sensor 20 is also connected to controller 18 via probe 21.
Part 23 is placed on the substrate 11 by assembly head 22.Solder 25 is provided with printed circuit board (PCB) 24, so as to
The contact 26 of part 23 is made to immerse in solder 25.Solder 25 is melted simultaneously followed by heating of the heater 16 to substrate 11
And formed and be welded to connect 27 according to Fig. 2.Alternatively, when being carried out using 16 pairs of components 28 (referring to Fig. 2) for completing of heater
So strong heating so that when the pad of formation melts again, assembly head 22 can be used for the dismounting of part 23 and process.
The electronic building brick 28 of installation can be seen in fig. 2.After component 28 is removed from installation system, pass through
Each between conductive traces 24 and engagement pad 14 to form electrical connection, heater 16 is connected to part 23.Which can be by another
It is welded to connect 29 or is made up of contact 30, wherein, contact is when housing member 31 is installed in conductive traces 24 and contact
Automatically electrical connection is set up between pad 14.Contact is configured to flexible, is thus reliably contacted.
According to Fig. 3, substrate 11 is made up of housing.Which is used as circuit carrier simultaneously.In the material of housing wall, exemplarily
Show the heater 16 of conductor path form.16 (not shown in detail) of heater is contacted by engagement pad 14a.This
Outward, engagement pad 14a has conductive traces 24a, can assemble switch (not shown) thereon.Other conductive traces 24b are formed and are used for
The installation site of unshowned part, the part is in the operation after a while of electronic building brick via on-off control heater 16.
Another unshowned heater is controlled via engagement pad 14b.Engagement pad 14b is controlled using plug contacts 32,
Plug contacts 32 make it possible to be contacted by plug-in connector after hot installation is carried out.By this way, it is unshowned
Heater can be being connected to electronic building brick via plug-in connector.
Figure 4 illustrates heater can be formed by multiple fragments 33, wherein, the accurate structural of these fragments is not
It is shown specifically.It can be concluded that fragment 33 is evenly distributed in the (peace of substrate 11 on substrate 11 in the form of a grid from Fig. 4
Dress side cannot be seen, because which is located above fragment 33).Thus, by individually controlling these fragments, the hot installation phase can be produced
Between substrate 11 and mounted component (not shown) after a while desired temperature curve.Although it is not shown, fragment
33 uneven distributions on the surface of substrate 11 are certainly possible.
Fig. 5 shows the section of substrate, wherein, it will also be seen that the fragment 33 of heater.It is to be noted here that many
Individual fragment can also be stacked in the planes up and down, wherein, region therein, substrate 11 is stacked and placed on about 33 in multiple fragments
In, higher heating intensity can be produced.In principle can be in the way of it figure 1 illustrates via 13 pairs of bases of penetrating contact site
The fragment 33 of Fig. 4 carries out electric control, and according to Fig. 5, needs arrange conductive layer stacked up and down in substrate 11, for multiple
The independent contact of section 33.These layers are not shown specifically, but which is located in the plane 34 for illustrating by a dotted line.Only via plane
34 can individually be controlled to fragment stacked up and down.But alternatively it is further envisioned that fragment 33 stacked up and down is corresponding
Ground powers commonly through with penetrating contact similar in FIG.
The top view of the component of installation can be seen in figure 6.Multiple parts 23 can be seen, wherein, part 23a
Heat management is carried out to component.For this purpose, conductive traces 24c are directed to switch 35, its in the substrate 11 that is not shown specifically plus
Thermal is controlled.Keep not during for the engagement pad 14 that is controlled to heater during heat is installed in assembly operating
Use.
Additionally, being provided with the switch 35a of control temperature sensor 20.Which is connected to part 23a via conductive traces 24d.
Also temperature sensor 20 is used via conductive traces 24e during heat is installed, wherein, the signal of temperature sensor 20 is via contact
Pad 14a is measured from outside.
Claims (15)
1. a kind of method for manufacturing electronic building brick, wherein,
- substrate (11) is provided, in a substrate, in the embedded electrical heating of the lower face of the installation side (15) formed for part (23)
Device (16),
- to installation side (15) build-up member (23),
- substrate (11) is heated to into uniform temperature by heater (16), to support hot installation process,
Characterized in that,
- heater (16) is operated independently from the circuit electrical formed by electronic building brick during hot installation process, and
- heater (16) is electrically connected with least one of the circuit of electronic building brick circuit after hot installation process, wherein,
Can be using circuit operation heater (16).
2. method according to claim 1,
Characterized in that,
Installation process is by welding, bonding or coating are constituted.
3. according to method in any one of the preceding claims wherein,
Characterized in that,
During hot installation process via joint, especially by probe (19) or terminal to heater (16) supply electricity
Can, wherein, joint is provided by installation system, and the method for manufacture is run in the installation system.
4. according to method in any one of the preceding claims wherein,
Characterized in that,
Electric heater unit is via plug contacts (32) or is welded to connect (27) and is connected with the electronic circuit.
5. method according to any one of claim 1 to 4,
Characterized in that,
Electric heater unit (16) is connected with the electronic circuit via contact (30), wherein, contact (30) be integrated in for
In the housing member (31) of electronic building brick and by housing member (31) is electrically connected on electronic building brick.
6. method according to any one of claim 1 to 4,
Characterized in that,
Electric heater unit (16) is via switch (35), particularly mechanical switch, diode, transistor or relay and the electricity
Electronic circuit connects.
7. according to method in any one of the preceding claims wherein,
Characterized in that,
Partly substrate (11) is heated with different intensity during hot installation process.
8. according to method in any one of the preceding claims wherein,
Characterized in that,
Temperature sensor (20) is provided with substrate, which is electrically connected with the electronic circuit.
9. method according to claim 8,
Characterized in that,
During hot installation process, temperature sensor (20) is contacted with the control device (18) of outside, wherein,
- control device (18) is provided by installation system, and the method for manufacture is run in the installation system,
- using control device (18) controlling to feed the energy of heater (16).
10. method according to claim 9,
Characterized in that,
- temperature sensor (20) is electrically operated independently from the electronic circuit formed by electronic building brick during hot installation process,
And
- temperature sensor (20) is electrically connected with least one of the electronic circuit of electronic building brick electronic circuit after installation process
Connect, wherein, can be using electronic circuit operation heater (16).
A kind of 11. at least one of methods for dismantling electronic building brick, wherein, component
- there is substrate (11), in a substrate, in the embedded electrical heating of the lower face of the installation side (15) formed for part (23)
Device (16),
- to installation side (15) build-up member (23), wherein,
- substrate (11) is heated to into uniform temperature by heater (16), to support hot unloading process,
- heater (16) is electrically operated independently from the electronic circuit formed by electronic building brick during hot unloading process,
- at least one part (23) is removed from substrate, and
- heater (16) is appointed according in claim 1 to 10 after unloading process or what then unloading process was carried out
After installation process described in one, electrically connect with least one of the electronic circuit of electronic building brick electronic circuit, wherein, energy
Enough using circuit operation heater (16).
A kind of 12. electronic building bricks, have：
- substrate (11), in a substrate, in the embedded electric heater unit of the lower face of the installation side (15) formed for part (23)
(16),
- in the part (23) of installation side (15), which is combined at least one electronic circuit,
Characterized in that,
At least one of-heater (16) and the electronic circuit of electronic building brick electronic circuit is electrically connected, wherein, can utilize
Electronic circuit operation heater (16), and
- energy contact structure+23 accessible from the outside is set between heater (16) and the electronic circuit.
13. electronic building bricks according to claim 12,
Characterized in that,
Contact structure+23 is connected with switch.
14. electronic building bricks according to claim 12 or 13,
Characterized in that,
Heater (16) is with the multiple fragments (33) that individually can be controlled.
15. electronic building bricks according to claim 14,
Characterized in that,
Fragment (33) in substrate (11) is stacked up and down with regard to the installation side (15) of substrate (11).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014213535.4A DE102014213535A1 (en) | 2014-07-11 | 2014-07-11 | A method of manufacturing an electronic assembly and electronic assembly, wherein a heater is provided in the substrate of the assembly |
| DE102014213535.4 | 2014-07-11 | ||
| PCT/EP2015/063504 WO2016005153A1 (en) | 2014-07-11 | 2015-06-17 | Method for producing an electronic component, and electronic assembly, a heating device being provided in the substrate of the assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106538073A true CN106538073A (en) | 2017-03-22 |
| CN106538073B CN106538073B (en) | 2019-11-15 |
Family
ID=53433198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580037882.1A Expired - Fee Related CN106538073B (en) | 2014-07-11 | 2015-06-17 | For manufacturing and dismantling the method and electronic building brick of electronic building brick |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9888559B2 (en) |
| EP (1) | EP3143848A1 (en) |
| CN (1) | CN106538073B (en) |
| DE (1) | DE102014213535A1 (en) |
| WO (1) | WO2016005153A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014213535A1 (en) | 2014-07-11 | 2016-01-14 | Siemens Aktiengesellschaft | A method of manufacturing an electronic assembly and electronic assembly, wherein a heater is provided in the substrate of the assembly |
| CN116634667A (en) * | 2017-06-15 | 2023-08-22 | 捷普有限公司 | System, apparatus and method for utilizing surface mount technology on a metal substrate |
| DE102020206026A1 (en) | 2020-05-13 | 2021-11-18 | Siemens Aktiengesellschaft | Establishing joining connections on an electronic assembly with a heating element |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6396706B1 (en) * | 1999-07-30 | 2002-05-28 | Credence Systems Corporation | Self-heating circuit board |
| US6423939B1 (en) * | 2000-10-02 | 2002-07-23 | Agilent Technologies, Inc. | Micro soldering method and apparatus |
| CN101341809A (en) * | 2005-12-22 | 2009-01-07 | 皇家飞利浦电子股份有限公司 | An electronic device, a housing part, and a method of manufacturing a housing part |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3440407A (en) * | 1966-12-29 | 1969-04-22 | Rca Corp | Temperature controlled circuit boards |
| US3887785A (en) * | 1974-08-29 | 1975-06-03 | Us Air Force | Temperature controlled hybrid oven |
| US5010233A (en) * | 1988-11-29 | 1991-04-23 | Amp Incorporated | Self regulating temperature heater as an integral part of a printed circuit board |
| US5539186A (en) | 1992-12-09 | 1996-07-23 | International Business Machines Corporation | Temperature controlled multi-layer module |
| DE102014213535A1 (en) | 2014-07-11 | 2016-01-14 | Siemens Aktiengesellschaft | A method of manufacturing an electronic assembly and electronic assembly, wherein a heater is provided in the substrate of the assembly |
-
2014
- 2014-07-11 DE DE102014213535.4A patent/DE102014213535A1/en not_active Withdrawn
-
2015
- 2015-06-17 EP EP15729831.6A patent/EP3143848A1/en not_active Withdrawn
- 2015-06-17 US US15/325,550 patent/US9888559B2/en active Active
- 2015-06-17 WO PCT/EP2015/063504 patent/WO2016005153A1/en active Application Filing
- 2015-06-17 CN CN201580037882.1A patent/CN106538073B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6396706B1 (en) * | 1999-07-30 | 2002-05-28 | Credence Systems Corporation | Self-heating circuit board |
| US6423939B1 (en) * | 2000-10-02 | 2002-07-23 | Agilent Technologies, Inc. | Micro soldering method and apparatus |
| CN101341809A (en) * | 2005-12-22 | 2009-01-07 | 皇家飞利浦电子股份有限公司 | An electronic device, a housing part, and a method of manufacturing a housing part |
Also Published As
| Publication number | Publication date |
|---|---|
| US9888559B2 (en) | 2018-02-06 |
| WO2016005153A1 (en) | 2016-01-14 |
| US20170164465A1 (en) | 2017-06-08 |
| EP3143848A1 (en) | 2017-03-22 |
| DE102014213535A1 (en) | 2016-01-14 |
| CN106538073B (en) | 2019-11-15 |
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